PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
7604001EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
7604001FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
7604001FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
JM38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
JM38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
JM38510/30601B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30601B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
JM38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SN54194J OBSOLETE CDIP J 16 TBD Call TI Call TI
SN54194J OBSOLETE CDIP J 16 TBD Call TI Call TI
SN54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN74194N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74194N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS194AD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194AD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194AN ACTIVE PDIP N 16 25 Pb-Free CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
(RoHS)
SN74LS194AN ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS194AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS194AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS194ANE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS194ANE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S194N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S194N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S194N3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S194N3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SNJ54LS194AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS194AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SNJ54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SNJ54LS194AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SNJ54LS194AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SNJ54S194FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S194FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SNJ54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SNJ54S194W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SNJ54S194W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 2
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 3
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS194ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS194ADR SOIC D 16 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 2
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
7604001EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
7604001FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
7604001FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
JM38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
JM38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
JM38510/30601B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30601B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
JM38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SN54194J OBSOLETE CDIP J 16 TBD Call TI Call TI
SN54194J OBSOLETE CDIP J 16 TBD Call TI Call TI
SN54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN74194N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74194N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS194AD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194AD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS194AN ACTIVE PDIP N 16 25 Pb-Free CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
(RoHS)
SN74LS194AN ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS194AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS194AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS194ANE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS194ANE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S194N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S194N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S194N3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S194N3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SNJ54LS194AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS194AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SNJ54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SNJ54LS194AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SNJ54LS194AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SNJ54S194FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S194FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SNJ54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SNJ54S194W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SNJ54S194W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 2
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 3
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS194ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS194ADR SOIC D 16 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 2
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