ZL60301/MJD - Microsemi Corp.

Zarlink Semiconductor Inc.

Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.

Features

• Complies with POP4 MSA specification

• 4 Transmit channels and 4 Receive channels

• Data rate up to 2.7 Gbps per channel

• 850 nm VCSEL array

• Data I/O is CML compatible with DC blocking

capacitors

• Link reach 300 m with 50/125 µm 500 MHz.km

fiber at 2.5 Gbps

• Channel BER better than 10-12

• Industry standard MPO/MTP ribbon fiber

connector interface

• Pluggable MegArray® ball grid array connector

• Optionally available with EMI shield and external

heat sink

• Laser class 1M IEC 60825-1:2001 compliant

• Low power consumption, max 1 W

• Power supply 3.3 V

February 2006

Ordering Information

ZL60301/MJD Parallel Fiber Transceiver

Heat sink and EMI shield options

are available upon request

0°C to +80°C

ZL60301

Parallel Fiber Optic Transceiver

(4 + 4) x 2.7 Gbps

Data Sheet

Figure 1 - Transceiver Block Diagram

PIN Array

Tx V

Trans-

Impedance

and

Limiting

Amplifier

DOUT0+

DOUT0-

DOUT3+

DOUT3-

VCSEL

Array

DIN0+

DIN0-

DIN3+

DIN3-

SQ_ENRx_EN Rx_SD V

CCA

Rx V

RxV

CCB

VCSEL

Driver

RESETTx_EN Tx_DIS

VCSEL Driver Controller

FAULT

RX0

RX1

RX2

RX3

TX3

TX2

TX1

TX0

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

Applications

• High-speed interconnects within and between switches, routers and transport equipment

• Proprietary backplanes

• Interconnects rack-to-rack, shelf-to-shelf, board-to-board, board-to-optical backplane

Description

The ZL60301 is a very high-speed transceiver for parallel fiber applications. This transceiver performs E/O and O/E

conversions for data transmission over multimode fiber ribbon.

The transmit section converts parallel electrical input signals via a laser driver and a VCSEL array into parallel

optical output signals at a wavelength of 850 nm.

The receive section converts parallel optical input signals via a PIN photodiode array and a transimpedance and

limiting amplifier, into electrical output signals.

The module is fitted with a pluggable industry-standard MegArray® BGA connector. This provides ease of assembly

on the host board and enables provisioning of bandwidth on demand.

ZL60301 Data Sheet

Table of Contents

Zarlink Semiconductor Inc.

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Transmitter Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Transmitter Control and Status Signal Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Transmitter Control and Status Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Receiver Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Receiver Control and Status Signal Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Receiver Control and Status Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Transceiver Module Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Transceiver Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Regulatory Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Eye safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Electrostatic discharge immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Electromagnetic Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Emission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Handling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Cleaning the Optical Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

ESD handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Link Reach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Link Model Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Electrical Interface - Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

Absolute Maximum Ratings

Not necessarily applied together. Exceeding these values may cause permanent damage. Functional operation

under these conditions is not implied.

Recommended Operating Conditions

Figure 2 - Recommended Power Supply Filter

Parameter Symbol Min. Max. Unit

Supply voltage VCC -0.3 4.0 V

Differential input voltage amplitude1

1. Differential input voltage amplitude is defined as ∆V = DIN+ − DIN-.

∆V1.2V

Voltage on any pin VPIN -0.3 VCC + 0.3 V

Relative humidity (non-condensing) MOS 595%

Storage temperature TSTG -40 100 °C

ESD resistance VESD ±1 kV

Parameter Symbol Min. Max. Unit

Power supply voltage VCC 3.135 3.465 V

Operating case temperature TCASE 080°C

Signalling rate (per channel)1

1. Data patterns are to have maximum run lengths and DC balance shifts no worse than that of a Pseudo Random Bit Sequence of

length 223-1 (PRBS-23). Information on lower bit rates and longer run lengths are available on request.

fD1.0 2.7 Gbps

Link distance2

2. For maximum distance, see Table 4.

LD 2 m

Data I/O DC blocking capacitors3

3. For AC-coupling, DC blocking capacitors external to the module with a minimum value of 100 nF is recommended.

CBLK 100 nF

Power supply noise4

4. Power supply noise is defined at the supply side of the recommended filter for all VCC supplies over the frequency range of 500 Hz

to 2700 MHz with the recommended power supply filter in place.

VNPS 200 mVp-p

Host

Vcc

R1 100

Ω

L1 1

R2 1.0 k

Ω

0.1

L2 6.8 nH

Module

Vcc

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

Transmitter Specifications

All parameters below require operating conditions according to “Recommended Operating Conditions” on page 4.

Parameter Symbol Min. Max. Unit

Optical Parameters

Launch power (50/125 µm MMF)1

1. The output optical power is compliant with IEC 60825-1 Amendment 2, Class 1M Accessible Emission Limits.

POUT -8 -2 dBm

Extinguished output power POFF -30 dBm

Extinction ratio2

2. The extinction ratio is measured at 622 Mbps.

ER 6 dB

Optical modulation amplitude3

3. Informative. Corresponds to POUT = -8 dBm and ER = 6 dBm.

OMA 0.30 mW

Center wavelength λC830 860 nm

Spectral width4

4. Spectral width is measured as defined in EIA/TIA-455-127 Spectral Characterization of Multimode Laser Diodes.

∆λ 0.85 nmrms

Relative intensity noise OMA5

5. Corresponds to a Relative Intensity Noise (RIN) of -120 dB/Hz.

RIN12OMA -116 dB/Hz

Optical output rise time (20 - 80%) tRO 150 ps

Optical output fall time (20 - 80%) tFO 150 ps

Total jitter contributed (peak to peak)6

6. Total jitter equals TP1 to TP2 as defined in IEEE 802.3 clauses 38.2 and 38.6 (Gigabit Ethernet).

TJ 120 ps

Deterministic jitter contributed (peak to peak) DJ 50 ps

Channel to channel skew7

7. Channel skew is defined for the condition of equal amplitude, zero ps skew signals applied to the transmitter inputs.

tSK 100 ps

Electrical Parameters

Power dissipation PD500 mW

Supply current ICC 150 mA

Differential input voltage amplitude (peak to peak)8

8. Differential input voltage is defined as the peak to peak value of the differential voltage between DIN+ and DIN-. Data inputs are CML

compatible.

∆VIN 200 800 mVp-p

Differential input impedance9

9. Differential input impedance is measured between DIN+ and DIN-.

ZIN 80 120 Ω

Electrical input rise time (20 - 80%) tRE 160 ps

Electrical input fall time (20 - 80%) tFE 160 ps

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

Classified in accordance with IEC 60825-1/A2:2001, IEC 60825-2: 2000

Class 1M Laser Product

Emitted wavelength: 840 nm

Figure 3 - Differential CML Input Equivalent Circuit

50Ω

13k

Ω

11k

Ω

DIN+

DIN-

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

Transmitter Control and Status Signal Requirements

The following table shows the timing relationships of the status and control signals of the transmit section.

Parameter Symbol Min. Typ. Max. Unit

Control input voltage high1

1. Applies to control signals RESET, Tx_DIS and Tx_EN.

VIH 2.1 V

Control input voltage low VIL 0.62 V

Control pull-up resistor2

2. Applies to control signals RESET and Tx_EN. Internal pull-up resistor.

RPU 10 kΩ

Control pull-down resistor3

3. Applies to control signal Tx_DIS. Internal pull-down resistor.

RPD1 10 kΩ

Status output voltage low4, 5

4. Applies to status signal FAULT. Internal pull-down to VEE.

5. With status output sink current max. 2 mA.

VOL 0.4 V

Status pull-down resistor4RPD2 10 kΩ

FAULT assert time TFA 100 µs

FAULT lasers off TFD 100 µs

RESET duration TTDD 10 µs

RESET assert time TOFF 510 µs

RESET de-assert time TON 100 ms

Tx_EN assert time TTEN 1ms

Tx_EN de-assert time TTD 510 µs

Tx_DIS assert time TTD 510 µs

Tx_DIS de-assert time TTEN 1ms

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

Transmitter Control and Status Timing Diagrams

The following figures show the timing relationships of the status and control signals of the transmit section.

Figure 4 - Transmitter Power-up Sequence

Figure 5 - Transmitter Fault Signal Timing Diagram

RESET: floating or high

Transmitter Not Ready Normal operation

TEN

Tx Output [0:3]

Data [0:3]

No Fault Fault

FAULT T

Tx Output [0:3]

Data [0:3]

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

Figure 6 - Transmitter Reset Signal Timing Diagram

Figure 7 - Transmitter Enable and Disable Timing Diagram

Tx_DIS High Tx_DIS Low

Tx_EN High Transmitter disabled Normal operation

Tx_EN Low Transmitter disabled Transmitter disabled

Table 1 - TruthTable for Transmitter Operation (Pre-condition: RESET floating or HIGH)

Transmitter Not Ready Normal operation

FAULT

Tx Output [0:3]

Data [0:3]

RESET

TDD

Tx_EN

Data [0:3]

Lasers

off

Normal operation Tx Off

Tx_DIS

Lasers

off

Data [0:3]

Normal operation Tx Off

Data [0:3]

Tx_EN

TEN

Normal operationTransmitter Not Ready

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

Receiver Specifications

All parameters below require operating conditions according to “Recommended Operating Conditions” on page 4

and a termination load of 100 Ω differential at the electrical output.

Parameter Symbol Min. Max. Unit

Optical Parameters

Input optical power1

1. Receive power for a channel is measured for a BER of 10-12 and worst case extinction ratio. PIN (Min) is measured using a fast

rise/fall time source with low RIN and adjacent channel(s) operating with incident power of 6 dB above PIN (Min).

PIN -16 -2 dBm

Center wavelength λC830 860 nm

Return loss2

2. Return loss is measured as defined in TIA/EIA-455-107A Determination of Component Reflectance or Link/System Return Loss Us-

ing a Loss Test Set.

RL 12 dB

Stressed receiver sensitivity3

3. The stressed receiver sensitivity is measured using PRBS 223-1 pattern, 2.6 dB inter-symbol interference, ISI (Min), 30 ps duty cycle

dependent deterministic jitter, DCD DJ (Min), and 6 dB extinction ratio, ER (Min) (ER penalty = 2.2 dB). All channels not under test

are receiving signals with an average input power of 6 dB above PIN (Min).

PSS -11.7 dBm

Channel to channel skew4

4. Channel skew is defined for the condition of equal amplitude, zero ps skew signals applied to the receiver inputs.

tSK 100 ps

Signal detect assert PSA -17 dBm

Signal detect de-assert PSD -31 dBm

Electrical Parameters

Power dissipation PD500 mW

Supply current ICC 150 mA

Differential output voltage amplitude (peak to peak)5

5. Differential output voltage is defined as the peak to peak value of the differential voltage between DOUT+ and DOUT- and measured

with a 100 Ω differential load connected between DOUT+ and DOUT-. Data outputs are CML compatible.

∆VOUT 500 800 mVp-p

Output differential load impedance6

6. See Figure 13.

ZL80 120 Ω

Stressed receiver eye opening7

7. The stressed receiver eye opening represents the eye at TP4 as defined in IEEE 802.3 clauses 38.2 and 38.6 (Gigabit Ethernet).

The stressed receiver eye opening is measured using PRBS 223-1 pattern, 2.6 dB ISI min, 30 ps DCD DJ min, 6 dB ER min and an

average input power of -11.2 dBm (0.5 dB above minimum stressed receiver sensitivity as defined in IEEE 802.3 clause 38.6). All

channels not under test are receiving signals with an average input power of 6 dB above PIN (Min).

PSE 0.3 UI

Electrical output rise time (20 - 80%) tRE 160 ps

Electrical output fall time (20 - 80%) tFE 160 ps

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

Receiver Control and Status Signal Requirements

The following table shows the timing relationships of the status and control signals of the receive section.

Receiver Control and Status Timing Diagrams

The following figures show the timing relationships of the status and control signals of the receive section.

Figure 8 - Receiver Enable Signal Timing Diagram

Parameter Symbol Min. Typ. Max. Unit

Control input voltage high1

1. Applies to control signals Rx_EN, SQ_EN.

VIH 2.0 V

Control input voltage low1VIL 0.9 V

Control input pull-up current1IIN10 100 µA

Status output voltage low2, 3

2. Applies to status signal Rx_SD. Internal pull-up to VCC.

3. With status output sink current max 2 mA.

VOL 0.4 V

Status output pull-up resistor2RPU 3.25 kΩ

Receiver signal detect assert time TSD 50 200 µs

Receiver signal detect de-assert time TLOS 50 200 µs

Receiver enable assert time TRXEN 33 ms

Receiver enable de-assert time TRXD 5µs

Normal Operation Rx Off

Rx_EN

RXD

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

Figure 9 - Receiver Signal Detect Timing Diagram

Transceiver Module Signals

The pluggable parallel optical transceiver uses a 100 position FCI MegArray electrical connector

(FCI PN: 84513-101), and an industry standard MTP(MPO) optical receptacle compliant with

IEC 61754-7.

KJHGFEDCBA

1DOUT00- VEE Rx DOUT03+ VEE Rx VEE Rx VEE Tx VEE Tx DIN03- VEE Tx DIN00+

2DOUT00+ VEE Rx DOUT03- VEE Rx VEE Rx VEE Tx VEE Tx DIN03+ VEE Tx DIN00-

3VEE Rx VEE Rx VEE Rx VEE Rx VEE Rx VEE Tx VEE Tx VEE Tx VEE Tx VEE Tx

4DOUT01+ VEE Rx DOUT02- NIC NIC NIC NIC DIN02+ VEE Tx DIN01-

5DOUT01- VEE Rx DOUT02+ NIC NIC NIC NIC DIN02- VEE Tx DIN01+

6VEE Rx VEE Rx VEE Rx NIC NIC NIC NIC VEE Tx VEE Tx VEE Tx

7VCCB Rx VCCB Rx VCCB Rx NIC NIC NIC NIC VCC Tx VCC Tx VCC Tx

8NIC DNC DNC DNC RX_EN TX_DIS TX_EN DNC DNC DNC

9NIC DNC DNC SD SQ_EN RESET FAULT DNC DNC DNC

10 VCCA Rx VCCA Rx VEE Rx NIC NIC NIC NIC VEE Tx VCC Tx VCC Tx

Table 2 - Transceiver Pinout Assignments (Top view, toward MPO/MTP connector end)

(10x10 array, 1.27 mm pitch)

Module front view - MTP key up

Tx0 Tx1 Tx2 Tx3 −−−−Rx3 Rx2 Rx1 Rx0

Host printed circuit board

Table 3 - Transceiver Optical Channel Assignment

Signal No Signal

Rx_SD

LOS

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

Transceiver Pin Description

The transceiver module case is electrically isolated from Transmitter signal common and Receiver signal common.

Connection through mounting screw holes or frontplate whichever is applicable. Make the appropriate electrical

connection for EMI shield integrity.

Signal Name Type Description Comments

DIN[0:3] +/- Data input Transmitter data in, channel 0 to 3 Internal differential

termination at 100 Ω.

VCC Tx Transmitter power supply rail

VEE Tx Transmitter signal common. All transmitter

voltages are referenced to this potential unless

otherwise stated.

Directly connect these pads

to the PC board transmitter

signal ground plane.

TX_EN Control

input

Transmitter enable.

HIGH: normal operation

LOW: disable transmitter

Active high, internal pull-up.

See Table 1.

TX_DIS Control

input

Transmitter disable.

HIGH: disable transmitter

LOW: normal operation

Active high, internal pull-

down. See Table 1.

FAULT Status

output

Transmitter fault.

HIGH: normal operation

LOW: laser fault detected on at least one channel

When active, all channels

are disabled. Clear by reset

signal. Internal pull-up.

RESET Control

input

Transmitter reset.

HIGH: normal operation

LOW:reset to clear fault signal

Internal pull-up.

DOUT[0:3] +/- Data

output

Receiver data out, channel 0 to 3.

VCCA Rx PIN preamplifier power supply rail.

VCCB Rx Receiver quantizer power supply rail.

VEE Rx Receiver signal common. All receiver voltages

are referenced to this potential unless otherwise

stated.

Directly connect these pads

to the PC board receiver

signal ground plane.

RX_EN Control

input

Receiver enable.

HIGH: normal operation

LOW: disable receiver

Internal pull-up.

RX_SD Status

output

Receiver signal detect.

HIGH: valid optical input on all channels

LOW: loss of signal on at least one channel

Internal pull-up.

SQ_EN Control

input

Squelch enable.

HIGH: squelch function enabled. Data OUT is

squelched on any channels that have loss of

signal

LOW: squelch function disabled

Internal pull-up.

DNC Do not connect to any potential, including ground.

NIC No internal connection.

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

VCCA and VCCB Rx can be connected to the same power supply. However, to insure maximum receiver sensitivity

and minimize the impact of noise from the power supply, it is recommended to keep the power supplies separate

and to use the recommended power supply filtering network on VCCA Rx, see Figure 2.

Thermal Characteristics

There are three options for heat sinks depending on the cooling needs. They are:

1. Direct application without any attached external heat sink

2. Use a generic external heat sink specified by Zarlink

3. Use a customer designed external heat sink

In Figure 10 and Figure 11, the temperature rise and thermal resistance as a function of air velocity (free air velocity

at the top of the module) is shown for option 1 and 2. The thermal resistance is defined as the temperature

difference between the case temperature and ambient flowing air divided by the total heat dissipation of the

module.

Improved thermal properties can be achieved by using a larger heat sink especially if more height is available

(option 3). For this option, a more detailed discussion with Zarlink is recommended regarding heat sink design

attachment materials.

Figure 10 - Temperature Difference Between Ambient Flowing Air and Case at a Heat Dissipation

of 1.0 W

Tem perature rise at 1.0W

(Free stream air velocity)

0123 45

Air velocity (m /s)

Temperature rise (K)

Option ZL60301/MLD

Option ZL60301/MJD

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

Figure 11 - Thermal Resistance, as a Function of Air Velocity (the airflow is along the shortest

side of the module)

For any other orientation, the thermal resistance is 75-100% of the values shown above.

Therm al resis tance to air

(Free stream air velocity)

012345

Air velocity (m /s)

Thermal resistance (K/W)

Option ZL60301/MLD

Option ZL60301/MJD

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

Regulatory Compliance

Eye safety

The maximum optical output power is specified to comply with Class 1M in accordance with IEC 60825−1:2001. In

addition the transmitter complies with FDA performance standards for laser products except for deviations pursuant

to Laser Notice No.50, dated July 26, 2001. No maintenance or service of the product may be performed.

Electrostatic discharge

The module is classified as Class 1 (> 1000 Volts) according to MIL−STD−883, test method 3015.7, with regards to

the electrical pads.

Electrostatic discharge immunity

The part withstand a 15 kV (air discharge) and 8 kV (contact discharge) either indirect or directly to receptacle;

tested according to IEC 61000−4−2, while in operation without addition of bit errors.

Electromagnetic Interference

Emission

The electromagnetic emission is tested in front of the module (module fitted with EMI shield), with the module

mounted in a frontplate cutout. The part is tested with FCC Part 15, 30 − 1000 MHz and 1 GHz to 5th harmonic of

the highest fundamental frequency (6.75 GHz), and is specified to be Class B with > 6 dB margin.

Immunity

The electromagnetic immunity is tested without a front panel or enclosure. The module specification is maintained

with an applied field of 10 V/m for frequencies between 10 kHz and 10 GHz, according to IEC 61000−4−3 and GR−

1089−CORE.

Handling instructions

Cleaning the Optical Interface

A protective connector plug is supplied with each module. This plug should remain in place whenever a fiber cable

is not inserted. This will keep the optical port free from dust or other contaminants, which may potentially degrade

the optical signal. Before reattaching the connector plug to the module, visually inspect the plug and remove any

contamination. If the module’s optical port becomes contaminated, it can be cleaned with high-pressure nitrogen

(the use of fluids, or physical contact, is not advised due to potential for damage).

Before a fiber cable connector is attached to the module, it is recommended to clean the fiber cable connector

using an optical connector cleaner, or according to the cable manufacturer's instructions. It is also recommended to

clean the optical port of the module with high-pressure nitrogen.

Connectors

For optimum performance, it is recommended that the number of insertions is limited to 50 for the electrical

MegArray connector and 200 for the optical MPO/MTP connector.

ESD handling

When handling the modules, precautions for ESD sensitive devices should be taken. These include use of ESD

protected work areas with wrist straps, controlled work-benches, floors etc.

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

Link Reach

The following table lists the minimum reach distance of the pluggable parallel fiber optic transceiver for different

multi-mode fiber (MMF) types and bandwidths assuming worst case parameters. Each case allows for a maximum

of 2 dB per channel connection loss for patch cables and other connectors.

Link Model Parameters

The link reaches above have been calculated using the following link model parameters and Gigabit Ethernet link

model version 2.3.5 (filename: 5pmd047.xls).

Fiber Type

[core / cladding µm]

Modal Bandwidth

@ 850 nm

[MHz*km]

Reach Distance

@ 1 Gbps

[m]

Reach Distance

@ 2.5 Gbps

[m]

Reach Distance

@ 2.7 Gbps

[m]

62.5/125 MMF 200 350 135 115

62.5/125 or 50/125 MMF 400 650 260 220

50/125 MMF 500 750 300 270

Table 4 - Link Reach for Different Fiber Types and Data Rates

Parameter Symbol Value Unit

Mode partition noise k-factor k 0.3

Modal noise MN 0.3 dB

Dispersion slope parameter SO0.11 ps/nm2*km

Wavelength of zero dispersion UO1320 nm

Attenuation coefficient at 850 nm αdB 3.5 dB/km

Conversion factor C1 480 ns.MHz

Q-factor [BER 10-12] Q 7.04

TP4 eye opening 0.3 UI

DCD allocation at TP3 DCD DJ 0.08 UI

RMS baseline wander S.D. σBLW 0.025

RIN coefficient kRIN 0.70

Conversion factor c_rx 329 ns.MHz

ZL60301 Data Sheet

Zarlink Semiconductor Inc.

Electrical Interface - Application Examples

Figure 12 - Recommended Differential CML Input Interface

Figure 13 - Recommended Differential CML Output Interface

OUT

=100

Ω

Differential

Recommended CML output

=100

Ω

Differential Z

=100

Ω

Differential

Transmitter CML input

100nF

Host PCB

Receiver CML output

=100

Ω

Differential Z

TERM

=100

Ω

Differential

Recommended CML input

100nF

Host PCB

FRONT VIEW ( 2 : 1 )

ISSUE

ACN

DATE

APPRD.

Previous package codes

Title

Drawing type

Package code

Projection Method

JS004296

27,64

36,87

4,3

7,55

3,26

31,75

7,48

18,16

1,145

13,72

17,5

A10 A1 0,58n`0,05 jn0,05 AB-C

n3,63

jn0,15mA

2-56 UNC-2B

3,50 Deep MIN

jn0,15mAB-C

14,4

jn0,15mAB-C

NOTES:-

1. All dimensions in mm.

2. Tolerancing per ASME Y14.5M-1994.

JS004296R1A

12-JUN-03

TD/BE MD/MA

24-JAN-04

JS004296 rev.2

JS004296 rev.3

24-JAN-05

MD/MA

Package Drawing - Module Layout

12,23

12,5

2-56 UNC-2B

n1,3

n2,5

0,98

0,76

30,23

ISSUE

ACN

DATE

APPRD.

Previous package codes

Title

Drawing type

Package code

Projection Method

JS004296

A10

K10

14,4

17,5

1,145

13,72

5,15

0,2518,16

30,23

31,75

35,31

0,75

jn0,1 AB-C

jn0,05 AB-C

jn0,1 A

jn0,1 AB-C

(n2,69 `0,12 Hole)

n1,70 `0,12 Holes

n3,00 MIN pads, Keep Out

n0,58 `0,05 Pads

n2,69 `0,12 Hole

n4,30 MIN pads (3x), Keep Out

NOTES:-

1. All dimensions in mm.

2. Tolerancing per ASME Y14.5M-1994.

Max product outline

Component keep-out area.

JS004296R1A

12-JUN-03

TD/BE MD/MA

24-JAN-05

JS004296 rev.2

Package Drawing,

Host Circuit Board Footprint Layout

JS004296 rev.3

14-FEB-05

MD/MA

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