(1.27 mm) .050" FLE SERIES
Tiger Beam™
contact
Available with optional
pick & place pads
(1.27 mm) .050"
micro pitch
Surface
mount
Ideal for
pass-through
applications
FLE–150–01–G–DV
FLE–110–01–G–DV
FLE–120–01–G–DV
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
01 PLATING
OPTION
NO. PINS
PER ROW
1
FLE
–G
= 10 µ" (0.25 µm) Gold
DV OPTIONS
–A
= Alignment Pin
(Metal or plastic at
Samtec discretion)
(3 positions minimum)
–K
= (4.25 mm) .167" DIA
Polyimide film
Pick & Place Pad
(5 positions minimum)
–P
= Metal Pick &
Place Pad
(5 positions minimum)
–TR
= Tape & Reel
02 thru 50
Note: Some lengths, styles
and options are non-standard,
non-returnable.
For complete specifications and
recommended PCB layouts
see www.samtec.com?FLE
Insulator Material:
Black Liquid
Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au over 50 µ" (1.27 µm) Ni
Current Rating:
2.9 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
(1.83 mm) .072" to
(4.37 mm) .172" or
pass-through
Normal Force:
100 grams (0.98 N)
Max Cycles:
100+
RoHS Compliant:
Ye s
No. of Positions x (1.27) .050 + (0.11) .0045
(1.27)
.050
(1.27)
.050
(0.51)
.020
(3.33)
.131
(4.55)
.179
(4.36)
.172
(4.74)
.187
(6.35)
.250
x
(4.17)
.164
(4.60)
.181
–P OPTION
SPECIFICATIONS
COST-EFFECTIVE RELIABLE SOCKET
For complete scope
of recognitions see
www.samtec.com/quality
RECOGNITIONS
ALSO AVAILABLE
(MOQ Required)
• Other platings
* Note: Standard FFMD callout
will not mate with FLE, SFMC.
Must use gold plated callouts.
(See drawing on web.)
FILE NO. E111594
PROCESSING
Lead-Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 30 µ" GOLD
HIGH MATING
CYCLES
Board Mates:
FTSH, FTS, FW
Cable Mates:
FFMD*, FMTP
F-219
