Device Marking Conventions National Semiconductor marks devices sold in order to provide device identification and manufacturing traceablility information. The method of presenting the information marked on the device is dependent on the size of the device package and the area available for marking, as well as the nature and specifications of the device. The information presented here describes the majority of the device markings a customer will observe. Specific package marking for a given device is given in the datasheet for that device. A package may have up to four lines of marking. The following information is usually contained in each line. First line: Manufacturing information * Company logo * Wafer and/or assembly plant codes (optional) (see Table 1 and Table 2) * Date code (see Table 4, Table 5, and Table 6) * Die run (wafer lot) code Second Line: Device part number * Device family (see Table 7) * Device type * Options * Package code (see Table 8) Third or fourth line: Optional, depending on device, package size, and customer * Continuation of device identification (if too long for the second line) * "Stampoff" number as required by specific customer request and specification * Notice(s) related to copyright or trademarks Very small packages, such as SOT-23, SOT-223, SC70, and SC90, are too small to contain all the information discussed above. Device identification marking is assigned differently, consisting of a four-character code: * Device type (see Table 10) * Device identification code * Grade These small packages also have a date code mark on the underside of the package. This is a one-character alpha code that represents a particular 6-week period during a 3-year span. The specific marking for a given device can be found in the device datasheet. Other date code information, which would be typically found in the "first line" marking, is identified on the container labels. Figure 1, Figure 2, and Figure 3 show the typical arrangement of marking on large, medium, and very small packages. Codes that are most often used in the device marking are listed in the following tables. For chip scale packaged devices and all other recent updates, please refer to www.national.com/packaging. (c) 2005 National Semiconductor Corporation MS101128 10112801 FIGURE 1. Marking Convention for Larger Packages 10112802 FIGURE 2. Marking Convention for Smaller Packages 10112803 FIGURE 3. Marking Convention for Very Small Packages www.national.com Device Marking Conventions July 2005 Device Marking Conventions Wafer Fab and Assembly Plant Codes Date of Manufacture Codes Marks indicating the date of manufacture occur in four, three, two, or one digit versions. The date code represents a sixweek period in which the device was assembled. The onedigit code is an alpha code for the very small packages, such as SOT, SC70, and SC90, and ranges from A to Z plus the character @, representing a 6-week period during a 3-year span. For the four, three, and two digit codes, the allocation of digits between year and week information in each scheme is summarized in Table 4: Table 1 lists single-letter codes for National Semiconductor's wafer fabrication plants. Letters that are not in this list indicate wafer fabrication at one of National Semiconductor's approved sub-contractors. TABLE 1. Wafer Fab Plant Code Code Fab Location E Arlington, TX J Greenock, UK R Santa Clara, CA V South Portland, ME X Arlington, TX 0 TABLE 4. Year Code Multiple Fab Origin 1 USA (Sub-con) 2 Taiwan (Sub-con) 3 USA (Sub-con) 8 Singapore (Sub-con) M USA (Sub-con) N Israel (Sub-con) P China (Sub-con) W Japan (Sub-con) Z USA (Sub-con) Version Year Digits Week Range Digits Four-digit (YYWW) 2 2 Three-digit (YWW) 1 2 Two-digit (YW) 1 1 Year: The year code is the last one or two digits of the calendar year of manufacture. For example, a device manufactured in 1999 would have a one-digit code of "9" or a two-digit code of "99". Week: The week code is based on the starting calendar week of the six-week period during which the device was assembled. Table 5 summarizes the six-week date code schedule for one- and two-digit codes. TABLE 5. Six-Week Period Code Table 2 lists single-letter codes for National Semiconductor's device assembly plants. Letters that are not in this list indicate device assembly at another of National Semiconductor's approved sub-contractors see Table 3. From Week Six-Week Period To Week Two-Digit Code One-Digit Code 52 05 52 9 06 11 06 1 12 17 12 2 Assembly Location 18 23 18 3 F Santa Clara, CA 24 29 24 4 C China 30 35 30 5 M Malacca, Malaysia 36 41 36 6 Singapore 42 47 42 7 48 51 48 8 TABLE 2. Assembly Plant Code NSC Assembly Sites Code S TABLE 3. Assembly Plant Code Sub-Contractors Code Some example date codes are shown in Table 6: Assembly Location B Thailand E Korea H Philippines J TABLE 6. Date Code Examples Date of Manufacture 4-Digit Code Japan Calendar week 48, 1999 9948 948 98 K Hong Kong Calendar week 6, 2000 0006 006 01 N Malaysia Calendar week 14, 2000 0012 012 02 P Malaysia Calendar week 32, 2001 0130 130 15 R Malaysia T Taiwan U China V Malaysia X USA Y Malaysia www.national.com 2 3-Digit 2-Digit Code Code M3, M5, M6, MF Molded Small Outline Package (SOT-23) The die run code is a two letter alpha code, ranging from AB through ZZ for each device, that is automatically assigned to each lot by an internal manufacturing system. When the date code is combined with the die run code, a unique identifier is created. In case of any problems with a device, this identification facilitates backward traceability to manufacturing processes where containment and corrective actions can be defined. These actions, in turn, minimize, and eventually eliminate, any negative impact on customers. M7, MG MC MH, MXP TABLE 7. Device Family CLC Comlinear Products Control Oriented Processor DAC Data Conversion DS, DSV Interface Products FPD Flat Panel Devices TSSOP with exposed pad MJ Molded surface mount with J-bend (SOJ) MM Miniature Molded Small Outline Package (MSOP, Mini SO) MP Molded Small Outline Package (SOT-223) Data Conversion COP Ceramic Small Outline Package (CSOP) MEA, MEB, Molded Shrink Small Outline Package MEC, MED, MQ, (SSOP) MQA, MS, MSA, MSC Device Family and Package Codes ADC, ADCV SC70 MB, MBH, MBS, Thin Small Outline Package (TSOP) MDA, MDB LF Linear (Bi-FETTM) MTB, MTC, MTD, MTE Molded Thin Shrink Small Outline Package (TSSOP) LM Linear (Monolithic) MW, WM Wide Body Molded Small Outline Package (SO, SOT) LMC Linear CMOS LMD Linear DMOS MWA Power Small Outline Package (PSOP) Linear Monolithic Filter N, NA Molded Dual-In-Line Package (DIP) LMF, MF LMH P, PA, TB Linear Monolithic High Speed S, TS Molded TO-202 Power Package Molded Power Surface Mount Package (TO-263) LMS Linear Second Source LMV Linear Low Voltage LMX Wireless SL, SLB Chip Scale Packaging (CSP) Laminate Linear Low Power SM, SLC Ball Grid Array (BGA) LP LPC Linear CMOS (Low Power) LPV Linear Low Power, Low Voltage SC SCAN TP T, TA TF Digital Cordless Telephony U, UA, UC JTAG Products U, UE Telecom Products UP V, VA TABLE 8. Package Type BP D, DA, DH Micro Surface-Mount Device (MicroSMD) Molded D-Pak (TO-252) EA, E Ceramic Leaded Chip Carrier (LCC) 3-Lead Metal Can (TO-46,TO-39) J, JA Ceramic Dual-In-Line Package (CerDIP) K, KA, KC, KS VS, VT, VU Ceramic Quad Flatpack (CQFP, CQJB) H, HA TO-3 Metal Can (Steel) LD, LQ, LQA Leadless Leadframe Package (LLP) M, MA Molded Small Outline Package (SO, SOT) Molded TO-220 Power Package With Isolated Tab Ball Grid Array (BGA) Ceramic Pin Grid Array (CPGA) Plastic Pin Grid Array (PPGA) 28 & 44-Lead Molded Plastic Leaded Chip Carrier (PLCC) Leaded Quad Flat Pack (LQFP) VC, VD, VE, VF, Molded Plastic Quad Flat Package VH, VI, VJ, VK, (PQFP) VM, VN, VO, VP Ceramic Sidebrazed Dual-In-Line Package DT, TD EL V, VV, VW, VY Molded TO-220 Power Package W, WA Ceramic Flatpack W, WQ Ceramic Quad Flatpak WG Ceramic Small Outline Package and Quad Flatpak with Gullwing Lead Form YA TQFP with exposed pad Z, ZA,R 3 Molded Plastic Thin Quad Flat Package (TQFP) Molded 3-Lead Transistor Package (TO-92) www.national.com Device Marking Conventions Die Run (Wafer Lot) Codes Device Marking Conventions Device Family and Package Codes (Continued) performance grade. This four-character "top mark" is usually fully specified in the device datasheet, for all options and grades of the product. TABLE 9. Package Type -- CLC Products E Molded Small Outline Package (SO, SOT) Q Molded Plastic Leaded Chip Carrier (PLCC) TABLE 10. Device Type Code A Amplifier B Buffer C Comparator D Driver Small Surface-Mount Package Marking H Comlinear L Low-Dropout Linear Regulator For packages such as SOT23 (3-, 5-, and 6-lead), SOT223, and MSOP, there is insufficient space to mark the entire part number, so a four-character code is used instead. The first character represents the device type (see Table 10). The second two characters are a code relating to the device part number and options. The fourth character relates to device R Voltage Reference S Switched-Capacitor Voltage Converter T Temperature Sensor Z Audio National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ``Banned Substances'' as defined in CSP-9-111S2. Leadfree products are RoHS compliant. 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