Ultra Series Crystal Oscillator
Si549 Data Sheet
Ultra Low Jitter I2C Programmable XO (95 fs), 0.2 to 1500 MHz
The Si549 Ultra Series oscillator utilizes Silicon Laboratories’ advanced 4th
generation DSPLL® technology to provide an ultra-low jitter, low phase noise
clock at any output frequency. The device is user-programmed via simple
I2C commands to provide any frequency from 0.2 to 1500 MHz with <1 ppb
resolution and maintains exceptionally low jitter for both integer and fraction-
al frequencies across its operating range. The Si549 offers excellent reliabili-
ty and frequency stability as well as guaranteed aging performance. On-chip
power supply filtering provides industry-leading power supply noise rejection,
simplifying the task of generating low jitter clocks in noisy systems that use
switched-mode power supplies. The Si549 has a dramatically simplified sup-
ply chain that enables Silicon Labs to ship custom frequency samples 1-2
weeks after receipt of order. Unlike a traditional XO, where a different crystal
is required for each output frequency, the Si549 uses one simple crystal and
a DSPLL IC-based approach to provide the desired output frequency. The
Si549 is factory-configurable for a wide variety of user specifications, includ-
ing startup frequency, I2C address, output format, and OE pin location/
polarity. Specific configurations are factory-programmed at time of shipment,
eliminating the long lead times associated with custom oscillators.
KEY FEATURES
I2C programmable to any frequency from 0.2 to
1500 MHz with < 1 ppb resolution
Ultra low jitter: 95 fs Typ RMS (12 kHz – 20 MHz)
Configure up to 4 pin-selectable startup frequencies
I2C interface supports 100 kbps, 400 kbps, and 1
Mbps (Fast Mode Plus)
Excellent PSRR and supply noise immunity: –80
dBc Typ
3.3 V, 2.5 V and 1.8 V VDD supply operation from
the same part number
LVPECL, LVDS, CML, HCSL, CMOS, and Dual
CMOS output options
3.2x5, 5x7 mm package footprints
Samples available with 1-2 week lead times
APPLICATIONS
100G/200G/400G OTN, coherent optics, PAM4
10G/40G/100G optical ethernet
3G-SDI/12G-SDI/24G-SDI broadcast video
Servers, switches, storage, search acceleration
Test and measurement
FPGA/ASIC clocking
Pin Assignments
1
2
3
6
5
4
GND
NC/OE/FS
VDD
CLK+
CLK–
OE/FS/NC
7
8
SDA
SCL
(Top View)
Pin # Descriptions
1, 2 Selectable via ordering option
OE = Output enable; FS = Frequency Select; NC = No connect
3 GND = Ground
4 CLK+ = Clock output
5 CLK- = Complementary clock output. Not used for CMOS.
6 VDD = Power supply
7 SDA = I2C Serial Data
8 SCL = I2C Serial Clock
Phase Error
Cancellation
Fixed
Frequency
Crystal
Frequency
Flexible
DSPLL Low
Noise
Driver
Digital
Loop
Filter
DCO
Digital
Phase
Detector
Fractional
Divider
Phase Error
OSC
Power Supply Regulation
NVM
Built-in Power Supply
Noise Rejection
Control
OE, Frequency Select
(I2C and Pin Control)
Flexible
Formats,
1.8V – 3.3V
Operation
silabs.com | Building a more connected world. Rev. 1.0
1. Ordering Guide
The Si549 XO supports a variety of options including startup frequency, output format, and OE pin location/polarity, as shown in the
chart below. Specific device configurations are programmed into the part at time of shipment, and samples are available in 1-2 weeks.
Silicon Laboratories provides an online part number configuration utility to simplify this process. Refer to www.silabs.com/oscillators to
access this tool and for further ordering instructions.
- - - - A B GAAA R
Device Revision
Tape and Reel
ReelCode
R
Coil Tape<Blank>
A
OE PolarityOE Pin
Code
Active HighPin 1A
Active LowPin 1B
Active HighPin 2C
Active LowPin 2D
FS0
(Dual)
FS1
(Quad)
Pinout Option
Active HighPin 1E
Active LowPin 1F
Active HighPin 2G
Active LowPin 2H
--
--
--
--
Pin 2
Pin 2
Pin 1
Pin 1
--
--
--
--
--
--
--
--
Frequency
Code Description
The Si549 supports one, two, or
four user-defined startup
frequencies in the range
selected by the Supported
Frequency Range code. A user-
defined 7-bit I2C address is
supported. Each unique startup
configuration and I2C address
combination is assigned a 6-digit
code.
3
xxxxxx
Order
Option
VDD RangeSignal Format
A2.5, 3.3 V LVPECL
B1.8, 2.5, 3.3 V LVDS
C1.8, 2.5, 3.3 V CMOS
D1.8, 2.5, 3.3 V CML
E1.8, 2.5, 3.3 V HCSL
F1.8, 2.5, 3.3 V
Dual CMOS
(In-Phase)
G1.8, 2.5, 3.3 V
Dual CMOS
(Complementary)
X1.8, 2.5, 3.3 V Custom 1
Supported Frequency Range
Code
0.2-1500 MHzA
0.2-800 MHzB
0.2-325 MHz (CMOS available to 250 MHz) C
- -549
1
2
3
6
5
4
GND
NC
VDD
CLK+
CLK–
OE 7
8
SDA
SCL
1
2
3
6
5
4
GND
FS0
VDD
CLK+
CLK–
OE 7
8
SDA
SCL
1
2
3
6
5
4
GND
FS1
VDD
CLK+
CLK–
FS0 7
8
SDA
SCL
1
2
3
6
5
4
GND
OE
VDD
CLK+
CLK–
NC 7
8
SDA
SCL
1
2
3
6
5
4
GND
OE
VDD
CLK+
CLK–
FS0 7
8
SDA
SCL
Single Dual Quad
Codes A, B Codes E, F Code J
Codes C, D Codes G, H
If replacing Si570A-K, use Code C
If replacing Si570M-W, use Code D
----J Pin 1 Pin 2
I2C Oscillator
DescriptionXO Series
549
Temp Stability
-40 to 85 °C
Temperature Grade
G
Total Stability 2
± 20 ppm
A± 50 ppm 5x7 mmA
3.2x5 mmB
Package
± 10 ppm
B± 25 ppm
± 7 ppm
C± 20 ppm
Notes:
1. Contact Silicon Labs for non-standard configurations.
2. Total stability includes temp stability, initial accuracy, load pulling, VDD variation, and 20 year aging at 70 °C.
3. Create custom part numbers at www.silabs.com/oscillators.
Si549 Data Sheet
Ordering Guide
silabs.com | Building a more connected world. Rev. 1.0 | 2
1.1 Technical Support
Frequently Asked Questions (FAQ) www.silabs.com/Si549-FAQ
Oscillator Phase Noise Lookup Utility www.silabs.com/oscillator-phase-noise-lookup
Quality and Reliability www.silabs.com/quality
Development Kits www.silabs.com/oscillator-tools
Si549 Data Sheet
Ordering Guide
silabs.com | Building a more connected world. Rev. 1.0 | 3
2. Electrical Specifications
Table 2.1. Electrical Specifications
VDD = 1.8 V, 2.5 or 3.3 V ± 5%, TA = –40 to 85 ºC
Parameter Symbol Test Condition/Comment Min Typ Max Unit
Temperature Range TA–40 85 ºC
Frequency Range FCLK LVPECL, LVDS, CML 0.2 1500 MHz
HCSL 0.2 400 MHz
CMOS, Dual CMOS 0.2 250 MHz
Supply Voltage VDD 3.3 V 3.135 3.3 3.465 V
2.5 V 2.375 2.5 2.625 V
1.8 V 1.71 1.8 1.89 V
Supply Current IDD LVPECL (output enabled) 107 153 mA
LVDS/CML (output enabled) 83 121 mA
HCSL (output enabled) 86 126 mA
CMOS (output enabled) 87 127 mA
Dual CMOS (output enabled) 92 141 mA
Tristate Hi-Z (output disabled) 73 112 mA
Temperature Stability Frequency stability Grade A –20 20 ppm
Frequency stability Grade B –10 10 ppm
Frequency stability Grade C –7 7 ppm
Total Stability1FSTAB Frequency stability Grade A –50 50 ppm
Frequency stability Grade B –25 25 ppm
Frequency stability Grade C –20 20 ppm
Rise/Fall Time
(20% to 80% VPP)
TR/TFLVPECL/LVDS/CML 350 ps
CMOS / Dual CMOS
(CL = 5 pF)
0.5 1.5 ns
HCSL, FCLK >50 MHz 550 ps
Duty Cycle DCAll formats 45 55 %
Output Enable (OE),
Frequency Select (FS0, FS1)2
VIH 0.7 × VDD V
VIL 0.3 × VDD V
TDOutput Disable Time, FCLK >10 MHz 3 µs
TEOutput Enable Time, FCLK >10 MHz 20 µs
TFS Settling Time after FS Change 10 ms
Powerup Time tOSC Time from 0.9 × VDD until output fre-
quency (FCLK) within spec
10 ms
LVPECL Output Option3VOC Mid-level VDD – 1.42 VDD – 1.25 V
VOSwing (diff) 1.1 1.9 VPP
Si549 Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 4
Parameter Symbol Test Condition/Comment Min Typ Max Unit
LVDS Output Option4VOC Mid-level (2.5 V, 3.3 V VDD) 1.125 1.20 1.275 V
Mid-level (1.8 V VDD) 0.8 0.9 1.0 V
VOSwing (diff) 0.5 0.7 0.9 VPP
HCSL Output Option5VOH Output voltage high 660 750 850 mV
VOL Output voltage low –150 0 150 mV
VCCrossing voltage 250 350 550 mV
CML Output Option (AC-Coupled) VOSwing (diff) 0.6 0.8 1.0 VPP
CMOS Output Option VOH IOH = 8/6/4 mA for 3.3/2.5/1.8V VDD 0.85 × VDD V
VOL IOL = 8/6/4 mA for 3.3/2.5/1.8V VDD 0.15 × VDD V
Notes:
1. Total Stability includes temperature stability, initial accuracy, load pulling, VDD variation, and aging for 20 yrs at 70 ºC.
2. OE includes a 50 kΩ pull-up to VDD for OE active high. Includes a 50 kΩ pull-down to GND for OE active low. FS0 and FS1 pins
each include a 50 kΩ pull-up to VDD. NC (No Connect) pins include a 50 kΩ pull-down to GND.
3. 50 Ω to VDD – 2.0 V.
4. Rterm = 100 Ω (differential).
5. 50 Ω to GND.
Table 2.2. I2C Characteristics
VDD = 1.8, 2.5, or 3.3 V ± 5%, TA = –40 to 85 ºC
Parameter Symbol Test Condition/Comment Min Typ Max Unit
SDA, SCL Input Voltage High VIH 0.70 x
VDD
V
SDA, SCL Input Voltage Low VIL 0.30 x
VDD
V
Frequency Reprogramming Resolution MRES 0.026 ppb
Frequency Range for Small Frequency
Change (Continuous Glitchless Output)
From center frequency -950 +950 ppm
Settling Time for Small Frequency Change < ±950 ppm from center fre-
quency
100 μs
Settling Time for Large Frequency Change
(Output Squelched during Frequency Transi-
tion)
> ±950 ppm from center fre-
quency
10 ms
Si549 Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 5
Table 2.3. Clock Output Phase Jitter and PSRR
VDD = 1.8 V, 2.5 or 3.3 V ± 5%, TA = –40 to 85 ºC
Parameter Symbol Test Condition/Comment Min Typ Max Unit
Phase Jitter (RMS, 12 kHz - 20MHz)1
All Differential Formats
ϕJFCLK ≥ 200 MHz 95 150 fs
100 MHz ≤ FCLK < 200 MHz 115 150 fs
Phase Jitter (RMS, 12kHz - 20MHz)1
CMOS / Dual CMOS Formats
ϕJ10 MHz ≤ FCLK ≤ 250 MHz 200 fs
Spurs Induced by External Power Supply
Noise, 50 mVpp Ripple. LVDS 156.25 MHz
Output
PSRR 100 kHz sine wave -83
dBc
200 kHz sine wave -83
500 kHz sine wave -82
1 MHz sine wave -85
Note:
1. Guaranteed by characterization. Jitter inclusive of any spurs.
Table 2.4. Clock Output Phase Noise (Typical)
Offset Frequency (f) 156.25 MHz LVDS 200 MHz LVDS 644.53125 MHz LVDS Unit
100 Hz –107 –104 –92
dBc/Hz
1 kHz –130 –126 –117
10 kHz –137 –135 –126
100 kHz –143 –140 –131
1 MHz –149 –147 –138
10 MHz –160 –161 –153
20 MHz –161 –161 –155
Offset Frequency (f) 156.25 MHz LVPECL 200 MHz LVPECL 644.53125 MHz LVPECL Unit
100 Hz –106 –103 –93
dBc/Hz
1 kHz –129 –127 –118
10 kHz –137 –135 –124
100 kHz –142 –140 –130
1 MHz –149 –147 –137
10 MHz –160 –163 –153
20 MHz –161 –164 –154
Si549 Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 6
Figure 2.1. Phase Jitter vs. Output Frequency
Phase jitter measured with Agilent E5052 using a differential-to-single ended converter (balun or buffer). Measurements collected for
>700 commonly used frequencies. Phase noise plots for specific frequencies are available using our free, online Oscillator Phase Noise
Lookup Tool at www.silabs.com/oscillators.
Table 2.5. Environmental Compliance and Package Information
Parameter Test Condition
Mechanical Shock MIL-STD-883, Method 2002
Mechanical Vibration MIL-STD-883, Method 2007
Solderability MIL-STD-883, Method 2003
Gross and Fine Leak MIL-STD-883, Method 1014
Resistance to Solder Heat MIL-STD-883, Method 2036
Moisture Sensitivity Level (MSL) 1
Contact Pads Gold over Nickel
Note:
1. For additional product information not listed in the data sheet (e.g. RoHS Certifications, MDDS data, qualification data, REACH
Declarations, ECCN codes, etc.), refer to our "Corporate Request For Information" portal found here: www.silabs.com/support/
quality/Pages/RoHSInformation.aspx.
Si549 Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 7
Table 2.6. Thermal Conditions
Package Parameter Symbol Test Condition Value Unit
3.2 × 5 mm
8-pin CLCC
Thermal Resistance Junction to Ambient ΘJA Still Air, 85 ºC 79.1 ºC/W
Thermal Resistance Junction to Board ΘJB Still Air, 85 ºC 49.6 ºC/W
Max Junction Temperature TJStill Air, 85 ºC 125 ºC
5 × 7 mm
8-pin CLCC
Thermal Resistance Junction to Ambient ΘJA Still Air, 85 ºC 67.1 ºC/W
Thermal Resistance Junction to Board ΘJB Still Air, 85 ºC 51.7 ºC/W
Max Junction Temperature TJStill Air, 85 ºC 125 ºC
Table 2.7. Absolute Maximum Ratings1
Parameter Symbol Rating Unit
Maximum Operating Temp. TAMAX 95 ºC
Storage Temperature TS–55 to 125 ºC
Supply Voltage VDD –0.5 to 3.8 ºC
Input Voltage VIN –0.5 to VDD + 0.3 V
ESD HBM (JESD22-A114) HBM 2.0 kV
Solder Temperature2TPEAK 260 ºC
Solder Time at TPEAK2TP20–40 sec
Notes:
1. Stresses beyond those listed in this table may cause permanent damage to the device. Functional operation specification
compliance is not implied at these conditions. Exposure to maximum rating conditions for extended periods may affect device
reliability.
2. The device is compliant with JEDEC J-STD-020.
Si549 Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.0 | 8
3. Dual CMOS Buffer
Dual CMOS output format ordering options support either complementary or in-phase signals for two identical frequency outputs. This
feature enables replacement of multiple XOs with a single Si549 device.
~
~
Complementary
Outputs
In-Phase
Outputs
Figure 3.1. Integrated 1:2 CMOS Buffer Supports Complementary or In-Phase Outputs
Si549 Data Sheet
Dual CMOS Buffer
silabs.com | Building a more connected world. Rev. 1.0 | 9
4. Recommended Output Terminations
The output drivers support both AC-coupled and DC-coupled terminations as shown in figures below.
CLK-
LVPECL
Receiver
(3.3V, 2.5V)
VDD
Si54x
50 Ω
CLK+ 50 Ω
Rp Rp
VDD
R1 R1
R2 R2
CLK-
LVPECL
Receiver
(3.3V, 2.5V)
VDD
Si54x
50 Ω
CLK+ 50 Ω
VDD
R1 R1
R2 R2
AC-Coupled LVPECL – Thevenin Termination DC-Coupled LVPECL – Thevenin Termination
CLK-
LVPECL
Receiver
50 Ω
CLK+
50 Ω
Rp Rp
50 Ω
R1
R2 50 Ω
VDD VTT
Si54x
(3.3V, 2.5V)
VDD
CLK-
LVPECL
Receiver
50 Ω
CLK+
50 Ω
50 Ω
R1
R2 50 Ω
VDD VTT
Si54x
(3.3V, 2.5V)
VDD
AC-Coupled LVPECL - 50 Ω w/VTT Bias DC-Coupled LVPECL - 50 Ω w/VTT Bias
Figure 4.1. LVPECL Output Terminations
AC Coupled LVPECL
Termination Resistor Values
VDD R1 R2 Rp
3.3 V 127 Ω 82.5 Ω 130 Ω
2.5 V 250 Ω 62.5 Ω 90 Ω
DC Coupled LVPECL
Termination Resistor Values
VDD R1 R2
3.3 V 127 Ω 82.5 Ω
2.5 V 250 Ω 62.5 Ω
Si549 Data Sheet
Recommended Output Terminations
silabs.com | Building a more connected world. Rev. 1.0 | 10
DC-Coupled LVDS Source Terminated HCSL
AC-Coupled LVDS Destination Terminated HCSL
CLK-
LVDS
Receiver
50 Ω
CLK+
50 Ω
100 Ω
Si54x
(3.3V, 2.5V, 1.8V)
VDD
CLK-
LVDS
Receiver
50 Ω
CLK+
50 Ω
100 Ω
Si54x
(3.3V, 2.5V, 1.8V)
VDD
CLK-
HCSL
Receiver
50 Ω
CLK+ 50 Ω
Si54x
(3.3V, 2.5V, 1.8V)
VDD
33 Ω
33 Ω
50 Ω 50 Ω
CLK-
HCSL
Receiver
50 Ω
CLK+ 50 Ω
Si54x
(3.3V, 2.5V, 1.8V)
VDD
50 Ω 50 Ω
Figure 4.2. LVDS and HCSL Output Terminations
CML Termination without VCM Single CMOS Termination
CML Termination with VCM Dual CMOS Termination
CLK-
CML
Receiver
50 Ω
CLK+
50 Ω
100 Ω
Si54x
(3.3V, 2.5V, 1.8V)
VDD
50 Ω
50 Ω
VCM
CLK-
CML
Receiver
50 Ω
CLK+
50 Ω
Si54x
(3.3V, 2.5V, 1.8V)
VDD
50 Ω
10
CLK
NC CMOS
Receiver
(3.3V, 2.5V, 1.8V)
VDD
Si54x
50 Ω
10 Ω
CLK+
(3.3V, 2.5V, 1.8V)
VDD
Si54x
50 Ω
10 Ω
CLK-
CMOS
Receivers
Figure 4.3. CML and CMOS Output Terminations
Si549 Data Sheet
Recommended Output Terminations
silabs.com | Building a more connected world. Rev. 1.0 | 11
5. Configuring Si549 Output Frequency via I2C
The Si549 oscillator device contains a fixed frequency crystal and frequency synthesis IC using Silicon Labs patented DSPLL technol-
ogy, all enclosed in a standard hermetically sealed crystal oscillator (XO) package. The internal crystal provides the reference frequen-
cy used by the DSPLL frequency synthesis IC. The output frequency of the Si549 oscillator device can be dynamically set via I2C regis-
ter settings in the DSPLL frequency synthesis IC. DSPLL technology provides unmatched frequency flexibility with superior output jitter/
phase noise performance and part per trillion frequency accuracy. This document describes how to calculate the required Si549 register
values used to set device output frequency, and how to load these values into the Si549 device.
OSC Digital
Phase
Detector
Phase
Error
Cancellation
Digital
VCO
FBDIV
HSDIV LSDIV
Driver
Control
Logic
and NVM
Power
Supply
Processing
VDD GND
Out+
Out-
OE
I2C / FS
Digital
Loop
Filter
Phase Error
Figure 5.1. Si549 Block Diagram
The figure above is a simplified high-level block diagram of the Si549 oscillator device. The output frequency is set by a combination of
three divider blocks highlighted in the above block diagram.
1. FBDIV - DSPLLTM Feedback Divider used to set Digital VCO frequency
2. HSDIV - High-Speed Output Divider
3. LSDIV - Low-Speed Output Divider
The final device output frequency is based on the digital VCO frequency divided by the product of HSDIV and LSDIV divider settings.
The limits of each of these internal blocks (both digital VCO and dividers) determines the valid operating frequency range of the device.
The FBDIV divider, is a fractional fixed-point divider with a total length of 43 bits consisting of an 11-bit integer field (FBINT) and a 32 bit
fractional field (FBFRAC) where total FBDIV = [FBINT].[FBFRAC] with an implied decimal point as shown. This bit format is known as
an 11.32 fixed point format where the integer portion is 11 bits and fractional portion is 32 bits, for a total of 43 bits.
The HSDIV divider is an integer divider, 11 bits in length, containing a binary divider value. One noteworthy feature of the HSDIV divider
is a special duty cycle correction circuit that allows odd divide ratios of lower divider values (5-33 only) with 50% duty cycle output. This
feature is useful when LSDIV divide ratio is set to 1.
The LSDIV divider performs power-of-2 divides ranging from divide by 1 (20) to divide by 32 (25). The register controlling the LSDIV
divider is 3 bits in length, holding the power-of-2 divide ratio (divider exponent). For example, if LSDIV register = 3 the LSDIV divide
ratio is 23 = 8. Values greater than 5 (i.e. LSDIV register = 6 or 7) still map into a divide by 32.
The tables below summarize the divider limits for LSDIV, HSDIV, FBDIV. These limits and restrictions must be observed when deriving
divider register values, as will be explained in later sections.
Table 5.1. Si549 Divider Range Limits
Divider Upper Limit Lower Limit
HSDIV[10:0] (unsigned) 2046 5
LSDIV[2:0] 1 (unsigned) 32 (2^5) 1 (2^0)
FBDIV[42:0] hex (unsigned) 7FDFFFFFFFF 03C00000000
FBDIV[42:0] int.frac (unsigned) 2045.99999999976 60.0
Note:
1. LSDIV is power of 2 divider. See LSDIV table below for actual divide ratio based on LSDIV register value.
Si549 Data Sheet
Configuring Si549 Output Frequency via I2C
silabs.com | Building a more connected world. Rev. 1.0 | 12
Table 5.2. Additional LSDIV and HSDIV Divider Restrictions
LSDIV
Register Value
Divide Ratio HSDIV Value Restrictions
0 1 5-33 even or odd values 1 ,
34-2046 even values only
1 2 5-2046 even or odd values
2 4 5-2046 even or odd values
3 8 5-2046 even or odd values
4 16 5-2046 even or odd values
5 32 5-2046 even or odd values
6 32 5-2046 even or odd values
7 32 5-2046 even or odd values
Note:
1. HSDIV can implement low value (5-33) odd divide ratios while providing a 50% duty cycle output due to special duty cycle correc-
tion circuit.
Note that all divider values (FBDIV, HSDIV, LSDIV) are unsigned and contain only positive values.
The Si549 high-performance oscillator family has three different speed grade offerings, each covering a specific frequency range. The
table below outlines the output frequency range coverage by each speed grade, the corresponding min and max VCO frequency for
that speed grade, and the nominal crystal frequency. The information in the table below is needed when calculating divider settings for
a given device, speed grade, and output frequency.
Table 5.3. Si549 Speed Grades, Crystal Frequency, and VCO Range Limits
Device Speed Grade Xtal freq (MHz) Min Output Freq
(MHz)
Max Output
Freq (MHz)
Min Fvco (GHz) Max Fvco (GHz)
Si549 A 152.6 0.2 1500 10.8 12.511886114
B 152.6 0.2 800 10.8 12.206718160
C 152.6 0.2 325 10.8 12.206718160
Si549 Data Sheet
Configuring Si549 Output Frequency via I2C
silabs.com | Building a more connected world. Rev. 1.0 | 13
5.1 Output Frequency Equations
The basic equations used to derive the output frequency are given below and can be easily inferred from the device block diagram in
Figure 5.2 Si549 Frequency Definition Block Diagram on page 14. Equation 1 is the relationship between the output frequency
(Fout), and the VCO frequency (Fvco) and total output divider ratio (HSDIV * LSDIV). Equation 2 is the relationship between the VCO
frequency (Fvco), the fixed crystal oscillator frequency (Fosc), and the feedback divider (FBDIV).
Fout = Fvco / (HSDIV x LSDIV)
Equation 1
Fvco = (Fosc x FBDIV)
Equation 2
OSC Digital
Phase
Detector
Phase
Error
Cancellation
Digital
VCO
FBDIV
HSDIV LSDIV
Driver
Control
Logic
and NVM
Power
Supply
Processing
VDD GND
Out+
Out-
OE
I2C / FS
Digital
Loop
Filter
Phase Error
Figure 5.2. Si549 Frequency Definition Block Diagram
Equation 3a is a rearranged Equation 1 to solve for the total output divider (HSDIV *LSDIV) given Fout and Fvco. Equation 3b is rear-
ranged again solving for Fvco given Fout and (HSDIV * LSDIV).
(HSDIV x LSDIV) = Fvco / Fout
Equation 3a
Fvco = Fout x (HSDIV x LSDIV)
Equation 3b
Equation 4 is a rearranged Equation 2 to now solve for FBDIV given Fvco and Fosc.
FBDIV = Fvco / Fosc
Equation 4
Equations 3a, 3b, and 4 will be used in the process of deriving the required divider values to provide a desired output frequency. The
basic process is outlined below.
Si549 Data Sheet
Configuring Si549 Output Frequency via I2C
silabs.com | Building a more connected world. Rev. 1.0 | 14
5.2 General Process Steps for Divider Calculation
1. Estimate a theoretical total output divider value (HSDIV * LSDIV) based on desired Fout while targeting the minimum valid Fvco
frequency using Eqn. 3a and Table 5.3 Si549 Speed Grades, Crystal Frequency, and VCO Range Limits on page 13. Use floating
point calculations for this step.
Result: Floating point value of total (HSDIV * LSDIV).
2. Derive a valid LSDIV divider value based on LSDIV and HSDIV divider limitations using the lowest possible value for LSDIV.
For example, if (HSDIV * LSDIV) = 8.22, use LSDIV =1 and HSDIV = 8.22 versus LSDIV = 2 and HSDIV = 4.11.
Result: Valid LSDIV value.
3. Using LSDIV value from #2 above, find nearest valid integer HSDIV divider value resulting in Fvco being equal to or greater than
Fvco min, which observing all HSDIV limitations. Use Eqns. 3a/3b as necessary.
Result: Valid HSDIV value.
4. With valid integer HSDIV and LSDIV values, calculate the required Fvco frequency with Eqn. 3b. (Fvco must remain in valid range
per Table 5.3 Si549 Speed Grades, Crystal Frequency, and VCO Range Limits on page 13.)
Result: Valid VCO frequency.
5. With the derived valid Fvco frequency, use Eqn 4 to calculate required FBDIV based on device specific Fosc frequency from Table
5.3 Si549 Speed Grades, Crystal Frequency, and VCO Range Limits on page 13.
Result: Valid FBDIV value
6. At this point all FBDIV, HSDIV and LSDIV values required to generate the desired output frequency have been calculated. These
three divider values must be now be appropriately formatted to fit the register format expected by the device. This is described in a
later section.
Si549 Data Sheet
Configuring Si549 Output Frequency via I2C
silabs.com | Building a more connected world. Rev. 1.0 | 15
5.3 Example: Deriving Si549 Divider Settings for 156.75 MHz Output
The general process of deriving divider values for a specific output frequency is outlined in the previous section and now will be used in
this example. To reiterate, all calculations must be done while observing divider limits and valid VCO frequency range limits for your
device. In this example, the device is Si549 and with a desired output frequency of 156.75 MHz, the speed grade required will be “C” or
better. (One important note: All divider and register settings derived for any speed grade will work without modification for all faster
speed grades on the same base part number device.)
Example VB code that implements the following divider calculation process is given in 5.8 Si549 Frequency Planner VB Code
and can be used for implementing any supported output frequency.
Step 1: Find the valid theoretical lower limit of the total output divider (HSDIV*LSDIV) based on the desired output frequency and low-
est valid VCO frequency. This will bias the divider solution to the lowest possible VCO frequency since this will provide the best per-
formance solution.
Given the valid Si549 VCO range is 10.8000 GHz to 12.1097 GHz, the minimum theoretical values for (HSDIV * LSDIV) for the example
156.75 MHz output frequency are given in Equation 3:
Minimum (HSDIV*LSDIV) = (10.8000 GHz / 156.75 MHz) = 68.89952…
Step 2: Find valid LSDIV divisor value given minimum (HSDIV*LSDIV) from step 1. For best performance, preference should be given
to implementation of the total output divider (HSDIV*LSDIV) using HSDIV with LSDIV divide ratio = 1, if possible. Use LSDIV divide
ratios > 1 only if HSDIV alone cannot implement the required output divider. Since the total (HSDIV*LSDIV) value of 68.8995… is less
than the HSDIV maximum divider value of 2046, the LSDIV divide ratio value will be 1, which corresponds to a LSDIV register setting
of 0, since the LSDIV divider can only be a power of 2 value (see Table 5.2 Additional LSDIV and HSDIV Divider Restrictions on page
13 for valid LSDIV settings).
LSDIV divide ratio = 1, therefore LSDIV register value = 0
Step 3: Find HSDIV divisor value. Given LSDIV = 1, HSDIV must implement 68.8995… or greater. Since HSDIV is an integer divider,
the next greatest integer is 69. But, checking valid HSDIV values when LSDIV divide ratio = 1, we see 69 is NOT valid since it is greater
than 33 and an odd value. This means the next greater integer value must be used, which is 70 (now even value). Note that 68 would
not be valid since 68 is less than 68.8995… and would result in a VCO frequency below the lower VCO frequency limit.
HSDIV divide ratio = 70, which gives HSDIV register value = 70 decimal (or hex value = 0x46)
Step 4: Calculate a valid VCO frequency and corresponding floating point FBDIV value. Given the calculated output divider value
(HSDIV*LSDIV) = 70, the VCO frequency must be set to (156.75 MHz * 70) = 10.9725 GHz. Note that 10.9725 GHz is indeed within the
valid VCO frequency range per Table 5.3 Si549 Speed Grades, Crystal Frequency, and VCO Range Limits on page 13.
Fvco = 10.9725 GHz
Step 5: Calculate the FBDIV value necessary to provide a 10.9725 GHz Fvco using a 55.05 MHz crystal as reference (Si549 device).
The floating point FBDIV value required to attain 10.9725 GHz with a 55.05 MHz crystal reference can be calculated as follows:
FBDIV (float) = 10.9725 GHz / 55.05 MHz = 199.318801089918
Step 6: Format each divider value into the required register format. LSDIV and HSDIV are simply binary values and can be directly
used. FBDIV must first be put into 11.32 fixed point format. Converting the floating point FBDIV value into the 11.32 fixed point hex
value required by the Si549 is done as follows:
Integer value = 199 decimal. Convert 199 to 11 bit hex = 0x0C7. This is FBINT.
Fractional value = 0.318801089918. Multiply fractional value by 2^32 = 1369240255.12805. Now extract only the integer part of the
result which is 1369240255. Convert 1369240255 to 32 bit hex = 0x519CF2BF . This is FBFRAC.
The resulting 11.32 fixed point hex number is therefore:
FBDIV = FBINT.FBFRAC = 0x0C7519CF2BF
Si549 Data Sheet
Configuring Si549 Output Frequency via I2C
silabs.com | Building a more connected world. Rev. 1.0 | 16
At this point we have calculated all the required divider values. The table below summarizes the resulting divider values for implement-
ing a 156.75 MHz output clock on the Si549.
Table 5.4. Divider Register Values for Si549 Configured for 156.75 MHz Output Clock
Divider Register Decimal Value Hex Value Reg Length (bits)
LSDIV 0 0x0 3
HSDIV 70 0x046 11
FBDIV 199.318801089918 0x0C7519CF2BF 43 (11+32)
5.4 Mapping Divider Settings into Register Values
For the previous 156.75 MHz example, the divider value to register mapping is shown in the table below. Note that Register 24 is a
packed register and contains bits from both LSDIV and HSDIV registers as follows: LSDIV[2:0] maps into Reg24[6:4] and HSDIV[10:8]
maps into Reg24[2:0]. Note that bits Reg24[7] and Reg24[3] are not used and indicated with ‘x’ in the RegName field below. See also
the Register Map Reference section for specific bit positioning within registers.
Table 5.5. Si549 Divider Register Values for 156.75 MHz Output Clock Configuration
Register (Decimal) Hex Value Reg Name
23 46 HSDIV[7:0]
24 00 x:LSDIV[2:0]:x:HSDIV[10:8]
26 BF FBDIV[7:0]
27 F2 FBDIV[15:8]
28 9C FBDIV[23:16]
29 51 FBDIV[31:24]
30 C7 FBDIV[39:32]
31 00 FBDIV[42:40]
Si549 Data Sheet
Configuring Si549 Output Frequency via I2C
silabs.com | Building a more connected world. Rev. 1.0 | 17
5.5 I2C Register Write Procedure to Set Output Frequency
After the frequency setting registers (Reg 23-Reg31) are calculated, there is a procedure that must be followed involving other specific
control registers for the device to properly use the new frequency setting registers. Simply writing Reg23-Reg31 is not enough. The
following procedure must be performed as shown to properly configure the Si549 for the desired output frequency. In other words, all
the following register writes must be done, and in the exact sequence shown.
This programming sequence consists of three distinct phases.
1. Writing to specific registers to get the device ready to be updated.
2. Writing the calculated frequency (divider) settings for the desired output frequency.
3. Writing to specific registers necessary to start-up the device after divider registers have been updated. The new output frequency
will appear on output.
The divider values shown in the table below are for the previously described Si549 example for an output frequency of 156.75 MHz (for
other frequencies, replace the divider values in registers 23-31 with values specific to your frequency requirements).
Table 5.6. Si549 Register Write Sequence to Set Output Frequency
Register (decimal) Write Data (hex) Description Purpose
255 0x00 Set page register to point to
page 0
Get Device Ready for Update
69 0x00 Disable FCAL override (to allow
FCAL for this Freq Update)
17 0x00 Synchronously disable output
23 0x46 HSDIV[7:0]
Update Dividers
24 0x00 LSDIV[2:0]:HSDIV[10:8]
26 0xBF FBDIV[7:0]
27 0xF2 FBDIV[15:8]
28 0x9C FBDIV[23:16]
29 0x51 FBDIV[31:24]
30 0xC7 FBDIV[39:32]
31 0x00 FBDIV[42:40]
7 0x08 Start FCAL using new divider
values
Startup Device
17 0x01 Synchronously enable output
Note: Refer to the device data sheet for default Si549 I2C address or to the device data sheet addendum for your specific I2C address.
Si549 Data Sheet
Configuring Si549 Output Frequency via I2C
silabs.com | Building a more connected world. Rev. 1.0 | 18
5.6 Digitally Controlled Oscillator – ADPLL: Small, Fast Frequency Changes
The Si549 can make small, fast frequency adjustments over a range of +/- 950 ppm (parts-per-million) around the device output fre-
quency (set as described in previous sections). This mode is typically used in applications requiring a digitally controlled oscillator
(DCO) for digital PLL or other types of frequency control loops. We refer to this type of application as an all-digital PLL or ADPLL.
The ADPLL mode uses a single 24 bit register, ADPLL_DELTA_M[23:0], to add an offset to the VCO frequency to affect the small fre-
quency change. This offset is added in a synchronous fashion to prevent frequency discontinuities and can be updated as fast as the
max I2C bus speed of 1 MHz will allow. The frequency offset can be positive or negative over a range of -950 ppm to +950 ppm with
0.0001164 ppm resolution.
The equation for this frequency change is simply,
ADPLL_DELTA_M[23:0] = ∆ FoutPPM / 0.0001164
Where FoutPPM is the desired ppm change in output frequency, ADPLL_DELTA_M[23:0] is a two’s complement 24 bit value, and
0.0001164 is a constant per-bit ppm value. The 24 bit ADPLL_DELTA_M[23:0] value is written into three sequential 8 bit registers in
LSByte to MSByte order via I2C. Upon writing the MSByte, the frequency change takes effect. Below is an example VB to implement
this feature. (Note that writing ADPLL_DELTA_M[23:0] = 0x000 will result in no frequency offset and return to the nominal output fre-
quency.)
VB Code example for ADPLL (small frequency change) calculation and operation:
nAddr = Device I2C address
PPM_Delta = desired PPM frequency shift
Function Set_ADPLL(ByVal nAddr As UInteger, ByVal PPM_Delta As Double) As Integer
Dim ADPLL_PPM_StepSize As Double = 0.0001164
Dim ADPLL_Delta_M As Integer
Dim Reg231 As UInteger = 0
Dim Reg232 As UInteger = 0
Dim Reg233 As UInteger = 0
Dim ReturnCode As Integer = 0 '1=OK, -1 PPM requested is out of bounds
If (PPM_Delta <= 950 And PPM_Delta >= -950) Then
ADPLL_Delta_M = (PPM_Delta / ADPLL_PPM_StepSize)
Reg231 = (ADPLL_Delta_M And &HFF)
Reg232 = (ADPLL_Delta_M >> 8) And &HFF
Reg233 = (ADPLL_Delta_M >> 16) And &HFF
I2C_Write(nAddr, 0, 231, Reg231) 'write “Reg231” value to register 231 at nAddr, page 0 (LSByte)
I2C_Write(nAddr, 0, 232, Reg232) 'write “Reg232” value to register 232 at nAddr, page 0
I2C_Write(nAddr, 0, 233, Reg233) 'write “Reg233” value to register 233 at nAddr, page 0
(MSByte)
ReturnCode = 1
Else
ReturnCode = -1
End If
Return (ReturnCode)
End Function
Si549 Data Sheet
Configuring Si549 Output Frequency via I2C
silabs.com | Building a more connected world. Rev. 1.0 | 19
5.7 Register Map Reference
Table 5.7. Register Map Reference Summary
Register
(decimal)
Register Bit Type Reset
Value
76543210
7 RESET <Reserved> = 3'b000 MS_ICAL
2
<Reserved> = 3'b000 R/W 0x00
17 <Unused> ODC_OE R/W 0x01
23 HSDIV[7:0] R/W 0x54
24 <Unused> LSDIV[2:0] <Unused> HSDIV[10:8] R/W 0x00
26 FBDIV[7:0] R/W 0x00
27 FBDIV[15:8] R/W 0x00
28 FBDIV[23:16] R/W 0x00
29 FBDIV[31:24] R/W 0x00
30 FBDIV[39:32] R/W 0x64
31 <Unused> FBDIV[42:40] R/W 0x00
69 FCAL_OV
R
<Reserved> = 7'b0000001 R/W 0x01
231 ADPLL_DELTA_M[7:0] R/W 0x00
232 ADPLL_DELTA_M[15:8] R/W 0x00
233 ADPLL_DELTA_M[23:16] R/W 0x00
255 <Reserved> = 6'b000000 PAGE[1:0] R/W 0x00
Table 5.8. Register Bit Field Summary
Register Bit Field Name Bit Field (#bits) Register Description
RESET 1 7 Set to 1 to reset device. Self clearing.
MS_ICAL2 1 7 Set to 1 to initiate FCAL. Self clearing.
HSDIV[10:0] 11 23-24 HSDIV is High-speed output divider value
in unsigned 11-bit binary format. Valid di-
vide values are from 5 to 2046, with values
of 5-33 even or odd, and values 34-2046
restricted to even values only.
LSDIV[2:0] 3 24 LSDIV sets a power-of-2 output divider.
Values of 0,1,2,3,4,5,6,7 result in divide ra-
tio of 1,2,4,8,16,32,32,32 respectively. Note
that a value of 0 (divide-by-1) essentially
bypasses this divider.
Si549 Data Sheet
Configuring Si549 Output Frequency via I2C
silabs.com | Building a more connected world. Rev. 1.0 | 20
Register Bit Field Name Bit Field (#bits) Register Description
FBDIV[42:0] 43 26-31 The main DSPLL system feedback divide
(FBDIV) value for Si54x. This 43 bit value is
composed of an unsigned 11-bit integer
value (FBDIV[42:32]) concatenated with a
32-bit fractional value (FBDIV[31:0]), for an
11.32 fixed point binary format. The valid
range of the 11-bit integer part is from 60 to
2045
FCAL_OVR 1 69 FCAL Override: If set to 1, FCAL is by-
passed. Clear to 0 to allow FCAL.
ADPLL_DELTA_M[23:0] 24 231-233 Digital word to effect small frequency shifts
to base frequency. Value is 24 bit 2's com-
plement causing a 0.0001164 ppm per bit
shift in frequency. Positive values = positive
freq shift, negative values = negative freq
shift. Valid range is -8161513 to +8161512,
representing a max PPM shift range of
-950 ppm to +950 ppm, with 0 value repre-
senting 0 PPM shift. Writing a new
ADPLL_DELTA_M value will take effect
upon writing to the MSByte (Register 233).
Therefore, value updates should follow the
sequence of writing in register order Reg
231...Reg 232...Reg 233.
PAGE[1:0] 2 255 Sets which page of registers the I2C port is
reading/writing. The size of a page is 256
bytes which is the addressable range of an
I2C "set address" command. The value of
PAGE is multiplied by 256 and added to
what "set address" has set. Physically, the
2 PAGE bits become bits [9:8] of the devi-
ce's internal register map address. This
mechanism allows for more than 256 regis-
ters to be addressed within the 8 bit I2C
"set address" limitation.
Si549 Data Sheet
Configuring Si549 Output Frequency via I2C
silabs.com | Building a more connected world. Rev. 1.0 | 21
5.8 Si549 Frequency Planner VB Code
Module Main
'
' Si54x Frequency Planner Code
'
'
'Set Target device type, Speed grade, and desired output frequency
'
Public Device As Integer = 549 ' 544 or 549 only
Public SpeedGrade As String = "C" 'Can only be "A" or "B" or "C"
Public Output_Freq As Double = 312500000.0 'Output frequency in Hz (initially set to 312.5 MHz)
'Set in 'SetLimits" function...
Public Fvco_max As Double 'Fvco Max per Table 3
Public Fvco_min As Double 'Fvco Min per Table 3
Public Xtal_freq As Double 'Xtal_Freq per Table 3
Public Fout_min As Double 'Minimum output frequency
Public Fout_max As Double 'Maximum output frequency
Sub Main()
'
' Device divider limits (see Tables 1 & 2)
'
Dim HSDIV_UpperLimit As Integer = 2046
Dim HSDIV_LowerLimit As Integer = 5
Dim HSDIV_LowerLimit_Odd As Integer = 5 'min count for odd HSDIV divisor
Dim HSDIV_UpperLimit_Odd As Integer = 33 'max count for odd HSDIV divisor
Dim LSDIV_UpperLimit As Integer = 5
Dim LSDIV_LowerLimit As Integer = 0
Dim FBDIV_UpperLimit As Double = 2045 + ((2 ^ 32 - 1) / (2 ^ 32))
Dim FBDIV_LowerLimit As Double = 60.0
'
' Working variables
'
Dim Min_HSLS_Div As Double
Dim LSDIV_Div As Double ' actual LSDIV divide ratio
Dim LSDIV_Reg As Integer ' LSDIV as encoded in power of 2 for device register use
Dim HSDIV As Double
Dim FBDIV As Double
Dim Fvco As Double
Dim FBDIV_Int As UInteger
Dim FBDIV_Frac As UInteger
Dim Reg23 As UInteger = 0 'HSDIV[7:0]
Dim Reg24 As UInteger = 0 'OD_LSDIV[2:0],HSDIV[10:8] (*2^4,/2^8)
Dim Reg26 As UInteger = 0 'FBDIV[7:0]
Dim Reg27 As UInteger = 0 'FBDIV[15:8] (/2^8)
Dim Reg28 As UInteger = 0 'FBDIV[23:16] (/2^16)
Dim Reg29 As UInteger = 0 'FBDIV[31:24] (/2^24)
Dim Reg30 As UInteger = 0 'FBDIV[39:32] (/2^32)
Dim Reg31 As UInteger = 0 'FBDIV[42:40] (/2^40)
'
' Set device limits based on device type and speed grade.
' (Checks if desired output frequency is valid based on device and speed grade)
'
If SetLimits(Device, SpeedGrade, Output_Freq) = 0 Then
'
' If limits are set and output frequency is valid, calculate frequency plan...
'***********************************************************************************************
' Step 1: Find theoretical HSDIV *LSDIV value based on lowest valid VCO frequency...
' (Assumes "Output_Freq" has been tested and is in valid range for the device grade
according to Table 3)
'
Min_HSLS_Div = Fvco_min / Output_Freq ' Floating point HS*LS div value. Remember to first
bounds check Output_Freq!
'Step 2: Find LSDIV divisor value given Min_HSLS_Div value
'
LSDIV_Div = Math.Ceiling(Min_HSLS_Div / HSDIV_UpperLimit) ' Divisor value of LSDIV, NOT yet
encoded as power of 2
Si549 Data Sheet
Configuring Si549 Output Frequency via I2C
silabs.com | Building a more connected world. Rev. 1.0 | 22
If (LSDIV_Div > 32) Then LSDIV_Div = 32 ' clip at 32 (max LSDIV divisor)
'
'Encode LSDIV divisor value into next nearest 'power of 2' value if not already. This will be
LSDIV_Reg
'
LSDIV_Reg = Math.Ceiling(Math.Log(LSDIV_Div, 2)) ' LSDIV_Reg now encoded as proper power of
2. Will range from 0 to 5.
' Adjust LSDIV_Div (holder of divisor) based on rounded power of 2 value in LSDIV_Reg
LSDIV_Div = 2 ^ LSDIV_Reg 'LSDIV_Div divisor now synchronized to actual LSDIV_Reg.
'
'Step 3: Find HSDIV divisor value using known LSDIV divisor
'
HSDIV = Math.Ceiling(Min_HSLS_Div / LSDIV_Div)
If ((LSDIV_Reg > 0) Or ((HSDIV >= HSDIV_LowerLimit_Odd) And (HSDIV <= HSDIV_UpperLimit_Odd))) Then
HSDIV = HSDIV ' Leaves HSDIV as even or odd only if LSDIV_Div = 1 and HSDIV is from 5 to 33.
Else
If ((HSDIV Mod 2) <> 0) Then 'If HSDIV is an odd value...
HSDIV = HSDIV + 1 '...make it even by rounding up
End If 'If already even, leave it alone
End If
'
' Step 4: Now calculate Fvco and FBDIV
'
Fvco = (HSDIV * LSDIV_Div * Output_Freq) 'Calculate Fvco based on valid HSDIV,LSDIV, and Fout
FBDIV = Fvco / Xtal_freq 'Finally, calculate FBDIV based on xtal freq
'Calculate 11.32 fixed point FBDIV value (MCTL_M)
'Extract Integer part
FBDIV_Int = Int(FBDIV)
'Extract fractional part
FBDIV = (FBDIV - FBDIV_Int)
FBDIV = FBDIV * (2 ^ 32)
FBDIV_Frac = Int(FBDIV)
'
'Generate Register values based on LSDIV, HSDIV, and FBDIV (MCTL_M)
'
Reg23 = (HSDIV And &HFF)
Reg24 = ((HSDIV >> 8) And &H7) Or ((LSDIV_Reg And &H7) << 4)
Reg26 = (FBDIV_Frac And &HFF)
Reg27 = (FBDIV_Frac >> 8) And &HFF
Reg28 = (FBDIV_Frac >> 16) And &HFF
Reg29 = (FBDIV_Frac >> 24) And &HFF
Reg30 = (FBDIV_Int) And &HFF
Reg31 = (FBDIV_Int >> 8) And &H7
'*************************************************************************
Else
Console.WriteLine("*** Device invalid or Device limits exceeded. Frequency plan not calculated.")
End If
End Sub
'
' Sets device limits according to Table 3
' Returns 0 if limits are set and output frequency is valid
' Returns -1 if limits not found or output frequency is invalid
Function SetLimits(ByVal Device As Integer, ByVal SpeedGrade As String, ByVal Output_Freq As Double) As
Integer
Dim ReturnCode As Integer
ReturnCode = 0
If Device = 544 Then
Xtal_freq = 55050000.0
If SpeedGrade = "A" Then
Fvco_min = 10800000000.0
Fvco_max = 12550082103.0
Fout_min = 200000.0
Fout_max = 1500000000.0
If ((Output_Freq < Fout_min) Or (Output_Freq > Fout_max)) Then
ReturnCode = -1
End If
ElseIf SpeedGrade = "B" Then
Fvco_min = 10800000000.0
Si549 Data Sheet
Configuring Si549 Output Frequency via I2C
silabs.com | Building a more connected world. Rev. 1.0 | 23
Fvco_max = 12109728345.0
Fout_min = 200000.0
Fout_max = 800000000.0
If ((Output_Freq < Fout_min) Or (Output_Freq > Fout_max)) Then
ReturnCode = -1
End If
ElseIf SpeedGrade = "C" Then
Fvco_min = 10800000000.0
Fvco_max = 12109728345.0
Fout_min = 200000.0
Fout_max = 325000000.0
If ((Output_Freq < Fout_min) Or (Output_Freq > Fout_max)) Then
ReturnCode = -1
End If
Else
ReturnCode = -1
End If
ElseIf Device = 549 Then
Xtal_freq = 152600000.0
If SpeedGrade = "A" Then
Fvco_min = 10800000000.0
Fvco_max = 12511886114.0
Fout_min = 200000.0
Fout_max = 1500000000.0
If ((Output_Freq < Fout_min) Or (Output_Freq > Fout_max)) Then
ReturnCode = -1
End If
ElseIf SpeedGrade = "B" Then
Fvco_min = 10800000000.0
Fvco_max = 12206718160.0
Fout_min = 200000.0
Fout_max = 800000000.0
If ((Output_Freq < Fout_min) Or (Output_Freq > Fout_max)) Then
ReturnCode = -1
End If
ElseIf SpeedGrade = "C" Then
Fvco_min = 10800000000.0
Fvco_max = 12206718160.0
Fout_min = 200000.0
Fout_max = 325000000.0
If ((Output_Freq < Fout_min) Or (Output_Freq > Fout_max)) Then
ReturnCode = -1
End If
Else
ReturnCode = -1
End If
Else
ReturnCode = -1
End If
Return (ReturnCode)
End Function
End Module
--------------------------------------------------------------------------
Si549 Data Sheet
Configuring Si549 Output Frequency via I2C
silabs.com | Building a more connected world. Rev. 1.0 | 24
5.9 Table of Common Frequencies for Si549 (152.6 MHz xtal)
Fout (MHz) LSDIV HSDIV FBDIV Fvco (GHz) Reg 23 Reg 24 Reg 26 Reg 27 Reg 28 Reg 29 Reg 30 Reg 31
70.656 0 154 71.30422018 10.881024 9Ah 00h BAh 5Fh E1h 4Dh 47h 00h
100 0 108 70.77326343 10.8 6Ch 00h A7h 97h F4h C5h 46h 00h
122.88 0 88 70.86133683 10.81344 58h 00h 04h 92h 80h DCh 46h 00h
125 0 88 72.08387942 11 58h 00h 34h 1Fh 79h 15h 48h 00h
148.351648 0 74 71.93985552 10.97802195 4Ah 00h 07h 5Fh 9Ah F0h 47h 00h
148.5 0 74 72.01179554 10.989 4Ah 00h 63h 08h 05h 03h 48h 00h
148.945454 0 74 72.22780862 11.0219636 4Ah 00h 7Dh AAh 51h 3Ah 48h 00h
150 0 72 70.77326343 10.8 48h 00h A7h 97h F4h C5h 46h 00h
153.6 0 72 72.47182176 11.0592 48h 00h 84h 4Fh C9h 78h 48h 00h
155.52 0 70 71.33944954 10.8864 46h 00h 46h 2Ah E6h 56h 47h 00h
156.25 0 70 71.67431193 10.9375 46h 00h D8h B4h 9Fh ACh 47h 00h
168.04 0 66 72.67785059 11.09064 42h 00h C2h 9Dh 87h ADh 48h 00h
168.75 0 64 70.77326343 10.8 40h 00h A7h 97h F4h C5h 46h 00h
200 0 54 70.77326343 10.8 36h 00h A7h 97h F4h C5h 46h 00h
212.5 0 52 72.41153342 11.05 34h 00h 17h 41h 5Ah 69h 48h 00h
245.76 0 44 70.86133683 10.81344 2Ch 00h 04h 92h 80h DCh 46h 00h
250 0 44 72.08387942 11 2Ch 00h 34h 1Fh 79h 15h 48h 00h
270 0 40 70.77326343 10.8 28h 00h A7h 97h F4h C5h 46h 00h
311.04 0 36 73.37771953 11.19744 24h 00h 1Ch 3Ah B2h 60h 49h 00h
312.5 0 36 73.72214941 11.25 24h 00h A3h C8h DEh B8h 49h 00h
322.265625 0 34 71.80230177 10.95703125 22h 00h 14h A6h 63h CDh 47h 00h
400 0 27 70.77326343 10.8 1Bh 00h A7h 97h F4h C5h 46h 00h
425 0 26 72.41153342 11.05 1Ah 00h 17h 41h 5Ah 69h 48h 00h
491.52 0 22 70.86133683 10.81344 16h 00h 04h 92h 80h DCh 46h 00h
500 0 22 72.08387942 11 16h 00h 34h 1Fh 79h 15h 48h 00h
614.4 0 18 72.47182176 11.0592 12h 00h 84h 4Fh C9h 78h 48h 00h
622.08 0 18 73.37771953 11.19744 12h 00h 1Ch 3Ah B2h 60h 49h 00h
644.53125 0 17 71.80230177 10.95703125 11h 00h 14h A6h 63h CDh 47h 00h
750 0 15 73.72214941 11.25 0Fh 00h A3h C8h DEh B8h 49h 00h
800 0 14 73.39449541 11.2 0Eh 00h C0h A6h FDh 64h 49h 00h
Si549 Data Sheet
Configuring Si549 Output Frequency via I2C
silabs.com | Building a more connected world. Rev. 1.0 | 25
5.10 I2C Interface
Configuration and operation of the Si549 is controlled by reading and writing to the RAM space using the I2C interface. The device
operates in slave mode with 7-bit addressing and can operate in Standard-Mode (100 kbps), Fast-Mode (400 kbps), or Fast-Mode Plus
(1 Mbps). Burst data transfer with auto address increments are also supported.
The I2C bus consists of a bidirectional serial data line (SDA) and a serial clock input (SCL). Both the SDA and SCL pins must be con-
nected to the VDD supply via an external pull-up as recommended by the I2C specification. The Si549 7-bit I2C slave address is user-
customized during the part number configuration process.
Data is transferred MSB first in 8-bit words as specified by the I2C specification. A write command consists of a 7-bit device (slave)
address + a write bit, an 8-bit register address, and 8 bits of data as shown in the figure below.
A write burst operation is also shown where every additional data word is written using an auto-incremented address.
1 – Read
0 – Write
A – Acknowledge (SDA LOW)
N – Not Acknowledge (SDA HIGH)
S – START condition
P – STOP condition
From slave to master
From master to slave
Write Operation – Single Byte
S 0 A Reg Addr [7:0]Slv Addr [6:0] A Data [7:0] PA
Write Operation - Burst (Auto Address Increment)
Reg Addr +1
S 0 A Reg Addr [7:0]Slv Addr [6:0] A Data [7:0] A Data [7:0] PA
Figure 5.3. I2C Write Operation
A read operation is performed in two stages. A data write is used to set the register address, then a data read is performed to retrieve
the data from the set address. A read burst operation is also supported. This is shown in the figure below.
1 – Read
0 – Write
A – Acknowledge (SDA LOW)
N – Not Acknowledge (SDA HIGH)
S – START condition
P – STOP condition
From slave to master
From master to slave
Read Operation – Single Byte
S 0 A Reg Addr [7:0]Slv Addr [6:0] A P
Read Operation - Burst (Auto Address Increment)
Reg Addr +1
S 1 ASlv Addr [6:0] Data [7:0] PN
S 0 A Reg Addr [7:0]Slv Addr [6:0] A P
S 1 ASlv Addr [6:0] Data [7:0] A PNData [7:0]
Figure 5.4. I2C Read Operation
The timing specifications and timing diagram for the I2C bus is compatible with the I2C-Bus standard. SDA timeout is supported for
compatibility with SMBus interfaces.
The I2C bus can be operated at a bus voltage of 1.71 to 3.63 V and should be the same voltage as the Si549 VDD.
Si549 Data Sheet
Configuring Si549 Output Frequency via I2C
silabs.com | Building a more connected world. Rev. 1.0 | 26
6. Package Outline
6.1 Package Outline (5x7 mm)
The figure below illustrates the package details for the 5x7 mm Si549. The table below lists the values for the dimensions shown in the
illustration.
Figure 6.1. Si549 (5x7 mm) Outline Diagram
Table 6.1. Package Diagram Dimensions (mm)
Dimension Min Nom Max Dimension Min Nom Max
A 1.07 1.18 1.33 E1 6.10 6.20 6.30
A2 0.40 0.50 0.60 L 1.07 1.17 1.27
A3 0.45 0.55 0.65 L1 1.00 1.10 1.20
b 1.30 1.40 1.50 p 1.70 -- 1.90
b1 0.50 0.60 0.70 R 0.70 REF
c 0.50 0.60 0.70 aaa 0.15
D 5.00 BSC bbb 0.15
D1 4.30 4.40 4.50 ccc 0.08
e 2.54 BSC ddd 0.10
E 7.00 BSC eee 0.05
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
Si549 Data Sheet
Package Outline
silabs.com | Building a more connected world. Rev. 1.0 | 27
6.2 Package Outline (3.2x5 mm)
The figure below illustrates the package details for the 5x3.2 mm Si549. The table below lists the values for the dimensions shown in
the illustration.
Figure 6.2. Si549 (3.2x5 mm) Outline Diagram
Table 6.2. Package Diagram Dimensions (mm)
Dimension MIN NOM MAX Dimension MIN NOM MAX
A 1.02 1.17 1.33 E1 2.85 BSC
A2 0.50 0.55 0.60 L 0.8 0.9 1.0
A3 0.45 0.50 0.55 L1 0.45 0.55 0.65
b 0.54 0.64 0.74 L2 0.05 0.10 0.15
b1 0.54 0.64 0.75 L3 0.15 0.20 0.25
D 5.00 BSC aaa 0.15
D1 4.65 BSC bbb 0.15
e 1.27 BSC ccc 0.08
e1 1.625 TYP ddd 0.10
E 3.20 BSC eee 0.05
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
Si549 Data Sheet
Package Outline
silabs.com | Building a more connected world. Rev. 1.0 | 28
7. PCB Land Pattern
7.1 PCB Land Pattern (5x7 mm)
The figure below illustrates the 5x7 mm PCB land pattern for the Si549. The table below lists the values for the dimensions shown in
the illustration.
Figure 7.1. Si549 (5x7 mm) PCB Land Pattern
Table 7.1. PCB Land Pattern Dimensions (mm)
Dimension (mm) Dimension (mm)
C1 4.20 Y1 1.95
C2 6.05 X2 1.80
E 2.54 Y2 0.75
X1 1.55
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a
Fabrication Allowance of 0.05 mm.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020D specification for Small Body Components.
Si549 Data Sheet
PCB Land Pattern
silabs.com | Building a more connected world. Rev. 1.0 | 29
7.2 PCB Land Pattern (3.2x5 mm)
The figure below illustrates the 3.2x5.0 mm PCB land pattern for the Si549. The table below lists the values for the dimensions shown
in the illustration.
Figure 7.2. Si549 (3.2x5 mm) PCB Land Pattern
Table 7.2. PCB Land Pattern Dimensions (mm)
Dimension (mm) Dimension (mm)
C1 2.70 X2 0.90
E 1.27 Y1 1.60
E1 4.30 Y2 0.70
X1 0.74
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a
Fabrication Allowance of 0.05 mm.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.
Si549 Data Sheet
PCB Land Pattern
silabs.com | Building a more connected world. Rev. 1.0 | 30
8. Top Marking
The figure below illustrates the mark specification for the Si549. The table below lists the line information.
Figure 8.1. Mark Specification
Table 8.1. Si549 Top Mark Description
Line Position Description
1 1–8 "Si549", xxx = Ordering Option 1, Option 2, Option 3 (e.g. Si549AAA)
2 1 x = Frequency Range Supported as described in the 1. Ordering Guide
2–7 6-digit custom Frequency Code as described in the 1. Ordering Guide
3Trace Code
Position 1 Pin 1 orientation mark (dot)
Position 2 Product Revision (B)
Position 3–5 Tiny Trace Code (3 alphanumeric characters per assembly release instructions)
Position 6–7 Year (last two digits of the year), to be assigned by assembly site (ex: 2017 = 17)
Position 8–9 Calendar Work Week number (1–53), to be assigned by assembly site
Si549 Data Sheet
Top Marking
silabs.com | Building a more connected world. Rev. 1.0 | 31
9. Revision History
Revision 1.0
August, 2018
Added 20 ppm total stability option.
Revision 0.75
March, 2018
Added 25 ppm total stability option.
Revision 0.5
December 11, 2017
Initial release.
Si549 Data Sheet
Revision History
silabs.com | Building a more connected world. Rev. 1.0 | 32
http://www.silabs.com
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701
USA
ClockBuilder Pro
One-click access to Timing tools,
documentation, software, source
code libraries & more. Available for
Windows and iOS (CBGo only).
www.silabs.com/CBPro
Timing Portfolio
www.silabs.com/timing
SW/HW
www.silabs.com/CBPro
Quality
www.silabs.com/quality
Support and Community
community.silabs.com
Disclaimer
Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or
intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"
parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes
without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included
information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted
hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of
Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant
personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass
destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.
Trademark Information
Silicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, Clockbuilder®, CMEMS®, DSPLL®, EFM®,
EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®,
Gecko®, ISOmodem®, Micrium, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress®, Zentri, Z-Wave, and others are trademarks or
registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited.
All other products or brand names mentioned herein are trademarks of their respective holders.