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DATA SH EET

Product data sheet

Supersedes data of 1997 May 07

1999 Apr 22

DISCRETE SEMICONDUCTORS

PMST4401

NPN switching transistor

ook, halfpage

M3D187

1999 Apr 22 2

NXP Semiconductors Product data sheet

NPN switching transistor PMST4401

FEATURES

•High current (max. 600 mA)

•Low voltage (max. 40 V).

APPLICATIONS

•General purpose s witc hing and linear amplification,

especially in port able equipment.

DESCRIPTION

NPN switching transistor in a SOT323 plastic package.

PNP complement: PMST4403.

MARKING

Note

1. ∗ = - : Made in Hong Kong.

∗ = t : Made in Malaysia.

PINNING

TYPE NUMBER MARKING CODE(1)

PMST4401 ∗2X

PIN DESCRIPTION

1base

2emitter

3collector

Fig.1 Simplified outline (SOT323) and symbol.

handbook, halfpage

MAM062

Top view

LIMITING VALUES

In accordance with th e Absolute Maximum Ratin g S ystem (IEC 134).

Note

1. Transistor mounted on an FR4 printed-circuit board.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCBO collector-base volta ge open emitter −60 V

VCEO collector-emitter voltage open base −40 V

VEBO emitter-base voltage open collector −6 V

ICcollector current (DC) −600 mA

ICM peak collector current −600 mA

IBM peak base current −200 mA

Ptot total power dissipation Tamb ≤ 25 °C; note 1 −200 mW

Tstg storage temperature −65 +150 °C

Tjjunction temperature −150 °C

Tamb operating ambient temperature −65 +150 °C

1999 Apr 22 3

NXP Semiconductors Pr oduct data shee t

NPN switching transistor PMST4401

THERMAL CHARACTE RISTICS

Note

1. Transistor mounted on an FR4 printed-circuit board.

CHARACTERISTICS

Tamb = 25 °C unless otherwise specified.

Note

1. Pulse test: tp ≤ 300 µs; δ ≤ 0.02.

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth j-a thermal resistance from junction to ambient note 1 625 K/W

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

ICBO collector cut-off current IE = 0; VCB = 60 V −50 nA

IE = 0; VCB = 60 V; Tj = 150 °C−10 µA

IEBO emitter cut-off current IC = 0; VEB = 6 V −50 nA

hFE DC current gain VCE = 1 V; (see Fig.2)

IC = 0.1 mA 20 −

IC = 1 mA 40 −

IC = 10 mA 80 −

IC = 150 mA; note 1 100 300

DC current gain IC = 500 mA; VCE = 2 V; note 1 40 −

VCEsat collector-emitter saturation voltage IC = 150 mA; IB = 15 mA; note 1 −400 mV

IC = 500 mA; IB = 50 mA; note 1 −750 mV

VBEsat base-emitt er saturation voltage IC = 150 mA; IB = 15 mA; note 1 −950 mV

IC = 500 mA; IB = 50 mA; note 1 −1.2 V

Cccollector capacitance IE = ie = 0; VCB = 5 V; f = 1 MHz −8pF

Ceemitter cap a citance IE = ie = 0; VEB = 500 mV; f = 1 MHz −30 pF

fTtransition freque ncy IC = 20 mA; VCE = 10 V; f = 100 MHz 250 −MHz

Switching times (between 10% and 90% levels); (see Fig.3)

ton turn-on time ICon = 150 mA; IBon = 15 mA;

IBoff = −15 mA −35 ns

tddelay time −15 ns

trrise time −20 ns

toff turn-off time −250 ns

tsstorage time −200 ns

tffall time −60 ns

1999 Apr 22 4

NXP Semiconductors Pr oduct data shee t

NPN switching transistor PMST4401

Fig.2 DC current gain; typical values.

handbook, full pagewidth

300

100

200

MGD811

10−111010

2103

hFE

IC mA

VCE = 1 V

handbook, full pagewidth

DUT

MLB826

RB(probe)

450 Ω

(probe)

450 Ω

oscilloscope oscilloscope

Fig.3 Test circuit for switching times.

Vi = 9.5 V; T = 500 µs; tp = 10 µs; tr = tf ≤ 3 ns.

R1 = 68 Ω; R2 = 325 Ω; RB = 325 Ω; RC = 160 Ω.

VBB = −3.5 V; VCC = 29.5 V.

Oscilloscope: input impedance Zi = 50 Ω.

1999 Apr 22 5

NXP Semiconductors Pr oduct data shee t

NPN switching transistor PMST4401

PACKAGE OUTLINE

UNIT A1

max bpcD Ee1HELpQwv

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 0.1

1.1

0.8 0.4

0.3 0.25

0.10 2.2

1.8 1.35

1.15 0.65

1.3 2.2

2.0 0.23

0.13 0.20.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15

SOT323 SC-70

detail X

vMA

0 1 2 mm

scale

Plastic surface mounted package; 3 leads SOT32

97-02-28

1999 Apr 22 6

NXP Semiconductors Pr oduct data shee t

NPN switching transistor PMST4401

DATA SHEET STATUS

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product s ta tus of device(s ) described in this document may have changed since this document was published

and may differ in case of multiple devices. The latest product status information is available on th e Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This document co ntains data from the objective s pecification for produc t

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet Production T his document contains the product specification.

DISCLAIMERS

General ⎯ Information in this document is believed to be

accurate and reliable . H ow ev er, NXP Semiconductors

does not give any representations or warranties,

expressed or implied, as to the accuracy or completeness

of such information and shall have no liability for the

consequenc es of use of such information.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to information

published in this doc ument, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

Suitability for use ⎯ NXP Semiconductors products are

not designed, au thorized or warranted to be suitable for

use in medical, military, aircraft, space or life support

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reasonably be

expected to result in pe rs onal injury, death or seve re

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or

applications and therefor e s uc h inclusion and/or use is at

the customer’s own risk .

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use witho ut fu rth e r testing or modification .

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) may cause permanent damage to

the device. Limiting values are stress ratings only and

operation of the device at these or any other conditions

above those given in the Characteristics sections of this

document is not implied. Exposure to limiting values for

extended periods may affect device reliability.

Terms and conditions of sale ⎯ NXP Semiconductors

products are sold subject to the general terms and

conditions of commercial sale, as published at

http://www.nxp.com/profile/terms, including those

pertaining to warranty, intellectual property rights

infringement and limitation of liability, unless explicitly

otherwise agreed to in writing by NXP Semiconductors. In

case of any incons istency or conflict betw een information

in this document an d such terms and conditio ns, the latter

will prevail.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for accept ance or the grant, c onveyance or

implication of any license under any copyrights, patents or

other industr i al or inte llectual property ri gh ts.

Export control ⎯ This document as well as the item(s)

described herein may be subject to export control

regulations. Export might require a prior authorization from

national author ities.

Quick refer ence data ⎯ The Quick reference data is an

extract of th e product data given in the Limiting values an d

Characteristics sections of this docu ment, and as such is

not complete, exhaus tive or legally binding.

NXP Semiconductors

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All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information pr e sent ed in this document d oes not form part o f an y quotation or cont ra ct, is b elieve d t o b e a ccur ate a nd re li a ble and may be chan ged

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Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were

made to the content, except for the legal definitions and disclaimers.

Printed in The Netherlands 115002 /00/03/pp7 Date of releas e: 1999 Apr 22 Document orde r number: 9397 750 05729