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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

SNVS754K –JANUARY 2000–REVISED DECEMBER 2016

LM78Lxx 100-mA Fixed Output Linear Regulator

1 Features

1• Input Voltage up to 30 V

• Output Voltage Tolerances of ±5% Over the

Temperature Range

• Available Output Voltages: 5 V, 6.2 V, 8.2 V, 9 V,

12 V, and 15 V

• Output Current of 100 mA

• Output Transistor Safe Area Protection

• Internal Thermal Overload Protection

• Internal Short-Circuit Current Limit

• No External Components

• Available in Tiny DSBGA Package

• Available in 3-Pin TO-92 and 8-Pin SOIC Low

Profile Packages

2 Applications

• Battery Chargers

• Portable Instrumentation

• LED Lighting

• Low Wattage Power Supplies

Package Options

3 Description

The LM78Lxx series of three terminal positive

regulators is available with several fixed output

voltages, making them useful in a wide range of

applications. Used as a Zener-diode and resistor

combination replacement, the LM78Lxx usually

provides an effective output impedance improvement

of two orders of magnitude and lower quiescent

current. These regulators can provide local, on-card

regulation, eliminating distribution problems

associated with single-point regulation. The available

voltages allow the LM78Lxx to be used in logic

systems, instrumentation, HiFi, and other solid-state

electronic equipment.

The LM78Lxx is available in the plastic TO-92 (LP)

package, the SOIC (D) package, and a chip-sized

package (8-Bump DSBGA) using TI's DSBGA

package technology. With adequate heat sinking, the

regulator can deliver 100-mA output current. Current

limiting is included to limit the peak output current to

a safe value. Safe area protection for the output

transistors is provided to limit internal power

dissipation. If internal power dissipation is too high for

the heat sinking provided, the thermal shutdown

circuit prevents the IC from overheating.

See AN-1112 DSBGA Wafer Level Chip Scale

Package (SNVA009) for DSBGA Considerations. For

more information on the TO-92 package, see TO-92

Packing Options / Ordering Instructions (SNOA072).

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LM78L05, LM78L09 DSBGA (8) 1.30 mm × 1.30 mm

LM78L05, LM78L12,

LM78L15 SOIC (8) 3.90 mm × 4.90 mm

LM78L05, LM78L12,

LM78L15, LM78L62 TO-92 (3) 3.70 mm × 4.70 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Fixed Output Regulator Circuit

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

SNVS754K –JANUARY 2000–REVISED DECEMBER 2016

www.ti.com

Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62

Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 Electrical Characteristics — LM78L05...................... 5

6.6 Electrical Characteristics — LM78L09...................... 5

6.7 Electrical Characteristics — LM78L12...................... 6

6.8 Electrical Characteristics — LM78L15...................... 6

6.9 Electrical Characteristics — LM78L62...................... 7

6.10 Typical Characteristics............................................ 8

7 Detailed Description............................................ 10

7.1 Overview................................................................. 10

7.2 Functional Block Diagram....................................... 10

7.3 Feature Description................................................. 11

7.4 Device Functional Modes........................................ 11

8 Application and Implementation ........................ 12

8.1 Application Information............................................ 12

8.2 Typical Applications ................................................ 12

9 Power Supply Recommendations...................... 16

10 Layout................................................................... 16

10.1 Layout Guidelines ................................................. 16

10.2 Layout Example .................................................... 16

11 Device and Documentation Support................. 17

11.1 Documentation Support ........................................ 17

11.2 Related Links ........................................................ 17

11.3 Receiving Notification of Documentation Updates 17

11.4 Community Resources.......................................... 17

11.5 Trademarks........................................................... 17

11.6 Electrostatic Discharge Caution............................ 17

11.7 Glossary................................................................ 17

12 Mechanical, Packaging, and Orderable

Information........................................................... 18

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision J (December 2013) to Revision K Page

• Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings table,

Recommended Operating Conditions table, Detailed Description section, Application and Implementation section,

Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section.................................................................................................. 1

• Deleted LM78L82 from the data sheet................................................................................................................................... 1

• Added Thermal Information table........................................................................................................................................... 1

• Deleted Lead temperature (soldering) information................................................................................................................. 4

• Changed RθJA values for D (SOIC) From: 180 To: 128.8, LP (TO-92) from 230 to 158.7, and YPB (DSBGA) From:

230.9 To 108.4 ....................................................................................................................................................................... 4

• Changed RθJC values for LP (TO-92) From: 60 To 75.2......................................................................................................... 4

Changes from Revision I (April 2013) to Revision J Page

• Added the AI suffix ................................................................................................................................................................. 5

1 VOUT

2 GND

3 VIN

Not to scale

A B C

Not to scale

VOUT NC GND

VOUT GND

VIN VIN NC

1VOUT 8 VIN

2GND 7 GND

3GND 6 GND

4NC 5 NC

Not to scale

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

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SNVS754K –JANUARY 2000–REVISED DECEMBER 2016

Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62

5 Pin Configuration and Functions

YPB Package

8-Pin DSBGA

Top View

D Package

8-Pin SOIC

Top View

LP Package

3-Pin TO-92

Bottom View

Pin Functions

PIN I/O DESCRIPTION

NAME DSBGA SOIC TO-92

GND C2, C3 2, 3, 6, 7 2 — Ground

NC B3, C1 4, 5 — — No connection

VIN A1, B1 8 3 I Input supply voltage pin

VOUT A2, A3 1 1 O Output voltage pin

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

SNVS754K –JANUARY 2000–REVISED DECEMBER 2016

www.ti.com

Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)

MIN MAX UNIT

Input voltage 35 V

Power dissipation Internally limited

Operating junction temperature, TJ

LM78LxxACZ (TO-92) 0 125

°C

LM78LxxACM (SOIC) 0 125

LM78LxxAIM (SOIC) –40 125

LM78LxxITP (thin DSBGA) –40 85

Storage temperature, Tstg –65 150 °C

(1) Human body model, 1.5 kΩin series with 100 pF.

6.2 ESD Ratings VALUE UNIT

V(ESD) Electrostatic discharge Human-body model (HBM),(1) ±1000 V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT

Input voltage 30 V

Continuous output current 100 mA

TJJunction temperature

LM78LxxACZ (TO-92) 0 125

°C

LM78LxxACM (SOIC) 0 125

LM78LxxAIM (SOIC) –40 125

LM78LxxITP (DSBGA) –40 85

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1) LM78Lxx

UNITD (SOIC) LP (TO-92) YPB (DSBGA)

8 PINS 3 PINS 8 PINS

RθJA Junction-to-ambient thermal resistance 128.8 158.7 108.4 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 76 75.2 1.3 °C/W

RθJB Junction-to-board thermal resistance 69.3 n/a 31.4 °C/W

ψJT Junction-to-top characterization parameter 26.3 30.2 4.5 °C/W

ψJB Junction-to-board characterization parameter 68.8 138.2 31.4 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance — — — °C/W

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

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SNVS754K –JANUARY 2000–REVISED DECEMBER 2016

Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62

(1) For the operating ranges of each package, see Absolute Maximum Ratings.

(2) Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.

(3) Power dissipation ≤0.75 W.

(4) Recommended minimum load capacitance of 0.01 µF to limit high-frequency noise.

6.5 Electrical Characteristics — LM78L05

Typical values apply for TJ= 25°C, Minimum and Maximum limits apply for the entire operating temperature range of the

package(1)(2), IO= 40 mA, CI= 0.33 µF, CO= 0.1 µF, VIN = 10 V (unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOOutput voltage TJ= 25°C 4.8 5 5.2 VVIN = 7 V to 20 V, IO= 1 mA to 40 mA(3) 4.75 5.25

IO= 1 mA to 70 mA(3) 4.75 5.25

ΔVO

Line regulation VIN = 7 V to 20 V, TJ= 25°C 18 75

VIN = 8 V to 20 V, TJ= 25°C 10 54

Load regulation IO= 1 mA to 100 mA, TJ= 25°C 20 60

IO= 1 mA to 40 mA, TJ= 25°C 5 30

IQQuiescent current TJ= 25°C 3 5 mA

ΔIQQuiescent current change VIN = 8 V to 20 V 1 mA

IO= 1 mA to 40 mA 0.1

VnOutput noise voltage f = 10 Hz to 100 kHz(4) 40 µV

ΔVIN/ΔVORipple rejection f = 120 Hz, VIN = 8 V to 16 V, TJ= 25°C 47 62 dB

IPK Peak output current 140 mA

ΔVO/ΔTAverage output voltage temperature

coefficient IO= 5 mA –0.65 mV/°C

VIN(MIN) Minimum value of input voltage

required to maintain line regulation TJ= 25°C 6.7 7 V

(1) For the operating ranges of each package, see Absolute Maximum Ratings.

(2) Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.

(3) Power dissipation ≤0.75 W.

6.6 Electrical Characteristics — LM78L09

Typical values apply for TJ= 25°C, Minimum and Maximum limits apply for the entire operating temperature range of the

package(1)(2), IO= 40 mA, CI= 0.33 µF, CO= 0.1 µF, VIN = 15 V (unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOOutput voltage TJ= 25°C 8.64 9 9.36 VVIN = 11.5 V to 24 V, IO= 1 mA to 40 mA(3) 8.55 9.45

IO= 1 mA to 70 mA(3) 8.55 9.45

ΔVO

Line regulation VIN = 11.5 V to 24 V, TJ= 25°C 100 200

VIN = 13 V to 24 V, TJ= 25°C 90 150

Load regulation IO= 1 mA to 100 mA, TJ= 25°C 20 90

IO= 1 mA to 40 mA, TJ= 25°C 10 45

IQQuiescent current TJ= 25°C 2 5.5 mA

ΔIQQuiescent current change VIN = 11.5 V to 24 V 1.5 mA

IO= 1 mA to 40 mA 0.1

VnOutput noise voltage 70 µV

ΔVIN/ΔVORipple rejection f = 120 Hz, VIN = 15 V to 25 V, TJ= 25°C 38 44 dB

IPK Peak output current 140 mA

ΔVO/ΔTAverage output voltage temperature

coefficient IO= 5 mA –0.9 mV/°C

VIN(MIN) Minimum value of input voltage

required to maintain line regulation 10.7 V

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

SNVS754K –JANUARY 2000–REVISED DECEMBER 2016

www.ti.com

Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62

(1) For the operating ranges of each package, see Absolute Maximum Ratings.

(2) Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.

(3) Power dissipation ≤0.75 W.

6.7 Electrical Characteristics — LM78L12

Typical values apply for TJ= 25°C, Minimum and Maximum limits apply for the entire operating temperature range of the

package(1)(2), IO= 40 mA, CI= 0.33 µF, CO= 0.1 µF, VIN = 19 V (unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOOutput voltage TJ= 25°C 11.5 12 12.5 VVIN = 14.5 V to 27 V, IO= 1 mA to 40 mA(3) 11.4 12.6

IO= 1 mA to 70 mA(3) 11.4 12.6

ΔVO

Line regulation VIN = 14.5 V to 27 V, TJ= 25°C 30 180

VIN = 16 V to 27 V, TJ= 25°C 20 110

Load regulation IO= 1 mA to 100 mA, TJ= 25°C 30 100

IO= 1 mA to 40 mA, TJ= 25°C 10 50

IQQuiescent current TJ= 25°C 3 5 mA

ΔIQQuiescent current change VIN = 16 V to 27 V 1 mA

IO= 1 mA to 40 mA 0.1

VnOutput noise voltage 80 µV

ΔVIN/ΔVORipple rejection f = 120 Hz, VIN = 15 V to 25 V, TJ= 25°C 40 54 dB

IPK Peak output current 140 mA

ΔVO/ΔTAverage output voltage temperature

coefficient IO= 5 mA –1 mV/°C

VIN(MIN) Minimum value of input voltage

required to maintain line regulation TJ= 25°C 13.7 14.5 V

(1) For the operating ranges of each package, see Absolute Maximum Ratings.

(2) Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.

(3) Power dissipation ≤0.75 W.

6.8 Electrical Characteristics — LM78L15

Typical values apply for TJ= 25°C, Minimum and Maximum limits apply for the entire operating temperature range of the

package(1)(2), IO= 40 mA, CI= 0.33 µF, CO= 0.1 µF, VIN = 23 V (unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOOutput voltage TJ= 25°C 14.4 15 15.6 VVIN = 17.5 V to 30 V, IO= 1 mA to 40 mA(3) 14.25 15.75

IO= 1 mA to 70 mA(3) 14.25 15.75

ΔVO

Line regulation VIN = 17.5 V to 30 V, TJ= 25°C 37 250

VIN = 20 V to 30 V, TJ= 25°C 25 140

Load regulation IO= 1 mA to 100 mA, TJ= 25°C 35 150

IO= 1 mA to 40 mA, TJ= 25°C 12 75

IQQuiescent current TJ= 25°C 3 5 mA

ΔIQQuiescent current change VIN =20 V to 30 V 1 mA

IO= 1 mA to 40 mA 0.1

VnOutput noise voltage 90 µV

ΔVIN/ΔVORipple rejection f = 120 Hz, VIN = 18.5 V to 28.5 V, TJ= 25°C 37 51 dB

IPK Peak output current 140 mA

ΔVO/ΔTAverage output voltage temperature

coefficient IO= 5 mA –1.3 mV/°C

VIN(MIN) Minimum value of input voltage

required to maintain line regulation TJ= 25°C 16.7 17.5 V

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

www.ti.com

SNVS754K –JANUARY 2000–REVISED DECEMBER 2016

Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62

(1) For the operating ranges of each package, see Absolute Maximum Ratings.

(2) Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.

(3) Power dissipation ≤0.75 W.

(4) Recommended minimum load capacitance of 0.01 µF to limit high-frequency noise.

6.9 Electrical Characteristics — LM78L62

Typical values apply for TJ= 25°C, Minimum and Maximum limits apply for the entire operating temperature range of the

package(1)(2), IO= 40 mA, CI= 0.33 µF, CO= 0.1 µF, VIN = 12 V (unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOOutput voltage TJ= 25°C 5.95 6.2 6.45 VVIN = 8.5 V to 20 V, IO= 1 mA to 40 mA(3) 5.9 6.5

IO= 1 mA to 70 mA(3) 5.9 6.5

ΔVO

Line regulation VIN = 8.5 V to 20 V, TJ= 25°C 65 175

VIN = 9 V to 20 V, TJ= 25°C 55 125

Load regulation IO= 1 mA to 100 mA, TJ= 25°C 13 80

IO= 1 mA to 40 mA, TJ= 25°C 6 40

IQQuiescent current TJ= 25°C 2 5.5 mA

ΔIQQuiescent current change VIN = 8 V to 20 V 1.5 mA

IO= 1 mA to 40 mA 0.1

VnOutput noise voltage f = 10 Hz to 100 kHz(4) 50 µV

ΔVIN/ΔVORipple rejection f = 120 Hz, VIN = 10 V to 20 V, TJ= 25°C 40 46 dB

IPK Peak output current 140 mA

ΔVO/ΔTAverage output voltage temperature

coefficient IO= 5 mA –0.75 mV/°C

VIN(MIN) Minimum value of input voltage

required to maintain line regulation 7.9 V

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

SNVS754K –JANUARY 2000–REVISED DECEMBER 2016

www.ti.com

Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62

6.10 Typical Characteristics

LP Package

Figure 1. Maximum Average Power Dissipation Figure 2. Peak Output Current

Figure 3. Dropout Voltage Figure 4. Ripple Rejection

Figure 5. Output Impedance Figure 6. Quiescent Current

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

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SNVS754K –JANUARY 2000–REVISED DECEMBER 2016

Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62

Typical Characteristics (continued)

Figure 7. Quiescent Current

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

SNVS754K –JANUARY 2000–REVISED DECEMBER 2016

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Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62

7 Detailed Description

7.1 Overview

The LM78Lxx series of positive regulators is available in the following fixed output voltages: 5 V, 6.2 V, 8.2 V, 9

V, 12 V, and 15 V. The regulator can be configured to an adjustable output by connecting the GND pin to the

center of a resistive voltage divider as shown in Figure 10. In this configuration, the fixed output voltage acts as

the reference voltage across R1 allowing the output to be adjusted by changing the resistor.

7.2 Functional Block Diagram

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

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7.3 Feature Description

7.3.1 Load Regulation

These devices regulate the voltage between the VOUT and GND pins, and can be made adjustable by using a

resistive voltage divider. The output voltage tolerance is ±5% over temperature.

7.3.2 Protection

The LM78Lxx series of regulators has internal thermal overload protection that automatically shuts off the device

if the operating temperature becomes too high. There is also internal short-circuit current limit and output

transistor safe area protection that shuts down the device if the output current becomes too high.

7.4 Device Functional Modes

7.4.1 Normal Operation

The VOUT pin sources current necessary to set the voltage on VOUT at a fixed voltage above the GND pin. See

Specifications for VOof each device.

7.4.2 Shutdown

The device automatically shuts down if the output current or its internal temperature becomes too high.

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

SNVS754K –JANUARY 2000–REVISED DECEMBER 2016

www.ti.com

Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

These devices are versatile and high-performance regulators with a wide temperature range and tight line and

load regulation. An input capacitor is required if the regulator is placed more than 3 inches from the power supply

filter. TI recommends a minimum load capacitance of 0.01 µF to limit high frequency.

8.2 Typical Applications

8.2.1 Fixed Output Regulator

*Required if the regulator is located more than 3 inches from the power supply filter.

**Recommended minimum load capacitance of 0.01 µF to limit high-frequency noise.

Figure 8. Fixed Output Regulator Circuit

8.2.1.1 Design Requirements

The device component count is very minimal. No external components are usually required. However, TI

recommends input or output capacitors depending on the distance between the device and the power supply and

if extra filtering is needed at the output.

The output voltage is set based on the selection of the two resistors (R1 and R2), as shown in Figure 14.

8.2.1.2 Detailed Design Procedure

8.2.1.2.1 Input Capacitor

An input capacitor is required if the regulator is placed more than 3 inches from the power supply filter. A 0.33-µF

capacitor on the input is suitable for most applications.

8.2.1.2.2 Output Capacitor

TI recommends a minimum load capacitance of 0.01 µF to limit high-frequency noise.

Load Current (mA)

Input - Output Differential (V)

0 20 40 60 80 100

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

25qC

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

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Typical Applications (continued)

8.2.1.3 Application Curve

Figure 9. LM78Lxx Dropout

8.2.2 Other Application Circuits

Figure 10 to Figure 14 show application circuit examples using the LM78Lxx devices. Customers must fully

validate and test these circuits before implementing a design based on these examples. Unless otherwise noted,

the design procedures in Fixed Output Regulator are applicable to these designs.

VO= 5 V + (5 V / R1 + IQ) × R2*

* The 5 V represents the fixed output voltage of the LM78L05. If using one of the other LM78Lxx devices, use that

fixed output voltage value when calculating VO.

IQ< 5 V / (3 × R1)

Load regulation (LR) of LM78L05 ≈(R1 + R2) / R1

Figure 10. Adjustable Output Regulator Circuit

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

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Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62

Typical Applications (continued)

IOUT = (VO/ R1) + IQ

IQ= 1.5 mA over line and load changes

Figure 11. Current Regulator Circuit

*Solid tantalum

**Heat sink Q1

***Optional: Improves ripple rejection and transient response.

Load Regulation = 0.6%, IL= 0 mA to 250 mA pulsed with tON = 50 ms.

Figure 12. 5-V, 500-mA Regulator With Short-Circuit Protection Circuit

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

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Typical Applications (continued)

*Solid tantalum

Figure 13. ±15-V, 100-mA Dual Power Supply Circuit

*Solid tantalum

VO= VG+ 5 V, R1 = (–VIN / IQ(LM78L05))

VO= 5 V (R2 / R4) for (R2 + R3) = (R4 + R5)

A 0.5-V output will correspond to (R2 / R4) = 0.1, (R3 / R4) = 0.9

Figure 14. Variable Output Regulator Circuit (0.5 V to 18 V)

VOUT

VIN

GND

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

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Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62

9 Power Supply Recommendations

The linear regulator input supply must be well regulated and kept at a voltage level to not exceed the maximum

input to output voltage differential allowed by the device. The minimum dropout voltage (VIN – VO) must be met

with extra headroom when possible to keep the output well regulated. A 0.33-µF or higher capacitor must be

placed at the input to bypass noise.

10 Layout

10.1 Layout Guidelines

For the best overall performance, some layout guidelines may be disregarded. Place all circuit components on

the same side of the circuit board and as near as practical to the respective linear regulator pins. Traces must be

kept short and wide to reduce the amount of parasitic elements in the system. The actual width and thickness of

traces depends on the current carrying capability and heat dissipation required by the end system.

10.2 Layout Example

Figure 15. LM78Lxx Example Circuit Layout

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

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Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

•AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009)

•TO-92 Packing Options / Ordering Instructions (SNOA072).

11.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL

DOCUMENTS TOOLS &

SOFTWARE SUPPORT &

COMMUNITY

LM78L05 Click here Click here Click here Click here Click here

LM78L09 Click here Click here Click here Click here Click here

LM78L12 Click here Click here Click here Click here Click here

LM78L15 Click here Click here Click here Click here Click here

LM78L62 Click here Click here Click here Click here Click here

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.7 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

LM78L05

LM78L09

LM78L12

LM78L15

LM78L62

SNVS754K –JANUARY 2000–REVISED DECEMBER 2016

www.ti.com

Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 14-Jul-2016

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM78L05ACM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 125 LM78L

05ACM

LM78L05ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 LM78L

05ACM

LM78L05ACMX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 125 LM78L

05ACM

LM78L05ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 LM78L

05ACM

LM78L05ACZ/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L

05ACZ

LM78L05ACZ/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L

05ACZ

LM78L05ACZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L

05ACZ

LM78L05ACZ/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L

05ACZ

LM78L05ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L

05ACZ

LM78L05AIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM78L

05AM

LM78L05AIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM78L

05AM

LM78L05ITP/NOPB ACTIVE DSBGA YPB 8 250 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 P

LM78L05ITPX/NOPB ACTIVE DSBGA YPB 8 3000 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 P

LM78L09ITPX/NOPB ACTIVE DSBGA YPB 8 3000 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 P

LM78L12ACM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 125 LM78L

12ACM

LM78L12ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 LM78L

12ACM

LM78L12ACMX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 125 LM78L

12ACM

PACKAGE OPTION ADDENDUM

www.ti.com 14-Jul-2016

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM78L12ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 LM78L

12ACM

LM78L12ACZ/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L

12ACZ

LM78L12ACZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L

12ACZ

LM78L12ACZ/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L

12ACZ

LM78L12ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L

12ACZ

LM78L15ACM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 125 LM78L

15ACM

LM78L15ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 LM78L

15ACM

LM78L15ACMX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 125 LM78L

15ACM

LM78L15ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 LM78L

15ACM

LM78L15ACZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L

15ACZ

LM78L15ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L

15ACZ

LM78L62ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L

62ACZ

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

PACKAGE OPTION ADDENDUM

www.ti.com 14-Jul-2016

Addendum-Page 3

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM78L05ACMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM78L05ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM78L05AIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM78L05ITP/NOPB DSBGA YPB 8 250 178.0 8.4 1.5 1.5 0.66 4.0 8.0 Q1

LM78L05ITPX/NOPB DSBGA YPB 8 3000 178.0 8.4 1.5 1.5 0.66 4.0 8.0 Q1

LM78L09ITPX/NOPB DSBGA YPB 8 3000 178.0 8.4 1.5 1.5 0.66 4.0 8.0 Q1

LM78L12ACMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM78L12ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM78L15ACMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM78L15ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2016

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM78L05ACMX SOIC D 8 2500 367.0 367.0 35.0

LM78L05ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM78L05AIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM78L05ITP/NOPB DSBGA YPB 8 250 210.0 185.0 35.0

LM78L05ITPX/NOPB DSBGA YPB 8 3000 210.0 185.0 35.0

LM78L09ITPX/NOPB DSBGA YPB 8 3000 210.0 185.0 35.0

LM78L12ACMX SOIC D 8 2500 367.0 367.0 35.0

LM78L12ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM78L15ACMX SOIC D 8 2500 367.0 367.0 35.0

LM78L15ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2016

Pack Materials-Page 2

www.ti.com

PACKAGE OUTLINE

0.575 MAX

0.15

0.11

TYP

8X 0.18

0.16

0.5

TYP

0.5

TYP

B E A

4215100/B 07/2016

DSBGA - 0.575 mm max heightYPB0008

DIE SIZE BALL GRID ARRAY

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

SYMM

BALL A1

CORNER

SEATING PLANE

BALL TYP 0.05 C

0.015 C A B

SCALE 9.000

D: Max =

E: Max =

1.337 mm, Min =

1.276 mm

www.ti.com

EXAMPLE BOARD LAYOUT

8X ( 0.16)

( 0.16)

METAL 0.05 MAX

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

( 0.16)

SOLDER MASK

OPENING

0.05 MIN

(0.5) TYP

(0.5)

TYP

4215100/B 07/2016

DSBGA - 0.575 mm max heightYPB0008

DIE SIZE BALL GRID ARRAY

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).

SOLDER MASK DETAILS

NOT TO SCALE

SYMM

LAND PATTERN EXAMPLE

SCALE:40X

NON-SOLDER MASK

DEFINED

(PREFERRED) SOLDER MASK

DEFINED

www.ti.com

EXAMPLE STENCIL DESIGN

8X ( 0.3) (R0.05) TYP

METAL

TYP

(0.5) TYP

4215100/B 07/2016

DSBGA - 0.575 mm max heightYPB0008

DIE SIZE BALL GRID ARRAY

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.125mm THICK STENCIL

SCALE:50X

IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES

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You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your

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TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT

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This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.

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modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Texas Instruments:

LM78L62ACZ LM78L62ACZ/LFT1 LM78L62ACZ/LFT3