Single-chip Type with Built-in FET Switching Regulator Series Output 1.5A or Less High Efficiency Step-down Switching Regulator with Built-in Power MOSFET No.10027ECT13 BD9150MUV Description ROHM's high efficiency dual step-down switching regulator BD9150MUV is a 2ch output power supply designed to produce a low voltage including 3.3,1.2 volts from 5.0 volts power supply line. Offers high efficiency with our original pulse skip control technology and synchronous rectifier. Employs a current mode control system to provide faster transient response to sudden change in load. Features 1) Offers fast transient response with current mode PWM control system. 2) Offers highly efficiency for all load range with synchronous rectifier (Pch/Nch FET) TM and SLLM (Simple Light Load Mode) 3) 2ch output power supply. 4) Each of EN controls 2ch output. 5) Incorporates soft-start function. 6) Incorporates ULVO functions. 7) Incorporates thermal protection and short-current protection circuit with time delay function. 8) Incorporates shutdown function Icc=0A(Typ.) 9) Output current max 1.5A/1.5A. 10) Employs small surface mount package : VQFN020V4040 Use Power supply for LSI including DSP, Micro computer and ASIC Absolute Maximum Rating (Ta=25) Parameter Vcc Voltage EN Voltage SW Voltage Power Dissipation Operating Temperature Range Storage Temperature Range Maximum Junction *1 *2 *3 *4 *5 Symbol VCC VEN1 VEN2 VSW1 VSW2 Pd1 Pd2 Pd3 Pd4 Topr Tstg Tjmax Limit -0.3+7 *1 -0.3+7 -0.3+7 -0.3+7 -0.3+7 0.34*2 0.70 *3 1.21 *4 3.56*5 -40+85 -55+150 +150 Unit V V V V V W W W W Pd should not be exceeded. IC only 1-layer. mounted on a 74.2mmx74.2mmx1.6mm glass-epoxy board, occupied area by copper foil : 10.29mm2 4-layer. mounted on a 74.2mmx74.2mmx1.6mm glass-epoxy board, occupied area by copper foil : 10.29mm2 , in each layers 4-layer. mounted on a 74.2mmx74.2mmx1.6mm glass-epoxy board, occupied area by copper foil : 5505mm2, in each layers www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 1/16 2010.04 - Rev.C Technical Note BD9150MUV Operating Conditions (Ta=-40+85) Parameter Vcc Voltage EN Voltage Output Voltage range SW Average Output Current *6 Min. Limit Typ. VCC 4.75 5.0 VEN1 0 VEN2 0 VOUT2 0.8 ISW1 - Symbol ISW2 - Max. Unit V - 5.5 5.5 - 5.5 V - 2.5 V - 1.5*6 A - 6 A V 1.5* Pd and ASO should not be exceeded. Electrical Characteristics (Ta=25 AVCC=PVCC=5.0V, EN1=EN2=AVCC ,unless otherwise specified.) Parameter Standby Current Min. Limit Typ. Max. ISTB - 0 Symbol Unit Condition 10 A EN1=EN2=0V ICC - 500 800 A EN Low Voltage VENL - GND 0.8 V Standby Mode EN High Voltage VENH 2.0 Vcc - V Active Mode EN Input Current IEN - 1 10 A VEN1=VEN2=2V Bias Current Oscillation Frequency Pch FET ON Resistance Nch FET ON Resistance FB Reference Voltage FOSC 1.2 1.5 - 0.17 1.8 0.3 MHz RONP1 Vcc=5V RONP2 - 0.17 0.3 Vcc=5V Vcc=5V Vcc=5V 1.5% RONN1 - 0.13 0.2 RONN2 - 0.13 0.2 FB1 3.25 3.3 3.35 V 0.812 V FB2 0.788 0.8 1.5% UVLO Threshold Voltage VUVLO1 3.6 3.8 4.0 V VCC=50V UVLO Release Voltage VUVLO2 3.65 3.9 4.2 V VCC=05V TSS 0.4 0.8 1.6 ms Timer Latch Time TLATCH 0.68 1.36 2.72 ms SCP/TSD ON Output Short circuit Threshold Voltage VSCP1 - 1.65 2.4 V FB1=3.30V VSCP2 - 0.4 0.56 V FB2=0.80V Soft Start Time www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 2/16 2010.04 - Rev.C Technical Note BD9150MUV Block Diagram, Application Circuit AVCC BD9150MUV PVCC 4.00.1 4.00.1 FB1 Current Comp Current R Gm Amp D9150 Q Sense/ Slope1 EN1 1.0Max. Lot No. AGND SW1 Protect S + Soft Start1 Driver Logic ITH1 0.08 S C0.2 2.10.1 16 1.0 10 0.5 SCP/ TSD UVLO CLK2 PVCC SCP2 6 15 OSC 5 20 PGND1 CLK1 VREF 2.10.1 0.40.1 1 0.02 +0.03 -0.02 (0.22) S SCP1 Current Current Comp R Gm Amp FB2 Q S 11 Sense/ Protect Slope2 0.25 +0.05 -0.04 Soft Start2 EN2 SW2 + Driver CLK2 Logic PGND2 ITH2 (Unit : mm) AGND Fig.1 BD9150MUV TOP View Pin No. & function table Pin Pin No. name Fig.2 BD9150MUV Block Diagram Function Pin No. Pin name Function Ch1 GmAmp output pin/Connected phase compensation capacitor 1 PGND2 Ch2 Lowside source pin 11 ITH1 2 PVcc Highside FET source pin 12 AGND 3 PVcc Highside FET source pin 13 N.C. Non Connection 4 PVcc Highside FET source pin 14 AVcc VCC power supply input pin 5 PGND1 Ch1 Lowside source pin 15 ITH2 Ch1 GmAmp output pin/Connected phase compensation capacitor 6 PGND1 Ch1 Lowside source pin 16 FB2 Ch2 output voltage detect pin 7 SW1 Ch1 Pch/Nch FET drain output pin 17 EN2 Ch2 Enable pin(High Active 8 SW1 Ch1 Pch/Nch FET drain output pin 18 SW2 Ch2 Pch/Nch FET drain output pin 9 EN1 Ch1 Enable pin(High Active) 19 SW2 Ch2 Pch/Nch FET drain output pin 10 FB1 Ch1 output voltage detect pin 20 PGND2 www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 3/16 Ground Ch2 Lowside source pin 2010.04 - Rev.C Technical Note BD9150MUV 3.5 3.0 3.0 2.5 Ta=25 Io=1.5A 2.0 1.5 VOUT1=3.3V 1.0 VOUT2=1.2V 0.5 0.0 3.5 VOUT1=3.3V 2.5 2.0 VOUT2=1.2V 1.5 VCC=5V Ta=25 Io=0A 1.0 0.5 1 2 3 4 INPUT VOLTAGE:VCC[V] 0 5 VOUT1=3.3V 2.0 1.5 1 2 3 4 VOUT2=1.2V 0.5 0 5 90 3.25 VCC=5V Io=0A 1.20 1.18 VCC=5V Io=0A 0 20 40 60 TEMPERATURE:Ta[] 60 VOUT2=1.5V 50 40 VOUT2=1.2V 30 VCC=5V Ta=25 10 0 -40 80 70 20 1.15 3.20 VOUT2=2.5V VOUT1=3.3V 80 1.23 EFFICIENCY: [%] OUTPUT VOLTAGE:VOUT[V] 3.30 Fig. 6 Ta - VOUT -20 0 20 40 60 TEMPERATURE:Ta[ ] 80 10 200 1.5 1.4 ON RESISTANCE:RON[m] FREQUENCY:FOSC[MHz] FREQUENCY:Fosc[MHz] 175 1.6 1.6 1.5 1.4 VCC=5V 1.3 80 125 NMOS 100 75 50 VCC=5V 0 4.5 Fig.9 Ta - Fosc 4.75 5 5.25 INPUT VOLTAGE:VCC[V] 5.5 Fig.10 Vcc - Fosc 2.0 -40 -20 0 20 40 60 80 TEMPERATURE:Ta[] 100 Fig.11 Ta - RONN, RONP Ta=25 600 VCC=5V,Ta=25 CIRCUIT CURRENT:ICC[A] 1.8 1.6 EN VOLTAGE:VEN[V] PMOS 150 25 1.3 0 20 40 60 TEMPERATURE:Ta[] 10000 Fig.8 Efficiency 1.7 -20 100 1000 OUTPUT CURRENT:IOUT[mA] Fig. 7 Ta - VOUT 1.7 4 100 VOUT2=1.2V VOUT2=1.2V 3.35 -40 1 2 3 OUTPUT CURRENT:IOUT[A] Fig.5 IOUT - VOUT 1.25 VOUT1=3.3V VCC=5V Ta=25 1.0 Fig.4 VEN - VOUT 3.40 -20 2.5 EN VOLTAGE:VEN[V] Fig.3 Vcc - VOUT -40 3.0 0.0 0.0 0 OUTPUT VOLTAGE:VOUT[V] OUTPUT VOLTAGE:VOUT[V] 3.5 OUTPUT VOLTAGE:VOUT[V] OUTPUT VOLTAGE:VOUT[V] Characteristics data 1.4 1.2 1.0 0.8 0.6 VCC=5V 0.4 500 400 EN1=E2 300 VOUT1 200 VCC=5V VOUT2 100 0.2 0 0.0 -40 -20 0 20 40 60 80 TEMPERATURE:Ta[] Fig.12 Ta-VEN www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. -40 -20 0 20 40 60 80 TEMPERATURE:Ta[] Fig.13 Ta-ICC 4/16 Fig.14 Soft start waveform (Io=0mA) 2010.04 - Rev.C Technical Note BD9150MUV Characteristics dataBD9150MUV VCC=5V,Ta=25 VCC=5V,Ta=25 VCC=5V,Ta=25 SW1 SW1 VOUT1 VOUT1 EN1=E2 VOUT1 VOUT2 Fig.15 Soft start waveform (Io=1.5A) Fig.16 SW1 waveform (Io=0mA) VCC=5V,Ta=25,VOUT2=1.2V Fig.17 SW1 waveform (Io=1.5A) VCC=5V,Ta=25,VOUT2=1.2V SW2 SW2 VOUT2 VOUT2 Fig.18 SW2 waveform (Io=0mA) VOUT1 IOUT1 Fig.19 SW2 waveform (Io=1.5A) VCC=5V,Ta=25 VCC=5V,Ta=25 Fig.20 VOUT1 Transient Response (Io0.5A1.5A / usec) VCC=5V,Ta=25,VOUT2=1.2V VCC=5V,Ta=25,VOUT2=1.2V VOUT1 VOUT2 VOUT2 IOUT1 IOUT2 IOUT2 Fig.21VOUT1 Transient Response (Io1.5A0.5A/ usec) www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. Fig.22 VOUT2 Transient Response (Io0.5A1.5A/ usec) 5/16 Fig.23 VOUT2 Transient Response (Io1.5A0.5A/ usec) 2010.04 - Rev.C Technical Note BD9150MUV Information on advantages Advantage 1Offers fast transient response with current mode control system. BD9150MUV (Load response IO=1.5A0.5A) BD9150MUV (Load response IO=0.5A1.5A) VOUT VOUT IOUT IOUT Fig.24Transient response Advantage 2 Offers high efficiency for all load range. For lighter load: Utilizes the current mode control mode called SLLM for lighter load, which reduces various dissipation such as switching dissipation (PSW), gate charge/discharge dissipation, ESR dissipation of output capacitor (PESR) and on-resistance dissipation (PRON) that may otherwise cause degradation in efficiency for lighter load. Achieves efficiency improvement for lighter load. For heavier load: Utilizes the synchronous rectifying mode and the low on-resistance MOS FETs incorporated as power transistor. ON resistance of Highside MOS FET : 170m(Typ.) ON resistance of Lowside MOS FET : 130m(Typ.) Efficiency [%] 100 Achieves efficiency improvement for heavier load. SLLM 50 PWM inprovement by SLLM system improvement by synchronous rectifier 0 0.001 Offers high efficiency for all load range with the improvements mentioned above. 0.01 0.1 Output current Io[A] 1 Fig.25 Efficiency Advantage 3Supplied in smaller package due to small-sized power MOS FET incorporated. Output capacitor Co required for current mode control: 22F ceramic capacitor Inductance L required for the operating frequency of 1 MHz: 2.2H inductor Incorporates FET + Boot strap diode Reduces a mounting area required. VOUT1 20mm L1 FB1 ITH1 EN1 SW1 SW1 PGND1 COUT1 COUT1 CIN1 CIN2 COUT2 PGND1 RITH1 CITH1 AGND PVcc N.C. PVcc AVcc PVcc ITH2 RITH2 CITH2 FB2 CIN1 15mm CIN2 PGND2 EN2 SW2 SW2 PGND2 L1 COUT2 R1 L2 RITH1 RITH2 R2 CITH1 CITH2 VOUT2 L2 R2 R1 Fig.26 Example application www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 6/16 2010.04 - Rev.C Technical Note BD9150MUV Operation BD9150MUV is a synchronous rectifying step-down switching regulator that achieves faster transient response by employing current mode PWM control system. It utilizes switching operation in PWM (Pulse Width Modulation) mode for heavier load, while it utilizes SLLM (Simple Light Load Mode) operation for lighter load to improve efficiency. Synchronous rectifier It does not require the power to be dissipated by a rectifier externally connected to a conventional DC/DC converter IC, and its P.N junction shoot-through protection circuit limits the shoot-through current during operation, by which the power dissipation of the set is reduced. Current mode PWM control Synthesizes a PWM control signal with a inductor current feedback loop added to the voltage feedback. PWM (Pulse Width Modulation) control The oscillation frequency for PWM is 1 MHz. SET signal form OSC turns ON a highside MOS FET (while a lowside MOS FET is turned OFF), and an inductor current IL increases. The current comparator (Current Comp) receives two signals, a current feedback control signal (SENSE: Voltage converted from IL) and a voltage feedback control signal (FB), and issues a RESET signal if both input signals are identical to each other, and turns OFF the highside MOS FET (while a lowside MOS FET is turned ON) for the rest of the fixed period. The PWM control repeat this operation. SLLM (Simple Light Load Mode) control When the control mode is shifted from PWM for heavier load to the one for lighter load or vise versa, the switching pulse is designed to turn OFF with the device held operated in normal PWM control loop, which allows linear operation without voltage drop or deterioration in transient response during the mode switching from light load to heavy load or vise versa. Although the PWM control loop continues to operate with a SET signal from OSC and a RESET signal from Current Comp, it is so designed that the RESET signal is held issued if shifted to the light load mode, with which the switching is tuned OFF and the switching pulses are thinned out under control. Activating the switching intermittently reduces the switching dissipation and improves the efficiency. SENSE Current Comp RESET VOUT Level Shift R Q FB SET Gm Amp. ITH S IL Driver Logic VOUT SW Load OSC Fig.27 Diagram of current mode PWM control PVCC Current Comp SENSE PVCC SENSE Current Comp FB FB SET GND SET GND RESET GND RESET GND SW GND SW IL GND IL(AVE) IL 0A VOUT VOUT VOUT(AVE) VOUT(AVE) Not switching Fig.28 PWM switching timing chart www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. Fig.29 SLLM 7/16 TM switching timing chart 2010.04 - Rev.C Technical Note BD9150MUV Description of operations Soft-start function EN terminal shifted to "High" activates a soft-starter to gradually establish the output voltage with the current limited during startup, by which it is possible to prevent an overshoot of output voltage and an inrush current. Shutdown function With EN terminal shifted to "Low", the device turns to Standby Mode, and all the function blocks including reference voltage circuit, internal oscillator and drivers are turned to OFF. Circuit current during standby is 0F (Typ.). UVLO function Detects whether the input voltage sufficient to secure the output voltage of this IC is supplied. And the hysteresis width of 100mV (Typ.) is provided to prevent output chattering. Hysteresis 100mV VCC EN1,EN2 VOUT1, VOUT2 Tss Tss Tss Soft start Standby mode Operating mode Standby mode Operating mode UVLO UVLO Standby mode Operating mode EN Standby mode UVLO Fig.30 Soft start, Shutdown, UVLO timing chart Short-current protection circuit with time delay function Turns OFF the output to protect the IC from breakdown when the incorporated current limiter is activated continuously for the fixed time(TLATCH) or more. The output thus held tuned OFF may be recovered by restarting EN or by re-unlocking UVLO. EN1EN2 Output Short circuit Threshold Voltage VOUT1 Output OFF Latch VOUT2 IL Limit IL1 IL2 t1<TLATCH Operating mode Standby mode t2=TLATCH Standby mode Timer latch EN Operating mode EN Fig.31 Short-current protection circuit with time delay timing chart www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 8/16 2010.04 - Rev.C Technical Note BD9150MUV Switching regulator efficiency Efficiency may be expressed by the equation shown below: POUT POUT VOUTxIOUT x100[%]= x100[%]= x100[%] = VinxIin Pin POUT+PD Efficiency may be improved by reducing the switching regulator power dissipation factors PD as follows: Dissipation factors: 1) ON resistance dissipation of inductor and FETPD(I2R) 2) Gate charge/discharge dissipationPD(Gate) 3) Switching dissipationPD(SW) 4) ESR dissipation of capacitorPD(ESR) 5) Operating current dissipation of ICPD(IC) 1)PD(I2R)=IOUT2x(RCOIL+RON) (RCOIL[]DC resistance of inductor, RON[]ON resistance of FET, IOUT[A]Output current.) 2)PD(Gate)=CgsxfxV (Cgs[F]Gate capacitance of FET, f[H]Switching frequency, V[V]Gate driving voltage of FET) 3)PD(SW)= 2 Vin xCRSSxIOUTxf IDRIVE (CRSS[F]Reverse transfer capacitance of FET, IDRIVE[A]Peak current of gate.) 2 4)PD(ESR)=IRMS xESR (IRMS[A]Ripple current of capacitor, ESR[]Equivalent series resistance.) 5)PD(IC)=VinxICC (ICC[A]Circuit current.) www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 9/16 2010.04 - Rev.C Technical Note BD9150MUV Consideration on permissible dissipation and heat generation As this IC functions with high efficiency without significant heat generation in most applications, no special consideration is needed on permissible dissipation or heat generation. In case of extreme conditions, however, including lower input voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generation must be carefully considered. For dissipation, only conduction losses due to DC resistance of inductor and ON resistance of FET are considered. Because the conduction losses are considered to play the leading role among other dissipation mentioned above including gate charge/discharge dissipation and switching dissipation. 4.5 2 4 layers (copper foil area : 5505mm ) (copper foil in each layers) j-a=32.1/W 2 4 layers (copper foil area : 10.29mm ) (copper foil in each layers) j-a=82.6/W 2 1 layer (copper foil area : 0mm ) j-a=160.1/W IC only j-a=249.5/W 4.0 Power dissipation:Pd [W] 3.56W 3.0 2.0 1.21W 1.0 0.70W 0.34W 0 0 25 50 75 100 105 125 150 Ambient temperature:Ta [] Fig.32 Thermal derating curve (VQFN020V4040) P=IOUT2xRON RON=DxRONP+(1-D)RONN DON duty (=VOUT/VCC) RONHON resistance of Highside MOS FET RONLON resistance of Lowside MOS FET IOUTOutput current If VCC=5V, VOUT1=3.3V, VOUT2=1.2V, RONH=170m, RONL=130m IOUT=1.5A, for example, D1=VOUT1/VCC=3.3/5=0.66 D2=VOUT2/VCC=1.2/5=0.24 RON1=0.66x0.170+(1-0.66)x0.130 =0.1122+0.0442 =0.1564[] RON2=0.24x0.170+(1-0.24)x0.130 =0.0408+0.0988 =0.1397[] 2 2 P=1.5 x0.1564+1.5 x0.1397=0.666[W] As RONH is greater than RONL in this IC, the dissipation increases as the ON duty becomes greater. consideration on the dissipation as above, thermal design must be carried out with sufficient margin allowed. www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 10/16 With the 2010.04 - Rev.C Technical Note BD9150MUV Selection of components externally connected 1. Selection of inductor (L) IL The inductance significantly depends on output ripple current. As seen in the equation (1), the ripple current decreases as the inductor and/or switching frequency increases. (VCC-VOUT)xVOUT IL= [A](1) LxVCCxf IL VCC IL Appropriate ripple current at output should be 20% more or less of the maximum output current. VOUT L IL=0.2xIOUTmax. [A](2) Co (VCC-VOUT)xVOUT L= Fig.33 Output ripple current ILxVCCxf [H](3) (IL: Output ripple current, and f: Switching frequency) Current exceeding the current rating of the inductor results in magnetic saturation of the inductor, which decreases efficiency. The inductor must be selected allowing sufficient margin with which the peak current may not exceed its current rating. If VCC=5.0V, VOUT=1.2V, f=1.5MHz, IL=0.2x1.5A=0.3A, for example,(BD9150MUV) (5-1.2)x1.2 =2.02 2.2[H] 0.3x5x1.5M Select the inductor of low resistance component (such as DCR and ACR) to minimize dissipation in the inductor for better efficiency. L= 2. Selection of output capacitor (CO) VCC Output capacitor should be selected with the consideration on the stability region and the equivalent series resistance required to smooth ripple voltage. Output ripple voltage is determined by the equation (4) VOUT L ESR VOUT=ILxESR [V](4) Co (IL: Output ripple current, ESR: Equivalent series resistance of output capacitor) Rating of the capacitor should be determined allowing sufficient margin against output voltage. A 22F to 100F ceramic capacitor is recommended. Less ESR allows reduction in output ripple voltage. Fig.34 Output capacitor 3. Selection of input capacitor (Cin) VCC Input capacitor to select must be a low ESR capacitor of the capacitance sufficient to cope with high ripple current to prevent high transient voltage. ripple current IRMS is given by the equation (5): Cin VOUT L IRMS=IOUTx The VOUT(VCC-VOUT) [A](5) VCC Co < Worst case > IRMS(max.) IOUT When Vcc=2xVOUT, IRMS= Fig.35 Input capacitor 2 If VCC=5.0V, VOUT=1.2V, and IOUTmax.=1.5A, (BD9150MUV) 1.2(5.0-1.2) IRMS=2x 5.0 =0.85[ARMS] A low ESR 22F/10V ceramic capacitor is recommended to reduce ESR dissipation of input capacitor for better efficiency. www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 11/16 2010.04 - Rev.C Technical Note BD9150MUV 4. Determination of RITH, CITH that works as a phase compensator As the Current Mode Control is designed to limit a inductor current, a pole (phase lag) appears in the low frequency area due to a CR filter consisting of a output capacitor and a load resistance, while a zero (phase lead) appears in the high frequency area due to the output capacitor and its ESR. So, the phases are easily compensated by adding a zero to the power amplifier output with C and R as described below to cancel a pole at the power amplifier. fp(Min.) 1 2xROxCO 1 fz(ESR)= 2xESRxCO A fp= fp(Max.) Gain [dB] 0 fz(ESR) IOUTMin. Phase [deg] IOUTMax. Pole at power amplifier When the output current decreases, the load resistance Ro increases and the pole frequency lowers. 0 -90 fp(Min.)= 1 [Hz]with lighter load 2xROMax.xCO fp(Max.)= 1 2xROMin.xCO Fig.36 Open loop gain characteristics A [Hz] with heavier load fz(Amp.) Zero at power amplifier Gain [dB] Increasing capacitance of the output capacitor lowers the pole frequency while the zero frequency does not change. (This is because when the capacitance is doubled, the capacitor ESR reduces to half.) 0 0 Phase [deg] -90 fz(Amp.)= 1 2xRITHxCITH Fig.37 Error amp phase compensation characteristics VOUT1 L1 FB1 EN1 SW1 SW1 ITH1 PGND1 ESR COUT1 RO1 PGND1 RITH1 CITH1 RITH2 CITH2 AGND PVcc N.C. PVcc AVcc PVcc ITH2 PGND2 FB2 EN2 SW2 SW2 PGND2 CIN1 CIN2 COUT2 ESR VOUT2 L2 R2 RO2 R1 Fig.38 Typical application Stable feedback loop may be achieved by canceling the pole fp (Min.) produced by the output capacitor and the load resistance with CR zero correction by the error amplifier. fz(Amp.)= fp(Min.) 1 2xRITHxCITH www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. = 1 2xROMax.xCO 12/16 2010.04 - Rev.C Technical Note BD9150MUV 5. Determination of output voltage The output voltage Vout is determined by the equation (6): VOUT=(R2/R1+1)xVADJ(6) VADJ: Voltage at ADJ terminal (0.8V Typ.) With R1 and R2 adjusted, the output voltage may be determined as required. L2 Output SW2 FB2 Adjustable output voltage range : 0.8V2.5V Cout2 R2 R1 Fig.39 Determination of output voltage Use 1 k100 k resistor for R1. If a resistor of the resistance higher than 100 k is used, check the assembled set carefully for ripple voltage etc. BD9150MUV Cautions on PC Board layout VOUT1 L1 FB1 EN1 SW1 SW1 PGND1 RITH1 CITH1 RITH2 CITH2 ITH1 PGND1 AGND PVcc N.C. PVcc AVcc PVcc ITH2 PGND2 FB2 EN2 SW2 SW2 PGND2 COUT1 CIN1 CIN2 COUT2 VOUT2 L2 R2 R1 Fig.40 Layout diagram Lay out the input ceramic capacitor CIN closer to the pins PVCC and PGND, and the output capacitor Co closer to the pin PGND. Lay out CITH and RITH between the pins ITH and GND as neat as possible with least necessary wiring. VQFN020V4040 (BD9150MUV) has thermal PAD on the reverse of the package. The package thermal performance may be enhanced by bonding the PAD to GND plane which take a large area of PCB. www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 13/16 2010.04 - Rev.C Technical Note BD9150MUV Recommended components Lists on above application Symbol L1,2 Part Coil Value 2.2uH Manufacturer TDK Series LTF5022-2R2N3R2 2.2uH TDK LTF5022-2R2N3R2 CIN1,CIN2 Ceramic capacitor 22uF Murata GRM32EB11A226KE20 Cout1,Cout2 Ceramic capacitor 22uF Murata GRM31CB30J226KE18 CITH1 Ceramic capacitor 330pF Murata CRM18 Serise RITH1 Resistance 56k Rohm MCR03 Serise CITH2 Ceramic capacitor RITH2 Resistance VOUT=1.0V 330pF Murata CRM18 Serise VOUT=1.2V VOUT=1.5V VOUT=1.8V VOUT=2.5V VOUT=1.0V VOUT=1.2V VOUT=1.5V VOUT=1.8V VOUT=2.5V 330pF 330pF 330pF 330pF 39k 47k 56k 75k 91k Murata Murata Murata Murata Rohm Rohm Rohm Rohm Rohm GRM18 Serise GRM18 Serise GRM18 Serise GRM18 Serise MCR03 Serise MCR03 Serise MCR03 Serise MCR03 Serise MCR03 Serise The parts list presented above is an example of recommended parts. Although the parts are sound, actual circuit characteristics should be checked on your application carefully before use. Be sure to allow sufficient margins to accommodate variations between external devices and this IC when employing the depicted circuit with other circuit constants modified. Both static and transient characteristics should be considered in establishing these margins. When switching noise is substantial and may impact the system, a low pass filter should be inserted between the VCC and PVCC pins, and a schottky barrier diode or snubber established between the SW and PGND pins. I/O equivalence circuit BD9150MUV EN1,EN2 pin SW1,SW2 PVCC PVCC PVCC EN1,EN2 SW1,SW2 FB1,FB2 pin ITH1,ITH2 pin AVCC FB1,FB2 ITH1,ITH2 Fig.41 I/O equivalence circuit www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 14/16 2010.04 - Rev.C Technical Note BD9150MUV Notes for use 1. Absolute Maximum Ratings While utmost care is taken to quality control of this product, any application that may exceed some of the absolute maximum ratings including the voltage applied and the operating temperature range may result in breakage. If broken, short-mode or open-mode may not be identified. So if it is expected to encounter with special mode that may exceed the absolute maximum ratings, it is requested to take necessary safety measures physically including insertion of fuses. 2. Electrical potential at GND GND must be designed to have the lowest electrical potential In any operating conditions. 3. Short-circuiting between terminals, and mismounting When mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. Failure to do so may result in IC breakdown. Short-circuiting due to foreign matters entered between output terminals, or between output and power supply or GND may also cause breakdown. 4. Thermal shutdown protection circuit Thermal shutdown protection circuit is the circuit designed to isolate the IC from thermal runaway, and not intended to protect and guarantee the IC. So, the IC the thermal shutdown protection circuit of which is once activated should not be used thereafter for any operation originally intended. 5. Inspection with the IC set to a pc board If a capacitor must be connected to the pin of lower impedance during inspection with the IC set to a pc board, the capacitor must be discharged after each process to avoid stress to the IC. For electrostatic protection, provide proper grounding to assembling processes with special care taken in handling and storage. When connecting to jigs in the inspection process, be sure to turn OFF the power supply before it is connected and removed. 6. Input to IC terminals + This is a monolithic IC with P isolation between P-substrate and each element as illustrated below. This P-layer and the N-layer of each element form a P-N junction, and various parasitic element are formed. If a resistor is joined to a transistor terminal as shown in Fig 42. P-N junction works as a parasitic diode if the following relationship is satisfied; GND>Terminal A (at resistor side), or GND>Terminal B (at transistor side); and if GND>Terminal B (at NPN transistor side), a parasitic NPN transistor is activated by N-layer of other element adjacent to the above-mentioned parasitic diode. The structure of the IC inevitably forms parasitic elements, the activation of which may cause interference among circuits, and/or malfunctions contributing to breakdown. It is therefore requested to take care not to use the device in such manner that the voltage lower than GND (at P-substrate) may be applied to the input terminal, which may result in activation of parasitic elements. Resistor Transistor (NPN) Pin A Pin B C Pin B B E Pin A N N P+ N P+ P N Parasitic element P+ P substrate Parasitic element GND B N P+ P N C E Parasitic element P substrate Parasitic element GND GND GND Other adjacent elements Fig.42 Simplified structure of monorisic IC 7. Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. 8 . Selection of inductor It is recommended to use an inductor with a series resistance element (DCR) 0.1 or less. Especially, in case output voltage is set 1.6V or more, note that use of a high DCR inductor will cause an inductor loss, resulting in decreased output voltage. Should this condition continue for a specified period (soft start time + timer latch time), output short circuit protection will be activated and output will be latched OFF. When using an inductor over 0.1, be careful to ensure adequate margins for variation between external devices and this IC, including transient as well as static characteristics. Furthermore, in any case, it is recommended to start up the output with EN after supply voltage is within operation range. www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. 15/16 2010.04 - Rev.C Technical Note BD9150MUV Ordering part number B D 9 Part No. 1 5 0 M Part No. U V - Package MUV: VQFN020V4040 E 2 Packaging and forming specification E2: Embossed tape and reel VQFN020V4040 <Tape and Reel information> 4.00.1 4.00.1 2.10.1 0.5 0.40.1 1 6 16 1.0 Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 5 20 10 15 2500pcs (0.22) S C0.2 Embossed carrier tape Quantity 11 2.10.1 0.08 S +0.03 0.02 -0.02 1.0MAX 1PIN MARK Tape +0.05 0.25 -0.04 1pin (Unit : mm) www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. Reel 16/16 Direction of feed Order quantity needs to be multiple of the minimum quantity. 2010.04 - Rev.C Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.001