Thin Film BGA Delay Lines US Patent 5,365,203 6,127,906 BL1L Series 1.0 Description These delay lines offer the same excellent frequency performance as the GL delay lines but come in a solder bump configuration that takes up less board space than the GL series. As with all of TFT's delay lines, these feature stripline conductors on ceramic for high speed, high stability performance. 2.0 Mechanical -Please refer to page 37 for land pattern dimension mm 6.40 0.10 1.27 0.07 3.81 1.27 0.07 0.80 max 1.27 1.27 schematic 1.27 1 Time delay 0.1 - 0.8 ns 0.9 - 1.7 ns 1.8 - 2.6 ns 2.7 - 3.5 ns 5.10 0.10 1.27 0.711 (28 mil) Dia. 10/90 Sn/Pb sphere Height (H) Code 1.05 max P 1.65 max Q 2.25 max R 2.85 max S Time delay 0.10 to 0.20ns 0.30 to 0.50ns 0.60 to 0.80ns 3.0 Electrical Type Time delay Time delay increment Rated current BL1L (P, Q, R, S) 0.1- 3.5 ns 0.1 ns step to 3.5 ns 100 mA >100 Mohm 50V 0 to +150 ppm/C Insulation resistance Temp. coefficient of Td Time delay tolerance 0.05 ns 50 5 ohm Characteristic impedance BL1L (W, X, Y) 0.10 - 0.80 ns 0.1 ns step to 0.80 ns Rise/fall time 200 ps/ns DC resistance <1.0 ohm/ns max Rated voltage 100 VDC (1 min) Operating temperature -40 to + 85 Storage temperature -55 to +125C 4.0 Part Number BL Product designator Circuit/element qualifier 1L Impedance (5 = 50 ohm) 5 R Height code Solder bump T Time delay (250 = 2.5ns) 250 S Serial code T1 Packaging (T = Tape, 1 = 100) Manufacturer(s) of the products described on this page are indicated by their respective logos. 6 schematic 2 Height (H) Code 1.80 max W 2.40 max X 3.00 max Y