TO -9 2 BT169D-L SCR Rev. 6 -- 20 March 2012 Product data sheet 1. Product profile 1.1 General description Planar passivated very sensitive gate Silicon Controlled Rectifier in a SOT54 (TO-92) plastic package. 1.2 Features and benefits Planar passivated for voltage ruggedness and reliability Very sensitive gate 1.3 Applications Ignition circuits Low power latching circuits Protection / shut-down circuits: lighting ballasts Protection / shut-down circuits: Switched Mode Power Supplies 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Min Typ Max Unit VDRM repetitive peak off-state voltage Conditions - - 400 V VRRM repetitive peak reverse voltage - - 400 V ITSM non-repetitive peak on-state current half sine wave; Tj(init) = 25 C; tp = 10 ms; see Figure 4; see Figure 5 - - 8 A IT(RMS) RMS on-state current half sine wave; Tlead 83 C; see Figure 1; see Figure 2 - - 0.8 A Static characteristics IGT gate trigger current VD = 12 V; IT = 10 mA; Tj = 25 C; see Figure 7 - - 50 A IH holding current VD = 12 V; Tj = 25 C; see Figure 9 - 0.4 1 mA IL latching current VD = 12 V; IG = 0.5 mA; Tj = 25 C; see Figure 8 - 2 4 mA BT169D-L NXP Semiconductors SCR 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 A anode 2 G gate 3 K cathode Simplified outline Graphic symbol A K G sym037 321 SOT54 (TO-92) 3. Ordering information Table 3. Ordering information Type number BT169D-L Package Name Description Version TO-92 plastic single-ended leaded (through hole) package; 3 leads SOT54 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDRM repetitive peak off-state voltage - 400 V VRRM repetitive peak reverse voltage IT(AV) average on-state current half sine wave; Tlead 83 C; see Figure 3 - 400 V - 0.5 A IT(RMS) RMS on-state current half sine wave; Tlead 83 C; see Figure 1; see Figure 2 - 0.8 A ITSM non-repetitive peak on-state current half sine wave; Tj(init) = 25 C; tp = 8.3 ms - 9 A half sine wave; Tj(init) = 25 C; tp = 10 ms; see Figure 4; see Figure 5 - 8 A I2t I2t for fusing tp = 10 ms; sine-wave pulse - 0.32 A2s IT = 2 A; IG = 10 mA; dIG/dt = 100 mA/s dIT/dt rate of rise of on-state current - 50 A/s IGM peak gate current - 1 A VRGM peak reverse gate voltage - 5 V PGM peak gate power - 2 W PG(AV) average gate power - 0.1 W Tstg storage temperature -40 150 C Tj junction temperature - 125 C BT169D-L Product data sheet over any 20 ms period All information provided in this document is subject to legal disclaimers. Rev. 6 -- 20 March 2012 (c) NXP B.V. 2012. All rights reserved. 2 of 12 BT169D-L NXP Semiconductors SCR 001aab449 2 001aab450 1 IT(RMS) (A) 0.8 IT(RMS) (A) (1) 1.5 0.6 1 0.4 0.5 0.2 0 10-2 Fig 1. 10-1 0 -50 1 10 surge duration (s) RMS on-state current as a function of surge duration for sinusoidal currents Fig 2. 0 50 100 150 Tlead (C) RMS on-state current as a function of lead temperature; maximum values 001aab446 0.8 a= 1.57 Ptot (W) 77 Tlead(max) (C) 1.9 0.6 89 2.2 2.8 0.4 101 4 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 0.2 113 125 0.6 0 0 0.1 0.2 0.3 0.4 0.5 IT(AV) (A) Fig 3. Total power dissipation as a function of average on-state current; maximum values BT169D-L Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 -- 20 March 2012 (c) NXP B.V. 2012. All rights reserved. 3 of 12 BT169D-L NXP Semiconductors SCR 001aab499 10 ITSM (A) 8 6 4 IT ITSM 2 t tp Tj(init) = 25 C max 0 1 102 10 103 number of cycles Fig 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values 001aab497 103 IT ITSM (A) 102 ITSM t tp Tj(init) = 25 C max 10 1 10-5 10-4 10-3 10-2 tp (s) Fig 5. Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum values BT169D-L Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 -- 20 March 2012 (c) NXP B.V. 2012. All rights reserved. 4 of 12 BT169D-L NXP Semiconductors SCR 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-lead) thermal resistance from junction to lead see Figure 6 - - 60 K/W Rth(j-a) thermal resistance from junction to ambient printed circuit board mounted: lead length = 4 mm - 150 - K/W 001aab451 102 Zth(j-lead) (K/W) 10 1 = P tp T 10-1 t tp T 10-2 10-5 10-4 10-3 10-2 10-1 1 10 tp (s) Fig 6. Transient thermal impedance from junction to lead as a function of pulse width BT169D-L Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 -- 20 March 2012 (c) NXP B.V. 2012. All rights reserved. 5 of 12 BT169D-L NXP Semiconductors SCR 6. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit Static characteristics IGT gate trigger current VD = 12 V; IT = 10 mA; Tj = 25 C; see Figure 7 - - 50 A IL latching current VD = 12 V; IG = 0.5 mA; Tj = 25 C; see Figure 8 - 2 4 mA IH holding current VD = 12 V; Tj = 25 C; see Figure 9 - 0.4 1 mA VT on-state voltage IT = 1.2 A; Tj = 25 C; see Figure 10 - 1.25 1.7 V VGT gate trigger voltage VD = 12 V; IT = 10 mA; Tj = 25 C; see Figure 11 - 0.5 0.8 V VD = 12 V; IT = 10 mA; Tj = 125 C; see Figure 11 0.2 0.3 - V VD = 400 V; Tj = 125 C; RGK = 1 k - 0.05 0.1 mA VD = 400 V; Tj = 25 C; RGK = 1 k - - 2 A Tj = 125 C; RGK = 1 k; VR = 400 V - 0.05 0.1 mA Tj = 25 C; RGK = 1 k; VR = 400 V - - 2 A 500 800 - V/s - 25 - V/s off-state current ID reverse current IR Dynamic characteristics dVD/dt rate of rise of off-state voltage VDM = 268 V; Tj = 125 C; RGK = 1 k; exponential waveform; see Figure 12 VDM = 268 V; Tj = 125 C; exponential waveform; gate open circuit; see Figure 12 001aab502 3 IGT IGT(25C) IL(Tj) IL(25 C) 2 2 1 1 0 -50 Fig 7. 0 50 100 Product data sheet 0 -50 150 0 50 100 150 Tj (C) Tj (C) Normalized gate trigger current as a function of junction temperature BT169D-L 003aag891 3 Fig 8. Normalized latching current as a function of junction temperature All information provided in this document is subject to legal disclaimers. Rev. 6 -- 20 March 2012 (c) NXP B.V. 2012. All rights reserved. 6 of 12 BT169D-L NXP Semiconductors SCR 003aag890 3 001aab454 5 IT (A) IH(Tj) 4 IH(25 C) 2 3 2 1 1 (1) 0 -50 0 50 100 150 0 0.4 (2) (3) 1.2 2 2.8 Tj (C) VT (V) Vo = 1.067 V; Rs = 0.187 (1) Tj = 125 C; typical values (2) Tj = 125 C; maximum values (3) Tj = 25 C; maximum values Fig 9. Normalized holding current as a function of junction temperature 001aab501 1.6 Fig 10. On-state current as a function of on-state voltage 001aab507 104 VGT VGT(25C) dVD/dt (V/s) 1.2 103 0.8 102 (1) (2) 0.4 -50 10 0 50 100 150 Product data sheet 50 100 150 Tj (C) Fig 11. Normalized gate trigger voltage as a function of junction temperature BT169D-L 0 Tj (C) Fig 12. Critical rate of rise of off-state voltage as a function of junction temperature; typical values All information provided in this document is subject to legal disclaimers. Rev. 6 -- 20 March 2012 (c) NXP B.V. 2012. All rights reserved. 7 of 12 BT169D-L NXP Semiconductors SCR 7. Package outline Plastic single-ended leaded (through hole) package; 3 leads SOT54 c E d A L b 1 e1 2 D e 3 b1 L1 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b b1 c D d E mm 5.2 5.0 0.48 0.40 0.66 0.55 0.45 0.38 4.8 4.4 1.7 1.4 4.2 3.6 e 2.54 e1 L L1(1) 1.27 14.5 12.7 2.5 max. Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION REFERENCES IEC SOT54 JEDEC JEITA TO-92 SC-43A EUROPEAN PROJECTION ISSUE DATE 04-06-28 04-11-16 Fig 13. Package outline SOT54 (TO-92) BT169D-L Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 -- 20 March 2012 (c) NXP B.V. 2012. All rights reserved. 8 of 12 BT169D-L NXP Semiconductors SCR 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes BT169D-L v.6 20120320 Product data sheet - BT169D-L v.5 - BT169D-L v.4 Modifications: BT169D-L v.5 BT169D-L Product data sheet * Various changes to content. 20111110 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 -- 20 March 2012 (c) NXP B.V. 2012. All rights reserved. 9 of 12 BT169D-L NXP Semiconductors SCR 9. Legal information 9.1 Data sheet status Document status[1] [2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 9.2 Definitions Preview -- The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with theTerms and conditions of commercial sale of NXP Semiconductors. BT169D-L Product data sheet Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. All information provided in this document is subject to legal disclaimers. Rev. 6 -- 20 March 2012 (c) NXP B.V. 2012. All rights reserved. 10 of 12 BT169D-L NXP Semiconductors SCR Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published athttp://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. Translations -- A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 9.4 Trademarks Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Adelante,Bitport,Bitsound,CoolFlux,CoReUse,DESFire,EZ-HV,FabKey,G reenChip,HiPerSmart,HITAG,IC-bus logo,ICODE,I-CODE,ITEC,Labelution,MIFARE,MIFARE Plus,MIFARE Ultralight,MoReUse,QLPAK,Silicon Tuner,SiliconMAX,SmartXA,STARplug,TOPFET,TrenchMOS,TriMedia andUCODE -- are trademarks of NXP B.V. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the HD Radio andHD Radio logo -- are trademarks of iBiquity Digital Corporation. 10. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:salesaddresses@nxp.com BT169D-L Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 -- 20 March 2012 (c) NXP B.V. 2012. All rights reserved. 11 of 12 BT169D-L NXP Semiconductors SCR 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2 Thermal characteristics . . . . . . . . . . . . . . . . . . .5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 20 March 2012 Document identifier: BT169D-L