HLMP-1600
T‑13/4 (5 mm), T‑1 (3 mm), 5 Volt, 12 Volt,
Integrated Resistor LED Lamps
Data Sheet
Figure A. T-1 package. Figure B. T-13/4 package.
Package Dimensions
HLMP-1600, HLMP-1601, HLMP-1620, HLMP-1621
HLMP-1640, HLMP-1641, HLMP-3600, HLMP-3601
HLMP-3650, HLMP-3651, HLMP-3680, HLMP-3681
Features
• Integral current limiting resistor
• TTL compatible
Requires no external current Limiter with 5 volt/12 volt
supply
• Cost effective
Saves space and resistor cost
• Wide viewing angle
• Available in all colors
Red, High Efficiency Red, Yellow, and High Performance
Green in T-1 and T-13/4 packages
Description
The 5 volt and 12 volt series lamps contain an integral
cur rent limiting resistor in series with the LED. This allows
the lamp to be driven from a 5 volt/12 volt source without
an external current limiter. The red LEDs are made from
GaAsP on a GaAs substrate. The High Efficiency Red and
Yellow devices use GaAsP on a GaP substrate.
The green devices use GaP on a GaP substrate. The diffused
lamps provide a wide off-axis viewing angle.
The T-13/4 lamps are provided with sturdy leads suitable
for wire wrap applications. The T-13/4 lamps may be front
panel mounted by using the HLMP-0103 clip and ring.
1.02 (0.040)
NOM.
3.43 (0.135)
2.92 (0.115)
24.13
(0.95)MIN.
4.70 (0.185)
4.19 (0.165)
3.18 (0.125)
2.67 (0.105)
2.54 (0.100) NOM.
1.27 (0.050)
NOM.
6.35 (0.250)
5.58 (0.220)
0.45 (0.018)
SQUARE NOM.
0.65 (0.026)
MAX.
CATHODE
6.1 (0.240)
5.6 (0.220)
23.0
(0.90)MIN.
0.64 (0.025)
SQUARE NOMINAL
2.54 (0.100)
NOM.
CATHODE
1.27 (0.050)
NOM.
0.89 (0.035)
0.64 (0.025)
9.19 (0.362)
8.43 (0.332)
11.56 (0.455)
10.80 (0.425)
1.32 (0.052)
1.02 (0.040)
5.08 (0.200)
4.57 (0.180)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. AN EPOXY MENISCUS MAY EXTEND ABOUT
1 mm (0.040") DOWN THE LEADS.
2
Selection Guide
Color Package Description
Package
Outline 2q1/2[1]
Operating
Voltage (V)
Part Number
HLMP-
Luminous Intensity
Iv (mcd)
Min. Max.
Red T-1 Tinted Diffused A 60
5 1600 2.1 -
1600-D00xx 2.1 -
60
12 1601 2.1 -
1601-D00xx 2.1 -
1601-GH0xx 8.6 27.6
T-1 3/4 Tinted Diffused B 60
5 3600 2.1 -
3600-D00xx 2.1 -
60
12 3601 2.1 -
3601-D00xx 2.1 -
Yellow T-1 Tinted Diffused A 60
5 1620 2.2 -
1620-C00xx 2.2 -
1620-C0Bxx 2.2 -
1620-EFBxx 3.4 10.8
60
12 1621 2.2 -
1621-C00xx 2.2 -
T-1 3/4 Tinted Diffused B 60
5 3650 2.2 -
3650-C00xx 2.2 -
60
12 3651 2.2 -
3651-C00xx 2.2 -
Green T-1 Tinted Diffused A 60
5 1640 1.6 -
1640-B00xx 1.6 -
1640-B0Dxx 1.6 -
1640-DE0xx 4.2 13.4
60
12 1641 1.6 -
1641-B00xx 1.6
T-1 3/4 Tinted Diffused B 60
5 3680 1.6 -
3680-B00xx 1.6 -
60
12 3681 1.6 -
3681-B00xx 1.6 -
Note:
1. q1/2 is the off-axis angle at which the luminous intensity is 1/2 the axial luminous intensity.
3
Absolute Maximum Ratings at TA = 25°C
Red/HER/Yellow
5 Volt Lamps
Red/HER/Yellow
12 Volt Lamps
Green
5 Volt Lamps
Green
12 Volt Lamps
DC Forward Voltage (TA = 25°C) 7.5 Volts[2] 15 Volts[3] 7.5 Volts[2] 15 Volts[3]
Reverse Voltage (IR = 100 μA) 5 Volts 5 Volts 5 Volts 5 Volts
Operating Temperature Range -40°C to 85°C -40°C to 85°C -20°C to 85°C -20°C to 85°C
Storage Temperature Range -40°C to 100°C -40°C to 100°C -40°C to 100°C -40°C to 100°C
Notes:
2. Derate from TA = 50°C at 0.071 V/°C, see Figure 3.
3. Derate from TA = 50°C at 0.086 V/°C, see Figure 4.
Part Numbering System
HLMX-X 6 X X X X X XX
Mechanical Option
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
A1,B1: Right Angle Housing, Uneven Leads
A2,B2: Right Angle Housing, Even Leads
Color Bin Options
0: Full color bin distribution
B: Color bin 2&3 only
D: Color bin 4&5 only
Maximum Iv Bin Options
0: Open (No. max. limit)
Others: Please refer to the Iv bin Table
Minimum Iv Bin Options
Please refer to the Iv bin Table
Operating Voltage
0: 5 V
1: 12 V
Color Options
0: GaP HER
2,5: GaP Yellow
4,8: GaP Green
Package Options
3: T-13/4 (5 mm)
1: T-1 (3 mm)
4
Electrical/Optical Characteristics at TA = 25°C
Symbol
Description
High Efficiency Red Yellow Green
Unit Test ConditionMin. Typ. Max. Min. Typ. Max. Min. Typ. Max.
lP Peak
Wavelength
635 583 565 nm
ld Dominant
Wavelength
626 585 569 nm Note 4
Dl1/2 Spectral Line
Halfwidth
40 36 28 nm
RqJ-PIN Thermal
Resistance
290 290 290 °C/W Junction to
Cathode Lead
(Note 6)
RqJ-PIN Thermal
Resistance
210 210 210 °C/W Junction to
Cathode Lead
(Note 7)
IF Forward Current
12 V Devices
13 20 13 20 13 20 mA VF = 12 V
IF Forward Current
5 V Devices
10 15 10 15 10 15 mA VF = 5 V
hV Luminous
Efficacy
145 500 595 lumen /
Watt
Note 2
VR Reverse
Breakdown
Voltage
5.0 5.0 5.0 V IR = 100 μA
Notes:
4. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the
device.
5. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = lV/hV, where lV is the luminous intensity in candelas and hV is the
luminous efficacy in lumens/Watt.
6. For Figure A package type.
7. For Figure B package type.
5
Figure 6. Relative luminous intensity vs. angular displacement for T-13/4
package.
Figure 5. Relative luminous intensity vs. angular displacement for T-1
package.
Figure 1. Forward current vs. applied forward voltage. 5 volt devices. Figure 2. Forward current vs. applied forward voltage. 12 volt devices.
Figure 4. Maximum allowed applied forward voltage vs.
ambient temperature RqJA = 175°C/W. 12 volt devices.
Figure 3. Maximum allowed applied forward voltage vs.
ambient temperature RqJA = 175°C/W. 5 volt devices.
IF – FORWARD CURRENT – mA
0
0
VCC – APPLIED FORWARD VOLTAGE – V
1612
4
7.5
2681014
24
20
16
12
8
4
15
IF – FORWARD CURRENT – mA
0
0
VCC – APPLIED FORWARD VOLTAGE – V
1612
4
7.5
2681014
24
20
16
12
8
4
15
VCC – APPLIED FORWARD VOLTAGE – V
0
0
TA – AMBIENT TEMPERATURE – °C
85
20 40 60 80
7.5
8
6
4
2
VCC – APPLIED FORWARD VOLTAGE – V
0
0
TA – AMBIENT TEMPERATURE – °C
85
20 40 60 80
15
16
12
8
4
10°100°40°70°20°60°80°30°50°90°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90°
1.0
0.6
0.8
0.2
0.4
10°100°40°70°20°60°30°50°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90°
1.0
0.6
0.8
0.2
0.4
80°90°
6
Figure 8. Relative luminous intensity vs. applied forward voltage. 12 volt
devices.
Figure 7. Relative luminous intensity vs. applied forward voltage. 5 volt
devices.
2.5
2.0
GaAsP
0.5
001024
5 VOLT DEVICES
RELATIVE IV
68
1.5
1.0
HIGH EFFICIENCY
RED, YELLOW, GREEN
1.5
1.0
GaAsP
0.5
002 20486
12 VOLT DEVICES
RELATIVE IV
HIGH EFFICIENCY
RED, YELLOW, GREEN
10 12 14 16 18
Intensity Bin Limit
Color Bin
Intensity Range (mcd)
Min. Max.
Red D 2.4 3.8
E 3.8 6.1
F 6.1 9.7
G 9.7 15.5
H 15.5 24.8
I 24.8 39.6
J 39.6 63.4
K 63.4 101.5
L 101.5 162.4
M 162.4 234.6
N 234.6 340.0
O 340.0 540.0
P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
Maximum tolerance for each bin limit is ±18%.
Intensity Bin Limit (Con't)
Color Bin
Intensity Range (mcd)
Min. Max.
Yellow C 2.5 4.0
D 4.0 6.5
E 6.5 10.3
F 10.3 16.6
G 16.6 26.5
H 26.5 42.3
I 42.3 67.7
J 67.7 108.2
K 108.2 173.2
L 173.2 250.0
M 250.0 360.0
N 360.0 510.0
O 510.0 800.0
P 800.0 1250.0
Q 1250.0 1800.0
R 1800.0 2900.0
S 2900.0 4700.0
T 4700.0 7200.0
U 7200.0 11700.0
V 11700.0 18000.0
W 18000.0 27000.0
Y 14800.0 21400.0
Z 21400.0 30900.0
7
Color Categories
Color Cat #
Lambda (nm)
Min. Max.
Green 6 561.5 564.5
5 564.5 567.5
4 567.5 570.5
3 570.5 573.5
2 573.5 576.5
1 582.0 584.5
3 584.5 587.0
Yellow 2 587.0 589.5
4 589.5 592.0
5 592.0 593.0
Tolerance for each bin limit is ±0.5 nm.
Mechanical Option Matrix
Mechanical Option Code Definition
00 Bulk Packaging, minimum increment 500 pcs/bag
01 Tape & Reel, crimped leads, minimum increment 1300 pcs/bag
02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag
A1 T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
A2 T-1, Right Angle Housing, even leads, minimum increment 500 pcs/bag
B1 T-13/4 Angle Housing, uneven lead, minimum increment 500 pcs/bag
B2 T-13/4 Angle Housing, even leads, minimum increment 500 pcs/bag
Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago
representative for further clarification/information.
Intensity Bin Limit (Con't)
Color Bin
Intensity Range (mcd)
Min. Max.
Green B 1.8 2.9
C 2.9 4.7
D 4.7 7.6
E 7.6 12.0
F 12.0 19.1
G 19.1 30.7
H 30.7 49.1
I 49.1 78.5
J 78.5 125.7
K 125.7 201.1
L 201.1 289.0
M 289.0 417.0
N 417.0 680.0
O 680.0 1100.0
P 1100.0 1800.0
Q 1800.0 2700.0
R 2700.0 4300.0
S 4300.0 6800.0
T 6800.0 10800.0
U 10800.0 16000.0
V 16000.0 25000.0
W 25000.0 40000.0
Z 21400.0 30900.0
8
Figure 9. Recommended wave soldering profile.
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of LED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED chip
die attach and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended soldering conditions:
Wave Soldering
Manual Solder
Dipping
Pre-heat Temperature 105°C Max. –
Pre-heat Time 30 sec Max. –
Peak Temperature 250°C Max. 260°C Max.
Dwell Time 3 sec Max. 5 sec Max.
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size Diagonal
Plated Through
Hole Diameter
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
0.718 mm
(0.028 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
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Data subject to change. Copyright © 2005‑2008 Avago Technologies. All rights reserved.
AV02‑0379EN ‑ September 25, 2008