PolySwitch® Resettable PPTCs
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/05/19
Surface Mount > microSMD Series
microSMD Series
Agency Approvals
AGENCY AGENCY FILE NUMBER
E74889
78165
72161779
Electrical Characteristics
Part
Number
IHITVMAX IMAX PD MAX Max Time-to-trip RMIN R1MAX
(A) (A) (VDC) (A) (W) (A) (s) (Ω) (Ω)
microSMD Series — Size 3225mm/1210mils
microSMD005F 0.05 0.15 30 10 1. 0 0 0.25 1.50 3.60 50.00
microSMD010F 0.10 0.25 30 10 0.80 0.50 1. 0 0 2.10 15.00
microSMD035F 0.35 0.75 6 40 0.80 8.00 0.20 0.32 1.30
microSMD050F 0.50 1. 0 0 13.2 40 0.80 8.00 0.05 0.25 0.90
microSMD075F 0.75 1.50 6 40 0.80 8.00 0.10 0.11 0.40
microSMD110F 1. 10 2.20 6 40 0.80 8.00 0.20 0.07 0.21
microSMD150F 1.50 3.00 6 40 0.80 8.00 1. 0 0 0.04 0.11
microSMD175F 1.75 3.50 6 40 0.80 8.00 0.80 0.025 0.08
microSMD200F 2.00 4.00 6 100 0.80 8.00 2.50 0.020 0.06
Notes:
IH : Hold current: maximum current device will pass without interruption in 20°C still air.
IT : Trip current: minimum current that will switch the device from low resistance to high resistance in 20°C still air.
VMAX
: Maximum continuous voltage device can withstand without damage at rated current.
IMAX
: Maximum fault current device can withstand without damage at rated voltage.
PD : Power dissipated from device when in the tripped state in 20°C still air.
RMIN : Minimum resistance of device as supplied at 20°C unless otherwise specified.
R1MAX : Maximum resistance measured one hour post-trip or post-reflow at 20°C.
RoHS
Description
The microSMD series provides surface mount overcurrent
protection for applications where space is at a premium
and resettable protection is desired.
Features
• Broadest range of resettable devices available in industry
• Low resistance
• Small 1210 footprint
• Fast time-to-trip
• RoHS complaint, lead-free and halogen-free
Applications
Mobile Electronics and Batteries
• Computer
• Portable electronics
• Multimedia
• Game machines
• Telephone and broadband
• Automotive
• Industrial controls
• Battery
Additional Information
Datasheet Resources Samples
PolySwitch® Resettable PTCs
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/05/19
Surface Mount > microSMD Series
Temperature Rerating
Maximum Ambient Temperature
Part Number -40°C -20°C 0°C 20°C 25°C 40°C 50°C 60°C 70°C 80°C 85°C
Hold Current (A)
microSMD Series — Size 3225mm/1210mils
microSMD005F 0.08 0.07 0.06 0.05 0.05 0.04 0.04 0.03 0.03 0.02 0.02
microSMD010F 0.15 0.13 0.12 0.10 0.10 0.09 0.08 0.06 0.06 0.05 0.05
microSMD035F 0.51 0.46 0.40 0.35 0.34 0.30 0.27 0.24 0.22 0.19 0.18
microSMD050F 0.76 0.66 0.58 0.50 0.48 0.42 0.38 0.35 0.29 0.25 0.23
microSMD075F 1. 10 0.97 0.86 0.75 0.72 0.64 0.58 0.55 0.47 0.42 0.39
microSMD110F 1.60 1.42 1.26 1. 10 1.06 0.94 0.86 0.80 0.70 0.62 0.58
microSMD150F 2.30 2.02 1. 76 1.50 1.43 1.24 1. 11 1. 0 0 0.85 0.72 0.65
microSMD175F 2.80 2.45 2.10 1.75 1.70 1.55 1.45 1.35 1.25 1. 15 1. 10
microSMD200F 2.60 2.44 2.35 2.00 1.96 1.78 1.67 1.50 1.45 1. 15 1. 10
0
20
40
60
80
100
120
140
160
180
200
-40 -20 0 20 40 60 80 100 120
Ambient Temperature (°C)
% of Rated Hold and Tr ip Current
Temperature Rerating Curve
PolySwitch® Resettable PPTCs
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/05/19
Surface Mount > microSMD Series
Typical Time-to-Trip Curves at 20°C
microSMDxxxF
A = microSMD005F
B = microSMD010F
C = microSMD035F
D = microSMD050F
E = microSMD075F
F = microSMD110F
G = microSMD150F
H = microSMD175F
I = microSMD200F
Time-to-Trip (s)
Fault Current (A)
10
1
0.1
0.01
0.001
0.0001
0.1
11
0010
A
A
B
B
C
C
D
D
EF
E
GH
H
I
I
G
F
Physical Specifications
Terminal Pad Material 100% Matte Tin with Nickel Underplate
Soldering Characteristics ANSI/J-STD-002 Category 3
Solder Heat Withstand per IEC-STD 68-2-20, Test Tb, Section 5, Method 1a
Flammability Resistance per IEC 695-2-2 Needle Flame Test for 20 seconds
Environmental Specifications
Test Test Method Conditions Resistance Change
Storage Life PS300, Section 5.3.2 60°C, 1000 hrs
85°C, 1000 hrs
±3% typ
±3% typ
Humidity Aging PS300, Section 5.3.1 85°C, 85% R.H., 100 hrs ±1.2% typ
Thermal Shock MIL-STD-202, Method 107G 85°C, -40°C (20 Times)
125°C, -55°C (10 Times)
-33% typ
-33% typ
Vibration MIL-STD-883C per MIL-STD-883C No Change
Solvent Resistance PS300, Section 5.2.2
Freon
Trichloroethane
Hydrocarbons
No Change
No Change
No Change
Moisture Resistance Level Level 2a, J-STD-020
Storage Conditions 40°C max, 70% RH max; devices should remain in original sealed bags prior to use.
Devices may not meet specified values if these storage conditions are exceeded.
PolySwitch® Resettable PTCs
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/05/19
Surface Mount > microSMD Series
Dimension Figures
Dimensions
Part Number
Dimensions in Millimeters (Inches)
FigureA B C D E
Min Max Min Max Min Max Min Max Min Max
microSMD Series — Size 3225mm/1210mils
microSMD005F 3.0 3.43 0.50 0.85 2.35 2.80 0.25 0.75 0.076 — 1
(0.118) (0.135) (0.019) (0.034) (0.092) (0.110) (0.010) (0.030) (0.003)
microSMD010F 3.0 3.43 0.50 0.85 2.35 2.80 0.25 0.75 0.076 — 1
(0.118) (0.135) (0.019) (0.034) (0.092) (0.110) (0.010) (0.030) (0.003)
microSMD035F 3.0 3.43 0.38 0.62 2.35 2.80 0.25 0.75 0.076 — 1
(0.118) (0.135) (0.015) (0.025) (0.092) (0.110) (0.010) (0.030) (0.003)
microSMD050F 3.0 3.43 0.38 0.62 2.35 2.80 0.25 0.75 0.076 — 1
(0.118) (0.135) (0.015) (0.025) (0.092) (0.110) (0.010) (0.030) (0.003)
microSMD075F 3.0 3.43 0.38 0.62 2.35 2.80 0.25 0.75 0.076 — 1
(0.118) (0.135) (0.015) (0.025) (0.092) (0.110) (0.010) (0.030) (0.003)
microSMD110F 3.0 3.43 0.28 0.48 2.35 2.80 0.25 0.75 0.076 — 1
(0.118) (0.135) (0.011) (0.019) (0.092) (0.110) (0.010) (0.030) (0.003)
microSMD150F 3.0 3.43 0.51 1.22 2.35 2.80 0.25 0.75 0.076 — 1
(0.118) (0.135) (0.020) (0.048) (0.092) (0.110) (0.010) (0.030) (0.003)
microSMD175F 3.0 3.43 0.40 0.76 2.35 2.80 0.25 0.75 0.076 — 1
(0.118) (0.135) (0.016) (0.030) (0.092) (0.110) (0.010) (0.030) (0.003)
microSMD200F 3.0 3.43 0.79 1.17 2.35 2.80 0.25 0.75 0.076 — 1
(0.118) (0.135) (0.031) (0.046) (0.092) (0.110) (0.010) (0.030) (0.003)
Figure 1
C
BB
F
A
A
B
ED
D
H
E
C
C
F
G
A
DE
PolySwitch® Resettable PPTCs
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/05/19
Surface Mount > microSMD Series
Packaging and Marking Information
Recommended Pad Layout Figures
[mm (in)]
Part
Number
Tape and Reel
Quantity
Standard
Package
Part
Marking
Dimension A
(Nom)
Dimension B
(Nom)
Dimension C
(Nom)
Agency
Recognition
microSMD Series — Size 3225mm/1210mils
microSMD005F 4,000 20,000 05 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV
microSMD010F 4,000 20,000 10 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV
microSMD035F 4,000 20,000 3 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV
microSMD050F 4,000 20,000 50 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV
microSMD075F 4,000 20,000 75 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV
microSMD110F 4,000 20,000 11 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV
microSMD150F 4,000 20,000 15 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV
microSMD175F 4,000 20,000 17 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV
microSMD200F 3,000 15,000 20 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV
Recommended Pad Layout
A
B
CB
PolySwitch® Resettable PTCs
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/05/19
Surface Mount > microSMD Series
Solder Reflow Recommendations
Solder Reflow
• Recommended reflow method: IR, hot air, nitrogen.
• Recommended maximum paste thickness: 0.25mm (0.010in)
• Devices can be cleaned using standard methods and aqueous solvents.
• Experience has shown the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is
placed underneath each device’s termination. As such, we request that customers comply with our recommended solder pad layouts.
• Customer should validate that the solder paste amount and reflow recommendations meet its application.
• We request that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch
devices. It is possible that raised features could negatively impact solderability performance of our devices.
Rework
•
Standard industry practices. (Please also avoid direct contact to the device.)
Critical Zone
TL to Tp
Ramp Up
t 25˚C to Peak
Reflow Profile Time
Ramp Down
ts
Preheat
TsMAX
TL
Tp
tp
25
TsMIN
tL
Temperature
Profile Feature Pb-Free Assembly
Average ramp up rate (TsMAX to Tp) 3°C/s max
Preheat
• Temperature min (TsMIN) 150°C
• Temperature max (TsMAX) 200°C
• Time (tsMIN to tsMAX) 60-120 s
Time maintained above:
• Temperature (TL) 217°C
• Time (tL) 60-150 s
Peak/Classification temperature (Tp) 260°C
Time within 5°C of actual peak temperature
Time (tp) 30 s max
Ramp down rate 3°C/s max
Time 25°C to peak temperature 8 min max
Note: All temperatures refer to topside of the package, measured on the package body
surface.
Part Ordering Number System
microSMD 150 F -2
Packaging
2 = Tape and Reel
Lead Free
Hold Current Indicator
Product Series
PolySwitch® Resettable PPTCs
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/05/19
Surface Mount > microSMD Series
Tape and Reel Specifications
Description
microSMD
EIA 481-1
microSMD005F
microSMD010F
microSMD035F
microSMD050F
microSMD075F
microSMD110F
microSMD150F
microSMD175F microSMD200F
W8.0 ± 0.30 8.0 ± 0.30
P0 4.0 ± 0.10 4.0 ± 0.10
P1 4.0 ± 0.10 4.0 ± 0.10
P2 2.0 ± 0.05 2.0 ± 0.05
A0 2.9 ± 0.1 2.9 ± 0.1
B03.5 ± 0.1 3.55 ± 0.1
B1 max 4.35 4.35
D0 1.55 ± 0.05 1.55 ± 0.05
F 3.50 ± 0.05 3.50 ± 0.05
E1 1.75 ± 0.10 1.75 ± 0.10
E2 min 6.25 6.25
T max 0.3 0.3
T1 max 0.1 0.1
K00.9 ± 0.1 1.27 ± 0.1
A max 185 185
N min 50 50
W18.4 + 1.5/-.00 8.4 + 1.5/-.00
W2 max 14.4 14.4
PolySwitch® Resettable PTCs
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/05/19
Surface Mount > microSMD Series
Tape and Reel Diagrams
E1
D0
E2
F
W
Cover Tape
Embossment
Center lines
of cavity
P2
P0
A0P1
B0
B1
T1
K0
T
A
Cover Tape
Embossed Cavity
Carrier Tape
N (Hub Dia.)
W2 (Measured at Hub)
W1 (Measured at Hub)
Figure 1
Figure 2
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each
product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
WARNING
• Users should independently evaluate the suitability of and test each product selected for their own application.
• Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.
• These devices are intended for protection against damage caused by occasional overcurrent or overtemperature fault conditions and should not be used when
repeated fault conditions or prolonged trip events are anticipated.
• Contamination of the PPTC material with certain silicone-based oils or some aggressive solvents can adversely impact the performance of the devices.
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical
procedures for electronic components.
• PPTC devices are not recommended for installation in applications where the device is constrained such that its PTC properties are inhibited, for example in rigid
potting materials or in rigid housings, which lack adequate clearance to accommodate device expansion.
• Operation in circuits with a large inductance can generate a circuit voltage (Ldi/dt) above the rated voltage of the device.
