TNPW e3
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High Stability Thin Film Flat Chip Resistors
TNPW e3 precision thin film flat chip resistors are the perfect
choice for most fields of modern electronics where highest
reliability and stability is of major concern. Typical
applications include test and measuring equipment, medical
equipment, industrial, and automotive.
FEATURES
Superior moisture resistivity (85 °C; 85 % RH)
Excellent overall stability at different
environmental conditions 0.05 % (1000 h
rated power at 70 °C)
AEC-Q200 qualified (sizes 0402 to 1206)
Single lot date code (optional)
Sulfur resistance verified according to ASTM B 809
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
Test and measuring equipment
Medical equipment
Industrial equipment
Automotive
Notes
(1) The detail specification EN 140401-801 does not cover this product size.
(2) Please refer to APPLICATION INFORMATION, see next page.
APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal
resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted
film temperature is not exceeded.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime.
TECHNICAL SPECIFICATIONS
DESCRIPTION TNPW0402 e3 TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
(1)
Imperial size 0402 0603 0805 1206 1210
Metric size code RR1005M RR1608M RR2012M RR3216M RR3225M
Resistance range 10
to 100 k
4.7
to 332 k
4.7
to 1 M
4.7
to 2 M
10
to 3.01 M
Resistance tolerance ± 1 %; ± 0.5 %; ± 0.1 %
Temperature coefficient ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
Rated dissipation,
P70
(2)
0.100 W 0.125 W 0.200 W 0.400 W 0.500 W
Operating voltage,
Umax.
AC
RMS
or DC 50 V 75 V 150 V 200 V 200 V
Permissible film temperature, F max. (2)
155 °C
Operating temperature range -55 °C to 155 °C
Permissible voltage against ambient
(insulation):
1 min; Uins
75 V 100 V 200 V 300 V 300 V
Failure rate: FIT
observed 0.1 x 10-9/h
TNPW e3
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Note
The presented operation modes do not refer to different types of resistors, but actually show examples of different loads, that lead to
different film temperatures and different achievable load-life stability (drift) of the resistance value. A suitable low thermal resistance of the
circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits. Please
consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) for
information on the general nature of thermal resistance.
MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
OPERATION MODE STANDARD POWER
Rated dissipation, P70
TNPW0402 e3 0.063 W 0.100 W
TNPW0603 e3 0.100 W 0.125 W
TNPW0805 e3 0.125 W 0.200 W
TNPW1206 e3 0.250 W 0.400 W
TNPW1210 e3 0.330 W 0.500 W
Operating temperature range -55 °C to 125 °C -55 °C to 155 °C
Permissible film temperature,
F max. 125 °C 155 °C
Max. resistance change at P70 for resistance range,
|R/R| after:
TNPW0402 e3 10 to 100 k10 to 100 k
TNPW0603 e3 4.7 to 332 k4.7 to 332 k
TNPW0805 e3 4.7 to 1 M4.7 to 1 M
TNPW1206 e3 4.7 to 2 M4.7 to 2 M
TNPW1210 e3 10 to 3.01 M10 to 3.01 M
1000 h 0.05 % 0.10 %
8000 h 0.10 % 0.20 %
225 000 h 0.30 % 0.60 %
TNPW e3
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TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES
TNPW0402 e3
± 50 ppm/K
± 1 % 10 to 100 kE24; E96
± 0.5 % 10 to 100 k
E24; E192
± 0.1 % 47 to 100 k
± 25 ppm/K
± 1 % 10 to 100 kE24; E96
± 0.5 % 10 to 100 k
E24; E192
± 0.1 %
47 to 100 k± 15 ppm/K ± 0.1 %
± 10 ppm/K ± 0.1 %
TNPW0603 e3
± 50 ppm/K
± 1 % 4.7 to 332 kE24; E96
± 0.5 % 4.7 to 332 kE24; E192
± 0.1 %
± 25 ppm/K
± 1 % 4.7 to 332 kE24; E96
± 0.5 % 4.7 to 332 k
E24; E192
± 0.1 %
± 15 ppm/K ± 0.1 % 47 to 332 k
± 10 ppm/K ± 0.1 %
TNPW0805 e3
± 50 ppm/K
± 1 % 4.7 to 1 ME24; E96
± 0.5 % 4.7 to 1 ME24; E192
± 0.1 %
± 25 ppm/K
± 1 % 4.7 to 1 ME24; E96
± 0.5 % 4.7 to 1 M
E24; E192
± 0.1 %
± 15 ppm/K ± 0.1 % 47 to 1 M
± 10 ppm/K ± 0.1 %
TNPW1206 e3
± 50 ppm/K
± 1 % 4.7 to 2 ME24; E96
± 0.5 % 4.7 to 2 ME24; E192
± 0.1 %
± 25 ppm/K
± 1 % 4.7 to 2 ME24; E96
± 0.5 % 4.7 to 2 M
E24; E192
± 0.1 %
± 15 ppm/K ± 0.1 % 47 to 2 M
± 10 ppm/K ± 0.1 %
TNPW1210 e3
± 50 ppm/K
± 1 % 10 to 3.01 ME24; E96
± 0.5 % 10 to 3.01 M
E24; E192
± 0.1 % 47 to 2.13 M
± 25 ppm/K
± 1 % 10 to 3.01 ME24; E96
± 0.5 % 10 to 3.01 M
E24; E192
± 0.1 %
47 to 2.13 M± 15 ppm/K ± 0.1 %
± 10 ppm/K ± 0.1 %
TNPW e3
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Notes
(1) 1000 pieces packaging is available only for precision resistors with tolerance ± 0.1 % and temperature coefficient ± 25 ppm/K.
(2) 20 000 pieces packaging is available only for resistors with TCR ± 25 ppm/K and ± 50 ppm/K.
Note
The product can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION.
PACKAGING
TYPE / SIZE CODE QUANTITY PACKAGING
STYLE WIDTH PITCH PACKAGING
DIMENSIONS
TNPW0402 e3
EP1 = EP 1000 (1)
Paper tape acc.
IEC 60286-3, Type 1a 8 mm
2 mm Ø 180 mm/7"ET2 = EI 5000
ET7 = ED 10 000
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
E52 = EN 1000 (1)
4 mm Ø 180 mm/7"
ET1 = EA 5000
ET6 = EC (2) 20 000 4 mm Ø 330 mm/13"
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: TNPW12061K32DEEA
TYPE/SIZE RESISTANCE TOLERANCE TCR PACKAGING SPECIAL
TNPW0402
TNPW0603
TNPW0805
TNPW1206
TNPW1210
R = decimal
K = thousand
M = million
(4 digits)
B = ± 0.1 %
D = ± 0.5 %
F = ± 1.0 %
H = ± 50 ppm/K
E = ± 25 ppm/K
X = ± 15 ppm/K
Y = ± 10 ppm/K
EI
EP
EA
EC
ED
EN
(E.. = lead-free)
Up to 2 digits
Blank = standard
0H = single lot date
code
Product Description: TNPW1206 1K32 0.5 % T-9 ET1 e3
TNPW1206 1K32 0.5 % T-9 ET1 e3
TYPE/SIZE RESISTANCE TOLERANCE TCR PACKAGING LEAD (Pb)-FREE
TNPW0402
TNPW0603
TNPW0805
TNPW1206
TNPW1210
Examples:
54R1 = 54.1
1K32 = 1320
± 0.1 %
± 0.5 %
± 1.0 %
T-2 = ± 50 ppm/K
T-9 = ± 25 ppm/K
T-10 = ± 15 ppm/K
T-13 = ± 10 ppm/K
EP1
ET1
ET2
ET6
ET7
E52
e3 = pure tin
termination finish
BV 20545 = single
lot date code
TW120PN 61K32DEEA
TNPW e3
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DESCRIPTION
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A
homogeneous film of special metal alloy is deposited on a
high grade ceramic substrate (AI2O3) and conditioned to
achieve the desired temperature coefficient. Specially
designed inner contacts are deposited on both sides. A
special laser is used to achieve the target value by smoothly
fine trimming the resistive layer without damaging the
ceramics. A further conditioning is applied in order to
stabilize the trimming result. The resistor elements are
covered by a protective coating designed for electrical,
mechanical and climatic protection. The terminations
receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. This
includes full screening for the elimination of products with a
potential risk of early life failures (feasible for R 10 ). Only
accepted products are laid directly into the tape in
accordance with IEC 60286-3, Type 1a (1).
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapour phase as shown in
IEC 61760-1
(1). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS-compliant, the pure tin plating
provides compatibility with lead (Pb)-free and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
MATERIALS
Vishay acknowledges the following systems for the
regulation of hazardous substances:
IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (2)
The Global Automotive Declarable Substance List
(GADSL) (3)
The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (4) for its
supply chain
The products do not contain any of the banned substances
as per IEC 62474, GADSL, or the SVHC list, see
www.vishay.com/how/leadfree.
Hence the products fully comply with the following
directives:
2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
2011/65/EU Restriction of the Use of Hazardous
Substances Directive (RoHS) with amendment
2015/863/EU
2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
RELATED PRODUCTS
The TNPW with SnPb termination plating is designed for
those applications, where lead bearing terminations are
mandatory. For ordering TNPW with SnPb terminations
please refer to latest edition of datasheet TNPW
(www.vishay.com/doc?31006).
TNPU e3 ultra precision thin film flat chip resistors combine
the proven reliability of TNPW e3 products with a most
advanced level of precision and stability
(www.vishay.com/doc?28779).
TNPS .... ESCC high-reliability thin film chip resistors are the
premium choice for design and manufacture of equipment,
where matured technology and proven reliability are
of utmost importance. They are regularly used in
communication and research satellites and fit equally well
into aircraft and military electronic systems.
Approval of the TNPS .... ESCC products is granted by the
European Space Components Coordination and registered
in the ESCC Qualified Parts List, REP005
(www.vishay.com/doc?28789).
TNPV e3 High Voltage Thin Film Flat Chip Resistors are
designed for most fields of modern electronics where
precision, reliability and stability at high operating voltage
are primary concerns (www.vishay.com/doc?28881).
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474.
(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at
www.gadsl.org.
(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table.
TNPW e3
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FUNCTIONAL PERFORMANCE
Note
(1) Typical figures. HF-characteristic also depends on termination and circuit design.
Non-Linearity Current Noise
HF Performance (1) HF Performance (1)
HF Performance (1) HF Performance (1)
120
110
100
90
80
70
60 10 100 1K 10K 100K
Non-Linearity A
3
in dB
Resistance Value in Ω
TNPW0603
e3
TNPW1206
e3
TNPW0402
e3
TNPW0805
e3
3
2
1
100 1K 10K 100K 1M
Current Noise in
µV/V
Resistance Value in Ω
TNPW0402
e3
TNPW0805
e3
0.5
0.3
0.1
0.01
0.03
0.05
TNPW0603
e3
TNPW1206
e3
60
40
20
0
- 40
- 60
-80
1 5 10 50 100
Frequency f in MHz
Phase Angle in
ϑ°
TNPW0603
e3
10 Ω
100 Ω
1 k Ω
4.75 k Ω
10 k Ω
500 1000
60
40
20
0
- 20
- 40
- 60
-80
TNPW0603 e3
1510 50 100 500 1000
Frequency f in MHz
[Z]-RO in %
RO
10 Ω
100 Ω
1 k Ω
4.75 k Ω
10 k Ω
60
40
20
0
- 20
- 40
- 60
-80
Phase Angle in ϑ°
1 5 10 50 100 Frequency f in MHz
TNPW0805
e3
10 Ω
100 Ω
1 k Ω
10 k Ω
500 1000
60
40
20
0
- 20
- 40
- 60
-80
[Z]-RO in %
RO
1510 50 100 500 1000
Frequency f in MHz
TNPW0805 e3
10 Ω
100 Ω
1 k Ω
10 k Ω
TNPW e3
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FUNCTIONAL PERFORMANCE
Note
The solid line is based on IEC/EN reference test conditions which is considered as standard mode. However, above that the maximum
permissible film temperature is 155 °C (dashed line).
Derating - Standard Operation
155
°C
-55
50
0
W
100
70
Ambient Temparature
amb
Power Dissipation P
ϑ
125
0
0.1
0.3
0.5
0.6
0.2
0.4
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
Derating - Power Operation
155
°C
-55
50
0
W
100
70
Ambient Temparature
amb
Power Dissipation P
ϑ
125
0
0.1
0.3
0.5
0.6
0.2
0.4
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
TNPW e3
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FUNCTIONAL PERFORMANCE
Single-Pulse High Voltage Overload
Test 1.2/50 μs EN140000 4.27
Single-Pulse High Voltage Overload
Test 10/700 μs EN140000 4.27
Maximum Pulse Load Pi, max.
for Single Pulses
Maximum Pulse Load Pi, max.
for Continuous Pulses
Maximum Pulse Voltage Ui, max.
3K
1K
100
10 10R 100R 1K 10K 100K
Test Voltage in V
TNPW0805 e3
TNPW0603 e3
Resistance Value
in Ω
3K
1K
100
10
10R 100R 1K 10K 100K
Resistance Value
in Ω
Test Voltage in V
TNPW0805 e3
TNPW0603 e3
100 W
10 W
1W
0.1 W
10 µs
Pulse Duration
t
i
Permissible pulse power
P
i, max.
100 µs 1 ms 10 ms 100 ms 1 s 10 s
TNPW1206 e3
TNPW0805 e3
TNPW0603 e3
Conditions:
P
0, n 1000 and
U
i
U
i, max.
100 W
10 W
1W
0.1 W
10 µs
Permissible pulse power
P
i, max.
100 µs 1 ms 10 ms 100 ms 1 s 10 s
Pulse Duration
t
i
TNPW1206 e3
TNPW0805 e3
TNPW0603 e3
Conditions:
P
max.
P
max. (including derating)
and
U
i
U
i, max.
10 000 V
1000 V
100 V
10 V
10 µs
Pulse Duration
t
i
Permissible pulse voltage
U
i, max.
100 µs 1 ms 10 ms 100 ms 1 s 10 s
TNPW1206 e3
TNPW0805 e3
TNPW0603 e3
Conditions:
P
i
P
i, max.
TNPW e3
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TEST AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification
EN 60115-8 (successor of EN 140400), sectional
specification
EN 140401-801, detail specification
IEC 60068-2-xx, test methods
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
The testing also covers most of the requirements specified
by EIA / ECA-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days).
The components are mounted for testing on printed circuit
boards in accordance with EN 60115-8, 2.4.2, unless
otherwise specified.
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2 (1)
TEST METHOD TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
4.5 - Resistance - ± 1 %; ± 0.5 %; ± 0.1 %
4.8 - Temperature
coefficient
At (20 / -55 / 20) °C
and (20 / 125 / 20) °C
± 50 ppm/K; ± 25 ppm/K;
± 15 ppm/K; ± 10 ppm/K
4.25.1 -
Endurance
at 70 °C:
standard
operation
mode
U = or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.05 % R + 0.01 )
70 °C; 8000 h ±(0.1 % R + 0.02 )
Endurance
at 70 °C:
power
operation
mode
U = or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.1 % R + 0.01 )
70 °C; 8000 h ±(0.2 % R + 0.02 )
4.25.3 -
Endurance at
upper category
temperature
125 °C; 1000 h ± (0.05 % R + 0.01 )
155 °C; 1000 h ± (0.1 % R + 0.02 )
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH ± (0.1 % R + 0.01 )
4.37 67 (Cy)
Damp heat,
steady state
accelerated:
Standard
operation
mode
(85 ± 2) °C
(85 ± 5) % RH
U = ;
U 0.3 x Umax.; 1000 h
± (0.25 % R + 0.05 )
- 1 (Ab) Cold - 55 °C; 2 h ± (0.05 % R + 0.01 )
P70 x R
P70 x R
0.1 x P70 x R
TNPW e3
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4.19 14 (Na) Rapid change
of temperature
30 min at LCT and 30 min at UCT;
LCT = - 55 °C; UCT = 125 °C;
1000 cycles ± (0.1 % R + 0.01 )
4.13 -
Short time
overload:
standard
operation
mode
U = 2.5 x
or U = 2 x Umax.;
whichever is the less severe;
5 s
± (0.05 % R + 0.01 )
Short time
overload:
power
operation
mode
U = 2.5 x
or U = 2 x Umax.;
whichever is the less severe;
5 s
± (0.1 % R + 0.01 )
4.27 -
Single pulse
high voltage
overload:
standard
operation
mode
Severity no. 4:
U = 10 x or
U = 2 x Umax.;
whichever is the less severe;
10 pulses 10 μs/700 μs
± (0.5 % R + 0.02 )
no visible damage
Single pulse
high voltage
overload:
power
operation
mode
Severity no. 4:
U = 10 x or
U = 2 x Umax.;
whichever is the less severe;
10 pulses 10 μs/700 μs
± (1 % R + 0.02 )
no visible damage
4.39 -
Periodic
electric
overload:
standard
operation
mode
U =
or U = 2 x Umax.;
0.1 s on; 2.5 s off;
whichever is the less severe;
1000 cycles
± (0.5 % R + 0.05 )
no visible damage
Periodic
electric
overload:
power
operation
mode
U =
or U = 2 x Umax.;
0.1 s on; 2.5 s off;
whichever is the less severe;
1000 cycles
± (1 % R + 0.05 )
no visible damage
4.38 -
Electro static
discharge
(human body
model)
IEC 61340-3-1 (1);
3 pos. + 3 neg.
(equivalent to MIL-STD-883, method
3015)
TNPW0402 e3: 400 V
TNPW0603 e3: 1000 V
TNPW0805 e3: 1500 V
TNPW 1206 e3: 2000 V
±(0.5 % R + 0.05 )
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude 1.5 mm or
200 m/s2; 7.5 h
± (0.05 % R + 0.01 )
no visible damage
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2 (1)
TEST METHOD TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
P70 x R
P70 x R
15 x P70 x R
15 x P70 x R
TNPW e3
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Revision: 12-May-16 11 Document Number: 28758
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
4.17 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5; non-activated
flux
(235 ± 3) °C; (2 ± 0.2) s
4.18 58 (Td) Resistance to
soldering heat Solder bath method;
(260 ± 5) °C; (10 ± 1) s ± (0.02 % R + 0.01 )
4.29 45 (XA) Component
solvent
resistance
Isopropyl alcohol + 50 °C; method 2 No visible damage
4.32 21 (Ue3)Shear
(adhesion)
TNPW0402 e3 and TNPW0603 e3: 9 N No visible damage
TNPW0805 e3 and TNPW1206 e3: 45 N
4.33 21 (Ue1)Substrate
bending Depth 2 mm, 3 times ± (0.05 % R + 0.01 )
no visible damage,
no open circuit in bent position
4.7 - Voltage proof URMS = Uins; 60 ± 5 s No flashover or breakdown
4.35 - Flammability IEC 60695-11-5 (1),
needle flame test; 10 s No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2 (1)
TEST METHOD TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
TNPW e3
www.vishay.com Vishay
Revision: 12-May-16 12 Document Number: 28758
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DIMENSIONS
SOLDER PAD DIMENSIONS
DIMENSIONS AND MASS
TYPE / SIZE L
(mm)
W
(mm)
H
(mm)
Tt/Tb
(mm)
MASS
(mg)
TNPW0402 e3 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.2 ± 0.10 0.65
TNPW0603 e3 1.55 ± 0.05 0.85 ± 0.10 0.45 ± 0.10 0.3 ± 0.20 2
TNPW0805 e3 2.0 ± 0.1 1.25 ± 0.15 0.45 ± 0.10 0.4 ± 0.20 5.5
TNPW1206 e3 3.2 + 0.1 / - 0.2 1.6 ± 0.15 0.55 ± 0.10 0.5 ± 0.25 10
TNPW1210 e3 3.2 + 0.1 / - 0.2 2.45 ± 0.15 0.60 ± 0.15 0.5 ± 0.25 16
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
REFLOW SOLDERING WAVE SOLDERING
a
(mm)
b
(mm)
l
(mm)
a
(mm)
b
(mm)
l
(mm)
TNPW0402 e3 0.4 0.6 0.5 - - -
TNPW0603 e3 0.5 0.9 1.0 0.9 0.9 1.0
TNPW0805 e3 0.7 1.3 1.2 0.9 1.3 1.3
TNPW1206 e3 0.9 1.7 2.0 1.1 1.7 2.3
TNPW1210 e3 0.9 2.5 2.0 1.1 2.5 2.3
T
t
T
b
Legal Disclaimer Notice
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Revision: 08-Feb-17 1Document Number: 91000
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