December 2016
DocID10761 Rev 2
1/12
This is information on a product in full production.
www.st.com
STTH30L06C
Turbo 2 ultratfast high voltage rectifier
Datasheet - production data
Features
Ultrafast switching
Low reverse current
Low thermal resistance
Reduce switching and conduction losses
ECOPACK®2 compliant component for
D²PAK on demand
Description
This device uses ST Turbo 2 600 V technology,
and is particularly suited as boost diode in
discontinuous or critical mode power factor
corrections.
It is also intended for use as a freewheeling diode
in power supplies and other power switching
applications.
Table 1: Device summary
Symbol
Value
IF(AV)
up to 2 x 20 A
VRRM
600 V
VF (typ.)
0.95 V
trr (max.)
55 ns
TO-247 D²PAK
K
K
A1 A1
A2 A2
A1 K
A2
Characteristics
STTH30L06C
2/12
DocID10761 Rev 2
1 Characteristics
Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
600
V
IF(RMS)
Forward rms current
30
A
IF(AV)
Average forward current δ = 0.5,
square wave
TC = 140 °C
Per diode
15
A
TC = 125 °C
Per device
30
TC = 120 °C
Per diode
20
TC = 110 °C
Per device
40
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
130
A
Tstg
Storage temperature range
-65 to +175
°C
Tj
Maximum operating junction temperature
+175
°C
Table 3: Thermal parameters
Symbol
Parameter
Max. value
Unit
Rth(j-c)
Junction to case
Per
diode
1.7
°C/W
Total
1.15
Rth(c)
Coupling
0.6
°C/W
When the diodes 1 and 2 are used simultaneously:
ΔTj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c)
Table 4: Static electrical characteristics (per diode)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
IR(1)
Reverse leakage current
Tj = 25 °C
VR = VRRM
-
15
µA
Tj = 150 °C
-
40
400
VF(2)
Forward voltage drop
Tj = 25 °C
IF = 15 A
-
1.55
V
Tj = 150 °C
-
0.95
1.2
Tj = 25 °C
IF = 30 A
1.76
Tj = 150 °C
1.15
1.45
Notes:
(1)Pulse test: tp = 5 ms, δ < 2%
(2)Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.94 x IF(AV) + 0.017 x IF2(RMS)
STTH30L06C
Characteristics
DocID10761 Rev 2
3/12
Table 5: Dynamic electrical characteristics (per diode)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
trr
Reverse recovery time
Tj = 25 °C
IF = 0.5 A
IR = 1 A
Irr = 0.25 A
-
55
ns
IF = 1 A
VR = 30 V
dlF/dt = 50 A/µs
-
60
85
IRM
Reverse recovery current
Tj = 125 °C
IF = 15 A
VR = 400 V
dlF/dt = 100 A/µs
-
8.5
12
A
tfr
Forward recovery time
Tj = 25 °C
IF = 15 A
VFR = 1.1 x VFmax.
dlF/dt = 100 A/µs
-
300
ns
VFP
Forward recovery voltage
-
3.0
V
Characteristics
STTH30L06C
4/12
DocID10761 Rev 2
1.1 Characteristics (curves)
Figure 1: Conduction losses versus average
forward current (per diode)
Figure 2: Forward voltage drop versus forward
current (per diode)
Figure 3: Relative variation of thermal impedance
junction to case versus pulse duration
Figure 4: Peak reverse recovery current versus
dlF/dt (typical values, per diode)
Figure 5: Reverse recovery time versus dlF/dt
(typical values, per diode)
Figure 6: Reverse recovery charges versus dlF/dt
(typical values, per diode)
0
2
4
6
8
10
12
14
16
18
20
22
24
860 42 10 12 14 16 18 20
P(W)
T
δ=tp/T tp
δ=1
IF(AV)(A)
δ=0.05
δ=0.1 δ=0.2 δ= 0.5
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00
th(j-c)
Z / t
Rh(j-c)
tp(s)
Single pulse
T
δ=tp/T tp
0
5
10
15
20
25
30
35
0 50 100 150 200 250 300 350 400 450 500
IRM(A)
dIF/dt(A/µs)
I =2 x I
F F(AV)
I =
F F
I(AV)
V =400V
I =0.5 x I
F F(AV)
T=125°C
R
j
0
100
200
300
400
500
600
700
800
0 50 100 150 200 250 300 350 400 450 500
trr(ns)
dIF/dt(A/µs)
I =
F F
I(AV) IF=0.5 x IF(AV)
V =400V
T=125°C
R
j
I =2 x I
F F(AV)
0
200
400
600
800
1000
1200
1400
1600
1800
0 100 200 300 400 500
Qrr(nC)
I =2 x I
F F(AV)
I =
F F
I(AV)
V =400V
I =0.5 x I
F F(AV)
T=125°C
R
j
dIF/dt(A/µs)
STTH30L06C
Characteristics
DocID10761 Rev 2
5/12
Figure 7: Reverse recovery softness factor versus
dlF/dt (typical values, per diode)
Figure 8: Relative variation of dynamic parameters
versus junction temperature
Figure 9: Transient peak forward voltage versus
dlF/dt (typical values, per diode)
Figure 10: Forward recovery time versus dlF/dt
(typical values, per diode)
Figure 11: Junction capacitance versus reverse
voltage applied (typical values, per diode)
Figure 12: Thermal resistance, junction to ambient,
versus copper surface under tab (D²PAK)
0
200
400
600
800
1000
1200
1400
1600
1800
0 100 200 300 400 500
Qrr(nC)
I =2 x I
F F(AV)
I =
F F
I(AV)
V =400V
I =0.5 x I
F F(AV)
T=125°C
R
j
dIF/dt(A/µs)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 10050 150 200 250 300 350 400 450 500
S factor
dIF/dt(A/µs)
T=125°C
F
I < 2 x I
j
F(AV)
VR=400V
0
1
2
3
4
5
6
7
8
9
10
11
12
0 50 100 150 200 250 300 350 400 450 500
VFP(V)
dIF/dt(A/µs)
I =I
T=125°C
j
F F(AV)
0
20
40
60
80
100
120
140
160
180
200
220
240
260
0 100 200 300 400 500
tfr(ns)
dIF/dt(A/µs)
I =I
T=125°C
j
F F(AV)
VFR=1.1 x VFmax.
10
100
1000
1 10010 1000
C(pF)
VR(V)
F=1MHz
V =30mV
OSC
T =25°CRMS
j
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
SCu(cm²)
Rth(j-a)(°C/W)
Epoxy printed board FR4, eCU= 35 µm
Package information
STTH30L06C
6/12
DocID10761 Rev 2
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Cooling method: by conduction (C)
Epoxy meets UL 94,V0
Recommended torque value: 0.8 N·m
Maximum torque value: 1.0 N·m
STTH30L06C
Package information
DocID10761 Rev 2
7/12
2.1 D²PAK package information
Figure 13: D²PAK package outline
This package drawing may slightly differ from the physical package. However, all
the specified dimensions are guaranteed.
Package information
STTH30L06C
8/12
DocID10761 Rev 2
Table 6: D²PAK package mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.36
4.60
0.172
0.181
A1
0.00
0.25
0.000
0.010
b
0.70
0.93
0.028
0.037
b2
1.14
1.70
0.045
0.067
c
0.38
0.69
0.015
0.027
c2
1.19
1.36
0.047
0.053
D
8.60
9.35
0.339
0.368
D1
6.90
8.00
0.272
0.311
D2
1.10
1.50
0.043
0.060
E
10.00
10.55
0.394
0.415
E1
8.10
8.90
0.319
0.346
E2
6.85
7.25
0.266
0.282
e
2.54 typ.
0.100
e1
4.88
5.28
0.190
0.205
H
15.00
15.85
0.591
0.624
J1
2.49
2.90
0.097
0.112
L
1.90
2.79
0.075
0.110
L1
1.27
1.65
0.049
0.065
L2
1.30
1.78
0.050
0.070
R
0.4 typ.
0.015
V2
0°
8°
0°
8°
Figure 14: D²PAK recommended footprint (dimensions in mm)
STTH30L06C
Package information
DocID10761 Rev 2
9/12
2.2 TO-247 package information
Figure 15: TO-247 package outline
0075325_8
Package information
STTH30L06C
10/12
DocID10761 Rev 2
Table 7: TO-247 package mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
4.85
5.15
0.191
0.203
A1
2.20
2.60
0.086
0.102
b
1.00
1.40
0.039
0.055
b1
2.00
2.40
0.078
0.094
b2
3.00
3.40
0.118
0.133
c
0.40
0.80
0.015
0.031
D(1)
19.85
20.15
0.781
0.793
E
15.45
15.75
0.608
0.620
e
5.30
5.45
5.60
0.209
0.215
0.220
L
14.20
14.80
0.559
0.582
L1
3.70
4.30
0.145
0.169
L2
18.50
0.728
ØP(2)
3.55
3.65
0.139
0.143
ØR
4.50
5.50
0.177
0.217
S
5.30
5.50
5.70
0.209
0.216
0.224
Notes:
(1)Dimension D plus gate protusion does not exceed 20.5 mm
(2)Resin thickness around the mounting hole is not less than 0.9 mm.
STTH30L06C
Ordering information
DocID10761 Rev 2
11/12
3 Ordering information
Table 8: Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STTH30L06CG-TR
STTH30L06CG
D2PAK
1.48 g
1000
Tape and reel
STTH30L06CW
STTH30L06CW
TO-247
4.46 g
50
Tube
4 Revision history
Table 9: Document revision history
Date
Revision
Changes
07-Sep-2004
1
Initial release.
14-Dec-2016
2
Removed TO-220AB package information.
STTH30L06C
12/12
DocID10761 Rev 2
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST
products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the
design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2016 STMicroelectronics – All rights reserved
