2015 Microchip Technology Inc. DS20005359A-page 1
MTD6508
Features
• 180° Sinusoidal Drive for High Efficiency and Low
Acoustic Noise
• Position Sensorless BLDC Drivers
(no Hall Effect Sensor required)
• Integrated Power Transistors
• Supports 2V to 5.5V Power Supplies
• Variable Programming Resistor (RPROG) Setting
to fit Motor Constant (KM) Range from 3.25 mV/
Hz to 52 mV/Hz
• Speed Control through Power Supply Modulation
(PSM) and/or Pulse-Width Modulation (PWM)
• Built-in Frequency Generator: FG, FG/3 Output
Signal (FG/2 and FG/6 Option are available upon
request)
• Output PWM Slew Rate Control Programmable
with an External Resistor for Start-up
(Adjustable version)
• Phase Target Selection for Regulation
(Adjustable Version)
• Start-up Strength Selection (Adjustable Version)
• Start-up Output Current Controlled by PWM
• Output Current Soft Start
• Built-in Lock-up Protection and Automatic
Recovery Circuit
• Built-in Overcurrent Limitation
• Built-in Thermal Shutdown Protection
• Built-in Overvoltage Protection
• Low Minimal Start-up Speed for Low-Speed
Operation
• Packages:
- 10-Lead 3 mm x 3 mm x 0.5 mm UDFN
- 16-Lead 4 mm x 4 mm x 0.5 mm UQFN
(Adjustable version)
Applications
• Notebook CPU Cooling Fans
• 5V 3-Phase BLDC Motors
Description
The MTD6508 device is a 3-phase, full-wave
sensorless driver for brushless DC (BLDC) motors. It
features a 180° sinusoidal drive, high torque output and
silent drive. With adaptive features, parameters and a
wide range of power supplies (2V to 5.5V), the
MTD6508 is intended to cover a broad range of motor
characteristics while requiring minimum external
components. Speed control can be achieved through
either power supply modulation (PSM) or pulse-width
modulation (PWM).
Compact packaging and a minimal bill of materials
make the MTD6508 device extremely cost-efficient in
fan applications. For example, the CPU cooling fans in
notebook computers require designs that provide low
acoustic noise, low mechanical vibration and are highly
efficient. The frequency generator (FG) output enables
precision speed control in closed-loop applications.
The MTD6508 device includes Lock-up Protection
mode to turn off the output current when the motor is in
a lock condition, with an automatic recovery feature to
restart the fan when the lock condition is removed.
Motor overcurrent limitation and thermal shutdown
protection are included for safety-enhanced operations.
The MTD6508 is available in compact, thermally-
enhanced, 10-Lead 3 mm x 3 mm x 0.5 mm UDFN
packages and 16-Lead 4 mm x 4 mm x 0.5 mm
UQFN packages.
3-Phase Sinusoidal Sensorless Brushless DC Fan Motor Driver
MTD6508
DS20005359A-page 2 2015 Microchip Technology Inc.
Package Types
Functional Block Diagram
*Includes Exposed Thermal Pad (EP); see Table 3-1.
MTD6508
4x4 UQFN-16*
MTD6508
3x3 UDFN-10*
Note: The DIR, SS and RT pins that are not available on UDFN-10 Package are internally pulled down. SR1 and
SR2 are connected by a fixed internal resistor (25 kΩ).
2
VBIAS
OUT2
FG RT
PWM
GND
FG3_SEL
OUT1
GND
OUT3
VDD
DIR
SR1
SR2
SS
RPROG EP
16
1
15 14 13
3
4
12
11
10
9
5678
17
VBIAS
RPROG
OUT1
FG3_SEL
VDD
1
2
3
4
10
9
8
7OUT3
PWMFG
EP
11
56
OUT2 GND
Thermal
Protection
VBIAS
OUT1
OUT2
CPU + Peripherals
PWM
FG
OUT3
VDD
Short-Circuit
Protection
Output Drive Circuit
Motor Phase
Detection Circuit
Overcurrent
Protection
GND
Nonvolatile
Memory
RPROG Sense
RPROG Adju stable KM
Slew Rate
Control
SR1
SR2
RT SS DIR
FG3_SEL
2015 Microchip Technology Inc. DS20005359A-page 3
MTD6508
Typical Application
FG
VBIA S
OUT2
OUT1
GND
OUT3
FG3_SEL
PWM
RPROG
C1
VDD
C2
VLOGI C
RFG
KM0K
M3KM1, 2
RPROG
VBIA S
VBIA S
RT
DIR
SR1
SR2
SS
RSR
VDD
PWM input
(1-100 kHz)
GND
VLOGI C = VBIA S or VDD
= Optional
VLOGI C
RPWM
VLOGI C
VLOGI C
VLOGI C
VBIA S
1
EP
17
16 15 14 13
5678
2
3
4
12
11
10
9
Legend
Recommended External Components for Typical Application
Element Type/Value Comment
C1 1 µF Connect as close as possible to IC input pin
C2 1 µF Connect as close as possible to IC input pin
RFG 10 kΩConnect to Vlogic on microcontroller side (FG Pull-Up)
RPWM 100 kΩConnect to Vlogic on microcontroller side (PWM Pull-Up)
RPROG 3.9 kΩ or 24 kΩSelect appropriate programming resistor value, see Ta b l e 4 - 1
RSR 4.7 kΩ-47 kΩSelect appropriate output PWM slew rate, see Tab l e 4 -2
MTD6508
DS20005359A-page 4 2015 Microchip Technology Inc.
NOTES:
2015 Microchip Technology Inc. DS20005359A-page 5
MTD6508
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Power Supply Voltage (VDD_MAX) ...................... -0.7 to +7.0V
Maximum Output Voltage (VOUT_MAX) ............... -0.7 to +7.0V
Maximum Output Current (IOUT_MAX)(1)....................1000 mA
FG Maximum Output Voltage (VFG_MAX) ........... -0.7 to +7.0V
FG Maximum Output Current (IFG_MAX) ......................5.0 mA
VBIAS Maximum Voltage (VBIAS_MAX) ................ -0.7 to +4.0V
PWM Maximum Voltage (VPWM_MAX) ................ -0.7 to +7.0V
Allowable Power Dissipation (PD_MAX)(2)........................1.5W
Maximum Junction Temperature (TJ).......................... +150°C
ESD protection on all pins 2kV
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only, and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
Note 1: IOUT is also internally limited, according
to the limits defined in the Electrical
Characteristics table.
2: Reference Printed Circuit Board (PCB)
according to JEDEC standard EIA/JESD
51-9.
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for VDD = 2.0V to 5.5V, TA = +25°C
Parameters Sym. Min. Typ. Max. Units Conditions
Power Supply Voltage VDD 2—5.5V
Power Supply Current IVDD —510mAV
DD =5V
Standby Current IVDD_STB —1525µAPWM=0V, V
DD =5V
(Standby mode)
OUTX High Resistance RON(H) —0.75—ΩIOUT = 0.5A, VDD =5V
OUTX Low Resistance RON(L) —0.75—ΩIOUT = 0.5A, VDD =5V
OUTX Total Resistance RON(H+L) —1.5—ΩIOUT = 0.5A, VDD =5V
VBIAS Internal
Supply Voltage
VBIAS —3—VV
DD = 3.2V to 5.5V
—V
DD –0.2 — V V
DD <3.2V
PWM Input Frequency fPWM 1—100kHz
PWM Input H Level VPWM_H 0.55 VDD —V
DD VV
DD 4.5V
PWM Input L Level VPWM_L 0—0.2VDD VV
DD 4.5V
FG3_SEL Input H Level VFG3_SEL_H VBIAS –0.5 — V
BIAS VV
DD 4.5V
FG3_SEL Input L Level VFG3_SEL_L 0—0.2VDD VV
DD 4.5V
FG Output Pin Low-Level
Voltage
VOL_FG ——0.25VI
FG =-1mA
FG Output Pin Leakage
Current
ILH_FG -10 — 10 µA VFG =5.5V
Lock Protection
Operating Time
TRUN —0.51s
Lock Protection Waiting Time TWAIT 55.56sNote 1
Overcurrent Protection IOC_MOT —750—mANote 2
Note 1: Related to the internal oscillator frequency (see Figure 2-1)
2: 750 mA is the standard option for MTD6508. Additional overcurrent protection levels are available upon
request. Please contact factory for different overcurrent protection values.
MTD6508
DS20005359A-page 6 2015 Microchip Technology Inc.
Overvoltage Protection VOV —7.2—V
Short Protection on High Side IOC_SW_H —2.57—A
Short Protection on Low Side IOC_SW_L —-2.83—A
Thermal Shutdown TSD —170—°C
Thermal Shutdown Hysteresis TSD_HYS —25—°C
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise specified, all limits are established for VDD = 2.0V to 5.5V, TA = +25°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Operating Temperature TOPR -40 — +125 °C
Storage Temperature Range TSTG -55 — +150 °C
Thermal Package Resistances
Thermal Resistance, 10L-UDFN, 3x3 JA —68 —°C/W
JC —11—°C/W
Thermal Resistance, 16L-UQFN, 4x4 JA —31.8— °C/W
JC —10—°C/W
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits are established for VDD = 2.0V to 5.5V, TA = +25°C
Parameters Sym. Min. Typ. Max. Units Conditions
Note 1: Related to the internal oscillator frequency (see Figure 2-1)
2: 750 mA is the standard option for MTD6508. Additional overcurrent protection levels are available upon
request. Please contact factory for different overcurrent protection values.
2015 Microchip Technology Inc. DS20005359A-page 7
MTD6508
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless indicated, TA = +25°C, VDD = 2.0V to 5.5V, OUT1, 2, 3 and PWM open.
FIGURE 2-1: Oscillator Frequency
Deviation vs. Temperature.
FIGURE 2-2: Internal Regulated Voltage
(VBIAS) vs Temperature.
FIGURE 2-3: Internal Regulated Voltage
(VBIAS) vs Supply Voltage (VDD).
FIGURE 2-4: Inputs (PWM) VIL vs.
Temperature.
FIGURE 2-5: Inputs (PWM) VIH vs.
Temperature.
FIGURE 2-6: Outputs RON High-Side
Resistance vs. Temperature.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
-4.5
-4
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
0.5
1
-40 -25 -10 5 20 35 50 65 80 95 110 125
Oscillator Frequeny Deviation
(%)
Temperature (°C)
VDD = 5.5V
VDD = 2V
3
3.02
3.04
3.06
3.08
-40 -25 -10 5 20 35 50 65 80 95 110 125
V
BIAS
(V)
Temperature (°C)
VDD = 5.5V
0
0.5
1
1.5
2
2.5
3
3.5
2.0 2.5 3.0 3.5 4.0 4.5 5.0
5.5
V
BIAS
(V)
VDD(V)
0
0.5
1
1.5
2
2.5
-40 -25 -10 5 20 35 50 65 80 95 110 125
PWM V
IL
(V)
Temperature (°C)
VDD = 5.5 VDD = 5.5 V
DD
= 5.5V
VDD = 2V
0
0.5
1
1.5
2
2.5
3
-40 -25 -10 5 20 35 50 65 80 95 110 125
PWM V
IH
(V)
Temperature (°C)
VDD = 5.5V
VDD = 2V
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-40 -25 -10 5 20 35 50 65 80 95 110 125
RON High Side (ȍ)
Temperature (°C)
VDD = 5.5V
MTD6508
DS20005359A-page 8 2015 Microchip Technology Inc.
Note: Unless indicated, TA = +25°C, VDD = 2.0V to 5.5V, OUT1, 2, 3 and PWM open.
FIGURE 2-7: Outputs RON Low-Side
Resistance vs. Temperature.
FIGURE 2-8: Supply Current vs.
Temperature.
FIGURE 2-9: Standby Current vs.
Temperature.
FIGURE 2-10: DIR, SS and RT Pins VIL (V)
vs. Temperature.
FIGURE 2-11: DIR, SS and RT Pins VIH (V)
vs. Temperature.
FIGURE 2-12: Typical Outputs on Closed
Loop.
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-40 -25 -10 5 20 35 50 65 80 95 110 125
RON Low Side (ȍ)
Temperature (°C)
VDD = 5.5V
0
1
2
3
4
5
6
7
-40 -25 -10 5 20 35 50 65 80 95 110 125
I
VDD
Current (mA)
Tem
p
erature
(
°C
)
VDD = 2V
VDD = 5.5V
0
10
20
30
40
-40 -25 -10 5 20 35 50 65 80 95 110 125
I
VDD_STB
Current (μA)
Temperature (°C)
VDD = 5.5V
0
0.5
1
1.5
2
2.5
-40 -25 -10 5 20 35 50 65 80 95 110 125
DIR, SS and RT Pins V
IL
(V)
Temperature (°C)
VDD = 5.5V
VDD = 2V
0
0.5
1
1.5
2
2.5
-40 -25 -10 5 20 35 50 65 80 95 110 125
DIR, SS and RT Pins V
IH
(V)
Temperature (°C)
VDD = 5.5V
VDD = 2V
2015 Microchip Technology Inc. DS20005359A-page 9
MTD6508
FIGURE 2-13: Typical Output Current on
Start-up.
FIGURE 2-14: Typical Outputs on Locked
Motor While Running.
MTD6508
DS20005359A-page 10 2015 Microchip Technology Inc.
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Ta b l e 3-1.
TABLE 3-1: PIN FUNCTION TABLE
MTD6508
Name Type Function
3x3
UDFN
4x4
UQFN
1 1 FG O Motor Speed Indication Output Pin
22R
PROG IK
M Parameter Setting with External Resistors Pin (do not leave floating)
33V
BIAS O 3V Internal Regulator Output Pin (for decoupling only)
5 4 OUT2 O Single-Phase Coil Output Pin
6 5 GND P Negative Voltage Supply Pin (ground)
4 6 OUT1 O Single-Phase Coil Output Pin
6 7 GND P Negative Voltage Supply Pin (ground)
7 8 OUT3 O Single-Phase Coil Output Pin
89V
DD P Positive Voltage Supply for Motor Driver Pin
9 10 FG3_SEL I FG Frequency Divider Selection Pin:
- FG signal divided by three: connect this pin to VBIAS
- FG normal signal: connect this pin to GND or leave floating
10 11 PWM I PWM Input Signal for Close-Loop Speed Control Pin (do not leave floating)
— 12 RT I Regulation Target Pin – phase target selection for regulation:
- Normal regulation: connect this pin to GND or leave floating
- Low load regulation: connect this pin to VBIAS or VDD
- Pin not available on UDFN-10 option; selection fixed to normal
regulation
— 13 SS I Strong Start Pin – start-up strength selection:
- Soft open-loop start-up (reduced current) – during the start-up open-
loop, the output amplitude is defined by the input PWM duty cycle:
connect this pin to GND or leave floating
- Strong open-loop start-up – during the start-up open-loop, the output
amplitude is fixed to 100%: connect this pin to VBIAS or VDD
- Pin not available on UDFN-10 option; selection fixed to soft
open-loop start-up
— 14 SR2 O Start-up Output PWM Slew Rate Control Pin 2 (High side)
- Pin not available on UDFN-10 option; selection fixed to 250 ns (25 kΩ)
— 15 SR1 I Start-up Output PWM Slew Rate Control Pin 1 (Low side)
- Pin not available on UDFN-10 option; selection fixed to 250 ns (25 kΩ)
— 16 DIR I Motor Rotation Direction Pin (DIR function):
- Forward direction: connect this pin to GND or leave floating
- Reverse direction: connect this pin to VBIAS or VDD
- Pin not available on UDFN-10 option; selection fixed to forward
direction
11 17 EP N/A Exposed Pad Pin; connect to ground plane on the PCB for enhanced thermal
performance
Note: I = Input, O = Output, P = Power
2015 Microchip Technology Inc. DS20005359A-page 11
MTD6508
4.0 FUNCTIONAL DESCRIPTION
The MTD6508 generates a full-wave signal to drive a
3-phase BLDC motor. High efficiency and low power
consumption are achieved due to CMOS transistors
and a synchronous rectification drive type.
4.1 Speed Control
The rotational speed of the motor can be controlled
either through the PWM digital input signal or by acting
directly on the power supply (VDD). When the PWM
signal is High, the motor rotates at full speed. When the
PWM signal is low, the IC outputs are set to high-
impedance and the motor is stopped.
By changing the PWM duty cycle, the speed can be
adjusted. Thus, the user has maximum freedom to
choose the PWM system frequency within a wide range
(from 1kHz to 100kHz).
The PWM pin should not be floating. It can be connected
to an external pull-up resistor connected to VDD.
When the PWM duty cycle is below 5%, MTD6508
directly stops the drive (output High Z) and will restart
only if the PWM duty cycle is above 5%. If MTD6508 is
not in standby mode (PWM duty cycle = 0%), it will not
restart unless a “waiting time” (TWAIT) has been spent
in order to allow the fan to break enough before the
next start-up. TWAIT begins as soon as the PWM duty
cycle falls below 5%.
The output transistor activation always occurs at a fixed
rate of 30 kHz, which is outside the range of audible
frequencies.
4.2 Frequency Generator Function
The Frequency Generator output (FG) is a Hall effect
sensor equivalent digital output, giving information to
an external controller about the speed and phase of the
motor. The FG pin is an open-drain output connecting
to a logical voltage level through an external pull-up
resistor. When a lock or an out-of-sync situation is
detected by the driver, this output is set to high-
impedance until the motor is restarted. The pin should
be left open when it is not used.
EQUATION 4-1:
If the FG3_SEL pin is enabled, the rotor speed rotation
per minute (RPM) has to be multiplied by three, because
the FG signal frequency will be divided by three.
FIGURE 4-1: FG and FG/3 Waveform.
4.3 Lock-Up Protection and Automatic
Restart
If the motor is blocked and cannot rotate freely, a lock-
up protection circuit detects it and disables the driver by
setting its outputs to high-impedance to prevent the
motor coil from burnout. After a “waiting time” (TWAIT),
the lock-up protection is released and normal operation
resumes for a given time (TRUN). If the motor is still
blocked, a new period of waiting time is started. TWAIT
and TRUN timings are fixed internally so that no external
capacitor is required.
4.4 Overcurrent Protection
The motor peak current is limited by the driver to
750 mA (standard value), thus limiting the maximum
power dissipation in the coils.
4.5 Thermal Shutdown
The MTD6508 has a thermal protection function which
detects when the die temperature exceeds
TJ= +170°C. When this temperature is reached, the
circuit enters the Thermal Shutdown mode and the
outputs OUT1, OUT2 and OUT3 are disabled (high-
impedance): avoiding the IC destruction and allowing
the circuit to cool down. When the junction temperature
(TJ) drops below +145°C, normal operation resumes.
The thermal detection circuit has +25°C hysteresis.
FIGURE 4-2: Thermal Protection
Hysteresis.
Note 1: The PWM frequency has no direct effect
on the motor speed, and is asynchronous
with the activation of the output transistors.
FG 720
PS
----------------------- R o t o r s p e e d R P M=
Where:
P = Total number of poles in the motor
S = Total number of slots in the motor
OUT1
FG
FG/3
TJ
+145°
Thermal shutdown
+170°
Normal
operation
MTD6508
DS20005359A-page 12 2015 Microchip Technology Inc.
4.6 Overvoltage Shutdown
The MTD6508 has an overvoltage protection function
which detects when the VDD voltage exceeds
VOV = +7.2V. In Overvoltage condition, outputs OUT1,
OUT2 and OUT3 are disabled (high impedance).
4.7 Internal Voltage Regulator
VBIAS voltage is generated internally and is used to
supply internal logical blocks. The VBIAS pin is used to
connect an external decoupling capacitor (1 µF or
higher). Notice that this pin is for IC internal use, and is
not designed to supply DC current to external blocks.
4.8 Back Electromotive Force (BEMF)
Coefficient Setting
KM is the electromechanical coupling coefficient of the
motor (also referred to as “motor constant” or “BEMF
constant”). Depending on the conventions in use, the
exact definition of KM and its measurement criteria can
vary among motor manufacturers. To accommodate
various motor applications, the MTD6508 provides
options to facilitate various BEMF coefficients.
The MTD6508 defines the BEMF coefficient (KM) as
the peak value of the phase-to-phase BEMF voltage,
normalized to the electrical speed of the motor. The
following table offers methods to set the KM value for
the MTD6508 device.
RPROG sensing is actually a sequence that is controlled
by the firmware. For any given RPROG
, the internal
control block will output the corresponding KM range.
4.9 Start-up Output PWM Slew Rate
Control
In order to reduce vibration, the output PWM slew rate
can be adjusted with RSR during start-up. Refer to
Table 4-2 when choosing the RSR value. A rate that is
too slow can decrease the efficiency of the IC. The
recommended RSR range is from 4.7 kΩ to 47 kΩ. The
RSR will be connected between pins SR1 and SR2.
Once the start-up open loop is finished, the MTD6508
will automatically switch to a fixed slew rate,
corresponding to 10 kΩ or 100 ns (typical).
4.10 Motor Rotation Direction Pin (DIR)*
The current-carrying order of the outputs depends on
the DIR pin state “Rotation Direction”, and is described
in Tabl e 4 - 3 . The DIR pin level is latched after power-
on or after exiting standby mode. The DIR pin is not
designed for dynamic direction change during
operation. The pin is internally connected to GND on
the non-adjustable version.
*On adjustable version only
TABLE 4-1: KM SETTINGS
KM
Option
KM (mV/Hz) Range
Phase-to-Phase RPROG
Min. Max.
KM0 3.25 6.5 GND
KM1 6.5 13 24 kΩ
KM2 13 26 3.9 kΩ
KM326 52V
BIAS
TABLE 4-2: SLEW RATE SETTINGS
RSR.
Value
Output PWM
Transition Time
for 10 to 90% Comment
Rising/Falling edge
x kΩx 10.64 ns Transition rate
equation
4.7 kΩ50 ns Fast transition
10 kΩ100 ns Typical transition
47 kΩ500 ns Slow transition
Note: Slew rate adjustment on start-up can only
be done in the adjustable version of the
MTD6508.
TABLE 4-3: MOTOR ROTATION
DIRECTION OPTIONS
DIR Pin State Rotation
Direction
Outputs Activation
Sequence
Connected to
GND or Floating
Forward OUT1 -> OUT2 -> OUT3
Connected to
VBIAS or VDD
Reverse OUT3 -> OUT2 -> OUT1
2015 Microchip Technology Inc. DS20005359A-page 13
MTD6508
4.11 Strong Start Pin (SS)*
The sinusoidal start-up open-loop phase current
amplitude can be defined by the PWM input duty cycle
or fixed at 100%. Ta b l e 4 - 4 describes both start-up
options. This pin is internally connected to GND on the
non-adjustable version.
*On adjustable version only
4.12 Regulation Target Pin (RT)*
The RT pin adjusts the phase regulation parameters
to allow more stability in applications using 3-Phase
BLDC motors attached to a light load. The low-load
phase regulation option reduces the speed correction
gain by 75% in order to produce smoother behavior.
Ta b l e 4 - 5 describes the phase regulation options.
The RT pin is internally connected to GND on the
non-adjustable version.
*On adjustable version only
TABLE 4-4: START-UP OPEN-LOOP CURRENT AMPLITUDE OPTIONS
SS Pin State Start-up Open-Loop Current Amplitude
Connected to GND or Floating Soft open-loop start-up (reduced current) – during the start-up open loop, the output
amplitude is defined by the input PWM duty cycle (start-up without speed overshoot,
with respect to the target speed set by PWM).
Connected to VBIAS or VDD Strong open-loop start-up – during the start-up open loop, the output amplitude is
fixed at 100% (start-up with maximal torque.
TABLE 4-5: PHASE REGULATION
OPTIONS
RT Pin State Phase Regulation
Target Options
Connected to GND or Floating Optimized for typical
load (Fan, Pump)
Connected to VBIAS or VDD Optimized for low
load (Motor with light
rotor and low air
resistance while
operating)
MTD6508
DS20005359A-page 14 2015 Microchip Technology Inc.
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
10-Lead UDFN (3x3x0.5 mm) Example
XXXX
YYWW
NNN
PIN 1 PIN 1
16-Lead UQFN (4x4x0.5 mm) Example
PIN 1 PIN 1
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
AAAL
1441
256
MTD
6508
I/JQ^^
441256
3
e
2015 Microchip Technology Inc. DS20005359A-page 15
MTD6508
MTD6508
DS20005359A-page 16 2015 Microchip Technology Inc.
2015 Microchip Technology Inc. DS20005359A-page 17
MTD6508
MTD6508
DS20005359A-page 18 2015 Microchip Technology Inc.
B
A
0.20 C
0.20 C
0.10 C A B
(DATUM B)
(DATUM A)
C
SEATING
PLANE
NOTE 1
1
2
N
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
NOTE 1
1
2
N
0.10 C A B
0.10 C A B
0.10 C
0.08 C
A1
Microchip Technology Drawing C04-257A Sheet 1 of 2
16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]
D
E
A
(A3)
16X b
e
e
2
2X
D2
E2
K
L
16X
2015 Microchip Technology Inc. DS20005359A-page 19
MTD6508
Microchip Technology Drawing C04-257A Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Pins
Overall Height
Terminal Width
Overall Width
Overall Length
Terminal Length
Exposed Pad Width
Exposed Pad Length
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
E2
D2
A3
e
L
E
N
0.65 BSC
0.127 REF
2.50
2.50
0.30
0.25
0.45
0.00
0.30
4.00 BSC
0.40
2.60
2.60
0.50
0.02
4.00 BSC
MILLIMETERS
MIN NOM
16
2.70
2.70
0.50
0.35
0.55
0.05
MAX
K-0.20 -
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]
MTD6508
DS20005359A-page 20 2015 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
SILK SCREEN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
2.70
2.70
MILLIMETERS
0.65 BSC
MIN
E
MAX
4.00
Contact Pad Length (X16)
Contact Pad Width (X16)
Y1
X1
0.80
0.35
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing C04-2257A
NOM
16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body
C2
C1
X2
Y2
X1
E
Y1
C1 4.00Contact Pad Spacing
1
2
16
[UQFN]
2015 Microchip Technology Inc. DS20005359A-page 21
MTD6508
APPENDIX A: REVISION HISTORY
Revision A (April 2015)
• Original release of this document.
MTD6508
DS20005359A-page 22 2015 Microchip Technology Inc.
NOTES:
2015 Microchip Technology Inc. DS20005359A-page 23
MTD6508
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MTD6508: 3-Phase Brushless DC, Sinusoidal Sensorless
Fan Motor Driver
Temperature
Range:
E = -40°C to +125°C (Extended)
Package: JQ = Ultra Thin Plastic Quad Flat, No-Lead
Package (JQ) – 4x4x0.5 mm Body, 16-Lead UQFN
NA = Ultra-thin Dual Flatpack, No-Lead Package
(NA[Y]) – 3x3x0.5 mm Body, 10-Lead UDFN
Examples:
a) MTD6508-ADJE/JQ Extended Temperature
16LD 4x4 UQFN package
b) MTD6508T-E/NA Tape and Reel,
Extended Temperature
10LD 3x3 UDFN package
PART NO. T(1) -X /XX
PackageTe mperatureTape & Reel
Device
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This identi-
fier is used for ordering purposes and is nto
printed on the device package. Check with
your Microchip Sales Office for package
availability with the Tape and Reel option.
MTD6508
DS20005359A-page 24 2015 Microchip Technology Inc.
NOTES:
2015 Microchip Technology Inc. DS20005359A-page 25
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63277-347-0
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS20005359A-page 26 2015 Microchip Technology Inc.
AMERICAS
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Worldwide Sales and Service
01/27/15
