ADC08DL502CIVV/NOPB - NATIONAL SEMICONDUCTOR

VREF

CLK/2

8-BIT

ADC1

VINI+

VINI-

DCLK+

DCLK-

Data Bus Output

16 LVDS Pairs

Selectable

DEMUX

OR/DCLK2

Control

Logic

8-BIT

ADC2

Data Bus Output

16 LVDS Pairs

3CalRun

S/H

VBG

CLK+

CLK-

Control

Inputs

Serial

Interface

DEMUX

LATCH

Selectable

DEMUX LATCH

VINQ+

VINQ-

Output

Clock

Generator

DId

DQd

ADC08DL502

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Low Power, 8-Bit, Dual 500 MSPS A/D Converter

Check for Samples: ADC08DL502

1FEATURES DESCRIPTION

The ADC08DL502 is a dual, low power, high

2• Single +1.9V ±0.1V Operation performance, CMOS analog-to-digital converter. The

• Duty Cycle Corrected Sample Clock ADC08DL502 digitizes signals to 8 bits of resolution

at sample rates up to 500 MSPS. Consuming a

KEY SPECIFICATIONS typical 1.2 Watts in demultiplex mode at 500 MSPS

from a single 1.9 Volt supply, this device is ensured

• Resolution: 8 Bits to have no missing codes over the full operating

• Max Conversion Rate: 500 MSPS temperature range. The unique folding and

• Code Error Rate: 10−18 (typ) interpolating architecture, the fully differential

comparator design, the innovative design of the

• ENOB @ 125 MHz Input: 7.5 Bits (typ) internal sample-and-hold amplifier and the calibration

• DNL: ±0.15 LSB (typ) schemes enable a very flat response of all dynamic

• Power Consumption parameters beyond Nyquist, producing a high 7.5

Effective Number of Bits (ENOB) with a 125 MHz

– Operating in 1:2 Demux Output: 1.25W (typ) input signal and a 500 MHz sample rate while

– Power Down Mode: 3.3 mW (typ) providing a 10−18 Code Error Rate (C.E.R.)

The converter typically consumes 3.3 mW in the

APPLICATIONS Power Down Mode and is available in a lead-free

• Satellite Modems 144-lead LQFP and operates over the modified

• Digital Oscilloscopes Industrial (-40°C ≤TA≤+70°C) temperature range.

• Direct RF Down Conversion

• Communications Systems

• Test Instrumentation

Block Diagram

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

GND

OutV/SCLK

OutEdge/DDR/SDATA

GND

VCMO

GND

VINI-

VINI+

GND

DR GND

FSR/ALT_ECE/DCLK_RST-

CLK+

CLK-

GND

VINQ+

VINQ-

GND

ADC08DL502

CAL

VBG

REXT

DR GND

Tdiode_p

Tdiode_n

DQd0+

DQd0-

DQd1+

DQd1-

DR GND

DQd2+

DQd2-

DQd3+

DQd3-

DQd4+

DQd4-

DQd5+

DQd5-

DRST_SEL

DR GND

DQd6+

DQd6-

DQd7+

DQd7-

DQ0+

DQ0-

DQ1+

DQ1-

DQ7+

DQ7-

OR+/DCLK2+

OR-/DCLK2-

DCLK-

DCLK+

DI7-

DI7+

DI6-

DI6+

DR GND

DI5-

DI5+

DI4-

DI4+

DI3-

DI3+

DI2-

DI2+

DQ4+

DQ4-

DQ5+

DQ5-

DR GND

DQ6+

DQ6-

DQ2+

DQ2-

DQ3+

DQ3-

128

123

118

113

PDQ

DCLK_RST/DCLK_RST+

VDR

CalRun

DId0+

DId0-

DId1+

DId1-

VDR

DNC

DId2+

DId2-

DId3+

DId3-

DId4+

DId4-

DId5+

DId5-

DNC

DId6+

DId6-

DId7+

DId7-

DI0+

DI0-

DI1+

DI1-

VDR

DNC

VDR

DR GND

144 NC

143

GND

ECE

DR GND

101

102

103

104

105

106

107

108

100

112

111

110

109

114

115

116

117

119

120

121

122

124

125

126

127

129

130

131

132

133

134

135

136

137

138

139

140

141

142 CalDly/SCS

ADC08DL502

SNAS582B –MARCH 2012–REVISED MARCH 2013

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Pin Configuration

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GND

50k

200k

8 pF

GND

50k

200k

8 pF

SDATA

DDR

GND

50k

ADC08DL502

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SNAS582B –MARCH 2012–REVISED MARCH 2013

Table 1. PIN DESCRIPTIONS AND EQUIVALENT CIRCUITS

Pin No. Symbol Equivalent Circuit Description

Output Voltage Amplitude and Serial Interface Clock. Tie this

pin high for normal differential DCLK and data amplitude.

Ground this pin for a reduced differential output amplitude

5 OutV / SCLK and reduced power consumption. When the extended control

mode is enabled, this pin functions as the SCLK input which

clocks in the serial data. For OutV functionality, see (1)

A logic high on the PDQ pin puts only the "Q" ADC into the

Power Down mode. For PDQ functionality, see (1)

31 PDQ

DCLK Edge Select, Double Data Rate Enable and Serial Data

Input. This input sets the output edge of DCLK+ at which the

OutEdge / DDR / output data transitions. When this pin is floating or connected

6SDATA to 1/2 the supply voltage, DDR clocking is enabled. When the

extended control mode is enabled, this pin functions as the

SDATA input. For OutEdge functionality, see (1)

DCLK Reset. When single-ended DCLK_RST is selected by

floating or setting pin 58 logic high, a positive pulse on this

pin is used to reset and synchronize the DCLK outputs of

DCLK_RST / multiple converters. When differential DCLK_RST is selected

17 DCLK_RST+ by setting pin 58 logic low, this pin receives the positive

polarity of a differential pulse signal used to reset and

synchronize the DCLK outputs of multiple converters. For

DCLK_RST, DCLK_RST+ functionality, see (1)

Power Down Pins. A logic high on the PD pin puts the entire

28 PD device into the Power Down Mode. For PD functionality, see

(1)

Calibration Cycle Initiate. A minimum tCAL_L input clock cycles

32 CAL logic low followed by a minimum of tCAL_H input clock cycles

high on this pin initiates the calibration sequence.

Full Scale Range Select, Alternate Extended Control Enable

and DCLK_RST-. This pin has three functions. It can

conditionally control the ADC full-scale voltage, enable the

extended control mode, or become the negative polarity

signal of a differential pair in differential DCLK_RST mode. If

pin 58 and pin 47 are floating or at logic high, this pin can be

used to set the full-scale-range or can be used as an

alternate extended control enable pin . When used as the

FSR pin, a logic low on this pin sets the full-scale differential

FSR/ALT_ECE/DC input range to a reduced VIN input level. A logic high on this

16 LK_RST- pin sets the full-scale differential input range to a higher VIN

input level. To enable the extended control mode, whereby

the serial interface and control registers are employed, allow

this pin to float or connect it to a voltage equal to VA/2. Note

that pin 47 overrides the extended control enable of this pin.

When pin 58 is held at logic low, this pin acts as the

DCLK_RST- pin. When in differential DCLK_RST mode, there

is no pin-controlled FSR and the full-scale-range is defaulted

to the higher VIN input level. For FSR, ALT_ECE,

DCLK_RST- functionality, see (1)

(1) This pin/bit functionality is not tested in production test; performance is tested in the specified/default mode only.

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GND

200k

8 pF

VCMO

Enable AC

Coupling

50k

AGND

50k

Control from VCMO

VCMO

150

AGND

100 VBIAS

50k

GND

50k

ADC08DL502

SNAS582B –MARCH 2012–REVISED MARCH 2013

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Table 1. PIN DESCRIPTIONS AND EQUIVALENT CIRCUITS (continued)

Pin No. Symbol Equivalent Circuit Description

Calibration Delay and Serial Interface Chip Select. With a

logic high or low on pin 16, and a logic high on pin 47, this pin

functions as Calibration Delay and sets the number of input

clock cycles after power up before calibration begins With pin

141 CalDly / SCS 16 floating, and a logic low on pin 47, this pin acts as the

enable pin for the serial interface input and the CalDly value

becomes "0" (short delay with no provision for a long power-

up calibration delay). For CalDly functionality, see (2)

LVDS Clock input pins for the ADC. The differential clock

20 CLK+ signal must be a.c. coupled to these pins. The input signal is

21 CLK−sampled on the falling edge of CLK+.

VINI+

VINI−

Analog signal inputs to the ADC. The differential full-scale

13 input range of this input is programmable using the FSR pin

12 16 in normal mode and the Input Full-Scale Voltage Adjust

24 register in the extended control mode. Refer to the VIN

VINQ+

25 specification in the Converter Electrical Characteristics for the

VINQ−full-scale input range in the normal mode.

Common Mode Voltage. This pin is the common mode output

in d.c. coupling mode and also serves as the a.c. coupling

mode select pin. When d.c. coupling is used, the voltage

9 VCMO output at this pin is required to be the common mode input

voltage at VIN+ and VIN−when d.c. coupling is used. This pin

should be grounded when a.c. coupling is used at the analog

inputs. This pin is capable of sourcing or sinking 100 μA.

(2) This pin/bit functionality is not tested in production test; performance is tested in the specified/default mode only.

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GND

10k

GND

10k

FS (PIN 14)

Tdiode_P

Tdiode_N

GND

ADC08DL502

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SNAS582B –MARCH 2012–REVISED MARCH 2013

Table 1. PIN DESCRIPTIONS AND EQUIVALENT CIRCUITS (continued)

Pin No. Symbol Equivalent Circuit Description

Bandgap output voltage capable of 100 μA source/sink and

33 VBG can drive a load up to 80 pF. For VBG functionality, see (3)

Calibration Running indication. This pin is at a logic high

140 CalRun when calibration is running. For CalRun functionality, see (3)

External bias resistor connection. Nominal value is 4.7 kΩ

34 REXT (±0.1%) to ground.

Temperature Diode Positive (Anode) and Negative (Cathode).

These pins may be used for die temperature measurements,

40 Tdiode_P however no specified accuracy is implied or enured. Noise

41 Tdiode_N coupling from adjacent output data signals has been shown

to affect temperature measurements using this feature. For

Tdiode_P, Tdiode_N functionality, see (3)

Extended Control Enable. This pin always enables and

disables Extended Control Enable. When this pin is set logic

high, the extended control mode is inactive and all control of

47 ECE the device must be through control pins only . When it is set

logic low, the extended control mode is active. This pin

overrides the Extended Control Enable signal set using pin

16.

DCLK_RST select. This pin selects whether the DCLK is

reset using a single-ended or differential signal. When this pin

is floating or logic high, the DCLK_RST operation is single-

ended and pin 16 functions as FSR/ALT_ECE. When this pin

is logic low, the DCLK_RST operation becomes differential

with functionality on pin 17 (DCLK_RST+) and pin 16

58 DRST_SEL (DCLK_RST-). When in differential DCLK_RST mode, there

is no pin-controlled FSR and the full-scale-range is defaulted

to the higher VIN input level. When pin 47 is set logic low, the

extended control mode is active and the Full-Scale Voltage

Adjust registers can be programmed. For DRST_SEL

functionality, see (3)

(3) This pin/bit functionality is not tested in production test; performance is tested in the specified/default mode only.

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VDR

DR GND

ADC08DL502

SNAS582B –MARCH 2012–REVISED MARCH 2013

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Table 1. PIN DESCRIPTIONS AND EQUIVALENT CIRCUITS (continued)

Pin No. Symbol Equivalent Circuit Description

93 / 88 DI7−/ DQ7−

94 / 87 DI7+ / DQ7+

95 / 86 DI6−/ DQ6−

96 / 85 DI6+ / DQ6+

99 / 82 DI5−/ DQ5−

100 / 81 DI5+ / DQ5+ I and Q channel LVDS Data Outputs that are not delayed in

101 / 80 DI4−/ DQ4−the output demultiplexer. Compared with the DId and DQd

102 / 79 DI4+ / DQ4+ outputs, these outputs represent the later time samples.

103 / 78 DI3−/ DQ3−These outputs should always be terminated with a 100 Ω

104 / 77 DI3+ / DQ3+ differential resistor.

105 / 76 DI2−/ DQ2−

106 / 75 DI2+ / DQ2+

114 / 67 DI1−/ DQ1−

115 / 66 DI1+ / DQ1+

116 / 65 DI0−/ DQ0−

117 / 64 DI0+ / DQ0+

118 / 63 DId7−/ DQd7−

119 / 62 DId7+ / DQd7+

120 / 61 DId6−/ DQd6−

121 / 60 DId6+ / DQd6+

125 / 56 DId5−/ DQd5−I and Q channel LVDS Data Outputs that are delayed by one

126 / 55 DId5+ / DQd5+ CLK cycle in the output demultiplexer. Compared with the

127 / 54 DId4−/ DQd4−DI/DQ outputs, these outputs represent the earlier time

128 / 53 DId4+ / DQd4+ sample. These outputs should be terminated with a 100 Ω

129 / 52 DId3−/ DQd3−differential resistor when enabled. In non-demultiplexed

130 / 51 DId3+ / DQd3+ mode, these outputs are disabled and are high impedance

131 / 50 DId2−/ DQd2−when enabled. When disabled, these outputs must be left

132 / 49 DId2+ / DQd2+ floating.

136 / 45 DId1−/ DQd1−

137 / 44 DId1+ / DQd1+

138 / 43 DId0−/ DQd0−

139 / 42 DId0+ / DQd0+ Out Of Range output. A differential high at these pins

indicates that the differential input is out of range (outside the

range ±VIN/2 as programmed by the FSR pin in non-extended

89 OR+/DCLK2+ control mode or the Input Full-Scale Voltage Adjust register

90 OR-/DCLK2- setting in the extended control mode). DCLK2 is the exact

mirror of DCLK and should output the same signal at the

same rate. For DCLK2+/- functionality, see (4)

Data Clock. Differential Clock outputs used to latch the output

data. Delayed and non-delayed data outputs are supplied

synchronous to this signal. In 1:2 demultiplexed mode, this

signal is at 1/2 the input clock rate in SDR mode and at 1/4

the input clock rate in the DDR mode. By default, the DCLK

outputs are not active during the termination resistor trim

section of the calibration cycle. If a system requires DCLK to

run continuously during a calibration cycle, the termination

92 DCLK+ resistor trim portion of the cycle can be disabled by setting

91 DCLK- the Resistor Trim Disable (RTD) bit to logic high in the

Extended Configuration Register (address 9h). This disables

all subsequent termination resistor trims after the initial trim

which occurs during the power on calibration. Therefore, this

output is not recommended as a system clock unless the

resistor trim is disabled. When the device is in the non-

demultiplexed mode, DCLK can only be in DDR mode and

the signal is at 1/2 the input clock rate.

4, 7, 10, 15,

18, 19, 22, VANONE Analog power supply pins. Bypass these pins to ground.

27, 30, 39,

142

46, 57, 68, Output Driver power supply pins. Bypass these pins to DR

83, 98, 113, VDR NONE GND.

124, 135

(4) This pin/bit functionality is not tested in production test; performance is tested in the specified/default mode only.

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Table 1. PIN DESCRIPTIONS AND EQUIVALENT CIRCUITS (continued)

Pin No. Symbol Equivalent Circuit Description

2, 3, 8, 11,

14, 23, 26, GND NONE Ground return for VA.

29, 35

48, 59, 70,

74, 84, 97, DR GND NONE Ground return for VDR.

107, 111,

122, 133

1, 36, 37,

38, 69, 71, Not Connected. These pins are not bonded and may be left

72, 73, 108, NC NONE floating or connected to any potential.

109, 110,

143, 144

112, 123, Do Not Connect. These pins are used for internal purposes

DNC NONE

134 and should not be connected, i.e. left floating. Do not ground.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

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Absolute Maximum Ratings(1)(2)(3)

Supply Voltage (VA, VDR) 2.2V

Supply Difference

VDR - VA0V to 100 mV

Voltage on Any Input Pin

(Except VIN+, VIN- ) −0.15V to (VA+0.15V)

Voltage on VIN+, VIN-

(Maintaining Common Mode) -0.15 to 2.5V

Ground Difference

|GND - DR GND| 0V to 100 mV

Input Current at Any Pin(4) ±25 mA

Package Input Current(4) ±50 mA

Junction Temperature TJ≤145°C

ESD Susceptibility(5) Human Body Model 2500V

Machine Model 250V

Charged Device Model 1000V

Storage Temperature −65°C to +150°C

(1) All voltages are measured with respect to GND = DR GND = 0V, unless otherwise specified.

(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. There is no specification of operation at the

Absolute Maximum Ratings. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific

performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply

only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test

conditions.

(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4) When the input voltage at any pin exceeds the power supply limits (that is, less than GND or greater than VA), the current at that pin

should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the

power supplies with an input current of 25 mA to two. This limit is not placed upon the power, ground and digital output pins.

(5) Human body model is 100 pF capacitor discharged through a 1.5 kΩresistor. Machine model is 220 pF discharged through ZERO

Ohms. Charged device model simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated

assembler) then rapidly being discharged.

Operating Ratings(1)(2)

Ambient Temperature Range(3) −40°C ≤TA≤+70°C

Supply Voltage (VA) +1.8V to +2.0V

Driver Supply Voltage (VDR) +1.8V to VA

Common Mode Input Voltage VCMO ± 50 mV

VIN+, VIN−Voltage Range (Maintaining Common Mode) 0V to 2.15V (100% duty cycle)

0V to 2.5V (10% duty cycle)

Ground Difference (|GND −DR GND|) 0V

CLK Pins Voltage Range 0V to VA

Differential CLK Amplitude 0.4VP-P to 2.0VP-P

Common Mode Input Voltage VCMO - 50mV < VCMI < VCMO + 50mV

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. There is no specification of operation at the

Absolute Maximum Ratings. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific

performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply

only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test

conditions.

(2) All voltages are measured with respect to GND = DR GND = 0V, unless otherwise specified.

(3) The 4-layer standard JEDEC thermal test board or 4LJEDEC is 4"x3" in size. The board has two embedded copper layers which cover

roughly the same size as the board. The copper thickness for the four layers, starting from the top one, is 2 oz., 1 oz., 1 oz., 2 oz.

Detailed description of the board can be found in the JESD 51-7 standard.

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I / O

GND

TO INTERNAL

CIRCUITRY

ADC08DL502

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SNAS582B –MARCH 2012–REVISED MARCH 2013

Package Thermal Resistance

Package θJA θJC psiJB

144-Lead, 43.6°C / W 12.5°C / W 39.0°C / W

LQFP

Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.

Static Converter Characteristics

The following specifications apply after calibration for VA= VDR = 1.9V; OutV = 1.9V; VIN FSR (a.c. coupled) = differential 840

mVP-P; CL= 10 pF; Differential, a.c. coupled Sine Wave Input Clock, fCLK = 500 MHz at 0.5 VP-P with 50% duty cycle; VBG =

Floating; Extended Control Mode default values; DDR 0° Mode; REXT = 4700 Ω±0.1%; 1:2 Output Demultiplex; Duty Cycle

Stabilizer on. Boldface limits apply for TA= TMIN to TMAX. All other limits TA= 25°C, unless otherwise noted.(1) (2).Units

Symbol Parameter Conditions Typ(3) Lim (Limits)

Resolution with No Missing Codes 8Bits

INL Integral Non-Linearity DC Coupled, 1 MHz Sine Wave ±0.3 ±0.9 LSB (max)

(Best fit) Overanged, SDR, Non-ECM, FSR

= High

DNL Differential Non-Linearity DC Coupled, 1 MHz Sine Wave ±0.15 ±0.75 LSB (max)

Overanged, SDR, Non-ECM, FSR

= High

VOFF Offset Error SDR, Non-ECM Mode −0.45 LSB

VOFF_ADJ Input Offset Adjustment Range(4) Extended Control Mode ±45 mV

PFSE Positive Full-Scale Error See (5) ±25 mV (max)

NFSE Negative Full-Scale Error See (5) ±25 mV (max)

Out of Range Output Code (VIN+) −(VIN−) > + Full Scale 255

(VIN+) −(VIN−) < −Full Scale 0

(1) The analog inputs are protected as shown below. Input voltage magnitudes beyond the Absolute Maximum Ratings may damage this

device.

(2) To ensure accuracy, it is required that VAand VDR be well bypassed. Each supply pin must be decoupled with separate bypass

capacitors. Additionally, achieving rated performance requires that the backside exposed pad be well grounded.

(3) Typical figures are at TA= 25°C, and represent most likely parametric norms. Test limits are ensured to TI's AOQL (Average Outgoing

Quality Level).

(4) Only the end points of the range, not the full sweep, are tested in production test.

(5) Calculation of Full-Scale Error for this device assumes that the actual reference voltage is exactly its nominal value. Full-Scale Error for

this device, therefore, is a combination of Full-Scale Error and Reference Voltage Error. For relationship between Gain Error and Full-

Scale Error, see Specification Definitions for Gain Error.

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Dynamic Converter Characteristics Units

Symbol Parameter Conditions Typ(1) Lim (Limits)

FPBW Full Power Bandwidth 2.0 GHz

Gain Flatness d.c. to 248 MHz ±0.8 dBFS

d.c. to 500 MHz ±1.0 dBFS

C.E.R. Code Error Rate 10−18 Error/

Sample

NPR Noise Power Ratio See (2) 38.4 dB

IMD3 3rd order Intermodulation Distortion fIN1 =111.47 MHz @ −7dBFS 71.4 dBFS

fIN2 =121.47 MHz @ −7dBFS 64.4 dBc

Noise Floor See (3) -135.4 dBm/Hz

-133.3 dBFS/Hz

ENOB Effective Number of Bits AIN = 125 MHz @ -0.5dBFS 7.5 6.8 bits

AIN = 248 MHz @ -0.5dBFS 7.6 bits (min)

SINAD Signal-to-Noise Plus Distortion AIN = 125 MHz @ -0.5dBFS 46.9 42.4 dB

Ratio AIN = 248 MHz @ -0.5dBFS 47.6 dB (min)

SNR Signal-to-Noise Ratio AIN = 125 MHz @ -0.5dBFS 47.8 43.5 dB

AIN = 248 MHz @ -0.5dBFS 48.5 dB (min)

THD Total Harmonic Distortion AIN = 125 MHz @ -0.5dBFS -54.2 -49 dB

AIN = 248 MHz @ -0.5dBFS -54.8 dB (max)

2nd Harm Second Harmonic Distortion AIN = 125 MHz @ -0.5dBFS −60 dB

AIN = 248 MHz @ -0.5dBFS -59 dB

3rd Harm Third Harmonic Distortion AIN = 125 MHz @ -0.5dBFS −68 dB

AIN = 248 MHz @ -0.5dBFS -60 dB

SFDR Spurious-Free dynamic Range AIN = 125 MHz @ -0.5dBFS 58.5 49 dB

AIN = 248 MHz @ -0.5dBFS 59.1 dB (min)

(1) Typical figures are at TA= 25°C, and represent most likely parametric norms. Test limits are ensured to TI's AOQL (Average Outgoing

Quality Level).

(2) The NPR was measured using an Agilent N6030A Arbitrary Waveform Generator (ARB) to generate the input signal. The "noise" portion

of the signal was created by tones spaced at 500 kHz and the "notch" was a 12.5 MHz absence of tones centered at 175 MHz.

(3) For the case where the inputs are shorted or terminted with 50Ω, the LSB of the ADC never transitions because the Noise Floor is

limited by quantization noise, not thermal noise. Therefore, the Noise Floor was measured with a low-level wideband input from 10 MHz

to 30 MHz; the noise floor was measured in the band from 126 MHz to 175 MHz.

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CIN, DIFF

CIN, PIN-TO-GND

VIN+

VIN-

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Analog Input/Output and Reference Characteristics Units

Symbol Parameter Conditions Typ(1) Lim (Limits)

Analog Inputs

VIN_FSR Analog Differential Input Full Scale Non-Extended Control Mode(2)

Range FSR Pin High, SDR 840 900 mVP-P

FSR Pin Low, SDR 650 mVP-P

Extended Control Mode(3)

FS_ADJ(15:7) = 1111 1111 1b840 mVP-P

FS_ADJ(15:7) = 1000 0000 0b700 mVP-P

(default)

FS_ADJ(15:7) = 0000 0000 0b560 mVP-P

CIN Analog Input Capacitance(4)(5)(6) Differential 0.02 pF

Each input pin to ground 1.6 pF

RIN Differential Input Resistance Measured at D.C. 140 Ω

Common Mode Output

VCMO Common Mode Output Voltage ICMO = ±100 µA 1.26 0.9 V (min)

1.6 V (max)

Bandgap Reference

VBG Bandgap Reference Output IBG = ±100 µA 1.26 V

Voltage

TC_VBG Bandgap Reference Voltage TA=−40°C to +70°C, 28 ppm/°C

Temperature Coefficient IBG = ±100 µA

CLOAD VBG Maximum Bandgap Reference load 80 pF

Capacitance

(1) Typical figures are at TA= 25°C, and represent most likely parametric norms. Test limits are ensured to TI's AOQL (Average Outgoing

Quality Level).

(2) This pin/bit functionality is not tested in production test; performance is tested in the specified/default mode only.

(3) Only the end points of the range, not the full sweep, are tested in production test.

(4) The analog and clock input capacitances are die capacitances only. Additional package capacitances of 0.65 pF differential and 0.95 pF

each pin to ground are isolated from the die capacitances by lead and bond wire inductances.

(5) This parameter is specified by design and is not tested in production.

(6) The differential and pin-to-ground input capacitances are lumped capacitance values from design; they are defined as shown below.

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I-Channel to Q-Channel Characteristics Units

Symbol Parameter Conditions Typ(1) Lim (Limits)

Offset Match 1 LSB

Positive Full-Scale Match Zero offset selected in Control 1 LSB

Negative Full-Scale Match Zero offset selected in Control 1 LSB

Phase Matching (I, Q) fIN = 500 MHz < 1 Degree

X-TALK Crosstalk from I (Aggressor) to Q Aggressor = 467 MHz F.S. −65 dB

(Victim) Channel Victim = 100 MHz F.S.

Crosstalk from Q (Aggressor) to I Aggressor = 467 MHz F.S. −65 dB

(Victim) Channel Victim = 100 MHz F.S.

(1) Typical figures are at TA= 25°C, and represent most likely parametric norms. Test limits are ensured to TI's AOQL (Average Outgoing

Quality Level).

Sampling Clock Characteristics Units

Symbol Parameter Conditions Typ(1) Lim (Limits)

VIN_CLK Differential Clock Input Level Sine Wave Clock 0.6 0.4 VP-P (min)

2.0 VP-P (max)

Square Wave Clock 0.6 0.4 VP-P (min)

2.0 VP-P (max)

RIN_CLK Sampling Clock Input Impedance Measured at D.C. 100 Ω

CIN_CLK Input Capacitance(2)(3) Differential 0.02 pF

Each input to ground 1.5 pF

VOSI Input Offset Voltage 1.2 V

(1) Typical figures are at TA= 25°C, and represent most likely parametric norms. Test limits are ensured to TI's AOQL (Average Outgoing

Quality Level).

(2) The analog and clock input capacitances are die capacitances only. Additional package capacitances of 0.65 pF differential and 0.95 pF

each pin to ground are isolated from the die capacitances by lead and bond wire inductances.

(3) This parameter is specified by design and is not tested in production.

Digital Control and Output Pin Characteristics Units

Symbol Parameter Conditions Typ(1) Lim (Limits)

Digital Control Pins

VIH Logic High Input Voltage(2) PD,CAL, OutV, PDQ, ECEb, 0.69 x VAV (min)

DRST_SEL

OUTEDGE, FSR, CalDly 0.815 x VAV (min)

VIL Logic Low Input Voltage(2) PD,CAL, OutV, PDQ, ECEb, 0.28 x VAV (max)

DRST_SEL

OUTEDGE, FSR, CalDly 0.21 x VAV (max)

CIN_DIG Input Capacitance(3)(4) Each input to ground 1.2 pF

Digital Output Pins

(1) Typical figures are at TA= 25°C, and represent most likely parametric norms. Test limits are ensured to TI's AOQL (Average Outgoing

Quality Level).

(2) This parameter is specified by design and/or characterization and is not tested in production.

(3) This parameter is specified by design and is not tested in production.

(4) The digital control pin capacitances are die capacitances only. Additional package capacitance of 1.6 pF each pin to ground are isolated

from the die capacitances by lead and bond wire inductances.

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Digital Control and Output Pin Characteristics (continued) Units

Symbol Parameter Conditions Typ(1) Lim (Limits)

VOD LVDS Differential Output Voltage Measured differentially, OutV = VA, 590 400 mVP-P

VBG = Floating(5)(6) (min)

850 mVP-P

(max)

Measured differentially, OutV = 432 mVP-P

GND, VBG = Floating(5)(6)

ΔVO DIFF Change in LVDS Output Swing ±1 mV

Between Logic Levels

VOS Output Offset Voltage VBG = Floating 0.8 V

VBG = VA(5)(6) 1.2 V

ΔVOS Output Offset Voltage Change ±1 mV

Between Logic Levels

IOS Output Short Circuit Current Output+ & Output −connected to ±4 mA

0.8V

ZODifferential Output Impedance 100 Ω

VOH CalRun H level output IOH =−400 µA(2) 1.65 V

VOL CalRun L level output IOH = 400 µA(2) 0.15 V

Differential DCLK Reset Pins (DCLK_RST)(7)

VCMI_DRST DCLK_RST Common Mode Input 1.25 V

Voltage

VID_DRST Differential DCLK_RST Input VIN_CLK VP-P

Voltage

RIN_DRST Differential DCLK_RST Input 100 Ω

Resistance

(5) Tying VBG to the supply rail will increase the output offset voltage (VOS) by 400 mV (typical), as shown in the VOS specification above.

Tying VBG to the supply rail will also affect the differential LVDS output voltage (VOD), causing it to increase by 40 mV (typical).

(6) This pin/bit functionality is not tested in production test; performance is tested in the specified/default mode only.

(7) This feature functionality is not tested in production test; performance is tested in the specified/default mode only.

Power Supply Characteristics Units

Symbol Parameter Conditions Typ(1) Lim (Limits)

IAAnalog Supply Current 1:2 Demux Output

PD = Low 494 650 mA (max)

PD = High 1.7 mA

IDR Output Driver Supply Current 1:2 Demux Output

PD = Low 168 275 mA (max)

PD = High 0.054 mA

PCPower Consumption 1:2 Demux Output

PD = Low 1.25 1.61 W (max)

PD = High 3.3 mW

(1) Typical figures are at TA= 25°C, and represent most likely parametric norms. Test limits are ensured to TI's AOQL (Average Outgoing

Quality Level).

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AC Electrical Characteristics Units

Symbol Parameter Conditions Typ(1) Lim (Limits)

Sampling Clock (CLK)

fCLK (max) Maximum Sampling Clock 500 MHz

Frequency

fCLK (min) Minimum Sampling Clock 200 MHz

Frequency

Sampling Clock Duty Cycle 200 MHz ≤fCLK ≤500 MHz(2) 50 20 % (min)

80 % (max)

tCL Sampling Clock Low Time See (3) 1000 400 ps (min)

tCH Sampling Clock High Time See (3) 1000 400 ps (min)

DCLK_RST(4)

tSR Setup Time DCLK_RST± Differential DCLK_RST(2) 90 ps

tHR Hold Time DCLK_RST± Differential DCLK_RST(2) 30 ps

tPWR Pulse Width DCLK_RST± See (3) 4CLK±

Cycles

(min)

Data Clock (DCLK)

DCLK Duty Cycle See (3) 50 45 % (min)

55 % (max)

tLHT Differential Low-to-High Transition 10% to 90% 150 ps

Time

tHLT Differential High-to-Low Transition 10% to 90% 150 ps

Time

tOSK DCLK-to-Data Output Skew 50% of DCLK transition to 50% of ±50 ps

Data transition

tSU Data-to-DCLK Set-Up Time DDR Mode, 90° DCLK(3) 750 ps

tHDCLK-to-Data Hold Time DDR Mode, 90° DCLK(3) 890 ps

Data Input-to-Output

tAD Sampling (Aperture) Delay Input CLK+ Fall to Acquisition of 1.6 ns

Data

tAJ Aperture Jitter 0.4 ps (rms)

tOD Input Clock-to Data Output Delay 50% of Input Clock transition to 4.0 ns

(in addition to Pipeline Delay) 50% of Data transition

tLAT Pipeline Delay (Latency) in 1:2 DI Outputs 13 Sampling

Demux Mode(3)(5) Clock

DId Outputs 14 Cycles

DQ Outputs 13

DQd Outputs 14

Pipeline Delay (Latency) in Non- DI Outputs 13

Demux Mode (3)(5) DQ Outputs 13

tORR Over Range Recovery Time Differential VIN step from ±1.2V to 1 Sampling

0V to get accurate conversion Clock

Cycle

tWU PD low to Rated Accuracy See (3) 500 ns

Conversion (Wake-Up Time)

(1) Typical figures are at TA= 25°C, and represent most likely parametric norms. Test limits are ensured to TI's AOQL (Average Outgoing

Quality Level).

(2) This parameter is specified by design and/or characterization and is not tested in production.

(3) This parameter is specified by design and is not tested in production.

(4) This feature functionality is not tested in production test; performance is tested in the specified/default mode only.

(5) Each of the two converters of the ADC08DL502 has two LVDS output buses, which each clock data out at one half the sample rate. The

data at each bus is clocked out at one half the sample rate. The second bus (D0 through D7) has a pipeline latency that is one Input

Clock cycle less than the latency of the first bus (Dd0 through Dd7) in 1:2 demux mode.

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Serial Port Interface Units

Symbol Parameter Conditions Typ(1) Lim (Limits)

fSCLK Serial Clock Frequency See (2) 15 MHz

Serial Clock Low Time 33.3 ns (min)

Serial Clock High Time 33.3 ns (min)

tSSU Serial Data to Serial Clock Rising See (2) 2.5 ns (min)

Setup Time

tSH Serial Data to Serial Clock Rising See (2) 1 ns (min)

Hold Time

tSCS CS to Serial Clock Rising Setup 2.5 ns

Time

tHCS CS to Serial Clock Falling Hold 1.5 ns

Time

(1) Typical figures are at TA= 25°C, and represent most likely parametric norms. Test limits are ensured to TI's AOQL (Average Outgoing

Quality Level).

(2) This parameter is ensured by design and is not tested in production.

Calibration Units

Symbol Parameter Conditions Typ(1) Lim (Limits)

tCAL Calibration Cycle Time Rtrim enabled 1.4 x 1061.62 x 106Clock

Cycles

Rtrim disabled 1.2 x 1061.35 x 106(max)

tCAL_L CAL Pin Low Time See (2) 1280 Clock

Cycles

tCAL_H CAL Pin High Time See (2) 1280 (min)

tCalDly Calibration Delay determined by CalDly = Low(3) 226 Clock

CalDly pin(2) Cycles

CalDly = High(3) 232 (max)

(1) Typical figures are at TA= 25°C, and represent most likely parametric norms. Test limits are ensured to TI's AOQL (Average Outgoing

Quality Level).

(2) This parameter is specified by design and is not tested in production.

(3) This pin/bit functionality is not tested in production test; performance is tested in the specified/default mode only.

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VD+

VD-

VOS

GND VOD = | VD+ - VD- | x 2

VOD

VD-

VD+

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Specification Definitions

APERTURE (SAMPLING) DELAY is the amount of delay, measured from the sampling edge of the Clock input,

after which the signal present at the input pin is sampled inside the device.

APERTURE JITTER (tAJ)is the variation in aperture delay from sample to sample. Aperture jitter shows up as

input noise.

CODE ERROR RATE (C.E.R.) is the probability of error and is defined as the probable number of word errors on

the ADC output per unit of time divided by the number of words seen in that amount of time. A C.E.R. of 10-18

corresponds to a statistical error in one word about every four (4) years.

CLOCK DUTY CYCLE is the ratio of the time that the clock waveform is at a logic high to the total time of one

clock period.

DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1

LSB. Measured at sample rate = 500 MSPS with a 1MHz input sinewave.

EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise

and Distortion Ratio, or SINAD. ENOB is defined as (SINAD −1.76) / 6.02 and says that the converter is

equivalent to a perfect ADC of this (ENOB) number of bits.

FULL POWER BANDWIDTH (FPBW) is a measure of the frequency at which the reconstructed output

fundamental drops 3 dB below its low frequency value for a full-scale input.

GAIN ERROR is the deviation from the ideal slope of the transfer function. It can be calculated from Offset and

Full-Scale Errors:

Positive Gain Error = Offset Error −Positive Full-Scale Error

Negative Gain Error = −(Offset Error −Negative Full-Scale Error)

Gain Error = Negative Full-Scale Error −Positive Full-Scale Error = Positive Gain Error + Negative Gain Error

INTEGRAL NON-LINEARITY (INL) is a measure of worst case deviation of the ADC transfer function from an

ideal straight line drawn through the ADC transfer function. The deviation of any given code from this straight line

is measured from the center of that code value step. The best fit method is used

INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components as a result of two

sinusoidal frequencies being applied to the ADC input at the same time. It is defined as the ratio of the power in

the second and third order intermodulation products to the power in one of the original frequencies. IMD is

usually expressed in dBFS.

LSB (LEAST SIGNIFICANT BIT) is the bit that has the smallest value or weight of all bits. This value is

VFS / 2N

where VFS is the differential full-scale amplitude VIN as set by the FSR input and "n" is the ADC resolution in bits,

and which is 8 for the ADC08DL502.

LOW VOLTAGE DIFFERENTIAL SIGNALING (LVDS) DIFFERENTIAL VOLTAGE (VID and VOD)is two times

the absolute value of the difference between the VD+ and VD−signals; each measured with respect to Ground.

LVDS OUTPUT OFFSET VOLTAGE (VOS)is the midpoint between the D+ and D−pins output voltage with

respect to ground, i.e., [(VD+)+(VD−)] / 2.

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THD = 20 x log + . . . + AAf22

f102

Af12

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MISSING CODES are those output codes that are skipped and will never appear at the ADC outputs. These

codes cannot be reached with any input value.

MSB (MOST SIGNIFICANT BIT) is the bit that has the largest value or weight. Its value is one half of full scale.

NEGATIVE FULL-SCALE ERROR (NFSE) is a measure of how far the first code transition is from the ideal 1/2

LSB above a differential −VIN/2. For the ADC08DL502 the reference voltage is assumed to be ideal, so this error

is a combination of full-scale error and reference voltage error.

OFFSET ERROR (VOFF)is a measure of how far the mid-scale point is from the ideal zero voltage differential

input.

Offset Error = Actual Input causing average of 8k samples to result in an average code of 127.5.

OUTPUT DELAY (tOD)is the time delay (in addition to Pipeline Delay) after the falling edge of CLK+ before the

data update is present at the output pins.

OVER-RANGE RECOVERY TIME is the time required after the differential input voltages goes from ±1.2V to 0V

for the converter to recover and make a conversion with its rated accuracy.

PIPELINE DELAY (LATENCY) is the number of input clock cycles between initiation of conversion and when

that data is presented to the output driver stage. New data is available at every clock cycle, but the data lags the

conversion by the Pipeline Delay plus the tOD.

POSITIVE FULL-SCALE ERROR (PFSE) is a measure of how far the last code transition is from the ideal 1-1/2

LSB below a differential +VIN/2. For the ADC08DL502 the reference voltage is assumed to be ideal, so this error

is a combination of full-scale error and reference voltage error.

POWER SUPPLY REJECTION RATIO (PSRR) can be one of two specifications. PSRR1 (DC PSRR) is the ratio

of the change in full-scale error that results from a power supply voltage change from 1.8V to 2.0V. PSRR2 (AC

PSRR) is a measure of how well an a.c. signal injected on the power supply is rejected from the output and is

measured with a 125 MHz, 50 mVP-P signal riding upon the power supply. It is the ratio of the output amplitude of

that signal at the output to its amplitude on the power supply pin. PSRR is expressed in dB.

SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal at the output

to the rms value of the sum of all other spectral components below one-half the sampling frequency, not

including harmonics or d.c.

SIGNAL TO NOISE PLUS DISTORTION (S/(N+D) or SINAD) is the ratio, expressed in dB, of the rms value of

the input signal at the output to the rms value of all of the other spectral components below half the input clock

frequency, including harmonics but excluding d.c.

SPURIOUS-FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the

input signal at the output and the peak spurious signal, where a spurious signal is any signal present in the

output spectrum that is not present at the input, excluding d.c.

TOTAL HARMONIC DISTORTION (THD) is the ratio expressed in dB, of the rms total of the first nine harmonic

levels at the output to the level of the fundamental at the output. THD is calculated as

(1)

where Af1 is the RMS power of the fundamental (output) frequency and Af2 through Af10 are the RMS power of

the first 9 harmonic frequencies in the output spectrum.

•Second Harmonic Distortion (2nd Harm) is the difference, expressed in dB, between the RMS power in the

input frequency seen at the output and the power in its 2nd harmonic level at the output

•Third Harmonic Distortion (3rd Harm) is the difference expressed in dB between the RMS power in the

input frequency seen at the output and the power in its 3rd harmonic level at the output.

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ACTUAL

POSITIVE

FULL-SCALE

TRANSITION

-VIN/2

ACTUAL NEGATIVE

FULL-SCALE TRANSITION

1111 1111 (255)

1111 1110 (254)

1111 1101 (253)

MID-SCALE

TRANSITION

(VIN+) < (VIN-) (VIN+) > (VIN-)

0.0V

Differential Analog Input Voltage (+VIN/2) - (-VIN/2)

Output

Code

OFFSET

ERROR

1000 0000 (128)

0111 1111 (127)

0000 0000 (0)

0000 0001 (1)

0000 0010 (2)

IDEAL

POSITIVE

FULL-SCALE

TRANSITION

POSITIVE

FULL-SCALE

ERROR

NEGATIVE

FULL-SCALE

ERROR

IDEAL NEGATIVE

FULL-SCALE TRANSITION

+VIN/2

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Transfer Characteristic

Figure 1. Input / Output Transfer Characteristic

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tOD

tAD

Sample N

Sample N+1

Sample N-1

VIN

CLK, CLK

DCLK+, DCLK-

(0° Phase)

DId, DI

DQd, DQ Sample N-14 and Sample N-13

Sample N-16 and Sample N-15

Sample N-18 and

Sample N-17

tOSK

DCLK+, DCLK-

(90° Phase)

tSU tH

tOD

tAD

Sample N

Sample N+1

Sample N-1

VIN

CLK, CLK

DCLK+, DCLK-

(OutEdge = 0)

DId, DI

DQd, DQ Sample N-16 and Sample N-15

Sample N-18 and

Sample N-17 Sample N-14 and Sample N-13

DCLK+, DCLK-

(OutEdge = 1)

tOSK

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TIMING DIAGRAMS

Figure 2. ADC08DL502 Timing — SDR Clocking in 1:2 Demultiplexed Mode

Figure 3. ADC08DL502 Timing — DDR Clocking in 1:2 Demultiplexed Mode

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CLK

Synchronizing Edge

DCLK+

tHR

DCLK_RST-

tPWR

tSR

DCLK_RST+ tOD

SCLK

112 13 16 17 32

Single Register Access

SCS

SDATA Fixed Header Pattern Register Address

MSB LSB

tSSU

tSH

tSCS

tHCS tHCS

tOD

tAD

Sample N

Sample N+1

Sample N-1

VIN

CLK, CLK

DCLK+, DCLK-

(0° Phase)

DId, DI

DQd, DQ Sample N-14

Sample N-15

tOSK

Sample N-13 Sample N-12 Sample N-11

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Figure 4. ADC08DL502 Timing — DDR Clocking in Non-Demultiplexed Mode

Figure 5. Serial Interface Timing

Figure 6. Clock Reset Timing in DDR Mode

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CalRun

POWER

SUPPLY

CAL

tCAL

Calibration Delay

determined by

CalDly Pin (127)

tCalDly

tCAL_L

tCAL_H

CLK

Synchronizing Edge

DCLK+

tHR

tPWR

tSR

OUTEDGE

DCLK_RST-

DCLK_RST+ tOD

CLK

DCLK_RST-

Synchronizing Edge

DCLK+

tHR

tPWR

tSR

OUTEDGE

tOD

DCLK_RST+

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Figure 7. Clock Reset Timing in SDR Mode with OUTEDGE Low

Figure 8. Clock Reset Timing in SDR Mode with OUTEDGE High

Figure 9. Power-up Calibration and On-Command Calibration Timing

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0 100 200 300 400 500

0.8

1.0

1.2

1.4

1.6

POWER (W)

CLOCK FREQUENCY (MHz)

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Typical Performance Characteristics

VA= VDR = 1.9V, fCLK = 500 MHz, fIN = 125 MHz, TA= 25°C, I channel, 1:2 Demux Mode (1:1 Demux Mode has similar

performance), unless otherwise stated.

INL vs. CODE INL vs. AMBIENT TEMPERATURE

Figure 10. Figure 11.

DNL vs. CODE DNL vs. AMBIENT TEMPERATURE

Figure 12. Figure 13.

POWER CONSUMPTION vs. CLOCK FREQUENCY GAIN STABILITY vs. DIE TEMPERATURE

Figure 14. Figure 15.

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0 50 100 150 200 250

-100

-80

-60

-40

-20

MAGNITUDE (dBFS)

FREQUENCY (MHz)

0 50 100 150 200 250

-100

-80

-60

-40

-20

AMPLITUDE (dBFS)

FREQUENCY (MHz)

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Typical Performance Characteristics (continued)

VA= VDR = 1.9V, fCLK = 500 MHz, fIN = 125 MHz, TA= 25°C, I channel, 1:2 Demux Mode (1:1 Demux Mode has similar

performance), unless otherwise stated.

SIGNAL GAIN vs. INPUT FREQUENCY CROSSTALK vs. SOURCE FREQUENCY

Figure 16. Figure 17.

SPECTRAL RESPONSE AT fIN = 125 MHz SPECTRAL RESPONSE AT fIN = 248 MHz

Figure 18. Figure 19.

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FUNCTIONAL DESCRIPTION

NOTE

NOT ALL OF THE PINS, BITS, AND FEATURES WHICH ARE MENTIONED IN THIS

SECTION ARE TESTED IN PRODUCTION TEST. SEE NOTES (1)(2)(3)(4) IN THE PIN

DESCRIPTIONS and EQUIVALENT CIRCUITS, THE CONVERTER ELECTRICAL

CHARACTERISTICS TABLES, (Table 4 and Table 5), AND THE REGISTER

DESCRIPTION FOR A DETAILED EXPLANATION OF WHAT IS TESTED. IF THE

SYSTEM APPLICATION REQUIRES ADDITIONAL FEATURES OF THE PRODUCT TO

BE TESTED, CONTACT YOUR TI SALES REPRESENTATIVE.

The ADC08DL502 is a versatile A/D Converter with an innovative architecture permitting very high speed

operation. The controls available ease the application of the device to circuit solutions. Optimum performance

requires adherence to the provisions discussed here and in the Applications Information Section.

While it is generally poor practice to allow an active pin to float, pins 6 and 16 of the ADC08DL502 are designed

to be left floating without jeopardy. In all discussions throughout this data sheet, whenever a function is called by

allowing a control pin to float, connecting that pin to a potential of one half the VAsupply voltage will have the

same effect as allowing it to float.

OVERVIEW

The ADC08DL502 uses a calibrated folding and interpolating architecture that achieves 7.5 effective bits. The

use of folding amplifiers greatly reduces the number of comparators and power consumption. Interpolation

reduces the number of front-end amplifiers required, minimizing the load on the input signal and further reducing

power requirements. In addition to other things, on-chip calibration reduces the INL bow often seen with folding

architectures. The result is an extremely fast, high performance, low power converter.

The analog input signal that is within the converter's input voltage range is digitized to eight bits at speeds of 200

MSPS to 500 MSPS. Differential input voltages below negative full-scale will cause the output word to consist of

all zeroes. Differential input voltages above positive full-scale will cause the output word to consist of all ones.

Either of these conditions at either the "I" or "Q" input will cause the OR (Out of Range) output to be activated.

This single OR output indicates when the output code from one or both of the channels is below negative full

scale or above positive full scale.

Each converter has a selectable output demultiplexer which feeds two LVDS buses. If the 1:2 demultiplexed

mode is selected, the output data rate is reduced to half the input sample rate on each bus. When non-

demultiplexed mode is selected, that output data rate on channels DI and DQ are at the same rate as the input

sample clock.

The output levels may be selected to be normal or reduced. Using reduced levels saves power but could result in

erroneous data capture of some or all of the bits, especially at higher sample rates and in marginally designed

systems.

Calibration

A calibration is performed upon power-up and can also be invoked by the user upon command. Calibration trims

the analog input differential termination resistor and minimizes full-scale error, offset error, DNL and INL,

resulting in maximizing SNR, THD, SINAD (SNDR) and ENOB. Internal bias currents are also set with the

calibration process. All of this is true whether the calibration is performed upon power up or is performed upon

command. Running the calibration is an important part of this chip's functionality and is required in order to obtain

adequate performance. In addition to the requirement to be run at power-up, an on-command calibration must be

run whenever the sense of the FSR pin is changed. For best performance, we recommend that an on-command

calibration be run 20 seconds or more after application of power and whenever the operating temperature

changes significantly relative to the specific system performance requirements. See On-Command Calibration for

more information. Calibration can not be initiated or run while the device is in the power-down mode. See Power

Down for information on the interaction between Power Down and Calibration.

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In normal operation, calibration is performed just after application of power and whenever a valid calibration

command is given, which is holding the CAL pin low for at least tCAL_L clock cycles, then hold it high for at least

another tCAL_H clock cycles as defined in the Converter Electrical Characteristics. The time taken by the

calibration procedure is specified as tCALin Converter Electrical Characteristics. Holding the CAL pin high upon

power up will prevent the calibration process from running until the CAL pin experiences the above-mentioned

tCAL_L clock cycles followed by tCAL_H clock cycles.

CalDly (pin 141) is used to select one of two delay times that apply from the application of power to the start of

calibration. This calibration delay time is depedent on the setting of the CalDly pin and is specified as tCalDly in the

Converter Electrical Characteristics. These delay values allow the power supply to come up and stabilize before

calibration takes place. If the PD pin is high upon power-up, the calibration delay counter will be disabled until the

PD pin is brought low. Therefore, holding the PD pin high during power up will further delay the start of the

power-up calibration cycle. The best setting of the CalDly pin depends upon the power-on settling time of the

power supply.

The CAL bit does not reset itself to zero automatically, but must be manually reset before another calibration

event can be initiated. If no further calibration event is desired, the CAL bit may be left high indefinitely, with no

negative consequences. The RTD bit setting is critical for running a calibration event with the Clock Phase Adjust

enabled. If initiating a calibration event while the Clock Phase Adjust is enabled, the RTD bit must be set to high,

or no calibration will occur. If initiating a calibration event while the Clock Phase Adjust is not enabled, a normal

calibration will occur, regardless of the setting of the RTD bit.

Acquiring the Input

In 1:2 demux mode, data is acquired at the falling edge of CLK+ (pin 20) and the digital equivalent of that data is

available at the digital outputs 13 input clock cycles later for the DI and DQ output buses and 14 input clock

cycles later for the DId and DQd output buses. There is an additional internal delay called tOD before the data is

available at the outputs. See the Timing Diagram. The ADC08DL502 will convert as long as the input clock signal

is present. The fully differential comparator design and the innovative design of the sample-and-hold amplifier,

together with calibration, enables a very flat SINAD/ENOB response beyond 1 GHz. The ADC08DL502 output

data signaling is LVDS and the output format is offset binary.

Control Modes

Much of the user control can be accomplished with several control pins that are provided. Examples include

initiation of the calibration cycle, power down mode and full scale range setting. However, the ADC08DL502 also

provides an Extended Control mode whereby a serial interface is used to access register-based control of

several advanced features. The Extended Control mode is not intended to be enabled and disabled dynamically.

Rather, the user is expected to employ either the normal control mode or the Extended Control mode at all times.

When the device is in the Extended Control mode, pin-based control of several features is replaced with register-

based control and those pin-based controls are disabled. These pins are OutV (pin 5), OutEdge/DDR (pin 6),

FSR (pin 16) and CalDly (pin 141). See NORMAL/EXTENDED CONTROL for details on the Extended Control

mode.

The Analog Inputs

The ADC08DL502 must be driven with a differential input signal. Operation with a single-ended signal is not

allowed. It is important that the inputs either be a.c. coupled to the inputs with the VCMO pin grounded, or d.c.

coupled with the VCMO pin left floating. An input common mode voltage equal to the VCMO output must be

provided when d.c. coupling is used.

Two full-scale range settings are provided with pin 16 (FSR). A high on pin 16 causes an input full-scale range

setting of a higher VIN input level, while grounding pin 16 causes an input full-scale range setting of a reduced

VIN input level. The full-scale range setting operates equally on both ADCs.

In the Extended Control mode, programming the Input Full-Scale Voltage Adjust register allows the input full-

scale range to be adjusted as described in REGISTER DESCRIPTION and THE ANALOG INPUT.

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Clocking

The ADC08DL502 must be driven with an a.c. coupled, differential clock signal. THE CLOCK INPUTS describes

the use of the clock input pins. A differential LVDS output clock is available for use in latching the ADC output

data into whatever device is used to receive the data.

The ADC08DL502 offers two output clocking options. These are a choice of which DCLK edge the output data

transitions on, and a choice of Single Data Rate (SDR) or Double Data Rate (DDR) outputs.

The ADC08DL502 also has the option to use a duty cycle corrected clock receiver as part of the input clock

circuit. This feature is enabled by default and provides improved ADC clocking. This circuitry allows the ADC to

be clocked with a signal source having a duty cycle ratio of 20% / 80% (worst case).

Table 2. Input Channel Samples Produced at Data Outputs in 1:2 Demultiplexed Mode(1)

Data Outputs

(Always sourced with respect to fall of DCLK+)

DI "I" Input Sampled with Fall of CLK 13 cycles earlier.

DId "I" Input Sampled with Fall of CLK 14 cycles earlier.

DQ "Q" Input Sampled with Fall of CLK 13 cycles earlier.

DQd "Q" Input Sampled with Fall of CLK 14 cycles after being sampled.

(1) Note that, in the non-demultiplexed mode, the DId and DQd outputs are disabled and are high impedance.

Table 3. Input Channel Samples Produced at Data Outputs in Non-Demultiplexed Mode

Data Outputs

(Sourced with respect to fall of DCLK+)

DI "I" Input Sampled with Fall of CLK 13 cycles earlier.

DId No output.

DQ "Q" Input Sampled with Fall of CLK 13 cycles earlier.

DQd No output.

OutEdge and Demultiplex Control Setting

To help ease data capture in the SDR mode, the output data may be caused to transition on either the positive or

the negative edge of the output data clock (DCLK). In the non-extended control mode, this is chosen with the

OutEdge input (pin 6). A high on the OutEdge input pin causes the output data to transition on the rising edge of

DCLK+, while grounding this input causes the output to transition on the falling edge of DCLK+. See Output

Edge Synchronization. When in the extended control mode, the OutEdge is selected using the OED bit in the

Configuration Register. This bit has two functions. In the single data rate (SDR) mode, the bit functions as

OutEdge and selects the DCLK edge with which the data transitions. In the Double Data Rate (DDR) mode, this

bit selects whether the device is in non-demultiplex or 1:2 demultiplex mode. In the DDR case, the DCLK has a

0° phase relationship with the output data independent of the demultiplexer selection. For 1:2 Demux DDR 0°

Mode, there are four, as opposed to three cycles of CLK systematic delay from the Synchronizing Edge to the

start of tOD. See MULTIPLE ADC SYNCHRONIZATION for more details.

Single Data Rate and Double Data Rate

A choice of single data rate (SDR) or double data rate (DDR) output is offered. With single data rate the output

clock (DCLK) frequency is the same as the data rate of the two output buses. With double data rate the DCLK

frequency is half the data rate and data is sent to the outputs on both edges of DCLK. DDR clocking is enabled

in non-Extended Control mode by allowing pin 6 to float.

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The LVDS Outputs

The data outputs, the Out Of Range (OR) and DCLK, are LVDS. The electrical specifications of the LVDS

outputs are compatible with typical LVDS receivers available on ASIC and FPGA chips; but they are not IEEE or

ANSI communications standards compliant due to the low +1.9V supply used this chip. User is given the choice

of a lower signal amplitude mode with OutV control pin or the OV control register bit. For short LVDS lines and

low noise systems, satisfactory performance may be realized with the OutV input low, which results in lower

power consumption. If the LVDS lines are long and/or the system in which the ADC08DL502 is used is noisy, it

may be necessary to tie the OutV pin high.

The LVDS data output have a typical common mode voltage when the VBG pin is unconnected and floating. This

common mode voltage can be increased by tying the VBG pin to VAif a higher common mode is required.

NOTE

Tying the VBG pin to VAwill also increase the differential LVDS output voltage by up to 40

mV.

Power Down

The ADC08DL502 is in the active state when the Power Down pin (PD) is low. When the PD pin is high, the

device is in the power down mode. In this power down mode the data output pins (positive and negative) are put

into a high impedance state and the devices power consumption is reduced to a minimal level. The DCLK+/- and

OR +/- are not tri-stated, they are weakly pulled down to ground internally. Therefore when both I and Q are

powered down the DCLK +/- and OR +/- should not be terminated to a DC voltage.

A high on the PDQ pin will power down the "Q" channel and leave the "I" channel active. There is no provision to

power down the "I" channel independently of the "Q" channel. Upon return to normal operation, the pipeline will

contain meaningless information.

If the PD input is brought high while a calibration is running, the device will not go into power down until the

calibration sequence is complete. However, if power is applied and PD is already high, the device will not begin

the calibration sequence until the PD input goes low. If a manual calibration is requested while the device is

powered down, the calibration will not begin at all. That is, the manual calibration input is completely ignored in

the power down state. Calibration will function with the "Q" channel powered down, but that channel will not be

calibrated if PDQ is high. If the "Q" channel is subsequently to be used, it is necessary to perform a calibration

after PDQ is brought low.

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NORMAL/EXTENDED CONTROL

The ADC08DL502 may be operated in one of two modes. In the simpler standard control mode, the user affects

available configuration and control of the device through several control pins. The "extended control mode"

provides additional configuration and control options through a serial interface and a set of 9 registers. Extended

control mode is selected by setting pin 47 to logic low. If pin 47 is floating and pin 58 is floating or logic high, pin

16 can be used to enable the extended control mode. The choice of control modes is required to be a fixed

selection and is not intended to be switched dynamically while the device is operational.

Table 4 shows how several of the device features are affected by the control mode chosen.

Table 4. Features and Modes

Feature Normal Control Mode Extended Control Mode

Selected with nDE in the Configuration Register (Addr-1h;

SDR or DDR Clocking Selected with pin 6 bit-10).

Selected with DCP in the Configuration Register (Addr-1h;

DDR Clock Phase(1) Not Selectable (0° Phase Only) bit-11).

SDR Data transitions with rising edge of

SDR Data transitions with rising Selected with OED in the Configuration Register (Addr-1h;

DCLK+ when pin 6 is high and on falling

or falling DCLK edge bit-8).

edge when low.

Normal differential data and DCLK Selected with OV in the Configuration Register (Addr-1h; bit-

LVDS output level(1) amplitude selected when pin 5 is high and 9).

reduced amplitude selected when low.

Short delay selected when pin 141 is low

Power-On Calibration Delay(1) Short delay only.

and longer delay selected when high.

Normal input full-scale range selected Up to 512 step adjustments over a nominal range specified

when pin 16 is high and reduced range in REGISTER DESCRIPTION. Separate range selected for

Full-Scale Range(2) when low. Selected range applies to both I- and Q-Channels. Selected using Full Range Registers

channels. (Addr-3h and Bh; bit-7 thru 15).

512 steps of adjustment using the Input Offset register

Input Offset Adjust(2) Not possible specified in REGISTER DESCRIPTION for each channel

using Input Offset Registers (Addr-2h and Ah; bit-7 thru 15).

A test pattern can be made present at the data outputs by

Test Pattern Not possible setting TPO to 1b in Extended Configuration Register (Addr-

9h; bit-15).

The DCLK outputs will continuously be present when RTD is

Resistor Trim Disable Not possible set to 1b in Extended Configuration Register (Addr-9h; bit-

14 to 7).

If the device is set in DDR, the output can be programmed

to be non-demultiplex. When OED in Configuration Register

Selectable Output Demultiplexer Not possible is set 1b (Addr-1h; bit-8), this selects non-demultiplex. If

OED is set 0b, this selects 1:2 demultiplex.

The OR outputs can be programmed to become a second

Second DCLK Output(1) Not possible DCLK output when nSD is set 0b in Configuration Register

(Addr-1h; bit-13).

The sampling clock phase can be manually adjusted

Sampling Clock Phase Adjust(3) Not possible through the Coarse and Intermediate Register (Addr-Fh; bit-

15–7) and Fine Register (Addr-Eh; bit-15 to 8).

(1) This feature functionality is not tested in production test; performance is tested in the specified/default mode only.

(2) Only the end points of the range, not the full sweep, are tested in production test.

(3) Coarse and intermediate step size are tested in major steps only in production test; fine step size is not tested.

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The default state of the Extended Control Mode is set upon power-on reset (internally performed by the device)

and is shown in Table 5.

Table 5. Extended Control Mode Operation (Pin 41 Logic Low or Pin 14 Floating)

Feature Extended Control Mode Default State

SDR or DDR Clocking DDR Clocking

DDR Clock Phase(1) Data changes with DCLK edge (0° phase)

LVDS Output Amplitude(1) Higher value indicated in Electrical Table

Calibration Delay(1) Short Delay

Full-Scale Range(2) 700 mV nominal for both channels

Input Offset Adjust(2) No adjustment for either channel

Test Pattern Not present at output

Resistor Trim Disable Trim enabled, DCLK not continuously present at output

Selectable Output Demultiplexer 1:2 demultiplex

Second DCLK Output(1) Not present, pins 89 and 90 function as OR+ and OR-

Sampling Clock Phase Adjust(3) No adjustment for fine, intermediate or coarse

(1) This feature functionality is not tested in production test; performance is tested in the specified/default mode only.

(2) Only the end points of the range, not the full sweep, are tested in production test.

(3) Coarse and intermediate step size are tested in major steps only in production test; fine step size is not tested.

THE SERIAL INTERFACE

NOTE

During the initial write using the serial interface, all nine registers must be written with

desired or default values. Subsequent writes to single registers are allowed.

The 3-pin serial interface is enabled only when the device is in the Extended Control mode. The pins of this

interface are Serial Clock (SCLK), Serial Data (SDATA) and Serial Interface Chip Select (SCS). Nine write only

registers are accessible through this serial interface.

SCS: This signal should be asserted low while accessing a register through the serial interface. Setup and hold

times with respect to the SCLK must be observed.

SCLK: Serial data input is accepted at the rising edge of this signal. There is no minimum frequency requirement

for SCLK.

SDATA: Each register access requires a specific 32-bit pattern at this input. This pattern consists of a header,

SCLK must be observed. See the Timing Diagram.

Each Register access consists of 32 bits, as shown in Figure 5 of the Timing Diagrams. The fixed header pattern

is 0000 0000 0001 (eleven zeros followed by a 1). The loading sequence is such that a "0" is loaded first. These

12 bits form the header. The next 4 bits are the address of the register that is to be written to and the last 16 bits

are the data written to the addressed register. The addresses of the various registers are indicated in Table 6.

Refer to the REGISTER DESCRIPTION for information on the data to be written to the registers.

Subsequent register accesses may be performed immediately, starting with the 33rd SCLK. This means that the

SCS input does not have to be de-asserted and asserted again between register addresses. It is possible,

although not recommended, to keep the SCS input permanently enabled (at a logic low) when using extended

control.

Control register contents are retained when the device is put into power-down mode.

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NOTE

Do not write to the Serial Interface when calibrating the ADC. Doing so will impair the

performance of the device until it is re-calibrated correctly. Programming the serial

registers will also reduce dynamic performance of the ADC for the duration of the register

access time.

Table 6. Register Addresses

4-Bit Address

Loading Sequence:

A3 loaded after Fixed Header pattern, A0 loaded last

A3 A2 A1 A0 Hex Register Addressed

0 0 0 0 0h Calibration

0 0 0 1 1h Configuration

0 0 1 0 2h "I" Ch Offset

0 0 1 1 3h "I" Ch Full-Scale Voltage Adjust

0 1 0 0 4h Reserved

0 1 0 1 5h Reserved

0 1 1 0 6h Reserved

0 1 1 1 7h Reserved

1 0 0 0 8h Reserved

1 0 0 1 9h Extended Configuration

1 0 1 0 Ah "Q" Ch Offset

1 0 1 1 Bh "Q" Ch Full-Scale Voltage Adjust

1 1 0 0 Ch Reserved

1 1 0 1 Dh Reserved

1 1 1 0 Eh Sampling Clock Phase Fine Adjust

1 1 1 1 Fh Sample Clock Phase Intermediate and Coarse

Adjust

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NOTE

NOT ALL OF THE PINS, BITS, AND FEATURES WHICH ARE MENTIONED IN THIS

SECTION ARE TESTED IN PRODUCTION TEST. SEE NOTES (1)(2)(3)(4) IN PIN

DESCRIPTIONS and EQUIVALENT CIRCUITS, THE CONVERTER ELECTRICAL

CHARACTERISTICS TABLES (Table 4 and Table 5), AND THE REGISTER

DESCRIPTION FOR A DETAILED EXPLANATION OF WHAT IS TESTED. IF THE

SYSTEM APPLICATION REQUIRES ADDITIONAL FEATURES OF THE PRODUCT TO

BE TESTED, CONTACT YOUR TI SALES REPRESENTATIVE.

Nine write-only registers provide several control and configuration options in the Extended Control Mode. These

registers have no effect when the device is in the Normal Control Mode. Each register description below also

shows the Power-On Reset (POR) state of each control bit.

Table 7. Calibration Register

Addr: 0h (0000b) Write only (0x7FFF)

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

CAL111111111111111

Bit 15 CAL: Calibration Enable. When this bit is set 1b, an on-command calibration cycle is initiated. This function is

exactly the same as issuing an on-command calibration using the CAL pin. (1)

POR State: 0b

Bits 14:0 Must be set to 1b

(1) This pin/bit functionality is not tested in production test; performance is tested in the specified/default mode only.

Table 8. Configuration Register

Addr: 1h (0001b) Write only (0xB2FF)

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

1 0 nSD DCS DCP nDE OV OED 1 1 1 1 1 1 1 1

Bit 15 Must be set to 1b

Bit 14 Must be set to 0b

Bit 13 nSD: Second DCLK Output Enable. When this bit is 1b, the device only has one DCLK output and one OR

output. When this bit is 0b, the device has two identical DCLK outputs and no OR output.(1)

POR State: 1b

Bit 12 DCS: Duty Cycle Stabilizer. When this bit is set to 1b, a duty cycle stabilization circuit is applied to the clock

input. When this bit is set to 0b the stabilization circuit is disabled. (1)

POR State: 1b

Bit 11 DCP: DDR Clock Phase. This bit only has an effect in the DDR mode. When this bit is set to 0b, the DCLK

edges are time-aligned with the data bus edges ("0° Phase"). When this bit is set to 1b, the DCLK edges are

placed in the middle of the data bit-cells ("90° Phase"), using the one-half speed DCLK shown in Figure 3 as

the phase reference.(1)

POR State: 0b

Bit 10 nDE: DDR Enable. When this bit is set to 0b, data bus clocking follows the DDR (Double Data Rate) mode

whereby a data word is output with each rising and falling edge of DCLK. When this bit is set to a 1b, data bus

clocking follows the SDR (single data rate) mode whereby each data word is output with either the rising or

falling edge of DCLK , as determined by the OutEdge bit.

POR State: 0b

(1) This pin/bit functionality is not tested in production test; performance is tested in the specified/default mode only.

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Bit 9 OV: Output Voltage. This bit determines the LVDS outputs' voltage amplitude and has the same function as the

OutV pin that is used in the normal control mode. When this bit is set to 1b, the standard output amplitude is

used. When this bit is set to 0b, the reduced output amplitude is used. (1)

POR State: 1b

Bit 8 OED: Output Edge and Demultiplex Control. This bit has two functions. When the device is in SDR mode, this

bit selects the DCLK edge with which the data words transition and has the same effect as the OutEdge pin in

the Non-extended control mode. When this bit is set to 1b, the data outputs change with the rising edge of

DCLK+. When this bit is set to 0b, the data output changes with the falling edge of DCLK+. When the device is

in DDR mode, this bit selects the non-demultiplexed mode when set to 1b. When the bit set to 0b, the device is

programmed into the Demultiplexed mode. If the device is in DDR and Non-Demultiplexed Mode, then the

DCLK has a 0° phase relationship with the data; it is not possible to select the 90° phase relationship.

POR State: 0b

Bits 7:0 Must be set to 1b

NOTE

It is recommended that this register should only be written upon power-up initialization as

writing it may cause disturbance on the DCLK output as this signal's basic configuration is

changed.

Table 9. I-Channel Offset(1)

Addr: 2h (0010b) Write only (0x007F)

(1) Only the end points of the range, not the full sweep, are tested in production test.

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

(MSB) Offset Value (LSB) Sign 1 1 1 1 1 1 1

Bits 15:8 Offset Value. The input offset of the I-Channel ADC is adjusted linearly and monotonically by the value in this

field. 00h provides a nominal zero offset, while FFh provides a nominal 45 mV of offset. Thus, each code step

provides 0.176 mV of offset.

POR State: 0000 0000 b

Bit 7 Sign bit. 0b gives positive offset, 1b gives negative offset, resulting in total offset adjustment of ±45 mV.

POR State: 0b

Bits 6:0 Must be set to 1b

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Table 10. I-Channel Full-Scale Voltage Adjust(1)

Addr: 3h (0011b) Write only (0x807F)

(1) Only the end points of the range, not the full sweep, are tested in production test.

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

(MSB) Adjust Value (LSB) 1 1 1 1 1 1 1

Bits 15:7 Full Scale Voltage Adjust Value. The input full-scale voltage or gain of the I-Channel ADC is adjusted linearly and

monotonically with a 9 bit data value. The adjustment range is ±20% of the nominal 700 mVP-P differential value.

0000 0000 0 560mVP-P

1000 0000 0 700mVP-P

Default Value

1111 1111 1 840mVP-P

For best performance, it is recommended that the value in this field be limited to the range of 0110 0000 0b to

1110 0000 0b. i.e., limit the amount of adjustment to ±15%. The remaining ±5% headroom allows for the ADC's

own full scale variation. A gain adjustment does not require ADC re-calibration.

POR State: 1000 0000 0b (no adjustment)

Bits 6:0 Must be set to 1b

Table 11. Extended Configuration Register

Addr: 9h (1001b) Write only (0x03FF)

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

TPORTD00001111111111

Bit 15 TPO: Test Pattern Output. When this bit is set 1b, the ADC is disengaged and a test pattern generator is

connected to the outputs including OR. This test pattern will work with the device in the SDR, DDR and the

non-demultiplex output modes.

POR State: 0b

Bit 14 RTD: Resistor Trim Disable. When this bit is set to 1b, the input termination resistor is not trimmed during the

calibration cycle and the DCLK output remains enabled. Note that the ADC is calibrated regardless of this

setting.

POR State: 0b

Bit 13:10 Must be set to 0b

Bits 9:0 Must be set to 1b

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Table 12. Q-Channel Offset(1)

Addr: Ah (1010b) Write only (0x007F)

(1) Only the end points of the range, not the full sweep, are tested in production test.

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D5 4 D3 D2 D1 D0

(MSB) Offset Value (LSB) Sign 1 1 1 1 1 1 1 1

Bits 15:8 Offset Value. The input offset of the Q-Channel ADC is adjusted linearly and monotonically by the value in this

field. 00h provides a nominal zero offset, while FFh provides a nominal 45 mV of offset. Thus, each code step

provides about 0.176 mV of offset.

POR State: 0000 0000 b

Bit 7 Sign bit. 0b gives positive offset, 1b gives negative offset.

POR State: 0b

Bits 6:0 Must be set to 1b

Table 13. Q-Channel Full-Scale Voltage Adjust(1)

Addr: Bh (1011b) Write only (0x807F)

(1) Only the end points of the range, not the full sweep, are tested in production test.

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

(MSB) Adjust Value (LSB) 1 1 1 1 1 1 1

Bits 15:7 Full Scale Voltage Adjust Value. The input full-scale voltage or gain of the I-Channel ADC is adjusted linearly

and monotonically with a 9 bit data value. The adjustment range is ±20% of the nominal 700 mVP-P differential

value.

0000 0000 0 560 mVP-P

1000 0000 0 700 mVP-P

1111 1111 1 840 mVP-P

For best performance, it is recommended that the value in this field be limited to the range of 0110 0000 0b to

1110 0000 0b. i.e., limit the amount of adjustment to ±15%. The remaining ±5% headroom allows for the ADC's

own full scale variation. A gain adjustment does not require ADC re-calibration.

POR State: 1000 0000 0b (no adjustment)

Bits 6:0 Must be set to 1b

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Table 14. Sample Clock Phase Fine Adjust(1)

Addr: 1110 Write only (0x00FF)

(1) Coarse and intermediate step size are tested in major steps only in production test; fine step size is not tested.

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

(MSB) Fine Phase Adjust (LSB) 1 1 1 1 1 1 1 1

Bits 15:8 Fine Phase Adjust. The phase of the ADC sampling clock is adjusted monotonically by the value in this field.

00h provides a nominal zero phase adjustment, while FFh provides a nominal 50 ps of delay. Thus, each code

step provides approximately 0.2 ps of delay.

POR State: 0000 0000b

Bits 7:0 Must be set to 1b

Table 15. Sample Clock Phase Intermediate/Coarse Adjust(1)

Addr: Fh (1111b) Write only (0x007F)

(1) Coarse and intermediate step size are tested in major steps only in production test; fine step size is not tested.

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

POL (MSB) Coarse Phase Adjust IPA (LSB) 1 1 1 1 1 1 1

Bit 15 Polarity Select. When this bit is selected, the polarity of the ADC sampling clock is inverted.

POR State: 0b

Bits 14:10 Coarse Phase Adjust. Each code value in this field delays the sample clock by approximately 65 ps. A value of

00000b in this field causes zero adjustment.

POR State: 00000b

Bits 9:7 Intermediate Phase Adjust. Each code value in this field delays the sample clock by approximately 11 ps. A

value of 000b in this field causes zero adjustment. Maximum combined adjustment using Coarse Phase Adjust

and Intermediate Phase adjust is approximately 2.1ns.

POR State: 000b

Bits 6:0 Must be set to 1b

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Note Regarding Clock Phase Adjust

This is a feature intended to help the system designer remove small imbalances in clock distribution traces at the

board level when multiple ADCs are used. Please note, however, that enabling this feature will reduce the

dynamic performance (ENOB, SNR, SFDR) some finite amount. The amount of degradation increases with the

amount of adjustment applied. The user is strongly advised to (a) use the minimal amount of adjustment; and (b)

verify the net benefit of this feature in his system before relying on it.

Note Regarding Extended Mode Offset Correction

When using the I or Q channel Offset Adjust registers, the following information should be noted.

For offset values of +0000 0000 and −0000 0000, the actual offset is not the same. By changing only the sign bit

in this case, an offset step in the digital output code of about 1/10th of an LSB is experienced. This is shown

more clearly in the Figure below.

Figure 20. Extended Mode Offset Behavior

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MULTIPLE ADC SYNCHRONIZATION

The ADC08DL502 has the capability to precisely reset its sampling clock input to DCLK output relationship as

determined by the user-supplied DCLK_RST pulse. This allows multiple ADCs in a system to have their DCLK

(and data) outputs transition at the same time with respect to the shared CLK input that all the ADCs use for

sampling.

The DCLK_RST signal must observe some timing requirements that are shown in Figure 6,Figure 7 and

Figure 8 of the Timing Diagrams. The DCLK_RST pulse must be of a minimum width and its deassertion edge

must observe setup and hold times with respect to the CLK input rising edge. The duration of the DCLK_RST

pulse affects the length of time that the digital output will take before providing valid data again after the end of

the reset condition. Therefore, the DCLK_RST pulse width should be made reasonably short within the system

application constraints. These timing specifications are listed as tRH, tRS, and tPWR in the Converter Electrical

Characteristics.

The DCLK_RST signal can be asserted asynchronous to the input clock. If DCLK_RST is asserted, the DCLK

output is held in a designated state. The state in which DCLK is held during the reset period is determined by the

mode of operation (SDR/DDR) and the setting of the Output Edge configuration pin or bit. (Refer to Figure 6,

Figure 7 and Figure 8 for the DCLK reset state conditions). Therefore, depending upon when the DCLK_RST

signal is asserted, there may be a narrow pulse on the DCLK line during this reset event. When the DCLK_RST

signal is de-asserted in synchronization with the CLK rising edge, there are three or four CLK cycles of

systematic delay and the next CLK falling edge synchronizes the DCLK output with those of other ADC08DL502s

in the system. The DCLK output is enabled again after a constant delay (relative to the input clock frequency)

which is equal to the CLK input to DCLK output delay (tOD). The device always exhibits this delay characteristic in

normal operation. The user has the option of using a single-ended DCLK_RST signal, but a differential

DCLK_RST is strongly recommended due to its superior timing specifications.

As shown in Figure 6,Figure 7, and Figure 8 of the Timing Diagrams, there is a delay from the deassertion of

DCLK_RST to the reappearance of DCLK, which is equal to several cycles of CLK plus tOD. Note that the

deassertion of DCLK_RST is not latched in until the next falling edge of CLK. For 1:2 Demux DDR 0° Mode,

there are four CLK cycles of delay; for all other modes, there are three CLK cycles of delay.

If the device is not programmed to allow DCLK to run continuously, DCLK will become inactive during a

calibration cycle. Therefore, it is strongly recommended that DCLK only be used as a data capture clock and not

as a system clock.

The DCLK_RST pin should NOT be brought high while the calibration process is running (while CalRun is high).

Doing so could cause a digital glitch in the digital circuitry, resulting in corruption and invalidation of the

calibration.

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ADC TEST PATTERN

To aid in system debug, the ADC08DL502 has the capability of providing a test pattern at the four output ports

completely independent of the input signal. The ADC is disengaged and a test pattern generator is connected to

the outputs including OR. Each port is given a unique 8-bit word, alternating between 1's and 0's as described in

Table 16 and Table 17.

Table 16. Test Pattern by Output Port in

1:2 Demultiplex Mode

Time Qd Id Q I OR Comments

T0 01h 02h 03h 04h 0

T1 FEh FDh FCh FBh 1 Pattern Sequence

T2 01h 02h 03h 04h 0 n

T3 FEh FDh FCh FBh 1

T4 01h 02h 03h 04h 0

T5 01h 02h 03h 04h 0

T6 FEh FDh FCh FBh 1 Pattern Sequence

T7 01h 02h 03h 04h 0 n+1

T8 FEh FDh FCh FBh 1

T9 01h 02h 03h 04h 0

T10 01h 02h 03h 04h 0 Pattern Sequence n+2

T11 ... ... ... ... ...

With the part programmed into the non-demultiplex mode, the test pattern’s order will be as described in

Table 17.

Table 17. Test Pattern by Output Port in

Non-demultiplex Mode

Time Q I OR Comments

T0 01h 02h 0

T1 FEh FDh 1

T2 01h 02h 0

T3 01h 02h 0

T4 FEh FDh 1 Pattern Sequence

T5 FEh FDh 1

T6 01h 02h 0

T7 01h 02h 0

T8 FEh FDh 1

T9 01h 02h 0

T10 01h 02h 0

T11 FEh FDh 1

T12 01h 02h 0 Pattern Sequence

n+1

T13 01h 02h 0

T14 FEh FDh 1

T15 ... ... ...

It is possible for the I and the Q channels' test patterns to be not synchronized. Either I and Id or Q and Qd

patterns may be slipped by one DCLK.

To ensure that the test pattern starts synchronously in each port, set DCLK_RST while writing the Test Pattern

Output bit in the Extended Configuration Register. The pattern appears at the data output ports when

DCLK_RST is cleared low. The test pattern will work at speed and will work with the device in the SDR, DDR

and the non-demultiplex output modes.

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Applications Information

THE REFERENCE VOLTAGE

The voltage reference for the ADC08DL502 is derived from a 1.254V bandgap reference, a buffered version of

which is made available at pin 33, VBG, for user convenience.

This output has an output current capability of ±100 μA and should be buffered if more current than this is

required.

There is no provision for the use of an external reference voltage, but the full-scale input voltage can be adjusted

through a Configuration Register in the Extended Control mode, as explained in NORMAL/EXTENDED

CONTROL.

Differential input signals up to the chosen full-scale level will be digitized to 8 bits. Signal excursions beyond the

full-scale range will be clipped at the output. These large signal excursions will also activate the OR output for

the time that the signal is out of range. See Out Of Range (OR) Indication.

One extra feature of the VBG pin is that it can be used to raise the common mode voltage level of the LVDS

outputs. The output offset voltage (VOS) is at its nominal value when the VBG pin is used as an output or left

unconnected. To raise the LVDS offset voltage, the VBG pin can be connected directly to the supply rails.

THE ANALOG INPUT

The analog input is a differential one to which the signal source may be a.c. coupled or d.c. coupled. In the

normal mode, the full-scale input range is selected using the FSR pin as specified in the Converter Electrical

Characteristics. In the Extended Control mode, the full-scale input range is selected by programming the Full-

Scale Voltage Adjust register through the Serial Interface. For best performance when adjusting the input full-

scale range in the Extended Control, refer to REGISTER DESCRIPTION for guidelines on limiting the amount of

adjustment

Table 18 gives the input to output relationship with the FSR pin high when the normal (non-extended) mode is

used. With the FSR pin grounded, the millivolt values in Table 18 are reduced to 75% of the values indicated. In

the Enhanced Control Mode, these values will be determined by the full scale range and offset settings in the

Control Registers.

Table 18. Differential Input To Output Relationship

(Non-Extended Control Mode, FSR High)

VIN+ VIN−Output Code

VCM −217.5 mV VCM + 217.5 mV 0000 0000

VCM −109 mV VCM + 109 mV 0100 0000

0111 1111 /

VCM VCM 1000 0000

VCM + 109 mV VCM −109 mV 1100 0000

VCM + 217.5 mV VCM −217.5 mV 1111 1111

The buffered analog inputs simplify the task of driving these inputs and the RC pole that is generally used at

sampling ADC inputs is not required. If it is desired to use an amplifier circuit before the ADC, use care in

choosing an amplifier with adequate noise and distortion performance and adequate gain at the frequencies used

for the application.

Note that a precise d.c. common mode voltage must be present at the ADC inputs. This common mode voltage,

VCMO, is provided on-chip when a.c. input coupling is used and the input signal is a.c. coupled to the ADC.

When the inputs are a.c. coupled, the VCMO output must be grounded, as shown in Figure 21. This causes the

on-chip VCMO voltage to be connected to the inputs through on-chip 50 kΩresistors.

NOTE

An Analog input channel that is not used should be connected to ac-ground (ie, capacitors

to ground) when the inputs are a.c. coupled. Do not connect an unused analog input

directly to ground.

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VIN-

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100:

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VIN-

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Figure 21. Differential Input Drive

When the d.c. coupled mode is used, a common mode voltage must be provided at the differential inputs. This

common mode voltage should track the VCMO output pin. Note that the VCMO output potential will change with

temperature. The common mode output of the driving device should track this change.

NOTE

An analog input channel that is not used should be tied to the VCMO voltage when the

inputs are d.c. coupled. Do not connect unused analog inputs to ground.

Full-scale distortion performance falls off rapidly as the input common mode

voltage deviates from VCMO. This is a direct result of using a very low supply voltage

to minimize power. Keep the input common voltage within 50 mV of VCMO.

Performance is as good in the d.c. coupled mode as it is in the a.c. coupled mode, provided the input common

mode voltage at both analog inputs remain within 50 mV of VCMO.

Handling Single-Ended Input Signals

There is no provision for the ADC08DL502 to adequately process single-ended input signals. The best way to

handle single-ended signals is to convert them to differential signals before presenting them to the ADC. The

easiest way to accomplish single-ended to differential signal conversion is with an appropriate balun-connected

transformer, as shown in Figure 22.

A.C. Coupled Input

The easiest way to accomplish single-ended a.c. input to differential A.C. signal is by using an appropriate balun,

as shown in Figure 22.

Figure 22. Single-Ended to Differential Signal Conversion Using a Balun

Figure 22 is a generic depiction of a single-ended to differential signal conversion using a balun. The circuitry

specific to the balun will depend upon the type of balun selected and the overall board layout. It is recommended

that the system designer contact the manufacturer of the balun they have selected to aid in designing the best

performing single-ended to differential conversion circuit using that particular balun.

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VIN-

VIN+

VCMO

LMV321

LMH6555

RADJ+

3.3V

RT2

50:

RT1

50:

RF1

RF2

RG1

RG2

VCM_REF

50:

100:

50:

Signal

Input with

dc-coupled

50:

output

impedance

50:

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When selecting a balun, it is important to understand the input architecture of the ADC. There are specific balun

parameters of which the system designer should be mindful. A designer should match the impedance of their

analog source to the ADC08DL502's on-chip differential input termination resistor. The range of this termination

resistor is described in the electrical table as the specification RIN.

Also, the phase and amplitude balance are important. The lowest possible phase and amplitude imbalance is

desired when selecting a balun. The phase imbalance should be no more than ±2.5° and the amplitude

imbalance should be limited to less than 1dB at the desired input frequency range. Finally, when selecting a

balun, the VSWR (Voltage Standing Wave Ratio), bandwidth and insertion loss of the balun should also be

considered. The VSWR aids in determining the overall transmission line termination capability of the balun when

interfacing to the ADC input. The insertion loss should be considered so that the signal at the balun output is

within the specified input range of the ADC as described in the Converter Electrical Characteristics as the

specification VIN.

D.C. Coupled Input

When D.C. coupling to the ADC08DL502 analog inputs is required, single-ended to differential conversion may

be easily accomplished with the LMH6555, as shown in Figure 23. In such applications, the LMH6555 performs

the task of single-ended to differential conversion while delivering low distortion and noise, as well as output

balance, that supports the operation of the ADC08DL502. Connecting the ADC08DL502 VCMO pin to the VCM_REF

pin of the LMH6555, through an appropriate buffer, will ensure that the common mode input voltage is as needed

for optimum performance of the ADC08DL502. The LMV321 was chosen to buffer VCMD for its low voltage

operation and reasonable offset voltage.

Be sure to limit output current from the ADC08DL502 VCMO pin to 100 μA

Figure 23. Example of Servoing the Analog Input with VCMO

In Figure 23, RADJ-and RADJ+ are used to adjust the differential offset that can be measured at the ADC inputs

VIN+ / VIN-with LMH6555's input terminated to ground as shown but not driven and with no RADJ resistors applied.

An unadjusted positive offset with reference to VIN-greater than |15mV| should be reduced with a resistor in the

RADJ-position. Likewise, an unadjusted negative offset with reference to VIN-greater than |15mV| should be

reduced with a resistor in the RADJ+ position. Table 19 gives suggested RADJ-and RADJ+ values for various

unadjusted differential offsets to bring the VIN+ / VIN-offset back to within |15mV|.

Table 19. D.C. Coupled Offset Adjustment

Unadjusted Offset Reading Resistor Value

0mV to 10mV no resistor needed

11mV to 30mV 20.0kΩ

31mV to 50mV 10.0kΩ

51mV to 70mV 6.81kΩ

71mV to 90mV 4.75kΩ

91mV to 110mV 3.92kΩ

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Out Of Range (OR) Indication

When the conversion result is clipped the Out of Range output is activated such that OR+ goes high and OR-

goes low. This output is active as long as accurate data on either or both of the buses would be outside the

range of 00h to FFh. Note that when the device is programmed to provide a second DCLK output, the OR

signals become DCLK2. Refer to REGISTER DESCRIPTION

Full-Scale Input Range

As with all A/D Converters, the input range is determined by the value of the ADC's reference voltage. The

reference voltage of the ADC08DL502 is derived from an internal band-gap reference. The FSR pin controls the

effective reference voltage of the ADC08DL502 such that the differential full-scale input range at the analog

inputs is a normal amplitude with the FSR pin high, or a reduced amplitude with FSR pin low as defined by the

specification VIN in the Converter Electrical Characteristics. Best SNR is obtained with FSR high, but better

distortion and SFDR are obtained with the FSR pin low. The LMH6555 of is Figure 23 suitable for any Full Scale

Range.

THE CLOCK INPUTS

The ADC08DL502 has differential LVDS clock inputs, CLK+ and CLK−, which must be driven with an a.c.

coupled, differential clock signal. Although the ADC08DL502 is tested and its performance is ensured with a

differential 1 GHz clock, it typically will function well with input clock frequencies indicated in the Converter

Electrical Characteristics. The clock inputs are internally terminated and biased. The input clock signal must be

capacitively coupled to the clock pins as indicated in Figure 24.

Operation up to the sample rates indicated in the Converter Electrical Characteristics is typically possible if the

maximum ambient temperatures indicated are not exceeded. Operating at higher sample rates than indicated for

the given ambient temperature may result in reduced device reliability and product lifetime. This is because of the

higher power consumption and die temperatures at high sample rates. Important also for reliability is proper

thermal management . See Thermal Management.

Figure 24. Differential (LVDS) Input Clock Connection

The differential input clock line pair should have a characteristic impedance of 100 Ωand (when using a balun),

be terminated at the clock source in that (100 Ω) characteristic impedance. The input clock line should be as

short and as direct as possible. The ADC08DL502 clock input is internally terminated with an untrimmed 100 Ω

resistor.

Insufficient input clock levels will result in poor dynamic performance. Excessively high clock levels could cause a

change in the analog input offset voltage. To avoid these problems, keep the clock level within the range

specified as VID in the Converter Electrical Characteristics.

The low and high times of the input clock signal can affect the performance of any A/D Converter. The

ADC08DL502 features a duty cycle clock correction circuit which can maintain performance over temperature.

The ADC will meet its performance specification if the input clock high and low times are maintained within the

duty cycle range as specified in the Converter Electrical Characteristics.

High speed, high performance ADCs such as the ADC08DL502 require a very stable input clock signal with

minimum phase noise or jitter. ADC jitter requirements are defined by the ADC resolution (number of bits),

maximum ADC input frequency and the input signal amplitude relative to the ADC input full scale range. The

maximum jitter (the sum of the jitter from all sources) allowed to prevent a jitter-induced reduction in SNR is

found to be

tJ(MAX) = (VINFSR / VIN(P-P)) x (1/(2(N+1) xπx fIN)) (2)

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where tJ(MAX) is the rms total of all jitter sources in seconds, VIN(P-P) is the peak-to-peak analog input signal, and

VINFSR is the full-scale range of the ADC, "N" is the ADC resolution in bits and fIN is the maximum input

frequency, in Hertz, at the ADC analog input.

Note that the maximum jitter described above is the RSS sum of the jitter from all sources, including that in the

ADC input clock, that added by the system to the ADC input clock and input signals and that added by the ADC

itself. Since the effective jitter added by the ADC is beyond user control, the best the user can do is to keep the

sum of the externally added input clock jitter and the jitter added by the analog circuitry to the analog signal to a

minimum.

Input clock amplitudes above those specified in the Converter Electrical Characteristics may result in increased

input offset voltage. This would cause the converter to produce an output code other than the expected 127/128

when both input pins are at the same potential.

CONTROL PINS

Six control pins (without the use of the serial interface) provide a wide range of possibilities in the operation of

the ADC08DL502 and facilitate its use. These control pins provide Full-Scale Input Range setting, Calibration,

Calibration Delay, Output Edge Synchronization choice, LVDS Output Level choice and a Power Down feature.

Full-Scale Input Range Setting

The input full-scale range can be selected with the FSR control input (pin 16) in the normal mode of operation.

The input full-scale range is specified as VIN in the Converter Electrical Characteristics. In the extended control

mode, the input full-scale range may be programmed using the Full-Scale Adjust Voltage register. See THE

ANALOG INPUT for more information.

Calibration

The ADC08DL502 calibration must be run to achieve specified performance. The calibration procedure is run

upon power-up and can be run any time on command. The calibration procedure is exactly the same whether

there is an input clock present upon power up or if the clock begins some time after application of power. The

CalRun output indicator is high while a calibration is in progress. Note that the DCLK outputs are not active

during a calibration cycle by default and therefore are not recommended as system clock unless the Resistor

Trim Disable feature is used (Reg.9h). The DCLK outputs are continuously present at the output only when the

Resistor Trim Disable is active.

Power-On Calibration

Power-on calibration begins after a time delay following the application of power. This time delay is determined

by the setting of CalDly, as described in the Calibration Delay Section, below.

The calibration process will be not be performed if the CAL pin is high at power up. In this case, the calibration

cycle will not begin until the on-command calibration conditions are met. The ADC08DL502 will function with the

CAL pin held high at power up, but no calibration will be done and performance will be impaired. A manual

calibration, however, may be performed after powering up with the CAL pin high. See On-Command Calibration.

The internal power-on calibration circuitry comes up in an unknown logic state. If the input clock is not running at

power up and the power on calibration circuitry is active, it will hold the analog circuitry in power down and the

power consumption will typically be less than 200 mW. The power consumption will be normal after the clock

starts.

On-Command Calibration

To initiate an on-command calibration, bring the CAL pin high for a minimum of tCAL_H input clock cycles after it

has been low for a minimum of tCAL_L input clock cycles. Holding the CAL pin high upon power up will prevent

execution of power-on calibration until the CAL pin is low for a minimum of tCAL_L input clock cycles, then brought

high for a minimum of another tCAL_H input clock cycles. The calibration cycle will begin tCAL_H input clock cycles

after the CAL pin is thus brought high. The CalRun signal should be monitored to determine when the calibration

cycle has completed.

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The minimum tCAL_L and tCAL_H input clock cycle sequence is required to ensure that random noise does not

cause a calibration to begin when it is not desired. As mentioned for best performance, a calibration should be

performed 20 seconds or more after power up and repeated when the operating temperature changes

significantly relative to the specific system design performance requirements.

By default, On-Command calibration also includes calibrating the input termination resistance and the ADC.

However, since the input termination resistance, once trimmed at power-up, changes marginally with

temperature, the user has the option to disable the input termination resistor trim, which will ensure that the

DCLK is continuously present at the output during subsequent calibration. The Resistor Trim Disable can be

programmed in register (address: 1h, bit 13) when in the Extended Control mode.

Calibration Delay

The CalDly input (pin 141) is used to select one of two delay times after the application of power to the start of

calibration, as described in Calibration. The calibration delay values allow the power supply to come up and

stabilize before calibration takes place. With no delay or insufficient delay, calibration would begin before the

power supply is stabilized at its operating value and result in non-optimal calibration coefficients. If the PD pin is

high upon power-up, the calibration delay counter will be disabled until the PD pin is brought low. Therefore,

holding the PD pin high during power up will further delay the start of the power-up calibration cycle. The best

setting of the CalDly pin depends upon the power-on settling time of the power supply.

Note that the calibration delay selection is not possible in the Extended Control mode and the short delay time is

used.

Output Edge Synchronization

DCLK signals are available to help latch the converter output data into external circuitry. The output data can be

synchronized with either edge of these DCLK signals. That is, the output data transition can be set to occur with

either the rising edge or the falling edge of the DCLK signal, so that either edge of that DCLK signal can be used

to latch the output data into the receiving circuit.

When OutEdge (pin 6) is high, the output data is synchronized with (changes with) the rising edge of the DCLK+

(pin 92). When OutEdge is low, the output data is synchronized with the falling edge of DCLK+.

At the very high speeds of which the ADC08DL502 is capable, slight differences in the lengths of the DCLK and

data lines can mean the difference between successful and erroneous data capture. The OutEdge pin is used to

capture data on the DCLK edge that best suits the application circuit and layout.

Reliable data capture can be achieved by using just one DCLK+/- signal for the full 32 signal data bus. However,

if desired, the user may configure the OR+/- output as the second DCLK+/- output instead.

LVDS Output Level Control

The output level can be set to one of two levels with OutV (pin 5). The strength of the output drivers is greater

with OutV high. With OutV low there is less power consumption in the output drivers, but the lower output level

means decreased noise immunity.

For short LVDS lines and low noise systems, satisfactory performance may be realized with the OutV input low.

If the LVDS lines are long and/or the system in which the ADC08DL502 is used is noisy, it may be necessary to

tie the OutV pin high.

Power Down Feature

The Power Down pins (PD and PDQ) allow the ADC08DL502 to be entirely powered down (PD) or the "Q"

channel to be powered down and the "I" channel to remain active. See Power Down for details on the power

down feature.

The digital data (+/-) output pins are put into a high impedance state when the PD pin for the respective channel

is high. Upon return to normal operation, the pipeline will contain meaningless information and must be flushed.

If the PD input is brought high while a calibration is running, the device will not go into power down until the

calibration sequence is complete. However, if power is applied and PD is already high, the device will not begin

the calibration sequence until the PD input goes low. If a manual calibration is requested while the device is

powered down, the calibration will not begin at all. That is, the manual calibration input is completely ignored in

the power down state.

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THE DIGITAL OUTPUTS

The ADC08DL502 normally demultiplexes the output data of each of the two ADCs on the die onto two LVDS

output buses (total of four buses, two for each ADC). For each of the two converters, the results of successive

conversions started on the odd falling edges of the CLK+ pin are available on one of the two LVDS buses, while

the results of conversions started on the even falling edges of the CLK+ pin are available on the other LVDS bus.

This means that, the word rate at each LVDS bus is 1/2 the ADC08DL502 input clock rate and the two buses

must be multiplexed to obtain the entire 1 GSPS conversion result.

Since the minimum recommended input clock rate for this device is 200 MSPS, the effective rate can be reduced

to as low as 100 MSPS by using the results available on just one of the the two LVDS buses and a 200 MHz

input clock, decimating the 200 MSPS data by two.

There is one LVDS output clock pair (DCLK+/−) available for use to latch the LVDS outputs on all buses.

However, the user has the option to configure the OR+/- output as a second DCLK+/- pair. Whether the data is

sent at the rising or falling edge of DCLK is determined by the sense of the OutEdge pin, as described in Output

Edge Synchronization.

DDR (Double Data Rate) clocking can also be used. In this mode a word of data is presented with each edge of

DCLK, reducing the DCLK frequency to 1/4 the input clock frequency. See the Timing Diagram section for

details.

The OutV pin is used to set the LVDS differential output levels. See LVDS Output Level Control.

The output format is Offset Binary. Accordingly, a full-scale input level with VIN+ positive with respect to VIN−will

produce an output code of all ones, a full-scale input level with VIN−positive with respect to VIN+ will produce an

output code of all zeros and when VIN+ and VIN−are equal, the output code will vary between codes 127 and

128. A non-multiplexed mode of operation is available for those cases where the digital ASIC is capable of higher

speed operation.

POWER CONSIDERATIONS

A/D converters draw sufficient transient current to corrupt their own power supplies if not adequately bypassed. A

33 µF capacitor should be placed within an inch (2.5 cm) of the A/D converter power pins. A 0.1 µF capacitor

should be placed as close as possible to each VApin, preferably within one-half centimeter. Leadless chip

capacitors are preferred because they have low lead inductance.

The VAand VDR supply pins should be isolated from each other to prevent any digital noise from being coupled

into the analog portions of the ADC. A ferrite choke, such as the JW Miller FB20009-3B, is recommended

between these supply lines when a common source is used for them.

As is the case with all high speed converters, the ADC08DL502 should be assumed to have little power supply

noise rejection. Any power supply used for digital circuitry in a system where a lot of digital power is being

consumed should not be used to supply power to the ADC08DL502. The ADC supplies should be the same

supply used for other analog circuitry, if not a dedicated supply.

Supply Voltage

The ADC08DL502 is specified to operate with a supply voltage of 1.9V ±0.1V. It is very important to note that,

while this device will function with slightly higher supply voltages, these higher supply voltages may reduce

product lifetime.

No pin should ever have a voltage on it that is in excess of the supply voltage or below ground by more than 150

mV, not even on a transient basis. This can be a problem upon application of power and power shut-down. Be

sure that the supplies to circuits driving any of the input pins, analog or digital, do not come up any faster than

does the voltage at the ADC08DL502 power pins.

The Absolute Maximum Ratings should be strictly observed, even during power up and power down. A power

supply that produces a voltage spike at turn-on and/or turn-off of power can destroy the ADC08DL502. The

circuit of Figure 25 will provide supply overshoot protection.

Many linear regulators will produce output spiking at power-on unless there is a minimum load provided. Active

devices draw very little current until their supply voltages reach a few hundred millivolts. The result can be a turn-

on spike that can destroy the ADC08DL502, unless a minimum load is provided for the supply. The 100 Ω

resistor at the regulator output provides a minimum output current during power-up to ensure there is no turn-on

spiking.

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Regulator

210

110

100

10 PF

VIN 1.9V

to ADC

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In the circuit of Figure 25, an LM317 linear regulator is satisfactory if its input supply voltage is 4V to 5V . If a

3.3V supply is used, an LM1086 linear regulator is recommended.

Figure 25. Non-Spiking Power Supply

The output drivers should have a supply voltage, VDR, that is within the range specified in the Operating Ratings

table. This voltage should not exceed the VAsupply voltage.

If the power is applied to the device without an input clock signal present, the current drawn by the device might

be below 200 mA. This is because the ADC08DL502 gets reset through clocked logic and its initial state is

unknown. If the reset logic comes up in the "on" state, it will cause most of the analog circuitry to be powered

down, resulting in less than 100 mA of current draw. This current is greater than the power down current

because not all of the ADC is powered down. The device current will be normal after the input clock is

established.

Thermal Management

The ADC08DL502 is capable of impressive speeds and performance at very low power levels for its speed.

However, the power consumption is still high enough to require attention to thermal management. For reliability

reasons, the die temperature should be kept to a maximum of 130°C. That is, TA(ambient temperature) plus

ADC power consumption times θJA (junction to ambient thermal resistance) should not exceed 130°C. This is not

a problem if the ambient temperature is kept to a maximum of +70°C as specified in the Operating Ratings

section.

To help minimize junction temperature, it is recommended that a simple heat sink be built into the PCB. This is

done by including a copper area of about 2 square inches (6.5 square cm) on the opposite side of the PCB. This

copper area may be plated or solder coated to prevent corrosion, but should not have a conformal coating, which

could provide some thermal insulation. Thermal vias should be used to connect this bottom copper area to a

copper pour on top of the PCB in the area underneath the ADC, where room allows. These thermal vias act as

"heat pipes" to carry the thermal energy from the device side of the board to the opposite side of the board

where it can be more effectively dissipated. The use of 9 to 16 thermal vias is recommended.

The thermal vias should be placed on a 1.2 mm grid spacing and have a diameter of 0.30 to 0.33 mm. Such

voids could increase the thermal resistance between the device and the thermal land on the board, which would

cause the device to run hotter.

LAYOUT AND GROUNDING

Proper grounding and proper routing of all signals are essential to ensure accurate conversion. A single ground

plane should be used, instead of splitting the ground plane into analog and digital areas.

Since digital switching transients are composed largely of high frequency components, the skin effect tells us that

total ground plane copper weight will have little effect upon the logic-generated noise. Total surface area is more

important than is total ground plane volume. Coupling between the typically noisy digital circuitry and the

sensitive analog circuitry can lead to poor performance that may seem impossible to isolate and remedy. The

solution is to keep the analog circuitry well separated from the digital circuitry.

High power digital components should not be located on or near any linear component or power supply trace or

plane that services analog or mixed signal components as the resulting common return current path could cause

fluctuation in the analog input “ground” return of the ADC, causing excessive noise in the conversion result.

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Generally, we assume that analog and digital lines should cross each other at 90° to avoid getting digital noise

into the analog path. In high frequency systems, however, avoid crossing analog and digital lines altogether. The

input clock lines should be isolated from ALL other lines, analog AND digital. The generally-accepted 90°

crossing should be avoided as even a little coupling can cause problems at high frequencies. Best performance

at high frequencies is obtained with a straight signal path.

The analog input should be isolated from noisy signal traces to avoid coupling of spurious signals into the input.

This is especially important with the low level drive required of the ADC08DL502. Any external component (e.g.,

a filter capacitor) connected between the converter's input and ground should be connected to a very clean point

in the analog ground plane. All analog circuitry (input amplifiers, filters, etc.) should be separated from any digital

components.

DYNAMIC PERFORMANCE

The ADC08DL502 is a.c. tested and its dynamic performance is guaranteed. To meet the published

specifications and avoid jitter-induced noise, the clock source driving the CLK input must exhibit low rms jitter.

The allowable jitter is a function of the input frequency and the input signal level, as described in THE CLOCK

INPUTS.

It is good practice to keep the ADC input clock line as short as possible, to keep it well away from any other

signals and to treat it as a transmission line. Other signals can introduce jitter into the input clock signal. The

clock signal can also introduce noise into the analog path if not isolated from that path.

Best dynamic performance is obtained when the exposed pad at the back of the package has a good connection

to ground. This is because this path from the die to ground is a lower impedance than offered by the package

pins.

USING THE SERIAL INTERFACE

The ADC08DL502 may be operated in the non-extended control (non-Serial Interface) mode or in the extended

control mode. Table 20 and Table 21 describe the functions of pins 5, 6, 16 and 141 in the non-extended control

mode and the extended control mode, respectively.

Non-Extended Control Mode Operation

Non-extended control mode operation means that the Serial Interface is not active and all controllable functions

are controlled with various pin settings. Pin 47 is the primary control of the extended control enable function.

When pin 47 is logic high, the device is in the non-extended control mode. If pin 47 is floating and pin 58 is

floating or logic high, the extended control enable function is controlled by pin 16. The device has functions which

are pin programmable when in the non-extended control mode. An example is the full-scale range is controlled in

the non-extended control mode by setting pin 16 high or low. Table 20 indicates the pin functions of the

ADC08DL502 in the non-extended control mode.

Table 20. Non-Extended Control Mode Operation

(Pin 47 Floating and Pin 58 Floating or Logic High)

Pin Low High Floating

5 Reduced VOD Normal VOD n/a

6 OutEdge = Neg OutEdge = Pos DDR

141 CalDly Short CalDly Long n/a

16 Reduced VIN Normal VIN Extended Control Mode

Pin 5 can be either high or low in the non-extended control mode. See NORMAL/EXTENDED CONTROL for

more information.

Pin 6 can be high or low or can be left floating in the non-extended control mode. In the non-extended control

mode, pin 6 high or low defines the edge at which the output data transitions. See Output Edge Synchronization

for more information. If this pin is floating, the output clock (DCLK) is a DDR (Double Data Rate) clock (see

Single Data Rate and Double Data Rate) and the output edge synchronization is irrelevant since data is clocked

out on both DCLK edges.

Pin 141, if it is high or low in the non-extended control mode, sets the calibration delay.

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Table 21. Extended Control Mode Operation

(Pin 47 Logic Low or Pin 16 Floating and Pin 58 Floating or Logic High)

Pin Function

5 SCLK (Serial Clock)

6 SDATA (Serial Data)

141 SCS (Serial Interface Chip Select)

COMMON APPLICATION PITFALLS

Failure to write all register locations when using extended control mode. When using the serial interface, all

nine address locations must be written at least once with the default or desired values before calibration and

subsequent use of the ADC.

Driving the inputs (analog or digital) beyond the power supply rails. For device reliability, no input should go

more than 150 mV below the ground pins or 150 mV above the supply pins. Exceeding these limits on even a

transient basis may not only cause faulty or erratic operation, but may impair device reliability. It is not

uncommon for high speed digital circuits to exhibit undershoot that goes more than a volt below ground.

Controlling the impedance of high speed lines and terminating these lines in their characteristic impedance

should control overshoot.

Care should be taken not to overdrive the inputs of the ADC08DL502. Such practice may lead to conversion

inaccuracies and even to device damage.

Incorrect analog input common mode voltage in the d.c. coupled mode. As discussed in The Analog Inputs

and THE ANALOG INPUT, the Input common mode voltage must remain within 50 mV of the VCMO output ,

which has a variability with temperature that must also be tracked. Distortion performance will be degraded if the

input common mode voltage is more than 50 mV from VCMO .

Using an inadequate amplifier to drive the analog input. Use care when choosing a high frequency amplifier

to drive the ADC08DL502 as many high speed amplifiers will have higher distortion than will the ADC08DL502,

resulting in overall system performance degradation.

Driving the VBG pin to change the reference voltage. As mentioned in THE REFERENCE VOLTAGE, the

reference voltage is intended to be fixed by FSR pin or Full-Scale Voltage Adjust register settings. Over driving

this pin will not change the full scale value, but can otherwise upset operation.

Driving the clock input with an excessively high level signal. The ADC input clock level should not exceed

the level described in the Operating Ratings Table or the input offset could change.

Inadequate input clock levels. As described in THE CLOCK INPUTS, insufficient input clock levels can result in

poor performance. Excessive input clock levels could result in the introduction of an input offset.

Using a clock source with excessive jitter, using an excessively long input clock signal trace, or having

other signals coupled to the input clock signal trace. This will cause the sampling interval to vary, causing

excessive output noise and a reduction in SNR performance.

Failure to provide adequate heat removal. As described in Thermal Management, it is important to provide

adequate heat removal to ensure device reliability. This can be done either with adequate air flow or the use of a

simple heat sink built into the board.

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REVISION HISTORY

Changes from Revision A (March 2013) to Revision B Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 48

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PACKAGE OPTION ADDENDUM

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Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

ADC08DL502CIVV/NOPB ACTIVE LQFP PGE 144 60 RoHS & Green SN Level-3-260C-168 HR -40 to 70 ADC08DL502CIVV

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

MECHANICAL DATA

MTQF017A – OCTOBER 1994 – REVISED DECEMBER 1996

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PGE (S-PQFP-G144) PLASTIC QUAD FLATPACK

4040147/C 10/96

0,27

0,17

0,13 NOM

0,25

0,75

0,45

0,05 MIN

Seating Plane

Gage Plane

108

109

144

22,20

21,80

19,80

17,50 TYP

20,20

1,35

1,45

1,60 MAX

0,08

0°–7°

0,08

0,50

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS-026

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