BAS70-04,235 - NXP Semiconductors

1. Product profile

1.1 General description

General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic

packages.

1.2 Features

1.3 Applications

BAS70 series;

1PS7xSB70 series

General-purpose Schottky diodes

Rev. 09 — 13 January 2010 Product data sheet

Table 1. Product overview

Type number Package Configuration

NXP JEITA

1PS76SB70 SOD323 SC-76 single diode

1PS79SB70 SOD523 SC-79 single diode

BAS70 SOT23 - single diode

BAS70H SOD123F - single diode

BAS70L SOD882 - single diode

BAS70W SOT323 SC-70 single diode

BAS70-04 SOT23 - dual series

BAS70-04W SOT323 SC-70 dual series

BAS70-05 SOT23 - dual common cathode

BAS70-05W SOT323 SC-70 dual common cathode

BAS70-06 SOT23 - dual common anode

BAS70-06W SOT323 SC-70 dua l common anode

BAS70-07 SOT143B - dual isolated

BAS70-07S SOT363 SC-88 dual isolated

BAS70-07V SOT666 - dual isolated

BAS70VV SOT666 - triple isolated

BAS70XY SOT363 SC-88 quadruple; 2 series

High switching speed Low leakage current

High breakdo wn vo ltage Low capacitance

Ultra high-speed switching Voltage clamping

Product data sheet Rev. 09 — 13 January 2010 2 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

1.4 Quick reference data

[1] Pulse test: tp≤300 μs; δ≤0.02.

2. Pinning information

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Per diode

IFforward current - - 70 mA

VFforward voltage IF=1mA [1] --410mV

VRreverse voltage - - 70 V

Table 3. Pinning

Pin Description Simplified outline Symbol

BAS70H; 1PS76SB70; 1PS79SB70

1 cathode [1]

2 anode

BAS70L

1 cathode [1]

2 anode

BAS70; BAS70W

1 anode

2 not connected

3 cathode

BAS70-04; BAS70-04W

1 anode (diode 1)

2 cathode (diode 2)

3 cathode (diode 1),

anode (diode 2)

001aab540

sym00

Transparent

top view

sym00

006aaa14

006aaa436

n.c.

006aaa14

006aaa43

Product data sheet Rev. 09 — 13 January 2010 3 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

BAS70-05; BAS70-05W

1 anode (diode 1)

2 anode (diode 2)

3 cathode (diode 1),

cathode (diode 2)

BAS70-06; BAS70-06W

1 cathode (diode 1)

2 cathode (diode 2)

3 anode (diode 1),

anode (diode 2)

BAS70-07

1 cathode (diode 1)

2 cathode (diode 2)

3 anode (diode 2)

4 anode (diode 1)

BAS70-07S; BAS70-07V

1 anode (diode 1)

2 not connected

3 cathode (diode 2)

4 anode (diode 2)

5 not connected

6 cathode (diode 1)

BAS70VV

1 anode (diode 1)

2 anode (diode 2)

3 anode (diode 3)

4 cathode (diode 3)

5 cathode (diode 2)

6 cathode (diode 1)

Table 3. Pinning …continued

Pin Description Simplified outline Symbol

006aaa14

006aaa43

006aaa14

006aaa43

006aaa4

001aab55

6 45

1 32 006aaa44

654

123

456 6

sym04

Product data sheet Rev. 09 — 13 January 2010 4 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

[1] The marking bar indicates the cathode.

3. Ordering information

BAS70XY

1 anode (diode 1)

2 cathode (diode 2)

3 anode (diode 3),

cathode (diode 4)

4 anode (diode 4)

5 cathode (diode 3)

6 cathode (diode 1),

anode (diode 2)

Table 3. Pinning …continued

Pin Description Simplified outline Symbol

132

006aaa25

654

123

Table 4. Ordering information

Type number Package

Name Description Version

1PS76SB70 SC-76 plastic surface-mounted package; 2 leads SOD323

1PS79SB70 SC-79 plastic surface-mounted package; 2 leads SOD523

BAS70 - plastic surface-mounted package; 3 leads SOT23

BAS70H - plastic surface-mounted package; 2 leads SOD123F

BAS70L - leadless ultra small plastic package; 2 terminals;

body 1.0 ×0.6 ×0.5 mm SOD882

BAS70W SC-70 plastic surface-mounted package; 3 leads SOT323

BAS70-04 - plastic surface-mounted package; 3 leads SOT23

BAS70-04W SC-70 plastic surface-mounted package; 3 leads SOT323

BAS70-05 - plastic surface-mounted package; 3 leads SOT23

BAS70-05W SC-70 plastic surface-mounted package; 3 leads SOT323

BAS70-06 - plastic surface-mounted package; 3 leads SOT23

BAS70-06W SC-70 plastic surface-mounted package; 3 leads SOT323

BAS70-07 - plastic surface-mounted package; 4 leads SOT143B

BAS70-07S SC-88 plastic surface-mounted package; 6 leads SOT363

BAS70-07V - plastic surface-mounted package; 6 leads SOT666

BAS70VV - plastic surface-mounted package; 6 leads SOT666

BAS70XY SC-88 plastic surface-mounted package; 6 leads SOT363

Product data sheet Rev. 09 — 13 January 2010 5 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

4. Marking

[1] * = -: made in Hong Kong

* = p: made in Hong Kong

* = t: made in Malaysia

* = W: made in China

5. Limiting values

[1] Tj=25°C prior to surge.

Table 5. Marking codes

Type number Marking code[1] Type number Marking code[1]

1PS76SB70 S2 BAS70-05W 75*

1PS79SB70 G BAS70-06 76*

BAS70 73* BAS70-06W 76*

BAS70H AH BAS70-07 77*

BAS70L S8 BAS70-07S 77*

BAS70W 73* BAS70-07V 77

BAS70-04 74* BAS70VV N1

BAS70-04W 74* BAS70XY 70*

BAS70-05 75* - -

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per diode

VRreverse voltage - 70 V

IFforward current - 70 mA

IFRM repetitive peak forward

current tp≤1s; δ≤0.5 - 70 mA

IFSM non-repetitive peak forward

current tp≤10 ms [1] -100mA

Tjjunction temperature - 150 °C

Tamb ambient temperature −65 +150 °C

Tstg storage temperature −65 +150 °C

Product data sheet Rev. 09 — 13 January 2010 6 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

6. Thermal characteristics

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2] Reflow soldering is the only recommended soldering method.

[3] Soldering point at pins 2, 3, 5 and 6.

7. Characteristics

[1] Pulse test: tp≤300 μs; δ≤0.02.

Table 7. Thermal characteris tics

Symbol Parameter Conditions Min Typ Max Unit

Per device

Rth(j-a) thermal resistance from

junction to ambient in free air [1]

SOT23 - - 500 K/W

SOT143B - - 500 K/W

SOT363 (BAS70-07S) - - 416 K/W

SOT666 (BAS70VV) [2] - - 700 K/W

SOT666 (BAS70-07V) [2] - - 416 K/W

SOD123F [2] - - 330 K/W

SOD323 - - 450 K/W

SOD523 [2] - - 450 K/W

SOD882 [2] - - 500 K/W

SOT323 - - 625 K/W

Rth(j-sp) thermal resistance from

junction to solder point

SOT363 (BAS70XY) [3] - - 260 K/W

Table 8. Characteristics

Tamb =25

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Per diode

VFforward voltage [1]

IF=1mA - - 410 mV

IF=10mA - - 750 mV

IF=15mA - - 1 V

IRreverse current VR=50V - - 100 nA

VR=70V - - 10 μA

Cddiode capacitance VR=0V; f=1MHz - - 2 pF

Product data sheet Rev. 09 — 13 January 2010 7 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

(1) Tamb = 125 °C

(2) Tamb =85°C

(3) Tamb =25°C

(4) Tamb =−40 °C

(1) Tamb = 125 °C

(2) Tamb =85°C

(3) Tamb =25°C

Fig 1. Forward current as a function of forward

voltage; typical values Fig 2. Reverse current as a functio n of reverse

voltage; typical values

f=10kHz T

amb =25°C; f = 1 MHz

Fig 3. Differential forward resistance as a function of

forward current; typical values Fig 4. Dio de ca pacitance as a function of reverse

voltage; typical values

0 0.2 0.4 0.6 0.8 1

(mA)

VF (V)

mra803

(1) (4)(2) (3)

102

10−1

10−2

mra805

102

0 20406080

VR (V)

(μA)

(1)

(3)

(2)

10−1

10−2

10−3

110

rdif

(Ω)

IF (mA)

mra802

10−1102

102

103

0.5

1.5

0 20406080

mra804

(pF)

VR (V)

Product data sheet Rev. 09 — 13 January 2010 8 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

8. Package outline

Fig 5. Pac kage outline SOD323 (SC-76) Fig 6. Package outline SOD523 (SC-7 9)

Fig 7. Pac kage outline SOT23 (TO-236AB) Fig 8. Package outline SOD123F

Fig 9. Pac kage outline SOD882 Fig 10. Package outline SOT323 (SC-70)

03-12-17Dimensions in mm

0.25

0.10

0.45

0.15

2.7

2.3

1.8

1.6

0.40

0.25

1.1

0.8

1.35

1.15

02-12-13Dimensions in mm

1.65

1.55

1.25

1.15

0.17

0.11

0.34

0.26

0.65

0.58

0.85

0.75

04-11-04Dimensions in mm

0.45

0.15

1.9

1.1

0.9

3.0

2.8

2.5

2.1

1.4

1.2

0.48

0.38

0.15

0.09

04-11-29Dimensions in mm

1.2

1.0

0.25

0.10

3.6

3.4

2.7

2.5

0.55

0.35

0.70

0.55

1.7

1.5

03-04-17Dimensions in mm

0.55

0.47

0.65

0.62

0.55

0.50

0.46

cathode marking on top side

1.02

0.95

0.30

0.22

0.30

0.22

04-11-04Dimensions in mm

0.45

0.15

1.1

0.8

2.2

1.8

2.2

2.0

1.35

1.15

1.3

0.4

0.3

0.25

0.10

Product data sheet Rev. 09 — 13 January 2010 9 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

Fig 11. Package outline SOT143B Fig 12. Packag e outline SOT363 (SC-88)

Fig 13. Package outline SOT666

04-11-16Dimensions in mm

3.0

2.8 1.1

0.9

2.5

2.1

1.4

1.2

1.7

1.9

0.48

0.38

0.15

0.09

0.45

0.15

0.88

0.78

06-03-16Dimensions in mm

0.25

0.10

0.3

0.2

pin 1

index

1.3

0.65

2.2

2.0

1.35

1.15

2.2

1.8

1.1

0.8

0.45

0.15

132

465

Dimensions in mm 04-11-08

1.7

1.5

1.7

1.5

1.3

1.1

0.18

0.08

0.27

0.17

0.5

pin 1 index

123

456

0.6

0.5

0.3

0.1

Product data sheet Rev. 09 — 13 January 2010 10 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

9. Packing information

[1] For further information and the availability of packing methods, see Section 13.

[2] T1: normal taping

[3] T2: reverse taping

Table 9. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number Package Description Packing quan tity

3000 4000 8000 10000

1PS76SB70 SOD323 4 mm pitch, 8 mm tape and reel -115 - - -135

1PS79SB70 SOD523 2 mm pitch, 8 mm tape and reel - - -315 -

4 mm pitch, 8 mm tape and reel -115 - - -135

BAS70 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235

BAS70H SOD123F 4 mm pitch, 8 mm tape and reel -115 - - -135

BAS70L SOD882 2 mm pitch, 8 mm tape and reel - - - -315

BAS70W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135

BAS70-04 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235

BAS70-04W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135

BAS70-05 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235

BAS70-05W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135

BAS70-06 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235

BAS70-06W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135

BAS70-07 SOT143B 4 mm pitch, 8 mm tape and reel -215 - - -235

BAS70-07S SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135

4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165

BAS70-07V SOT666 2 mm pitch, 8 mm tape and reel - - -315 -

4 mm pitch, 8 mm tape and reel - -115 - -

BAS70VV SOT666 2 mm pitch, 8 mm tape and reel - - -315 -

4 mm pitch, 8 mm tape and reel - -115 - -

BAS70XY SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135

4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165

Product data sheet Rev. 09 — 13 January 2010 11 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

10. Soldering

Dimensions in mm

Fig 14. Reflow soldering footprint SOD323 (SC-76)

Dimensions in mm

Fig 15. Wave soldering footprint SOD323 (SC-76)

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 16. Reflow soldering footprint SOD523 (SC-79)

msa433

1.65

0.50

(2×)

2.10

1.60

2.80

0.60

3.05

0.500.95

solder lands

solder resist

occupied area

solder paste

msa415

1.40

4.40

5.00

1.202.75

preferred transport direction during soldering

solder lands

solder resist

occupied area

mgs34

1.80

1.90

0.30

0.40

0.50

1.20 0.60

2.15

solder lands

solder resist

occupied area

solder paste

Product data sheet Rev. 09 — 13 January 2010 12 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

Dimensions in mm

Fig 17. Reflow soldering footprint SOT23 (TO-236AB)

Dimensions in mm

Fig 18. Wave soldering footprint SOT23 (TO-236AB)

MSA439

1.00

0.60

(3x)

1.30

2.50

3.00

0.85

2.70

2.90

0.50 (3x)

0.60 (3x)

3.30

0.85

solder lands

solder resist

occupied area

solder paste

MSA427

4.00

4.60

2.80

4.50

1.20

3.40

1.20 (2x)

preferred transport direction during soldering

solder lands

solder resist

occupied area

Product data sheet Rev. 09 — 13 January 2010 13 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 19. Reflow soldering footprint SOD123F

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 20. Reflow soldering footprint SOD882

1.6

2.9

4.4

1.1 1.22.1

1.1

(2×)

solder lands

solder resist

occupied area

solder paste

mbl87

1.30

0.30R = 0.05 (8×) R = 0.05 (8×)

0.60

(2×)

0.70

(2×)

0.80

(2×)

0.90

0.30

(2×)

0.40

(2×)

0.50

(2×)

solder lands

solder resist

occupied area

solder paste

Product data sheet Rev. 09 — 13 January 2010 14 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

Dimensions in mm

Fig 21. Reflow soldering footprint SOT323 (SC-70)

Dimensions in mm

Fig 22. Wave soldering footprint SOT323 (SC-70)

msa429

0.852.35

0.55

(3×)

1.3250.75

2.40

2.65

1.30

0.60

(3×)

0.50

(3×)1.90

solder lands

solder resist

occupied area

solder paste

Dimensions in mm

msa41

4.00

4.60

2.103.65

1.15

2.70

10.90

(2×)

preferred transport direction during soldering

solder lands

solder resist

occupied area

Dimensions in mm

Product data sheet Rev. 09 — 13 January 2010 15 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

Dimensions in mm

Fig 23. Reflow soldering footprint SOT143B

Dimensions in mm

Fig 24. Wave soldering footprint SOT143B

msa441

0.60

(4x)

1.30

2.50

3.00

2.70

0.50 (3x)

0.60 (3x)

3.25

0.90

1.00

solder lands

solder resist

occupied area

solder paste

msa422

4.00 4.60

1.20 (3×)

4.45

1.15

3.40

1.00 preferred transport direction during soldering

solder lands

solder resist

occupied area

Dimensions in mm

Product data sheet Rev. 09 — 13 January 2010 16 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

Dimensions in mm

Fig 25. Reflow soldering footprint SOT363 (SC-88)

Fig 26. Wave soldering footprint SOT363 (SC-88)

MSA432

solder lands

solder resist

occupied area

solder paste

1.20

2.40

0.50

(4×)

0.40

(2×)0.90 2.10

0.50

(4×)

0.60

(2×)

2.35

2.65

sot363_

solder lands

solder resist

occupied area

preferred transport

direction during soldering

5.3

1.3 1.3

1.5

0.3

1.5

4.5

2.45

2.5

Dimensions in mm

Product data sheet Rev. 09 — 13 January 2010 17 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

Reflow soldering is the only recommended soldering method.

Fig 27. Reflow soldering footprint SOT666

solder lands

placement area

occupied area

solder paste

sot666_

2.75

2.45

2.1

1.6

0.4

(6×)

0.55

(2×)

0.25

(2×)

0.6

(2×)

0.65

(2×)

0.3

(2×)

0.325

(4×)

0.45

(4×)

0.5

(4×)

0.375

(4×)

1.72

1.7

1.075

0.538

Dimensions in mm

Product data sheet Rev. 09 — 13 January 2010 18 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

11. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAS70_1PS7XSB70_SER_9 20100113 Product data sheet - BAS70_1PS7XSB70_SER_8

Modifications: •This data sheet was changed to reflec t the new company name NXP Semiconductors,

including new legal definitions and disclaimers. No changes were made to the technical

content.

BAS70_1PS7XSB70_SER_8 20060504 Product data sheet - BAS70_1PS7XSB70_SER_7

BAS70_1PS7XSB70_SER_7 20050718 Product data sheet - 1PS76SB70_2

1PS79SB70_1 BAS7 0H_1

BAS70L_1 BAS70-07V_1

BAS70VV_1 BAS70W_3

BAS70-07S_4

BAS70_SERIES_6

1PS76SB70_2 20040126 Product specification - 1PS76SB70_1

1PS79SB70_1 19980716 Product specification - -

BAS70H_1 20050425 Product data sheet - -

BAS70L_1 20030520 Product specification - -

BAS70-07V_1 20020117 Product specification - -

BAS70VV_1 20040910 Product data sheet - -

BAS70W_3 19990326 Product specification - BAS70W_2

BAS70-07S_4 20030411 Product specification - BAS70_07S_3

BAS70_SERIES_6 20011011 Product specification - BAS70_5

Product data sheet Rev. 09 — 13 January 2010 19 of 20

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

12.3 Disclaimers

General — In formation in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give an y represent ations or

warranties, expressed or impli ed, as to the accuracy or completeness of such

information and shall have no liability for th e co nsequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descripti ons, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ra tings System of IEC 60134) may cause pe rmanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other co nditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may af fect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/profile/terms, including those pertaining to warr anty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conflict between inf ormation in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property right s.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

12.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.

Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors BAS70 series; 1PS7xSB70 series

General-p u rpo s e Sc ho t tk y di od e s

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 13 January 2010

Document identifier: BAS70_1PS7XSB70_SER_9

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

14. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 4

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 6

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8

9 Packing information . . . . . . . . . . . . . . . . . . . . 10

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 19

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19

13 Contact information. . . . . . . . . . . . . . . . . . . . . 19

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

NXP:

1PS76SB70,135 1PS76SB70,115 1PS79SB70,115 BAS70-05,235 BAS70,235 BAS70-04,215 BAS70-04W,115

BAS70-05,215 BAS70-05W,135 BAS70-05W,115 BAS70-06,215 BAS70-06W,115 BAS70-07S,115 BAS70-07,215

BAS70-07V,115 BAS70H,115 BAS70L,315 BAS70,215 BAS70VV,115 BAS70W,115 BAS70XY,115

1PS79SB70,315 BAS70-04,235