6
Thin Film BGA Delay Lines US Patent 5,365,203 6,127,906
BL1L Series
1.0 Description
2.0 Mechanical
3.0 Electrical
4.0 Part Number
These delay lines offer the same excellent frequency performance as the GL delay lines but come in a solder
bump configuration that takes up less board space than the GL series. As with all of TFT’s delay lines, these
feature stripline conductors on ceramic for high speed, high stability performance.
dimension mm
schematic
Time delay Height (H) Code
0.1 - 0.8 ns 1.05 max P
0.9 - 1.7 ns 1.65 max Q
1.8 - 2.6 ns 2.25 max R
2.7 - 3.5 ns 2.85 max S
Manufacturer(s) of the products described on this page are indicated by their respective logos.
-Please refer to page 37 for land pattern
BL
1L
5
R
T
250
S
T1
Serial code
Time delay (250 = 2.5ns)
Solder bump
Height code
Impedance (5 = 50 ohm)
Product designator
Circuit/element qualifier
Packaging (T = Tape, 1 = 100)
schematic
6.40
±0.10
1.27
±0.07 1.27
±0.07
3.81
1 2
0.711 (28 mil) Dia.
10/90 Sn/Pb sphere Time delay Height (H) Code
0.10 to 0.20ns 1.80 max W
0.30 to 0.50ns 2.40 max X
0.60 to 0.80ns 3.00 max Y
0.80
max
5.10
±0.10
1.27
1.27
1.27
1.27
Type BL1L (P, Q, R, S) BL1L (W, X, Y)
Time delay 0.1- 3.5 ns 0.10 - 0.80 ns
Time delay increment 0.1 ns step to 3.5 ns 0.1 ns step to 0.80 ns
Rated current 100 mA Rise/fall time 200 ps/ns
Insulation resistance >100 Mohm 50V DC resistance <1.0 ohm/ns max
Temp. coefficient of Td 0 to +150 ppm/°C Rated voltage 100 VDC (1 min)
Time delay tolerance ±0.05 ns Operating temperature -40 to + 85°
Characteristic impedance 50 ±5 ohm Storage temperature -55 to +125°C
