REV. C –5–
REF02
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the REF02 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
*
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V
Output Short-Circuit Duration
(to Ground or V
IN
) . . . . . . . . . . . . . . . . . . . . . . . . Indefinite
Storage Temperature Range
J, RC, and Z Packages . . . . . . . . . . . . . . . –65∞C to +150∞C
P Package . . . . . . . . . . . . . . . . . . . . . . . . . –65∞C to +125∞C
Operating Temperature Range
REF02A, REF02, REF02RC . . . . . . . . . . –55∞C to +125∞C
REF02CJ, REF02CZ . . . . . . . . . . . . . . . . . . . . 0∞C to 70∞C
REF02CP, REF02CS, REF02E,
REF02H . . . . . . . . . . . . . . . . . . . . . . . . . –40∞C to +85∞C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . 300∞C
*Absolute maximum ratings apply to both DICE packaged parts, unless otherwise
noted.
Package Type
JA
*
JC
Unit
TO-99 (J) 170 24 ∞C/W
8-Lead Hermetic DIP (Z) 162 26 ∞C/W
8-Lead Plastic DIP (P) 110 50 ∞C/W
20-Contact LCC (RC, TC) 120 40 ∞C/W
8-Lead SOIC (S) 160 44 ∞C/W
20-Contact PLCC (PC) 80 39 ∞C/W
*
JA
is specified for worst-case mounting conditions, i.e.,
JA
is specified for device
in socket for TO, CERDIP, P-DIP, and LCC packages;
JA
is specified for device
soldered to printed circuit board for SO and PLCC packages.
ORDERING GUIDE
1
T
A
= 25∞CPackage Description Operating
⌬V
OS
Max Cerdip Plastic LCC Temperature
(mV) TO-99 8-Lead 8-Lead 20-Contact Range
±15 REF02AZ
2
MIL
±15 REF02EJ REF02EZ XIND
±25 REF02J
2
REF02Z
2
REF02RC/883 MIL
±25 REF02HJ REF02HZ REF02HP XIND
±50 REF02CJ REF02CZ COM
±50 REF02CP XIND
±50 REF02CS
3
XIND
±100 REF02DP COM
NOTES
1
Burn-in is available on commercial and industrial temperature range parts in Cerdip, plastic DIP, and TO-can packages.
2
For devices processed in total compliance to MIL-STD-883, add 883 after part number. Consult factory for 883 data sheet.
3
For availability and burn-in information on SOIC and PLCC packages, contact your local sales office.