NE5532D8R2G - ON Semiconductor

March, 2006 − Rev. 1

1Publication Order Number:

NE5532/D

NE5532, SA5532, SE5532,

NE5532A, SE5532A

Internally Compensated

Dual Low Noise

Operational Amplifier

The 5532 is a dual high-performance low noise operational

amplifier. Compared to most of the standard operational amplifiers,

such as the 1458, it shows better noise performance, improved output

drive capability and considerably higher small-signal and power

bandwidths.

This makes the device especially suitable for application in

high-quality and professional audio equipment, instrumentation and

control circuits, and telephone channel amplifiers. The op amp is

internally compensated for gains equal to one. If very low noise is of

prime importance, it is recommended that the 5532A version be used

because it has guaranteed noise voltage specifications.

Features

•Small-Signal Bandwidth: 10 MHz

•Output Drive Capability: 600 W, 10 VRMS

•Input Noise Voltage: 5.0 nVńHz

Ǹ (Typical)

•DC Voltage Gain: 50000

•AC Voltage Gain: 2200 at 10 kHz

•Power Bandwidth: 140 kHz

•Slew Rate: 9.0 V/ms

•Large Supply Voltage Range: "3.0 to "20 V

•Compensated for Unity Gain

•Pb−Free Packages are Available

http://onsemi.com

See detailed ordering and shipping information in the package

dimensions section on page 7 of this data sheet.

ORDERING INFORMATION

PIN CONNECTIONS

SOIC−8

D SUFFIX

CASE 751

PDIP−8

N SUFFIX

CASE 626

SOIC−16 WB

D SUFFIX

CASE 751G

N, D8 Packages

D Package*

*SOL and non-standard pinout.

V+

OUTB

−INB

+INB

OUTA

−INA

+INA

V-

Top View

−INA

+INA

V−

+INB

−INB

OUTA

V+

OUTB

Top View

See general marking information in the device marking

section on page 6 of this data sheet.

DEVICE MARKING INFORMATION

NE5532, SA5532, SE5532, NE5532A, SE5532A

http://onsemi.com

Figure 1. Equivalent Schematic (Each Amplifier)

MAXIMUM RATINGS

Rating Symbol Value Unit

Supply Voltage VS"22 V

Input Voltage VIN "VSUPPLY V

Differential Input Voltage (Note 1) VDIFF "0.5 V

Operating Temperature Range

NE5532/A

SA5532

SE5532/A

Tamb 0 to 70

−40 to +85

−55 to +125

°C

Storage Temperature Tstg −65 to +150 °C

Junction Temperature Tj150 °C

Maximum Power Dissipation, Tamb = 25°C (Still-Air)

8 D8 Package

8 N Package

16 D Packagee

PD780

1200

Thermal Resistance, Junction−to−Ambient

8 D8 Package

8 N Package

16 D Packagee

RqJA 182

130

140

°C/W

Lead Soldering Temperature (10 sec max) Tsld 230 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input

voltage exceeds 0.6 V. Maximum current should be limited to "10 mA.

NE5532, SA5532, SE5532, NE5532A, SE5532A

http://onsemi.com

DC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.) (Notes 2, 3 and 4)

Characteristic Symbol Test Conditions

SE5532/A NE5532/A, SA5532

Unit

Min Typ Max Min Typ Max

Offset Voltage VOS − − 0.5 2.0 −0.5 4.0 mV

−Overtemperature − − 3.0 − − 5.0 mV

DVOS/DT− − 5.0 − − 5.0 −mV/°C

Offset Current IOS − − − 100 −10 150 nA

−Overtemperature − − 200 − − 200 nA

DIOS/DT− − 200 − − 200 −pA/°C

Input Current IB− − 200 400 −200 800 nA

−Overtemperature − − 700 − − 1000 nA

DIB/DT− − 5.0 − − 5.0 −nA/°C

Supply Current ICC − − 8.0 10.5 −8.0 16 mA

−Overtemperature − − 13 − − −

Common-Mode Input Range VCM −"12 "13 −"12 "13 −V

Common-Mode Rejection Ratio CMRR −80 100 −70 100 −dB

Power Supply Rejection Ratio PSRR − − 10 50 −10 100 mV/V

Large-Signal Voltage Gain AVOL RL w2.0 kW; VO = "10 V 50 100 −25 100 −V/mV

Overtemperature 25 − − 15 − −

RL w600 W; VO = "10 V 40 50 −15 50 −

Overtemperature 20 − − 10 − −

Output Swing VOUT RL w 600 W"12 "13 −"12 "13 −V

Overtemperature "10 "12 −"10 "12 −

RL w 600 W; VS = "18 V "15 "16 −"15 "16 −

Overtemperature "12 "14 −"12 "14 −

RL w 2.0 kW"13 "13.5 −"13 "13.5 −

Overtemperature "12 "12.5 −"10 "12.5 −

Input Resistance RIN −30 300 −30 300 −kW

Output Short Circuit Current ISC −10 38 60 10 38 60 mA

2. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input

voltage exceeds 0.6 V. Maximum current should be limited to "10 mA.

3. For operation at elevated temperature, derate packages based on the package thermal resistance.

4. Output may be shorted to ground at VS = "15 V, Tamb = 25°C. Temperature and/or supply voltages must be limited to ensure dissipation rating

is not exceeded.

NE5532, SA5532, SE5532, NE5532A, SE5532A

http://onsemi.com

AC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.)

Characteristic Symbol Test Conditions

NE/SE5532/A, SA5532

Unit

Min Typ Max

Output Resistance ROUT AV = 30 dB Closed-loop

f = 10 kHz, RL = 600 W

−0.3 −W

Overshoot −Voltage-Follower %

VIN = 100 mVP-P −10 −

CL = 100 pF; RL = 600 W

Gain AVf = 10 kHz −2.2 −V/mV

Gain Bandwidth Product GBW CL = 100 pF; RL = 600 W−10 −MHz

Slew Rate SR − − 9.0 −V/ms

Power Bandwidth −VOUT = "10 V −140 −kHz

VOUT = "14 V;

RL = 600 W

−100 −

VCC = "18 V

ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.)

Characteristic Symbol Test Conditions

NE/SE5532 NE/SA/SE5532A

Unit

Min Typ Max Min Typ Max

Input Noise Voltage VNOISE fO = 30 Hz −8.0 − − 8.0 12 nV/√Hz

fO = 1.0 kHz −5.0 − − 5.0 6.0

Input Noise Current INOISE fO = 30 Hz −2.7 − − 2.7 −pA/√Hz

fO = 1.0 kHz −0.7 − − 0.7 −

Channel Separation −f = 1.0 kHz; RS = 5.0 kW−110 − − 110 −dB

NE5532, SA5532, SE5532, NE5532A, SE5532A

http://onsemi.com

TYPICAL PERFORMANCE CHARACTERISTICS

GAIN (dB)

10 102103104105106107

120

-40

f (Hz)

-55 -25 0 25 50 75 100 +125 -55 -25 0 25 50 75 100 +125

1,4

1,2

0,8

0,4

01020

Tamb (oC)

TYP

(mA)

(mA) VIN (V)

Vp; −VN (V)

Figure 2. Open-Loop Frequency

Response

-20

103104105106107108

f (Hz)

RF = 10 kW; RE = 100 W

RF = 9 kW; RE = 1 kW

RF = 1 kW; RE = ∞

102103104105106107

f (Hz)

(V)

Vo(p-p)

(nVńHz

Ǹ)

IO = 0

010 20

10−2

10−1

10−2

10 102103104

f (Hz)

TYP

(mA)

Vp; −VN (V)

Tamb (oC)

Figure 3. Closed-Loop Frequency

Response

Figure 4. Large−Signal Frequency

Response

Figure 5. Output Short−Circuit

Current

Figure 6. Input Bias Current Figure 7. Input Common−Mode

Voltage Range

Figure 8. Supply Current Figure 9. Input Noise Voltage

Density

TYPICAL VALUES

TYPICAL VALUES VS = "15 V

TYPICAL VALUES

VS = "15 V VS = "15 V TYPICAL VALUES

NE5532, SA5532, SE5532, NE5532A, SE5532A

http://onsemi.com

Closed-Loop Frequency Response Voltage-Follower

−

5532 (1/2)

100 pF

VIRE

800 W

25 W

−

5532

VIN VOUT

100 pF

600 W

V+

V−

1 kW

Figure 10. Test Circuits

MARKING DIAGRAMS

SOIC−8

D SUFFIX

CASE 751

PDIP−8

N SUFFIX

CASE 626

A = Assembly Location

WL, L = Wafer Lot

YY, Y = Year

WW, W = Work Week

G or G= Pb−Free Packagee

NE5532AN

AWL

YYWWG

NE5532N

AWL

YYWWG

SA5532N

AWL

YYWWG

SE5532N

AWL

YYWWG

SOIC−16 WB

D SUFFIX

CASE 751G

NE5532D

AWLYYWWG

S5532

ALYWA

N5532

ALYW

N5532

ALYWA

NE5532, SA5532, SE5532, NE5532A, SE5532A

http://onsemi.com

ORDERING INFORMATION

Device Description Temperature Range Shipping†

NE5532AD8 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C98 Units / Rail

NE5532AD8G 8−Pin Plastic Small Outline (SO−8) Package

(Pb−Free)

0 to 70°C98 Units / Rail

NE5532AD8R2 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C2500 / Tape & Reel

NE5532AD8R2G 8−Pin Plastic Small Outline (SO−8) Package

(Pb−Free)

0 to 70°C2500 / Tape & Reel

NE5532AN 8−Pin Plastic Dual In−Line Package (PDIP−8) 0 to 70°C50 Units / Rail

NE5532ANG 8−Pin Plastic Dual In−Line Package (PDIP−8)

(Pb−Free)

0 to 70°C50 Units / Rail

NE5532D 16−Pin Plastic Small Outline (SO−16 WB) Package 0 to 70°C47 Units / Rail

NE5532DG 16−Pin Plastic Small Outline (SO−16 WB) Package

(Pb−Free)

0 to 70°C47 Units / Rail

NE5532DR2 16−Pin Plastic Small Outline (SO−16 WB) Package 0 to 70°C1000 Tape & Reel

NE5532DR2G 16−Pin Plastic Small Outline (SO−16 WB) Package

(Pb−Free)

0 to 70°C1000 Tape & Reel

NE5532D8 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C98 Units / Rail

NE5532D8G 8−Pin Plastic Small Outline (SO−8) Package

(Pb−Free)

0 to 70°C98 Units / Rail

NE5532D8R2 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C2500 / Tape & Reel

NE5532D8R2G 8−Pin Plastic Small Outline (SO−8) Package

(Pb−Free)

0 to 70°C2500 / Tape & Reel

NE5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) 0 to 70°C50 Units / Rail

NE5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8)

(Pb−Free)

0 to 70°C50 Units / Rail

SA5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) −40 to +85°C50 Units / Rail

SA5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8)

(Pb−Free)

−40 to +85°C50 Units / Rail

SE5532AD8 8−Pin Plastic Small Outline (SO−8) Packagee −55 to +125°C98 Units / Rail

SE5532AD8G 8−Pin Plastic Small Outline (SO−8) Package

(Pb−Free)

−55 to +125°C98 Units / Rail

SE5532AD8R2 8−Pin Plastic Small Outline (SO−8) Packagee −55 to +125°C2500 / Tape & Reel

SE5532AD8R2G 8−Pin Plastic Small Outline (SO−8) Package

(Pb−Free)

−55 to +125°C2500 / Tape & Reel

SE5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) −55 to +125°C50 Units / Rail

SE5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8)

(Pb−Free)

−55 to +125°C50 Units / Rail

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

NE5532, SA5532, SE5532, NE5532A, SE5532A

http://onsemi.com

PACKAGE DIMENSIONS

SOIC−8 NB

CASE 751−07

ISSUE AG

SEATING

PLANE

X 45_

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

6. 751−01 THRU 751−06 ARE OBSOLETE. NEW

STANDARD IS 751−07.

0.10 (0.004)

DIM

MIN MAX MIN MAX

INCHES

4.80 5.00 0.189 0.197

MILLIMETERS

B3.80 4.00 0.150 0.157

C1.35 1.75 0.053 0.069

D0.33 0.51 0.013 0.020

G1.27 BSC 0.050 BSC

H0.10 0.25 0.004 0.010

J0.19 0.25 0.007 0.010

K0.40 1.27 0.016 0.050

M0 8 0 8

N0.25 0.50 0.010 0.020

S5.80 6.20 0.228 0.244

−X−

−Y−

0.25 (0.010)

−Z−

0.25 (0.010) ZSXS

____

1.52

0.060

7.0

0.275

0.6

0.024

1.270

0.050

4.0

0.155

ǒmm

inchesǓ

SCALE 6:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

NE5532, SA5532, SE5532, NE5532A, SE5532A

http://onsemi.com

PACKAGE DIMENSIONS

8−Pin Plastic Dual In−Line Package (PDIP−8)

N SUFFIX

CASE 626−05

ISSUE L NOTES:

1. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

2. PACKAGE CONTOUR OPTIONAL (ROUND OR

SQUARE CORNERS).

3. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

NOTE 2 −A−

−B−

−T−

SEATING

PLANE

0.13 (0.005) B M

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A9.40 10.16 0.370 0.400

B6.10 6.60 0.240 0.260

C3.94 4.45 0.155 0.175

D0.38 0.51 0.015 0.020

F1.02 1.78 0.040 0.070

G2.54 BSC 0.100 BSC

H0.76 1.27 0.030 0.050

J0.20 0.30 0.008 0.012

K2.92 3.43 0.115 0.135

L7.62 BSC 0.300 BSC

M−−− 10 −−− 10

N0.76 1.01 0.030 0.040

NE5532, SA5532, SE5532, NE5532A, SE5532A

http://onsemi.com

PACKAGE DIMENSIONS

SOIC−16 WB

D SUFFIX

CASE 751G−03

ISSUE C

14X

B16X

SEATING

PLANE

0.25 B S

16 9

hX 45_

0.25

H8X

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

3. DIMENSIONS D AND E DO NOT INLCUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 TOTAL IN

EXCESS OF THE B DIMENSION AT MAXIMUM

MATERIAL CONDITION.

DIM MIN MAX

MILLIMETERS

A2.35 2.65

A1 0.10 0.25

B0.35 0.49

C0.23 0.32

D10.15 10.45

E7.40 7.60

e1.27 BSC

H10.05 10.55

h0.25 0.75

L0.50 0.90

q0 7

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any

liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental

damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over

time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under

its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,

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Phone: 81−3−5773−3850

NE5532/D

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