N25Q128A13EF840E - Micron

Micron Serial NOR Flash Memory

3V, Multiple I/O, 4KB Sector Erase

N25Q128A

Features

• SPI-compatible serial bus interface

• 108 MHz (MAX) clock frequency

• 2.7–3.6V single supply voltage

• Dual/quad I/O instruction provides increased

throughput up to 432 MHz

• Supported protocols

– Extended SPI, dual I/O, and quad I/O

• Execute-in-place (XIP) mode for all three protocols

– Configurable via volatile or nonvolatile registers

– Enables memory to work in XIP mode directly af-

ter power-on

• PROGRAM/ERASE SUSPEND operations

• Continuous read of entire memory via a single com-

mand

– Fast read

– Quad or dual output fast read

– Quad or dual I/O fast read

• Flexible to fit application

– Configurable number of dummy cycles

– Output buffer configurable

• Software reset

• 64-byte, user-lockable, one-time programmable

(OTP) dedicated area

• Erase capability

– Subsector erase 4KB uniform granularity blocks

– Sector erase 64KB uniform granularity blocks

– Full-chip erase

• Write protection

– Software write protection applicable to every

64KB sector via volatile lock bit

– Hardware write protection: protected area size

defined by five nonvolatile bits (BP0, BP1, BP2,

BP3, and TB)

– Additional smart protections, available upon re-

quest

• Electronic signature

– JEDEC-standard 2-byte signature (BA18h)

– Unique ID code (UID): 17 read-only bytes, in-

cluding:

• Two additional extended device ID (EDID)

bytes to identify device factory options

• Customized factory data (14 bytes)

• Minimum 100,000 ERASE cycles per sector

• More than 20 years data retention

• Packages JEDEC standard, all RoHS compliant

– F7 = V-PDFN-8 6mm x 5mm Sawn (MLP8 6mm x

5mm)

– F8 = V-PDFN-8 8mm x 6mm (MLP8 8mm x 6mm)

– 12 = T-PBGA-24b05 6mm x 8mm

– 14 = T-PBGA-24b05 6mm x 8mm, 4x6 ball array

– SF = SOP2-16 300 mils body width (SO16W)

– SE = SOP2-8 208 mils body width (SO8W)

128Mb, 3V, Multiple I/O Serial Flash Memory

Features

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Products and specifications discussed herein are subject to change by Micron without notice.

Contents

Important Notes and Warnings ......................................................................................................................... 6

Device Description ........................................................................................................................................... 7

Features ....................................................................................................................................................... 7

Operating Protocols ...................................................................................................................................... 7

XIP Mode ..................................................................................................................................................... 7

Device Configurability .................................................................................................................................. 8

Signal Assignments ........................................................................................................................................... 9

Signal Descriptions ......................................................................................................................................... 11

Memory Organization .................................................................................................................................... 13

Memory Configuration and Block Diagram .................................................................................................. 13

Memory Map – 128Mb Density ....................................................................................................................... 14

Device Protection ........................................................................................................................................... 15

Serial Peripheral Interface Modes .................................................................................................................... 17

SPI Protocols .................................................................................................................................................. 20

Nonvolatile and Volatile Registers ................................................................................................................... 21

Status Register ............................................................................................................................................ 22

Nonvolatile and Volatile Configuration Registers .......................................................................................... 23

Enhanced Volatile Configuration Register .................................................................................................... 26

Flag Status Register ..................................................................................................................................... 27

Command Definitions .................................................................................................................................... 29

READ REGISTER and WRITE REGISTER Operations ........................................................................................ 31

READ STATUS REGISTER or FLAG STATUS REGISTER Command ................................................................ 31

READ NONVOLATILE CONFIGURATION REGISTER Command ................................................................... 31

READ VOLATILE or ENHANCED VOLATILE CONFIGURATION REGISTER Command .................................. 32

WRITE STATUS REGISTER Command ......................................................................................................... 32

WRITE NONVOLATILE CONFIGURATION REGISTER Command ................................................................. 33

WRITE VOLATILE or ENHANCED VOLATILE CONFIGURATION REGISTER Command ................................. 33

READ LOCK REGISTER Command .............................................................................................................. 34

WRITE LOCK REGISTER Command ............................................................................................................ 35

CLEAR FLAG STATUS REGISTER Command ................................................................................................ 36

READ IDENTIFICATION Operations ............................................................................................................... 37

READ ID and MULTIPLE I/O READ ID Commands ...................................................................................... 37

READ SERIAL FLASH DISCOVERY PARAMETER Command ......................................................................... 38

READ MEMORY Operations ............................................................................................................................ 41

PROGRAM Operations .................................................................................................................................... 45

WRITE Operations .......................................................................................................................................... 49

WRITE ENABLE Command ......................................................................................................................... 49

WRITE DISABLE Command ........................................................................................................................ 49

ERASE Operations .......................................................................................................................................... 51

SUBSECTOR ERASE Command ................................................................................................................... 51

SECTOR ERASE Command ......................................................................................................................... 51

BULK ERASE Command ............................................................................................................................. 52

PROGRAM/ERASE SUSPEND Command ..................................................................................................... 53

PROGRAM/ERASE RESUME Command ...................................................................................................... 55

ONE TIME PROGRAMMABLE Operations ....................................................................................................... 56

READ OTP ARRAY Command ...................................................................................................................... 56

PROGRAM OTP ARRAY Command .............................................................................................................. 56

XIP Mode ....................................................................................................................................................... 58

Activate or Terminate XIP Using Volatile Configuration Register ................................................................... 58

Activate or Terminate XIP Using Nonvolatile Configuration Register ............................................................. 58

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Features

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Confirmation Bit Settings Required to Activate or Terminate XIP .................................................................. 59

Terminating XIP After a Controller and Memory Reset ................................................................................. 59

Power-Up and Power-Down ............................................................................................................................ 60

Power-Up and Power-Down Requirements .................................................................................................. 60

Power Loss Rescue Sequence ...................................................................................................................... 61

AC Reset Specifications ................................................................................................................................... 62

Absolute Ratings and Operating Conditions ..................................................................................................... 67

DC Characteristics and Operating Conditions .................................................................................................. 69

AC Characteristics and Operating Conditions – Standard ................................................................................. 70

AC Characteristics and Operating Conditions – Enhanced ................................................................................ 71

Package Dimensions ....................................................................................................................................... 73

Part Number Ordering Information ................................................................................................................. 79

Revision History ............................................................................................................................................. 81

Rev. T – 02/2018 .......................................................................................................................................... 81

Rev. S – 11/2014 .......................................................................................................................................... 81

Rev. R - 07/2014 .......................................................................................................................................... 81

Rev. Q – 05/2014 ......................................................................................................................................... 81

Rev. P – 06/2013 .......................................................................................................................................... 81

Rev. O – 04/2013 ......................................................................................................................................... 81

Rev. N – 01/2013 ......................................................................................................................................... 81

Rev. M – 07/2012 ........................................................................................................................................ 81

Rev. L – 06/2012 .......................................................................................................................................... 81

Rev. K – 02/2012 ......................................................................................................................................... 81

Rev. J – 12/2011 .......................................................................................................................................... 81

Rev. I – 10/2011 .......................................................................................................................................... 82

Rev. H – 08/2011 ......................................................................................................................................... 82

Rev. G – 08/2011 ......................................................................................................................................... 82

Rev. F – 02/2011 .......................................................................................................................................... 82

Rev. E – 01/2011 .......................................................................................................................................... 82

Rev. D – 10/2010 ......................................................................................................................................... 82

Rev. C – 02/2010 ......................................................................................................................................... 82

Rev. B – 05/2009 ......................................................................................................................................... 82

Rev. A – 01/2009 .......................................................................................................................................... 82

128Mb, 3V, Multiple I/O Serial Flash Memory

Features

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List of Figures

Figure 1: Logic Diagram ................................................................................................................................... 8

Figure 2: 8-Pin, VDFPN8 – MLP8 and SOP2 – SO8W (Top View) ......................................................................... 9

Figure 3: 16-Pin, Plastic Small Outline – SO16 (Top View) .................................................................................. 9

Figure 4: 24-Ball TBGA (Balls Down) .............................................................................................................. 10

Figure 5: 24-Ball TBGA , 4x6 (Balls Down) ....................................................................................................... 10

Figure 6: Block Diagram ................................................................................................................................ 13

Figure 7: Bus Master and Memory Devices on the SPI Bus ............................................................................... 18

Figure 8: Bus Master and Memory Devices on the SPI Bus ............................................................................... 19

Figure 9: SPI Modes ....................................................................................................................................... 19

Figure 10: Internal Configuration Register ...................................................................................................... 21

Figure 11: READ REGISTER Command .......................................................................................................... 31

Figure 12: WRITE REGISTER Command ......................................................................................................... 33

Figure 13: READ LOCK REGISTER Command ................................................................................................. 35

Figure 14: WRITE LOCK REGISTER Command ............................................................................................... 36

Figure 15: READ ID and MULTIPLE I/O Read ID Commands .......................................................................... 38

Figure 16: READ Command ........................................................................................................................... 42

Figure 17: FAST READ Command ................................................................................................................... 42

Figure 18: DUAL OUTPUT FAST READ ........................................................................................................... 43

Figure 19: DUAL INPUT/OUTPUT FAST READ Command .............................................................................. 43

Figure 20: QUAD OUTPUT FAST READ Command ......................................................................................... 44

Figure 21: QUAD INPUT/OUTPUT FAST READ Command ............................................................................. 44

Figure 22: PAGE PROGRAM Command .......................................................................................................... 46

Figure 23: DUAL INPUT FAST PROGRAM Command ...................................................................................... 46

Figure 24: EXTENDED DUAL INPUT FAST PROGRAM Command ................................................................... 47

Figure 25: QUAD INPUT FAST PROGRAM Command ..................................................................................... 47

Figure 26: EXTENDED QUAD INPUT FAST PROGRAM Command ................................................................... 48

Figure 27: WRITE ENABLE and WRITE DISABLE Command Sequence ............................................................ 50

Figure 28: SUBSECTOR and SECTOR ERASE Command .................................................................................. 52

Figure 29: BULK ERASE Command ................................................................................................................ 53

Figure 30: READ OTP Command .................................................................................................................... 56

Figure 31: PROGRAM OTP Command ............................................................................................................ 57

Figure 32: XIP Mode Directly After Power-On .................................................................................................. 58

Figure 33: Power-Up Timing .......................................................................................................................... 60

Figure 34: Reset AC Timing During PROGRAM or ERASE Cycle ........................................................................ 63

Figure 35: Reset Enable ................................................................................................................................. 63

Figure 36: Serial Input Timing ........................................................................................................................ 63

Figure 37: Write Protect Setup and Hold During WRITE STATUS REGISTER Operation (SRWD = 1) ................... 64

Figure 38: Hold Timing .................................................................................................................................. 65

Figure 39: Output Timing .............................................................................................................................. 66

Figure 40: VPPH Timing .................................................................................................................................. 66

Figure 41: AC Timing Input/Output Reference Levels ...................................................................................... 68

Figure 42: V-PDFN-8 6mm x 5mm Sawn (MLP8) – Package Code: F7 ................................................................ 73

Figure 43: V-PDFN-8 8mm x 6mm (MLP8) – Package Code: F8 ........................................................................ 74

Figure 44: T-PBGA-24b05 6mm x 8mm – Package Code: 12 .............................................................................. 75

Figure 45: T-PBGA-24b05 6mm x 8mm – Package Code: 14 .............................................................................. 76

Figure 46: SOP2-16 (300 mils body width) – Package Code: SF ......................................................................... 77

Figure 47: SOP2-8 (208 mils body width) – Package Code: SE ........................................................................... 78

128Mb, 3V, Multiple I/O Serial Flash Memory

Features

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List of Tables

Table 1: Signal Descriptions ........................................................................................................................... 11

Table 2: Sectors[255:0] ................................................................................................................................... 14

Table 3: Data Protection using Device Protocols ............................................................................................. 15

Table 4: Memory Sector Protection Truth Table .............................................................................................. 15

Table 5: Protected Area Sizes – Upper Area ..................................................................................................... 15

Table 6: Protected Area Sizes – Lower Area ...................................................................................................... 16

Table 7: SPI Modes ........................................................................................................................................ 17

Table 8: Extended, Dual, and Quad SPI Protocols ............................................................................................ 20

Table 9: Status Register Bit Definitions ........................................................................................................... 22

Table 10: Nonvolatile Configuration Register Bit Definitions ........................................................................... 23

Table 11: Volatile Configuration Register Bit Definitions .................................................................................. 24

Table 12: Sequence of Bytes During Wrap ....................................................................................................... 26

Table 13: Supported Clock Frequencies .......................................................................................................... 26

Table 14: Enhanced Volatile Configuration Register Bit Definitions .................................................................. 26

Table 15: Flag Status Register Bit Definitions .................................................................................................. 27

Table 16: Command Set ................................................................................................................................. 29

Table 17: Lock Register .................................................................................................................................. 34

Table 18: Data/Address Lines for READ ID and MULTIPLE I/O READ ID Commands ....................................... 37

Table 19: Read ID Data Out ............................................................................................................................ 37

Table 20: Extended Device ID, First Byte ......................................................................................................... 37

Table 21: Serial Flash Discovery Parameter – Header Structure ........................................................................ 39

Table 22: Parameter ID .................................................................................................................................. 39

Table 23: Command/Address/Data Lines for READ MEMORY Commands ....................................................... 41

Table 24: Data/Address Lines for PROGRAM Commands ................................................................................ 45

Table 25: Suspend Parameters ....................................................................................................................... 54

Table 26: Operations Allowed/Disallowed During Device States ...................................................................... 54

Table 27: OTP Control Byte (Byte 64) .............................................................................................................. 57

Table 28: XIP Confirmation Bit ....................................................................................................................... 59

Table 29: Effects of Running XIP in Different Protocols .................................................................................... 59

Table 30: Power-Up Timing and VWI Threshold ............................................................................................... 61

Table 31: AC RESET Conditions ...................................................................................................................... 62

Table 32: Absolute Ratings ............................................................................................................................. 67

Table 33: Operating Conditions ...................................................................................................................... 67

Table 34: Input/Output Capacitance .............................................................................................................. 67

Table 35: AC Timing Input/Output Conditions ............................................................................................... 68

Table 36: DC Current Characteristics and Operating Conditions ...................................................................... 69

Table 37: DC Voltage Characteristics and Operating Conditions ...................................................................... 69

Table 38: AC Characteristics and Operating Conditions – Standard Specifications ............................................ 70

Table 39: AC Characteristics and Operating Conditions – Enhanced Specifications .......................................... 71

Table 40: Part Number Information ................................................................................................................ 79

Table 41: Package Details ............................................................................................................................... 80

128Mb, 3V, Multiple I/O Serial Flash Memory

Features

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Important Notes and Warnings

Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,

including without limitation specifications and product descriptions. This document supersedes and replaces all

information supplied prior to the publication hereof. You may not rely on any information set forth in this docu-

ment if you obtain the product described herein from any unauthorized distributor or other source not authorized

by Micron.

Automotive Applications. Products are not designed or intended for use in automotive applications unless specifi-

cally designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distrib-

utor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims,

costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of

product liability, personal injury, death, or property damage resulting directly or indirectly from any use of non-

automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and con-

ditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron

products are not designed or intended for use in automotive applications unless specifically designated by Micron

as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to in-

demnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys'

fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage

resulting from any use of non-automotive-grade products in automotive applications.

Critical Applications. Products are not authorized for use in applications in which failure of the Micron compo-

nent could result, directly or indirectly in death, personal injury, or severe property or environmental damage

("Critical Applications"). Customer must protect against death, personal injury, and severe property and environ-

mental damage by incorporating safety design measures into customer's applications to ensure that failure of the

Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron

component for any critical application, customer and distributor shall indemnify and hold harmless Micron and

its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims,

costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of

product liability, personal injury, or death arising in any way out of such critical application, whether or not Mi-

cron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the

Micron product.

Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems,

applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAIL-

URE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE

WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR

PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included

in customer's applications and products to eliminate the risk that personal injury, death, or severe property or en-

vironmental damages will result from failure of any semiconductor component.

Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential

damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal

or replacement of any products or rework charges) whether or not such damages are based on tort, warranty,

breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly

authorized representative.

128Mb, 3V, Multiple I/O Serial Flash Memory

Important Notes and Warnings

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Device Description

The N25Q is the first high-performance multiple input/output serial Flash memory de-

vice manufactured on 65nm NOR technology. It features execute-in-place (XIP) func-

tionality, advanced write protection mechanisms, and a high-speed SPI-compatible bus

interface. The innovative, high-performance, dual and quad input/output instructions

enable double or quadruple the transfer bandwidth for READ and PROGRAM opera-

tions.

Features

The memory is organized as 256 (64KB) main sectors that are further divided into 16

subsectors each (4096 subsectors in total). The memory can be erased one 4KB subsec-

tor at a time, 64KB sectors at a time, or as a whole.

The memory can be write protected by software through volatile and nonvolatile pro-

tection features, depending on the application needs. The protection granularity is of

64KB (sector granularity) for volatile protections

The device has 64 one-time programmable (OTP) bytes that can be read and program-

med with the READ OTP and PROGRAM OTP commands. These 64 bytes can also be

permanently locked with a PROGRAM OTP command.

The device also has the ability to pause and resume PROGRAM and ERASE cycles by us-

ing dedicated PROGRAM/ERASE SUSPEND and RESUME instructions.

Operating Protocols

The memory can be operated with three different protocols:

• Extended SPI (standard SPI protocol upgraded with dual and quad operations)

• Dual I/O SPI

• Quad I/O SPI

The standard SPI protocol is extended and enhanced by dual and quad operations. In

addition, the dual SPI and quad SPI protocols improve the data access time and

throughput of a single I/O device by transmitting commands, addresses, and data

across two or four data lines.

XIP Mode

XIP mode requires only an address (no instruction) to output data, improving random

access time and eliminating the need to shadow code onto RAM for fast execution.

All protocols support XIP operation. For flexibility, multiple XIP entry and exit methods

are available. For applications that must enter XIP mode immediately after powering

up, XIP mode can be set as the default mode through the nonvolatile configuration reg-

ister bits.

128Mb, 3V, Multiple I/O Serial Flash Memory

Device Description

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Device Configurability

The N25Q family offers additional features that are configured through the nonvolatile

configuration register for default and/or nonvolatile settings. Volatile settings can be

configured through the volatile and volatile-enhanced configuration registers. These

configurable features include the following:

• Number of dummy cycles for the fast READ commands

• Output buffer impedance

• SPI protocol types (extended SPI, DIO-SPI, or QIO-SPI)

• Required XIP mode

• Enabling/disabling HOLD (RESET function)

• Enabling/disabling wrap mode

Figure 1: Logic Diagram

VCC

DQ0

VPP/W#/DQ2

HOLD#/DQ3

VSS

DQ1

Note: 1. Reset functionality is available in devices with a dedicated part number. See Part Num-

ber Ordering Information for more details.

128Mb, 3V, Multiple I/O Serial Flash Memory

Device Description

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Signal Assignments

Figure 2: 8-Pin, VDFPN8 – MLP8 and SOP2 – SO8W (Top View)

DQ1

W#/VPP/DQ2

VSS

VCC

HOLD#/DQ3

DQ0

Notes: 1. On the underside of the MLP8 package, there is an exposed central pad that is pulled

internally to VSS and must not be connected to any other voltage or signal line on the

PCB.

2. Reset functionality is available in devices with a dedicated part number. See Part Num-

ber Ordering Information for complete package names and details.

Figure 3: 16-Pin, Plastic Small Outline – SO16 (Top View)

DQ0

DNU

VSS

W#/VPP/DQ2

HOLD#/DQ3

VCC

DNU

DQ1

Note: 1. Reset functionality is available in devices with a dedicated part number. See Part Num-

ber Ordering Information for complete package names and details.

128Mb, 3V, Multiple I/O Serial Flash Memory

Signal Assignments

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Figure 4: 24-Ball TBGA (Balls Down)

VCC

W#/VPP/DQ2

HOLD#/DQ3

VSS

DQ0

DQ1

54321

Note: 1. See Part Number Ordering Information for complete package names and details.

Figure 5: 24-Ball TBGA , 4x6 (Balls Down)

1 2 3 4

VCC

W#/VPP/DQ2

HOLD#/DQ3

VSS

DQ0

DQ1

NCNCNCNC

Note: 1. See Part Number Ordering Information for complete package names and details.

128Mb, 3V, Multiple I/O Serial Flash Memory

Signal Assignments

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Signal Descriptions

The signal description table below is a comprehensive list of signals for the N25 family

devices. All signals listed may not be supported on this device. See Signal Assignments

for information specific to this device.

Table 1: Signal Descriptions

Symbol Type Description

C Input Clock: Provides the timing of the serial interface. Commands, addresses, or data present at se-

rial data inputs are latched on the rising edge of the clock. Data is shifted out on the falling

edge of the clock.

S# Input Chip select: When S# is HIGH, the device is deselected and DQ1 is at High-Z. When in exten-

ded SPI mode, with the device deselected, DQ1 is tri-stated. Unless an internal PROGRAM,

ERASE, or WRITE STATUS REGISTER cycle is in progress, the device enters standby power mode

(not deep power-down mode). Driving S# LOW enables the device, placing it in the active pow-

er mode. After power-up, a falling edge on S# is required prior to the start of any command.

DQ0 Input

and I/O

Serial data: Transfers data serially into the device. It receives command codes, addresses, and

the data to be programmed. Values are latched on the rising edge of the clock. DQ0 is used for

input/output during the following operations: DUAL OUTPUT FAST READ, QUAD OUTPUT FAST

READ, DUAL INPUT/OUTPUT FAST READ, and QUAD INPUT/OUTPUT FAST READ. When used for

output, data is shifted out on the falling edge of the clock.

In DIO-SPI, DQ0 always acts as an input/output.

In QIO-SPI, DQ0 always acts as an input/output, with the exception of the PROGRAM or ERASE

cycle performed with VPP. The device temporarily enters the extended SPI protocol and then re-

turns to QIO-SPI as soon as VPP goes LOW.

DQ1 Output

and I/O

Serial data:Transfers data serially out of the device. Data is shifted out on the falling edge of

the clock. DQ1 is used for input/output during the following operations: DUAL INPUT FAST

PROGRAM, QUAD INPUT FAST PROGRAM, DUAL INPUT EXTENDED FAST PROGRAM, and QUAD

INPUT EXTENDED FAST PROGRAM. When used for input, data is latched on the rising edge of

the clock.

In DIO-SPI, DQ1 always acts as an input/output.

In QIO-SPI, DQ1 always acts as an input/output, with the exception of the PROGRAM or ERASE

cycle performed with the enhanced program supply voltage (VPP). In this case the device tem-

porarily enters the extended SPI protocol and then returns to QIO-SPI as soon as VPP goes LOW.

DQ2 Input

and I/O

DQ2: When in QIO-SPI mode or in extended SPI mode using QUAD FAST READ commands, the

signal functions as DQ2, providing input/output.

All data input drivers are always enabled except when used as an output. Micron recommends

customers drive the data signals normally (to avoid unnecessary switching current) and float

the signals before the memory device drives data on them.

DQ3 Input

and I/O

DQ3: When in quad SPI mode or in extended SPI mode using quad FAST READ commands, the

signal functions as DQ3, providing input/output. HOLD# is disabled and RESET# is disabled if

the device is selected.

RESET# Control

Input

RESET: This is a hardware RESET# signal. When RESET# is driven HIGH, the memory is in the

normal operating mode. When RESET# is driven LOW, the memory enters reset mode and out-

put is High-Z. If RESET# is driven LOW while an internal WRITE, PROGRAM, or ERASE operation

is in progress, data may be lost.

128Mb, 3V, Multiple I/O Serial Flash Memory

Signal Descriptions

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Table 1: Signal Descriptions (Continued)

Symbol Type Description

HOLD# Control

Input

HOLD: Pauses any serial communications with the device without deselecting the device. DQ1

(output) is High-Z. DQ0 (input) and the clock are "Don't Care." To enable HOLD, the device

must be selected with S# driven LOW.

HOLD# is used for input/output during the following operations: QUAD OUTPUT FAST READ,

QUAD INPUT/OUTPUT FAST READ, QUAD INPUT FAST PROGRAM, and QUAD INPUT EXTENDED

FAST PROGRAM.

In QIO-SPI, HOLD# acts as an I/O (DQ3 functionality), and the HOLD# functionality is disabled

when the device is selected. When the device is deselected (S# is HIGH) in parts with RESET#

functionality, it is possible to reset the device unless this functionality is not disabled by means

of dedicated registers bits.

The HOLD# functionality can be disabled using bit 4 of the NVCR or bit 4 of the VECR.

On devices that include DTR mode capability, the HOLD# functionality is disabled as soon as a

DTR operation is recognized.

W# Control

Input

Write protect: W# can be used as a protection control input or in QIO-SPI operations. When in

extended SPI with single or dual commands, the WRITE PROTECT function is selectable by the

voltage range applied to the signal. If voltage range is low (0V to VCC), the signal acts as a

write protection control input. The memory size protected against PROGRAM or ERASE opera-

tions is locked as specified in the status register block protect bits 3:0.

W# is used as an input/output (DQ2 functionality) during QUAD INPUT FAST READ and QUAD

INPUT/OUTPUT FAST READ operations and in QIO-SPI.

VPP Power Supply voltage: If VPP is in the voltage range of VPPH, the signal acts as an additional power

supply, as defined in the AC Measurement Conditions table.

During QIFP, QIEFP, and QIO-SPI PROGRAM/ERASE operations, it is possible to use the addition-

al VPP power supply to speed up internal operations. However, to enable this functionality, it is

necessary to set bit 3 of the VECR to 0.

In this case, VPP is used as an I/O until the end of the operation. After the last input data is shif-

ted in, the application should apply VPP voltage to VPP within 200ms to speed up the internal

operations. If the VPP voltage is not applied within 200ms, the PROGRAM/ERASE operations

start at standard speed.

The default value of VECR bit 3 is 1, and the VPP functionality for quad I/O modify operations is

disabled.

VCC Power Device core power supply: Source voltage.

VSS Ground Ground: Reference for the VCC supply voltage.

DNU – Do not use.

NC – No connect.

128Mb, 3V, Multiple I/O Serial Flash Memory

Signal Descriptions

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Memory Organization

Memory Configuration and Block Diagram

Each page of memory can be individually programmed. Bits are programmed from one

through zero. The device is subsector, sector, or bulk-erasable, but not page-erasable.

Bits are erased from zero through one. The memory is configured as 16,777,216 bytes (8

bits each); 256 sectors (64KB each); 4096 subsectors (4KB each); and 65,536 pages (256

bytes each); and 64 OTP bytes are located outside the main memory array.

Figure 6: Block Diagram

HOLD#

W#/VPP Control logic High voltage

generator

I/O shift register

Address register

and counter

256 byte

data buffer

256 bytes (page size)

X decoder

Y decoder

Status

0000000h

00FFFFFF

00000FFh

64 OTP bytes

DQ0

DQ1

DQ2

DQ3

128Mb, 3V, Multiple I/O Serial Flash Memory

Memory Organization

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Memory Map – 128Mb Density

Table 2: Sectors[255:0]

Sector Subsector

Address Range

Start End

255 4095 00FF F000h 00FF FFFFh

⋮ ⋮ ⋮

4080 00FF 0000h 00FF 0FFFh

⋮ ⋮ ⋮ ⋮

127 2047 007F F000h 007F FFFFh

⋮ ⋮ ⋮

2032 007F 0000h 007F 0FFFh

⋮ ⋮ ⋮ ⋮

63 1023 003F F000h 003F FFFFh

⋮ ⋮ ⋮

1008 003F 0000h 003F 0FFFh

⋮ ⋮ ⋮ ⋮

0 15 0000 F000h 0000 FFFFh

⋮ ⋮ ⋮

0 0000 0000h 0000 0FFFh

128Mb, 3V, Multiple I/O Serial Flash Memory

Memory Map – 128Mb Density

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Device Protection

Table 3: Data Protection using Device Protocols

Note 1 applies to the entire table

Protection by: Description

Power-on reset and internal timer Protects the device against inadvertent data changes while the power supply is out-

side the operating specification.

Command execution check Ensures that the number of clock pulses is a multiple of one byte before executing a

PROGRAM or ERASE command, or any command that writes to the device registers.

WRITE ENABLE operation Ensures that commands modifying device data must be preceded by a WRITE ENABLE

command, which sets the write enable latch bit in the status register.

Note: 1. Extended, dual, and quad SPI protocol functionality ensures that device data is protec-

ted from excessive noise.

Table 4: Memory Sector Protection Truth Table

Note 1 applies to the entire table

Sector Lock Register

Memory Sector Protection Status

Sector Lock

Down Bit

Sector Write Lock

Bit

0 0 Sector unprotected from PROGRAM and ERASE operations. Protection status re-

versible.

0 1 Sector protected from PROGRAM and ERASE operations. Protection status rever-

sible.

1 0 Sector unprotected from PROGRAM and ERASE operations. Protection status not

reversible except by power cycle or reset.

1 1 Sector protected from PROGRAM and ERASE operations. Protection status not

reversible except by power cycle or reset.

Note: 1. Sector lock register bits are written to when the WRITE LOCK REGISTER command is exe-

cuted. The command will not execute unless the sector lock down bit is cleared (see the

WRITE LOCK REGISTER command).

Table 5: Protected Area Sizes – Upper Area

Note 1 applies to the entire table

Status Register Content Memory Content

Top/

Bottom

Bit BP3 BP2 BP1 BP0 Protected Area Unprotected Area

0 0 0 0 0 None All sectors

0 0 0 0 1 Upper 256th Sectors (0 to 254)

0 0 0 1 0 Upper 128th Sectors (0 to 253)

0 0 0 1 1 Upper 64th Sectors (0 to 251)

0 0 1 0 0 Upper 32th Sectors (0 to 247)

0 0 1 0 1 Upper 16nd Sectors (0 to 239)

128Mb, 3V, Multiple I/O Serial Flash Memory

Device Protection

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Table 5: Protected Area Sizes – Upper Area (Continued)

Note 1 applies to the entire table

Status Register Content Memory Content

Top/

Bottom

Bit BP3 BP2 BP1 BP0 Protected Area Unprotected Area

0 0 1 1 0 Upper 8th Sectors (0 to 223)

0 0 1 1 1 Upper quarter Sectors (0 to 191)

0 1 0 0 0 Upper half Sectors (0 to 127)

0 1 0 0 1 All sectors None

0 1 0 1 0 All sectors None

0 1 0 1 1 All sectors None

0 1 1 0 0 All sectors None

0 1 1 0 1 All sectors None

0 1 1 1 0 All sectors None

0 1 1 1 1 All sectors None

Note: 1. See the Status Register for details on the top/bottom bit and the BP 3:0 bits.

Table 6: Protected Area Sizes – Lower Area

Note 1 applies to the entire table

Status Register Content Memory Content

Top/

Bottom

Bit BP3 BP2 BP1 BP0 Protected Area Unprotected Area

1 0 0 0 0 None All sectors

1 0 0 0 1 Lower 256th Sectors (1 to 255)

1 0 0 1 0 Lower 128th Sectors (2 to 255)

1 0 0 1 1 Lower 64th Sectors (4 to 255)

1 0 1 0 0 Lower 32th Sectors (8 to 255)

1 0 1 0 1 Lower 16nd Sectors (16 to 255)

1 0 1 1 0 Lower 8th Sectors (32 to 255)

1 0 1 1 1 Lower quarter Sectors (64 to 255)

1 1 0 0 0 Lower half Sectors (128 to 255)

1 1 0 0 1 All sectors None

1 1 0 1 0 All sectors None

1 1 0 1 1 All sectors None

1 1 1 0 0 All sectors None

1 1 1 0 1 All sectors None

1 1 1 1 0 All sectors None

1 1 1 1 1 All sectors None

Note: 1. See the Status Register for details on the top/bottom bit and the BP 3:0 bits.

128Mb, 3V, Multiple I/O Serial Flash Memory

Device Protection

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Serial Peripheral Interface Modes

The device can be driven by a microcontroller while its serial peripheral interface is in

either of the two modes shown here. The difference between the two modes is the clock

polarity when the bus master is in standby mode and not transferring data. Input data is

latched in on the rising edge of the clock, and output data is available from the falling

edge of the clock.

Table 7: SPI Modes

Note 1 applies to the entire table

SPI Modes Clock Polarity

CPOL = 0, CPHA = 0 C remains at 0 for (CPOL = 0, CPHA = 0)

CPOL = 1, CPHA = 1 C remains at 1 for (CPOL = 1, CPHA = 1)

Note: 1. The listed SPI modes are supported in extended, dual, and quad SPI protocols.

Shown below is an example of three memory devices in extended SPI protocol in a sim-

ple connection to an MCU on an SPI bus. Because only one device is selected at a time,

that one device drives DQ1, while the other devices are High-Z.

Resistors ensure the device is not selected if the bus master leaves S# High-Z. The bus

master might enter a state in which all input/output is High-Z simultaneously, such as

when the bus master is reset. Therefore, the serial clock must be connected to an exter-

nal pull-down resistor so that S# is pulled HIGH while the serial clock is pulled LOW.

This ensures that S# and the serial clock are not HIGH simultaneously and that tSHCH

is met. The typical resistor value of 100kΩ, assuming that the time constant R × Cp (Cp =

parasitic capacitance of the bus line), is shorter than the time the bus master leaves the

SPI bus in High-Z.

Example: Cp = 50pF, that is R × Cp = 5μs. The application must ensure that the bus mas-

ter never leaves the SPI bus High-Z for a time period shorter than 5μs. W# and HOLD#

should be driven either HIGH or LOW, as appropriate.

128Mb, 3V, Multiple I/O Serial Flash Memory

Serial Peripheral Interface Modes

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Figure 7: Bus Master and Memory Devices on the SPI Bus

SPI bus master

SPI memory

device

SDO

SDI

SCK

DQ1 DQ0

SPI memory

device

DQ1 DQ0

SPI memory

device

DQ1 DQ0

CS3 CS2 CS1

SPI interface:

(CPOL, CPHA) =

(0, 0) or (1, 1)

W# HOLD# S# W# HOLD# S# W# HOLD#

R R R

VCC

VCC VCC VCC

VSS

VSS VSS VSS

128Mb, 3V, Multiple I/O Serial Flash Memory

Serial Peripheral Interface Modes

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Figure 8: Bus Master and Memory Devices on the SPI Bus

SPI bus master

SPI memory

device

SDO

SDI

SCK

DQ1 DQ0

SPI memory

device

DQ1 DQ0

SPI memory

device

DQ1 DQ0

CS3 CS2 CS1

SPI interface:

(CPOL, CPHA) =

(0, 0) or (1, 1)

HOLD# S# HOLD# S# HOLD#

R R R

VCC

VCC VCC VCC

VSS

VSS VSS VSS

Figure 9: SPI Modes

DQ0

DQ1

CPHA

CPOL

MSB

128Mb, 3V, Multiple I/O Serial Flash Memory

Serial Peripheral Interface Modes

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SPI Protocols

Table 8: Extended, Dual, and Quad SPI Protocols

Protocol

Name

Com-

mand

Input

Address

Input

Data

Input/Output Description

Extended DQ0 Multiple DQn

lines, depending

on the command

Multiple DQn

lines, depending

on the command

Device default protocol from the factory. Additional com-

mands extend the standard SPI protocol and enable address

or data transmission on multiple DQn lines.

Dual DQ[1:0] DQ[1:0] DQ[1:0] Volatile selectable: When the enhanced volatile configu-

ration register bit 6 is set to 0 and bit 7 is set to 1, the de-

vice enters the dual SPI protocol immediately after the

WRITE ENHANCED VOLATILE CONFIGURATION REGISTER

command. The device returns to the default protocol after

the next power-on. In addition, the device can return to de-

fault protocol using the rescue sequence or through new

WRITE ENHANCED VOLATILE CONFIGURATION REGISTER

command, without power-off or power-on.

Nonvolatile selectable: When nonvolatile configuration

after the next power-on. Once this register bit is set, the de-

vice defaults to the dual SPI protocol after all subsequent

power-on sequences until the nonvolatile configuration

Quad1DQ[3:0] DQ[3:0] DQ[3:0] Volatile selectable: When the enhanced volatile configu-

ration register bit 7 is set to 0, the device enters the quad

SPI protocol immediately after the WRITE ENHANCED VOL-

ATILE CONFIGURATION REGISTER command. The device re-

turns to the default protocol after the next power-on. In ad-

dition, the device can return to default protocol using the

rescue sequence or through new WRITE ENHANCED VOLA-

TILE CONFIGURATION REGISTER command, without power-

off or power-on.

Nonvolatile selectable: When nonvolatile configuration

tocol after the next power-on. Once this register bit is set,

the device defaults to the quad SPI protocol after all subse-

quent power-on sequences until the nonvolatile configura-

tion register bit is reset to 1.

Note: 1. In quad SPI protocol, all command/address input and data I/O are transmitted on four

lines except during a PROGRAM and ERASE cycle performed with VPP. In this case, the

device enters the extended SPI protocol to temporarily allow the application to perform

a PROGRAM/ERASE SUSPEND operation or to check the write-in-progress bit in the sta-

tus register or the program/erase controller bit in the flag status register. Then, when

VPP goes LOW, the device returns to the quad SPI protocol.

128Mb, 3V, Multiple I/O Serial Flash Memory

SPI Protocols

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Nonvolatile and Volatile Registers

The device features the following volatile and nonvolatile registers that users can access

to store device parameters and operating configurations:

• Status register

• Nonvolatile and volatile configuration registers

• Enhanced volatile configuration register

• Flag status register

• Lock register

Note: The lock register is defined in READ LOCK REGISTER Command.

In addition to these user-accessible registers, the working condition of memory is set by

an internal configuration register that is not directly accessible to users. As shown be-

low, parameters in the internal configuration register are loaded from the nonvolatile

configuration register during each device boot phase or power-on reset. In this sense,

then, the nonvolatile configuration register contains the default settings of memory.

Also, during the life of an application, each time a WRITE VOLATILE or ENHANCED

VOLATILE CONFIGURATION REGISTER command executes to set configuration pa-

rameters in these respective registers, these new settings are copied to the internal con-

figuration register. Therefore, memory settings can be changed in real time. However, at

the next power-on reset, the memory boots according to the memory settings defined

in the nonvolatile configuration register parameters.

Figure 10: Internal Configuration Register

the power-on phase or after a reset,

overwriting configuration register settings

on the internal configuration register.

WRITE VOLATILE OR ENHANCED VOLATILE

CONFIGURATION REGISTER command,

overwriting configuration register

settings on the internal configuration register.

Nonvolatile configuration register

Internal configuration

Device behavior

Volatile configuration register and

enhanced volatile configuration register

128Mb, 3V, Multiple I/O Serial Flash Memory

Nonvolatile and Volatile Registers

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Status Register

Table 9: Status Register Bit Definitions

Note 1 applies to entire table

Bit Name Settings Description Notes

7 Status register

write enable/disable

0 = Enabled

1 = Disabled

Nonvolatile bit: Used with the W#/VPP signal to enable or

disable writing to the status register. A one-time program-

mable bit used to lock permanently the entire status regis-

ter.

5 Top/bottom 0 = Top

1 = Bottom

Nonvolatile bit: Determines whether the protected mem-

ory area defined by the block protect bits starts from the

top or bottom of the memory array.

6, 4:2 Block protect 3–0 See Protected Area

Sizes – Upper Area

and Lower Area

tables in Device

Protection

Nonvolatile bit: Defines memory to be software protec-

ted against PROGRAM or ERASE operations. When one or

more block protect bits is set to 1, a designated memory

area is protected from PROGRAM and ERASE operations.

1 Write enable latch 0 = Cleared (Default)

1 = Set

Volatile bit: The device always powers up with this bit

cleared to prevent inadvertent WRITE STATUS REGISTER,

PROGRAM, or ERASE operations. To enable these opera-

tions, the WRITE ENABLE operation must be executed first

to set this bit.

0 Write in progress 0 = Ready

1 = Busy

Volatile bit: Indicates if one of the following command cy-

cles is in progress:

WRITE STATUS REGISTER

WRITE NONVOLATILE CONFIGURATION REGISTER

PROGRAM

ERASE

Notes: 1. Bits can be read from or written to using READ STATUS REGISTER or WRITE STATUS REG-

ISTER commands, respectively.

2. The status register write enable/disable bit, combined with the W#/VPP signal as descri-

bed in the Signal Descriptions, provides hardware data protection for the device as fol-

lows: When the enable/disable bit is set to 1, and the W#/VPP signal is driven LOW, the

status register nonvolatile bits become read-only and the WRITE STATUS REGISTER oper-

ation will not execute. The only way to exit this hardware-protected mode is to drive

W#/VPP HIGH.This one-time programmable status register bit can be set to 1 only once.

Afterward, the status register is set permanently to read-only, and the area protected by

the status register block protect bits also is set permanently to read-only.

3. See Protected Area Sizes tables in Device Protection. The BULK ERASE command is exe-

cuted only if all bits are 0.

4. Volatile bits are cleared to 0 by a power cycle or reset.

128Mb, 3V, Multiple I/O Serial Flash Memory

Nonvolatile and Volatile Registers

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Nonvolatile and Volatile Configuration Registers

Table 10: Nonvolatile Configuration Register Bit Definitions

Note 1 applies to entire table

Bit Name Settings Description Notes

15:12 Number of

dummy clock

cycles

0000 (identical to 1111)

0001

0010

1101

1110

1111

Sets the number of dummy clock cycles subse-

quent to all FAST READ commands.

The default setting targets the maximum al-

lowed frequency and guarantees backward com-

patibility.

2, 3

11:9 XIP mode at

power-on re-

set

000 = XIP: Fast Read

001 = XIP: Dual Output Fast Read

010 = XIP: Dual I/O Fast Read

011 = XIP: Quad Output Fast Read

100 = XIP: Quad I/O Fast Read

101 = Reserved

110 = Reserved

111 = Disabled (Default)

Enables the device to operate in the selected XIP

mode immediately after power-on reset.

8:6 Output driver

strength

000 = Reserved

001 = 90 Ohms

010 = 60 Ohms

011 = 45 Ohms

100 = Reserved

101 = 20 Ohms

110 = 15 Ohms

111 = 30 (Default)

Optimizes impedance at VCC/2 output voltage.

5 Reserved X "Don't Care."

4 Reset/hold 0 = Disabled

1 = Enabled (Default)

Enables or disables hold or reset.

(Available on dedicated part numbers.)

3 Quad I/O pro-

tocol

0 = Enabled

1 = Disabled (Default, Extended SPI prot-

cocol)

Enables or disables quad I/O protocol. 4

2 Dual I/O pro-

tocol

0 = Enabled

1 = Disabled (Default, Extended SPI pro-

tocol)

Enables or disables dual I/O protocol. 4

1:0 Reserved X "Don't Care."

1 Reserved X "Don't Care."

0 Lock

nonvolatile

configuration

0 = Disabled

1 = Enabled (Default)

When this bit is set to 0, the nonvolatile configu-

ration register becomes permanently write pro-

tected and any WRITE NONVOLATILE CONFIGU-

RATION REGISTER command is ignored.

Notes: 1. Settings determine device memory configuration after power-on. The device ships from

the factory with all bits erased to 1 (FFFFh). The register is read from or written to by

128Mb, 3V, Multiple I/O Serial Flash Memory

Nonvolatile and Volatile Registers

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READ NONVOLATILE CONFIGURATION REGISTER or WRITE NONVOLATILE CONFIGURA-

TION REGISTER commands, respectively.

2. The 0000 and 1111 settings are identical in that they both define the default state,

which is the maximum frequency of fc = 108 MHz. This ensures backward compatibility.

3. If the number of dummy clock cycles is insufficient for the operating frequency, the

memory reads wrong data. The number of cycles must be set according to and sufficient

for the clock frequency, which varies by the type of FAST READ command, as shown in

the Supported Clock Frequencies table.

4. If bits 2 and 3 are both set to 0, the device operates in quad I/O. When bits 2 or 3 are

reset to 0, the device operates in dual I/O or quad I/O respectively, after the next power-

on.

Table 11: Volatile Configuration Register Bit Definitions

Note 1 applies to entire table

Bit Name Settings Description Notes

7:4 Number of dum-

my clock cycles

0000 (identical to 1111)

0001

0010

1101

1110

1111

Sets the number of dummy clock cycles subsequent to

all FAST READ commands.

The default setting targets maximum allowed frequen-

cy and guarantees backward compatibility.

2, 3

3 XIP 0 = Enable

1 = Disable (default)

Enables or disables XIP. For device part numbers with

feature digit equal to 2 or 4, this bit is always "Don’t

Care," so the device operates in XIP mode without set-

ting this bit.

2 Reserved X = Default 0b = Fixed value.

1:0 Wrap 00 = 16-byte boundary

aligned

16-byte wrap: Output data wraps within an aligned 16-

byte boundary starting from the 3-byte address issued

after the command code.

01 = 32-byte boundary

aligned

32-byte wrap: Output data wraps within an aligned 32-

byte boundary starting from the 3-byte address issued

after the command code.

10 = 64-byte boundary

aligned

64-byte wrap: Output data wraps within an aligned 64-

byte boundary starting from the 3-byte address issued

after the command code.

11 = sequential (default) Continuous reading (default): All bytes are read se-

quentially.

Notes: 1. Settings determine the device memory configuration upon a change of those settings by

the WRITE VOLATILE CONFIGURATION REGISTER command. The register is read from or

written to by READ VOLATILE CONFIGURATION REGISTER or WRITE VOLATILE CONFIGU-

RATION REGISTER commands respectively.

2. The 0000 and 1111 settings are identical in that they both define the default state,

which is the maximum frequency of fc = 108 MHz. This ensures backward compatibility.

3. If the number of dummy clock cycles is insufficient for the operating frequency, the

memory reads wrong data. The number of cycles must be set according to and be suffi-

cient for the clock frequency, which varies by the type of FAST READ command, as

shown in the Supported Clock Frequencies table.

128Mb, 3V, Multiple I/O Serial Flash Memory

Nonvolatile and Volatile Registers

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4. See the Sequence of Bytes During Wrap table.

128Mb, 3V, Multiple I/O Serial Flash Memory

Nonvolatile and Volatile Registers

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Table 12: Sequence of Bytes During Wrap

Starting Address 16-Byte Wrap 32-Byte Wrap 64-Byte Wrap

0 0-1-2- . . . -15-0-1- . . 0-1-2- . . . -31-0-1- . . 0-1-2- . . . -63-0-1- . .

1 1-2- . . . -15-0-1-2- . . 1-2- . . . -31-0-1-2- . . 1-2- . . . -63-0-1-2- . .

15 15-0-1-2-3- . . . -15-0-1- . . 15-16-17- . . . -31-0-1- . . 15-16-17- . . . -63-0-1- . .

31 31-16-17- . . . -31-16-17- . . 31-0-1-2-3- . . . -31-0-1- . . 31-32-33- . . . -63-0-1- . .

63 63-48-49- . . . -63-48-49- . . 63-32-33- . . . -63-32-33- . . 63-0-1- . . . -63-0-1- . .

Table 13: Supported Clock Frequencies

Note 1 applies to entire table

Number of

Dummy

Clock Cycles FAST READ

DUAL OUTPUT

FAST READ

DUAL I/O FAST

READ

QUAD OUTPUT

FAST READ

QUAD I/O FAST

READ Unit

1 90 80 50 43 30

MHz

2 100 90 70 60 40

3 108 100 80 75 50

4 108 105 90 90 60

5 108 108 100 100 70

6 108 108 105 105 80

7 108 108 108 108 86

8 108 108 108 108 95

9 108 108 108 108 105

10 108 108 108 108 108

Note: 1. Values are guaranteed by characterization and not 100% tested in production.

Enhanced Volatile Configuration Register

Table 14: Enhanced Volatile Configuration Register Bit Definitions

Note 1 applies to entire table

Bit Name Settings Description Notes

7 Quad I/O protocol 0 = Enabled

1 = Disabled (Default,

extended SPI protocol)

Enables or disables quad I/O protocol. 2

6 Dual I/O protocol 0 = Enabled

1 = Disabled (Default,

extended SPI protocol)

Enables or disables dual I/O protocol. 2

5 Reserved X = Default 0b = Fixed value.

4 Reset/hold 0 = Disabled

1 = Enabled (Default)

Enables or disables hold or reset.

(Available on dedicated part numbers.)

128Mb, 3V, Multiple I/O Serial Flash Memory

Nonvolatile and Volatile Registers

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Table 14: Enhanced Volatile Configuration Register Bit Definitions (Continued)

Note 1 applies to entire table

Bit Name Settings Description Notes

3 VPP accelerator 0 = Enabled

1 = Disabled (Default)

Enables or disables VPP acceleration for QUAD

INPUT FAST PROGRAM and QUAD INPUT EX-

TENDED FAST PROGRAM OPERATIONS.

2:0 Output driver strength 000 = Reserved

001 = 90 Ohms

010 = 60 Ohms

011 = 45 Ohms

100 = Reserved

101 = 20 Ohms

110 = 15 Ohms

111 = 30 (Default)

Optimizes impedance at VCC/2 output voltage.

Notes: 1. Settings determine the device memory configuration upon a change of those settings by

the WRITE ENHANCED VOLATILE CONFIGURATION REGISTER command. The register is

read from or written to in all protocols by READ ENHANCED VOLATILE CONFIGURATION

tively.

2. If bits 6 and 7 are both set to 0, the device operates in quad I/O. When either bit 6 or 7 is

reset to 0, the device operates in dual I/O or quad I/O, respectively, following the next

WRITE ENHANCED VOLATILE CONFIGURATION command.

Flag Status Register

Table 15: Flag Status Register Bit Definitions

Note 1 applies to entire table

Bit Name Settings Description Notes

7 Program or

erase

controller

0 = Busy

1 = Ready

Status bit: Indicates whether a PROGRAM, ERASE,

WRITE STATUS REGISTER, or WRITE NONVOLATILE CON-

FIGURATION command cycle is in progress.

2, 3

6 Erase suspend 0 = Not in effect

1 = In effect

Status bit: Indicates whether an ERASE operation has

been or is going to be suspended.

5 Erase 0 = Clear

1 = Failure or protection error

Error bit: Indicates whether an ERASE operation has

succeeded or failed.

4, 5

4 Program 0 = Clear

1 = Failure or protection error

Error bit: Indicates whether a PROGRAM operation has

succeeded or failed. Also indicates an attempt to pro-

gram a 0 to a 1 when VPP = VPPH and the data pattern is

a multiple of 64 bits.

4, 5

3 VPP 0 = Enabled

1 = Disabled (Default)

Error bit: Indicates an invalid voltage on VPP during a

PROGRAM or ERASE operation.

4, 5

2 Program

suspend

0 = Not in effect

1 = In effect

Status bit: Indicates whether a PROGRAM operation

has been or is going to be suspended.

128Mb, 3V, Multiple I/O Serial Flash Memory

Nonvolatile and Volatile Registers

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Table 15: Flag Status Register Bit Definitions (Continued)

Note 1 applies to entire table

Bit Name Settings Description Notes

1 Protection 0 = Clear

1 = Failure or protection error

Error bit: Indicates whether an ERASE or a PROGRAM

operation has attempted to modify the protected array

sector, or whether a PROGRAM operation has attemp-

ted to access the locked OTP space.

4, 5

0 Reserved Reserved Reserved

Notes: 1. Register bits are read by READ FLAG STATUS REGISTER command. All bits are volatile.

2. These program/erase controller settings apply only to PROGRAM or ERASE command cy-

cles in progress, or to the specific WRITE command cycles in progress as shown here.

3. Status bits are reset automatically.

4. Error bits must be reset by CLEAR FLAG STATUS REGISTER command.

5. Typical errors include operation failures and protection errors caused by issuing a com-

mand before the error bit has been reset to 0.

128Mb, 3V, Multiple I/O Serial Flash Memory

Nonvolatile and Volatile Registers

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Command Definitions

Table 16: Command Set

Note 1 applies to entire table

Command Code Extended

Dual

I/O

Quad

I/O

Data

Bytes Notes

RESET Operations

RESET ENABLE 66h Yes Yes Yes 0 2

RESET MEMORY 99h

IDENTIFICATION Operations

READ ID 9E/9Fh Yes No No 1 to 20 2

MULTIPLE I/O READ ID AFh No Yes Yes 1 to 3 2

READ SERIAL FLASH

DISCOVERY PARAMETER

5Ah Yes Yes Yes 1 to ∞3

READ Operations

READ 03h Yes No No 1 to ∞4

FAST READ 0Bh Yes Yes Yes 5

DUAL OUTPUT FAST READ 3Bh Yes Yes No 1 to ∞5

DUAL INPUT/OUTPUT FAST READ 0Bh

3Bh

BBh

Yes Yes No 5, 6

QUAD OUTPUT FAST READ 6Bh Yes No Yes 1 to ∞5

QUAD INPUT/OUTPUT FAST READ 0Bh

6Bh

EBh

Yes No Yes 5, 7

WRITE Operations

WRITE ENABLE 06h Yes Yes Yes 0 2

WRITE DISABLE 04h

READ STATUS REGISTER 05h Yes Yes Yes 1 to ∞2

WRITE STATUS REGISTER 01h 1 2, 8

READ LOCK REGISTER E8h Yes Yes Yes 1 to ∞4

WRITE LOCK REGISTER E5h 1 4, 8

READ FLAG STATUS REGISTER 70h Yes Yes Yes 1 to ∞2

CLEAR FLAG STATUS REGISTER 50h 0

READ NONVOLATILE

CONFIGURATION REGISTER

B5h Yes Yes Yes 2 2

WRITE NONVOLATILE

CONFIGURATION REGISTER

B1h 2, 8

READ VOLATILE

CONFIGURATION REGISTER

85h Yes Yes Yes 1 to ∞2

WRITE VOLATILE

CONFIGURATION REGISTER

81h 1 2, 8

128Mb, 3V, Multiple I/O Serial Flash Memory

Command Definitions

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Table 16: Command Set (Continued)

Note 1 applies to entire table

Command Code Extended

Dual

I/O

Quad

I/O

Data

Bytes Notes

READ ENHANCED VOLATILE

CONFIGURATION REGISTER

65h Yes Yes Yes 1 to ∞2

WRITE ENHANCED VOLATILE

CONFIGURATION REGISTER

61h Yes Yes Yes 1 2, 8

PROGRAM Operations

PAGE PROGRAM 02h Yes Yes Yes 1 to 256 4, 8

DUAL INPUT FAST PROGRAM A2h Yes Yes No 1 to 256 4, 8

EXTENDED DUAL INPUT

FAST PROGRAM

02h

A2h

D2h

Yes Yes No 4, 6, 8

QUAD INPUT FAST PROGRAM 32h Yes No Yes 1 to 256 4, 8

EXTENDED QUAD INPUT

FAST PROGRAM

02h

32h

12h

Yes No Yes 4, 7, 8

ERASE Operations

SUBSECTOR ERASE 20h Yes Yes Yes 0 4, 8

SECTOR ERASE D8h 4, 8

BULK ERASE C7h 2, 8

PROGRAM/ERASE RESUME 7Ah Yes Yes Yes 0 2, 8

PROGRAM/ERASE SUSPEND 75h

ONE-TIME PROGRAMMABLE (OTP) Operations

READ OTP ARRAY 4Bh Yes Yes Yes 1 to 64 5

PROGRAM OTP ARRAY 42h 4

Notes: 1. Yes in the protocol columns indicates that the command is supported and has the same

functionality and command sequence as other commands marked Yes.

2. Address bytes = 0. Dummy clock cycles = 0.

3. Address bytes = 3. Dummy clock cycles default = 8.

4. Address bytes default = 3. Dummy clock cycles = 0.

5. Address bytes default = 3. Dummy clock cycles default = 8. Dummy clock cycles default =

10 (when quad SPI protocol is enabled). Dummy clock cycles is configurable by the user.

6. When the device is in dual SPI protocol, the command can be entered with any of these

three codes. The different codes enable compatibility between dual SPI and extended

SPI protocols.

7. When the device is in quad SPI protocol, the command can be entered with any of these

three codes. The different codes enable compatibility between quad SPI and extended

SPI protocols.

8. The WRITE ENABLE command must be issued first before this command can be execu-

ted.

128Mb, 3V, Multiple I/O Serial Flash Memory

Command Definitions

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READ REGISTER and WRITE REGISTER Operations

READ STATUS REGISTER or FLAG STATUS REGISTER Command

To initiate a READ STATUS REGISTER command, S# is driven LOW. For extended SPI

protocol, the command code is input on DQ0, and output on DQ1. For dual SPI proto-

col, the command code is input on DQ[1:0], and output on DQ[1:0]. For quad SPI proto-

col, the command code is input on DQ[3:0], and is output on DQ[3:0]. The operation is

terminated by driving S# HIGH at any time during data output.

The status register can be read continuously and at any time, including during a PRO-

GRAM, ERASE, or WRITE operation.

The flag status register can be read continuously and at any time, including during an

ERASE or WRITE operation.

If one of these operations is in progress, checking the write in progress bit or P/E con-

troller bit is recommended before executing the command.

Figure 11: READ REGISTER Command

High-Z

DQ1

7 8 910 11 12 13 14 15

MSB

DQ0

LSB

Command

3 4 5 6 7

MSB

DQ[1:0]

LSB

Command

MSB

DOUT DOUT DOUT DOUT DOUT

LSB

Extended

MSB

DOUT DOUT DOUT DOUT DOUT

LSB

DOUT DOUT DOUT DOUT

Dual

Quad 1 2 3

MSB

DQ[3:0]

LSB

Command

MSB

DOUT DOUT DOUT

LSB

Don’t Care

Notes: 1. Supports all READ REGISTER commands except READ LOCK REGISTER.

2. A READ NONVOLATILE CONFIGURATION REGISTER operation will output data starting

from the least significant byte.

READ NONVOLATILE CONFIGURATION REGISTER Command

To execute a READ NONVOLATILE CONFIGURATION REGISTER command, S# is driv-

en LOW. For extended SPI protocol, the command code is input on DQ0, and output on

DQ1. For dual SPI protocol, the command code is input on DQ[1:0], and output on

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READ REGISTER and WRITE REGISTER Operations

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DQ[1:0]. For quad SPI protocol, the command code is input on DQ[3:0], and is output

on DQ[3:0]. The operation is terminated by driving S# HIGH at any time during data

output.

The nonvolatile configuration register can be read continuously. After all 16 bits of the

READ VOLATILE or ENHANCED VOLATILE CONFIGURATION REGISTER Command

To execute a READ VOLATILE CONFIGURATION REGISTER command or a READ EN-

HANCED VOLATILE CONFIGURATION REGISTER command, S# is driven LOW. For ex-

tended SPI protocol, the command code is input on DQ0, and output on DQ1. For dual

SPI protocol, the command code is input on DQ[1:0], and output on DQ[1:0]. For quad

SPI protocol, the command code is input on DQ[3:0], and is output on DQ[3:0]. The op-

eration is terminated by driving S# HIGH at any time during data output.

When the register is read continuously, the same byte is output repeatedly.

WRITE STATUS REGISTER Command

To issue a WRITE STATUS REGISTER command, the WRITE ENABLE command must be

executed to set the write enable latch bit to 1. S# is driven LOW and held LOW until the

eighth bit of the last data byte has been latched in, after which it must be driven HIGH.

For extended SPI protocol, the command code is input on DQ0, followed by the data

bytes. For dual SPI protocol, the command code is input on DQ[1:0], followed by the da-

ta bytes. For quad SPI protocol, the command code is input on DQ[3:0], followed by the

data bytes. When S# is driven HIGH, the operation, which is self-timed, is initiated; its

duration is tW.

This command is used to write new values to status register bits 7:2, enabling software

data protection. The status register can also be combined with the W# signal to provide

hardware data protection. The WRITE STATUS REGISTER command has no effect on

status register bits 1:0.

When the operation is in progress, the write in progress bit is set to 1. The write enable

latch bit is cleared to 0, whether the operation is successful or not. The status register

and flag status register can be polled for the operation status. When the operation com-

pletes, the write in progress bit is cleared to 0, whether the operation is successful or

not.

128Mb, 3V, Multiple I/O Serial Flash Memory

READ REGISTER and WRITE REGISTER Operations

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Figure 12: WRITE REGISTER Command

7 8 9 10 11 12 13 14 15

MSB

DQ0

LSB

Command

3 4 5 6 7

MSB

DQ[1:0]

LSB

Command

MSB

DIN DIN DIN DIN DIN

LSB

Extended

MSB

LSB

DIN DIN DIN DIN DIN

DIN DIN DIN DIN

Dual

Quad 1 2 3

MSB

DQ[3:0]

LSB

Command

MSB

DIN DIN DIN

LSB

Notes: 1. Supports all WRITE REGISTER commands except WRITE LOCK REGISTER.

2. Waveform must be extended for each protocol, to 23 for extended, 11 for dual, and 5

for quad.

3. A WRITE NONVOLATILE CONFIGURATION REGISTER operation requires data being sent

starting from least significant byte.

WRITE NONVOLATILE CONFIGURATION REGISTER Command

To execute the WRITE NONVOLATILE CONFIGURATION REGISTER command, the

WRITE ENABLE command must be executed to set the write enable latch bit to 1. S# is

driven LOW and held LOW until the 16th bit of the last data byte has been latched in,

after which it must be driven HIGH. For extended SPI protocol, the command code is

input on DQ0, followed by two data bytes. For dual SPI protocol, the command code is

input on DQ[1:0], followed by the data bytes. For quad SPI protocol, the command code

is input on DQ[3:0], followed by the data bytes. When S# is driven HIGH, the operation,

which is self-timed, is initiated; its duration is tWNVCR.

When the operation is in progress, the write in progress bit is set to 1. The write enable

latch bit is cleared to 0, whether the operation is successful or not. The status register

and flag status register can be polled for the operation status. When the operation com-

pletes, the write in progress bit is cleared to 0, whether the operation is successful or

not. If S# is not driven HIGH, the command is not executed, flag status register error

bits are not set, and the write enable latch remains set to 1.

WRITE VOLATILE or ENHANCED VOLATILE CONFIGURATION REGISTER Command

To execute a WRITE VOLATILE CONFIGURATION REGISTER command or a WRITE

ENHANCED VOLATILE CONFIGURATION REGISTER command, the WRITE ENABLE

command must be executed to set the write enable latch bit to 1. S# is driven LOW and

held LOW until the eighth bit of the last data byte has been latched in, after which it

must be driven HIGH. For extended SPI protocol, the command code is input on DQ0,

followed by the data bytes. For dual SPI protocol, the command code is input on

128Mb, 3V, Multiple I/O Serial Flash Memory

READ REGISTER and WRITE REGISTER Operations

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DQ[1:0], followed by the data bytes. For quad SPI protocol, the command code is input

on DQ[3:0], followed by the data bytes.

If S# is not driven HIGH, the command is not executed, the flag status register error bits

are not set and the write enable latch remains set to 1. Reserved bits are not affected by

this command.

READ LOCK REGISTER Command

To execute the READ LOCK REGISTER command, S# is driven LOW. For extended SPI

protocol, the command code is input on DQ0, followed by three address bytes that

point to a location in the sector. For dual SPI protocol, the command code is input on

DQ[1:0]. For quad SPI protocol, the command code is input on DQ[3:0]. Each address

bit is latched in during the rising edge of the clock. For extended SPI protocol, data is

shifted out on DQ1 at a maximum frequency fC during the falling edge of the clock. For

dual SPI protocol, data is shifted out on DQ[1:0], and for quad SPI protocol, data is shif-

ted out on DQ[3:0]. The operation is terminated by driving S# HIGH at any time during

data output.

When the register is read continuously, the same byte is output repeatedly. Any READ

LOCK REGISTER command that is executed while an ERASE, PROGRAM, or WRITE cy-

cle is in progress is rejected with no affect on the cycle in progress.

Table 17: Lock Register

Note 1 applies to entire table

Bit Name Settings Description

7:2 Reserved 0 Bit values are 0.

1 Sector lock down 0 = Cleared (Default)

1 = Set

Volatile bit: the device always powers-up with this bit cleared,

which means sector lock down and sector write lock bits can be

set.

When this bit set, neither of the lock register bits can be written

to until the next power cycle.

0 Sector write lock 0 = Cleared (Default)

1 = Set

Volatile bit: the device always powers-up with this bit cleared,

which means that PROGRAM and ERASE operations in this sector

can be executed and sector content modified.

When this bit is set, PROGRAM and ERASE operations in this sec-

tor will not be executed.

Note: 1. Sector lock register bits 1:0 are written to by the WRITE LOCK REGISTER command. The

command will not execute unless the sector lock down bit is cleared.

128Mb, 3V, Multiple I/O Serial Flash Memory

READ REGISTER and WRITE REGISTER Operations

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Figure 13: READ LOCK REGISTER Command

MSB

DQ[0]

LSB

Command

A[MAX]

A[MIN]

7 8 Cx

3 4 Cx

MSB

DQ[1:0]

LSB

Command

A[MAX]

A[MIN]

MSB

DOUT DOUT DOUT DOUT DOUT

LSB

1 2 Cx

MSB

DQ[3:0]

LSB

Command

A[MAX]

A[MIN]

MSB

DOUT DOUT DOUT

LSB

Extended

Dual

Quad

High-Z

DQ1

MSB

DOUT DOUT DOUT DOUT DOUT

LSB

DOUT DOUT DOUT DOUT

Don’t Care

Note: 1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).

For dual SPI protocol, Cx = 3 + ((A[MAX] + 1)/2).

For quad SPI protocol, Cx = 1 + ((A[MAX] + 1)/4).

WRITE LOCK REGISTER Command

To initiate the WRITE LOCK REGISTER command, the WRITE ENABLE command must

be executed to set the write enable latch bit to 1. S# is driven LOW and held LOW until

the eighth bit of the last data byte has been latched in, after which it must be driven

HIGH. The command code is input on DQn, followed by three address bytes that point

to a location in the sector, and then one data byte that contains the desired settings for

lock register bits 0 and 1. Each address bit is latched in during the rising edge of the

clock.

When execution is complete, the write enable latch bit is cleared within tSHSL2 and no

error bits are set. Because lock register bits are volatile, change to the bits is immediate.

WRITE LOCK REGISTER can be executed when an ERASE SUSPEND operation is in ef-

fect. If S# is not driven HIGH, the command is not executed, flag status register error

bits are not set, and the write enable latch remains set to 1.

128Mb, 3V, Multiple I/O Serial Flash Memory

READ REGISTER and WRITE REGISTER Operations

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Figure 14: WRITE LOCK REGISTER Command

7 8 Cx

MSB

DQ0

LSB

Command

A[MAX]

A[MIN]

MSB

DIN DIN DIN DIN DIN

LSB

DIN DIN DIN DIN

3 4 Cx

MSB

DQ[1:0]

LSB

Command

A[MAX]

A[MIN]

MSB

DIN DIN DIN DIN DIN

LSB

1 2 Cx

MSB

DQ[3:0]

LSB

Command

A[MAX]

A[MIN]

MSB

DIN DIN DIN

LSB

Extended

Dual

Quad

Note: 1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).

For dual SPI protocol, Cx = 3 + ((A[MAX] + 1)/2).

For quad SPI protocol, Cx = 1 + ((A[MAX] + 1)/4).

CLEAR FLAG STATUS REGISTER Command

To execute the CLEAR FLAG STATUS REGISTER command and reset the error bits

(erase, program, and protection), S# is driven LOW. For extended SPI protocol, the com-

mand code is input on DQ0. For dual SPI protocol, the command code is input on

DQ[1:0]. For quad SPI protocol, the command code is input on DQ[3:0]. The operation

is terminated by driving S# HIGH at any time.

128Mb, 3V, Multiple I/O Serial Flash Memory

READ REGISTER and WRITE REGISTER Operations

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READ IDENTIFICATION Operations

READ ID and MULTIPLE I/O READ ID Commands

To execute the READ ID or MULTIPLE I/O READ ID commands, S# is driven LOW and

the command code is input on DQn. The device outputs the information shown in the

tables below. If an ERASE or PROGRAM cycle is in progress when the command is exe-

cuted, the command is not decoded and the command cycle in progress is not affected.

When S# is driven HIGH, the device goes to standby. The operation is terminated by

driving S# HIGH at any time during data output.

Table 18: Data/Address Lines for READ ID and MULTIPLE I/O READ ID Commands

Command Name Data In Data Out

Unique ID

is Output Extended Dual Quad

READ ID DQ0 DQ0 Yes Yes No No

MULTIPLE I/O READ ID DQ[3:0] DQ[1:0] No No Yes Yes

Note: 1. Yes in the protocol columns indicates that the command is supported and has the same

functionality and command sequence as other commands marked Yes.

Table 19: Read ID Data Out

Size

(Bytes) Name Content Value Assigned by

1Manufacturer ID 20h JEDEC

2Device ID

Memory Type BAh Manufacturer

Memory Capacity 18h (128Mb)

17 Unique ID

1 Byte: Length of data to follow 10h Factory

2 Bytes: Extended device ID and device

configuration information

ID and information such as uniform

architecture, and HOLD

or RESET functionality

14 Bytes: Customized factory data Unique ID code (n read-only bytes)

Note: 1. The 17 bytes of information in the unique ID is read by the READ ID command, but can-

not be read by the MULTIPLE I/O READ ID command.

Table 20: Extended Device ID, First Byte

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Reserved Reserved 1 = Reserved

0 = Standard BP

scheme

Volatile configuration

0 = Required

1 = Not required

HOLD#/RESET#:

0 = HOLD

1 = RESET

Addressing:

0 = by byte

Architecture:

00 = Uniform

128Mb, 3V, Multiple I/O Serial Flash Memory

READ IDENTIFICATION Operations

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Figure 15: READ ID and MULTIPLE I/O Read ID Commands

UID

Device

identification

Manufacturer

identification

High-Z

DQ1

MSB MSB

DOUT DOUT DOUT DOUT

LSB

7 8 15 16 32

MSB

DQ0

LSB

Command

MSB

DOUT DOUT

LSB

Extended (READ ID)

Dual (MULTIPLE I/O READ ID )

Quad (MULTIPLE I/O READ ID )

Don’t Care

3 4 7815

MSB

DQ[1:0]

LSB

Command

Device

identification

Manufacturer

identification

MSB MSB

DOUT DOUT DOUT DOUT

LSB

1 2 347

MSB

DQ[3:0]

LSB

Command

Device

identification

Manufacturer

identification

MSB MSB

DOUT DOUT DOUT DOUT

LSB

Note: 1. The READ ID command is represented by the extended SPI protocol timing shown first.

The MULTIPLE I/O READ ID command is represented by the dual and quad SPI protocols

are shown below extended SPI protocol.

READ SERIAL FLASH DISCOVERY PARAMETER Command

To execute READ SERIAL FLASH DISCOVERY PARAMETER command, S# is driven

LOW. The command code is input on DQ0, followed by three address bytes and 8 dum-

my clock cycles in extended or dual SPI protocol, 10 dummy clock cycles in quad SPI

protocol. The device outputs the information starting from the specified address. When

the 2048-byte boundary is reached, the data output wraps to address 0 of the serial

Flash discovery parameter table. The operation is terminated by driving S# HIGH at any

time during data output.

The operation always executes in continuous mode so the read burst wrap setting in the

volatile configuration register does not apply.

Note: Data to be stored in the serial Flash discovery parameter area is still in the defini-

tion phase.

128Mb, 3V, Multiple I/O Serial Flash Memory

READ IDENTIFICATION Operations

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Table 21: Serial Flash Discovery Parameter – Header Structure

Description

Byte

Address Bits

Data

128Mb

SFDP signature 00h 7:0 53h

01h 7:0 46h

02h 7:0 44h

03h 7:0 50h

SFDP revision Minor 04h 7:0 00h

Major 05h 7:0 01h

Number of parameter headers 06h 7:0 00h

Unused 07h 7:0 FFh

Parameter ID (0) 08h 7:0 00h

Parameter minor revision 09h 7:0 00h

Parameter major revision 0Ah 7:0 01h

Parameter length (in DW) 0Bh 7:0 09h

Parameter table pointer 0Ch 7:0 30h

0Dh 7:0 00h

0Eh 7:0 00h

Unused 0Fh 7:0 FFh

Note: 1. Locations 10h to 2Fh contain FFh.

Table 22: Parameter ID

Description

Byte

Address Bits

Data

128Mb

Minimum block/sector erase sizes 30h 1:0 01b

Write granularity 2 1

WRITE ENABLE command required for writing to volatile status

registers

3 0

WRITE ENABLE command code select for writing to volatile status

4 0

Unused 7:5 111b

4KB ERASE command code 31h 7:0 20h

Supports 1-1-2 fast read 32h 0 1

Address bytes 2:1 00b

Supports double transfer rate clocking 3 0

Supports 1-2-2 fast read 4 1

Supports 1-4-4 fast read 5 1

Supports 1-1-4 fast read 6 1

Unused 7 1

Reserved 33h 7:0 FFh

128Mb, 3V, Multiple I/O Serial Flash Memory

READ IDENTIFICATION Operations

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Table 22: Parameter ID (Continued)

Description

Byte

Address Bits

Data

128Mb

Flash size (in bits) 34h 7:0 FFh

35h 7:0 FFh

36h 7:0 FFh

37h 7:0 07h

1-4-4 FAST READ DUMMY cycle count 38h 4:0 01001b

1-4-4 fast read number of mode bits 7:5 001b

1-4-4 FAST READ command code 39h 7:0 EBh

1-1-4 FAST READ DUMMY cycle count 3Ah 4:0 00111b

1-1-4 fast read number of mode bits 7:5 001b

1-1-4 FAST READ command code 3Bh 7:0 6Bh

1-1-2 FAST READ DUMMY cycle count 3Ch 4:0 01000b

1-1-2 fast read number of mode bits 7:5 000b

1-1-2 FAST READ command code 3Dh 7:0 3Bh

1-2-2 FAST READ DUMMY cycle count 3Eh 4:0 00111b

1-2-2 fast read number of mode bits 7:5 001b

1-2-2 Instruction opcode 3Fh 7:0 BBh

Supports 2-2-2 fast read 40h 0 1

Reserved 3:1 111b

Supports 4-4-4 fast read 4 1

Reserved 7:5 111b

Reserved 43:41h FFFFFFh FFFFFFh

Reserved 45:44h FFFFh FFFFh

2-2-2 FAST READ DUMMY cycle count 46h 4:0 00111b

2-2-2 fast read number of mode bits 7:5 001b

2-2-2 FAST READ command code 47h 7:0 BBh

Reserved 49:48h FFFFh FFFFh

4-4-4 FAST READ DUMMY cycle count 4Ah 4:0 01001b

4-4-4 fast read number of mode bits 7:5 001b

4-4-4 FAST READ command code 4Bh 7:0 EBh

Sector type 1 size 4Ch 7:0 0Ch

Sector type 1 command code 4Dh 7:0 20h

Sector type 2 size 4Eh 7:0 10h

Sector type 2 command code 4Fh 7:0 D8h

Sector type 3 size 50h 7:0 00h

Sector type 3 command code 51h 7:0 00h

Sector type 4 size 52h 7:0 00h

Sector type 4 command code 53h 7:0 00h

128Mb, 3V, Multiple I/O Serial Flash Memory

READ IDENTIFICATION Operations

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READ MEMORY Operations

The device supports default reading and writing to an A[MAX:MIN] of A[23:0].

To execute READ MEMORY commands, S# is driven LOW. The command code is input

on DQn, followed by input on DQn of three address bytes. Each address bit is latched in

during the rising edge of the clock. The addressed byte can be at any location, and the

address automatically increments to the next address after each byte of data is shifted

out; therefore, the entire memory can be read with a single command. The operation is

terminated by driving S# HIGH at any time during data output.

Table 23: Command/Address/Data Lines for READ MEMORY Commands

Note 1 applies to entire table

Command Name

READ

FAST

READ

DUAL OUTPUT

FAST READ

DUAL

INPUT/OUTPUT

FAST READ

QUAD OUTPUT

FAST READ

QUAD

INPUT/OUTPUT

FAST READ

03 0B 3B BB 6B EB

Extended SPI Protocol

Supported Yes Yes Yes Yes Yes Yes

Command Input DQ0 DQ0 DQ0 DQ0 DQ0 DQ0

Address Input DQ0 DQ0 DQ0 DQ[1:0] DQ0 DQ[3:0]

Data Output DQ1 DQ1 DQ[1:0] DQ[1:0] DQ[3:0] DQ[3:0]

Dual SPI Protocol

Supported No Yes Yes Yes No No

Command Input – DQ[1:0] DQ[1:0] DQ[1:0] – –

Address Input – DQ[1:0] DQ[1:0] DQ[1:0] – –

Data Output – DQ[1:0] DQ[1:0] DQ[1:0] – –

Quad SPI Protocol

Supported No Yes No No Yes Yes

Command Input – DQ[3:0] – – DQ[3:0] DQ[3:0]

Address Input – DQ[3:0] – – DQ[3:0] DQ[3:0]

Data Output – DQ[3:0] – – DQ[3:0] DQ[3:0]

Notes: 1. Yes in the "Supported" row for each protocol indicates that the command in that col-

umn is supported; when supported, a command's functionality is identical for the entire

column regardless of the protocol. For example, a FAST READ functions the same for all

three protocols even though its data is input/output differently depending on the pro-

tocol.

2. FAST READ is similar to READ, but requires dummy clock cycles following the address

bytes and can operate at a higher frequency (fC).

128Mb, 3V, Multiple I/O Serial Flash Memory

READ MEMORY Operations

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Figure 16: READ Command

Don’t Care

MSB

DQ[0]

LSB

Command

A[MAX]

A[MIN]

7 8 Cx

Extended

High-Z

DQ1

MSB

DOUT DOUT DOUT DOUT DOUT

LSB

DOUT DOUT DOUT DOUT

Note: 1. Cx = 7 + (A[MAX] + 1).

Figure 17: FAST READ Command

7 8 Cx

MSB

DQ0

LSB

Command

A[MAX]

A[MIN]

3 4 Cx

MSB

DQ[1:0]

LSB

Command

A[MAX]

A[MIN]

MSB

DOUT DOUT DOUT DOUT DOUT

LSB

Dummy cycles

1 2 Cx

MSB

DQ[3:0]

LSB

Command

A[MAX]

A[MIN]

MSB

DOUT DOUT DOUT

LSB

Dummy cycles

Extended

MSB

DOUT DOUT DOUT DOUT DOUT

LSB

DOUT DOUT DOUT DOUT

Dummy cycles

Dual

Quad

DQ1 High-Z

Don’t Care

Note: 1. For extended protocol, Cx = 7 + (A[MAX] + 1); For dual protocol, Cx = 3 + (A[MAX] + 1)/2;

For quad protocol, Cx = 1 + (A[MAX] + 1)/4.

128Mb, 3V, Multiple I/O Serial Flash Memory

READ MEMORY Operations

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Figure 18: DUAL OUTPUT FAST READ

7 8 Cx

MSB

DQ0

LSB

Command DOUT

LSB

DQ1 DOUT

A[MAX]

High-Z

A[MIN]

DOUT

MSB

DOUT

Dummy cycles

DQ[1:0]

Dual

Extended

3 4 Cx

MSB

LSB

Command

A[MAX]

A[MIN]

MSB

DOUT DOUT DOUT DOUT DOUT

LSB

Dummy cycles

Note: 1. Cx = 7 + (A[MAX] + 1).

Figure 19: DUAL INPUT/OUTPUT FAST READ Command

7 8 Cx

MSB

DQ0

LSB

Command DOUT

LSB

DQ1 DOUT

High-Z

A[MIN]

DOUT

MSB

DOUT

A[MAX]

Dummy cycles

3 4 Cx

MSB

DQ[1:0]

LSB

Command

A[MAX]

A[MIN]

MSB

DOUT DOUT DOUT DOUT DOUT

LSB

Dummy cycles

Dual

Extended

Note: 1. Cx = 7 + (A[MAX] + 1)/2.

128Mb, 3V, Multiple I/O Serial Flash Memory

READ MEMORY Operations

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Figure 20: QUAD OUTPUT FAST READ Command

Dummy cycles

7 8 Cx

MSB

DQ0

LSB

Command DOUT

LSB

DQ[2:1] DOUT

A[MAX]

High-Z

A[MIN]

DOUT

DQ3 DOUT

‘1’

MSB

DOUT DOUT

1 2 Cx

MSB

DQ[3:0]

LSB

Command

A[MAX]

A[MIN]

MSB

DOUT DOUT DOUT

LSB

Dummy cycles

Quad

Extended

Note: 1. Cx = 7 + (A[MAX] + 1).

Figure 21: QUAD INPUT/OUTPUT FAST READ Command

Dummy cycles

7 8 Cx

MSB

DQ0

LSB

Command DOUT

LSB

DQ[2:1] DOUT

High-Z

A[MIN]

DOUT

DQ3 DOUT

‘1’

MSB

DOUT DOUT

A[MAX]

1 2 Cx

MSB

DQ[3:0]

LSB

Command

A[MAX]

A[MIN]

MSB

DOUT DOUT DOUT

LSB

Dummy cycles

Quad

Extended

Note: 1. Cx = 7 + (A[MAX] + 1)/4.

128Mb, 3V, Multiple I/O Serial Flash Memory

READ MEMORY Operations

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PROGRAM Operations

PROGRAM commands are initiated by first executing the WRITE ENABLE command to

set the write enable latch bit to 1. S# is then driven LOW and held LOW until the eighth

bit of the last data byte has been latched in, after which it must be driven HIGH. The

command code is input on DQ0, followed by input on DQ[n] of address bytes and at

least one data byte. Each address bit is latched in during the rising edge of the clock.

When S# is driven HIGH, the operation, which is self-timed, is initiated; its duration is

tPP.

If the bits of the least significant address, which is the starting address, are not all zero,

all data transmitted beyond the end of the current page is programmed from the start-

ing address of the same page. If the number of bytes sent to the device exceed the maxi-

mum page size, previously latched data is discarded and only the last maximum page-

size number of data bytes are guaranteed to be programmed correctly within the same

page. If the number of bytes sent to the device is less than the maximum page size, they

are correctly programmed at the specified addresses without any effect on the other

bytes of the same page.

When the operation is in progress, the write in progress bit is set to 1. The write enable

latch bit is cleared to 0, whether the operation is successful or not. The status register

and flag status register can be polled for the operation status. An operation can be

paused or resumed by the PROGRAM/ERASE SUSPEND or PROGRAM/ERASE RESUME

command, respectively. When the operation completes, the write in progress bit is

cleared to 0.

If the operation times out, the write enable latch bit is reset and the program fail bit is

set to 1. If S# is not driven HIGH, the command is not executed, flag status register error

bits are not set, and the write enable latch remains set to 1. When a command is applied

to a protected sector, the command is not executed, the write enable latch bit remains

set to 1, and flag status register bits 1 and 4 are set.

Table 24: Data/Address Lines for PROGRAM Commands

Note 1 applies to entire table

Command Name Data In Address In Extended Dual Quad

PAGE PROGRAM DQ0 DQ0 Yes Yes Yes

DUAL INPUT FAST PROGRAM DQ[1:0] DQ0 Yes Yes No

EXTENDED DUAL INPUT

FAST PROGRAM

DQ[1:0] DQ[1:0] Yes Yes No

QUAD INPUT FAST PROGRAM DQ[3:0] DQ0 Yes No Yes

EXTENDED QUAD INPUT

FAST PROGRAM

DQ[3:0] DQ[3:0] Yes No Yes

Note: 1. Yes in the protocol columns indicates that the command is supported and has the same

functionality and command sequence as other commands marked Yes.

128Mb, 3V, Multiple I/O Serial Flash Memory

PROGRAM Operations

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Figure 22: PAGE PROGRAM Command

7 8 Cx

MSB

DQ0

LSB

Command

A[MAX]

A[MIN]

MSB

DIN DIN DIN DIN DIN

LSB

DIN DIN DIN DIN

3 4 Cx

MSB

DQ[1:0]

LSB

Command

A[MAX]

A[MIN]

MSB

DIN DIN DIN DIN DIN

LSB

1 2 Cx

MSB

DQ[3:0]

LSB

Command

A[MAX]

A[MIN]

MSB

DIN DIN DIN

LSB

Extended

Dual

Quad

Note: 1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).

For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.

For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.

Figure 23: DUAL INPUT FAST PROGRAM Command

Extended

Dual 3 4 Cx

MSB

DQ[1:0]

LSB

Command DIN

LSB

A[MAX]

A[MIN]

MSB

DIN DIN DIN DIN

7 8 Cx

MSB

DQ0

LSB

Command DIN

LSB

DQ1 DIN

A[MAX]

High-Z

A[MIN]

DIN

MSB

DIN

Note: 1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).

For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.

128Mb, 3V, Multiple I/O Serial Flash Memory

PROGRAM Operations

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Figure 24: EXTENDED DUAL INPUT FAST PROGRAM Command

Extended

Dual 3 4 Cx

MSB

DQ[1:0]

LSB

Command DIN

LSB

A[MAX]

A[MIN]

MSB

DIN DIN DIN DIN

7 8 Cx

MSB

DQ0

LSB

Command DIN

LSB

DQ1 DIN

High-Z

A[MIN]

A[MAX]

DIN

MSB

DIN

Note: 1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1)/2.

For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.

Figure 25: QUAD INPUT FAST PROGRAM Command

7 8 Cx

MSB

DQ0

LSB

Command DIN

LSB

DQ[3:1] DIN

A[MAX]

High-Z

A[MIN]

DIN

MSB

DIN

Extended

Quad 1 2 Cx

MSB

DQ[3:0]

LSB

Command DIN

LSB

A[MAX]

A[MIN]

MSB

DIN DIN

Note: 1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1)/4.

For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.

128Mb, 3V, Multiple I/O Serial Flash Memory

PROGRAM Operations

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Figure 26: EXTENDED QUAD INPUT FAST PROGRAM Command

7 8 Cx

MSB

DQ0

LSB

Command DIN

LSB

DQ[2:1] DIN

High-Z

A[MIN]

A[MAX]

DIN

DQ3 DIN

‘1’

MSB

DIN DIN

Extended

Quad 1 2 Cx

MSB

DQ[3:0]

LSB

Command DIN

LSB

A[MAX]

A[MIN]

MSB

DIN DIN

Note: 1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1)/4.

For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.

128Mb, 3V, Multiple I/O Serial Flash Memory

PROGRAM Operations

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WRITE Operations

WRITE ENABLE Command

The WRITE ENABLE operation sets the write enable latch bit. To execute a WRITE ENA-

BLE command, S# is driven LOW and held LOW until the eighth bit of the command

code has been latched in, after which it must be driven HIGH. The command code is

input on DQ0 for extended SPI protocol, on DQ[1:0] for dual SPI protocol, and on

DQ[3:0] for quad SPI protocol.

The write enable latch bit must be set before every PROGRAM, ERASE, and WRITE com-

mand. If S# is not driven HIGH after the command code has been latched in, the com-

mand is not executed, flag status register error bits are not set, and the write enable

latch remains cleared to its default setting of 0.

WRITE DISABLE Command

The WRITE DISABLE operation clears the write enable latch bit. To execute a WRITE

DISABLE command, S# is driven LOW and held LOW until the eighth bit of the com-

mand code has been latched in, after which it must be driven HIGH. The command

code is input on DQ0 for extended SPI protocol, on DQ[1:0] for dual SPI protocol, and

on DQ[3:0] for quad SPI protocol.

If S# is not driven HIGH after the command code has been latched in, the command is

not executed, flag status register error bits are not set, and the write enable latch re-

mains set to 1.

128Mb, 3V, Multiple I/O Serial Flash Memory

WRITE Operations

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Figure 27: WRITE ENABLE and WRITE DISABLE Command Sequence

DQ0

MSB

LSB

Dual

Don’t Care

Command Bits

DQ0

01 2 4 53 76

Extended

High-Z

DQ1

MSB

LSB

0 0 0 0 0 011

Command Bits

0 0 1 0

MSB

LSB

DQ1

DQ2

Quad

Command Bits

DQ3 0 0

DQ0 0 0

DQ1 0 0 0 1

1 2

Note: 1. Shown here is the WRITE ENABLE command code, which is 06h or 0000 0110 binary. The

WRITE DISABLE command sequence is identical, except the WRITE DISABLE command

code is 04h or 0000 0100 binary.

128Mb, 3V, Multiple I/O Serial Flash Memory

WRITE Operations

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ERASE Operations

SUBSECTOR ERASE Command

To execute the SUBSECTOR ERASE command (and set the selected subsector bits set to

FFh), the WRITE ENABLE command must be issued to set the write enable latch bit to

1. S# is driven LOW and held LOW until the eighth bit of the last data byte has been

latched in, after which it must be driven HIGH. The command code is input on DQ0,

followed by three address bytes; any address within the subsector is valid. Each address

bit is latched in during the rising edge of the clock. When S# is driven HIGH, the opera-

tion, which is self-timed, is initiated; its duration is tSSE. The operation can be suspen-

ded and resumed by the PROGRAM/ERASE SUSPEND and PROGRAM/ERASE RESUME

commands, respectively.

If the write enable latch bit is not set, the device ignores the SUBSECTOR ERASE com-

mand and no error bits are set to indicate operation failure.

When the operation is in progress, the write in progress bit is set to 1. The write enable

latch bit is cleared to 0, whether the operation is successful or not. The status register

and flag status register can be polled for the operation status. When the operation com-

pletes, the write in progress bit is cleared to 0.

If the operation times out, the write enable latch bit is reset and the erase error bit is set

to 1. If S# is not driven HIGH, the command is not executed, flag status register error

bits are not set, and the write enable latch remains set to 1. When a command is applied

to a protected subsector, the command is not executed. Instead, the write enable latch

bit remains set to 1, and flag status register bits 1 and 5 are set.

SECTOR ERASE Command

To execute the SECTOR ERASE command (and set selected sector bits to FFh), the

WRITE ENABLE command must be issued to set the write enable latch bit to 1. S# is

driven LOW and held LOW until the eighth bit of the last data byte has been latched in,

after which it must be driven HIGH. The command code is input on DQ0, followed by

three address bytes; any address within the sector is valid. Each address bit is latched in

during the rising edge of the clock. When S# is driven HIGH, the operation, which is

self-timed, is initiated; its duration is tSE. The operation can be suspended and resumed

by the PROGRAM/ERASE SUSPEND and PROGRAM/ERASE RESUME commands, re-

spectively.

If the write enable latch bit is not set, the device ignores the SECTOR ERASE command

and no error bits are set to indicate operation failure.

When the operation is in progress, the write in progress bit is set to 1 and the write ena-

ble latch bit is cleared to 0, whether the operation is successful or not. The status regis-

ter and flag status register can be polled for the operation status. When the operation

completes, the write in progress bit is cleared to 0.

If the operation times out, the write enable latch bit is reset and erase error bit is set to

1. If S# is not driven HIGH, the command is not executed, flag status register error bits

are not set, and the write enable latch remains set to 1. When a command is applied to a

protected sector, the command is not executed. Instead, the write enable latch bit re-

mains set to 1, and flag status register bits 1 and 5 are set.

128Mb, 3V, Multiple I/O Serial Flash Memory

ERASE Operations

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Figure 28: SUBSECTOR and SECTOR ERASE Command

7 8 Cx

MSB

DQ0

LSB

Command

A[MAX]

A[MIN]

3 4 Cx

MSB

DQ0[1:0]

LSB

Command

A[MAX]

A[MIN]

1 2 Cx

MSB

DQ0[3:0]

LSB

Command

A[MAX]

A[MIN]

Extended

Dual

Quad

Note: 1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).

For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.

For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.

BULK ERASE Command

To initiate the BULK ERASE command, the WRITE ENABLE command must be issued

to set the write enable latch bit to 1. S# is driven LOW and held LOW until the eighth bit

of the last data byte has been latched in, after which it must be driven HIGH. The com-

mand code is input on DQ0. When S# is driven HIGH, the operation, which is self-

timed, is initiated; its duration is tBE.

If the write enable latch bit is not set, the device ignores the BULK ERASE command

and no error bits are set to indicate operation failure.

When the operation is in progress, the write in progress bit is set to 1 and the write ena-

ble latch bit is cleared to 0, whether the operation is successful or not. The status regis-

ter and flag status register can be polled for the operation status. When the operation

completes, the write in progress bit is cleared to 0.

If the operation times out, the write enable latch bit is reset and erase error bit is set to

1. If S# is not driven HIGH, the command is not executed, the flag status register error

bits are not set, and the write enable latch remains set to 1.

The command is not executed if any sector is locked. Instead, the write enable latch bit

remains set to 1, and flag status register bits 1 and 5 are set.

128Mb, 3V, Multiple I/O Serial Flash Memory

ERASE Operations

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Figure 29: BULK ERASE Command

MSB

DQ0

LSB

Command

MSB

DQ[1:0]

LSB

Command

MSB

DQ[3:0]

LSB

Command

Extended

Dual

Quad

PROGRAM/ERASE SUSPEND Command

To initiate the PROGRAM/ERASE SUSPEND command, S# is driven LOW. The com-

mand code is input on DQ0. The operation is terminated by the PROGRAM/ERASE RE-

SUME command.

PROGRAM/ERASE SUSPEND command enables the memory controller to interrupt

and suspend an array PROGRAM or ERASE operation within the program/erase latency.

If a SUSPEND command is issued during a PROGRAM operation, then the flag status

also set to 1, showing the device to be in a suspended state, waiting for any operation

(see the Operations Allowed/Disallowed During Device States table).

If a SUSPEND command is issued during an ERASE operation, then the flag status regis-

ter bit 6 is set to 1. After erase/program latency time, the flag status register bit 7 is also

set to 1, showing that device to be in a suspended state, waiting for any operation (see

the Operations Allowed/Disallowed During Device States table).

If the time remaining to complete the operation is less than the suspend latency, the de-

vice completes the operation and clears the flag status register bits 2 or 6, as applicable.

Because the suspend state is volatile, if there is a power cycle, the suspend state infor-

mation is lost and the flag status register powers up as 80h.

During an ERASE SUSPEND operation, a PROGRAM or READ operation is possible in

any sector except the one in a suspended state. Reading from a sector that is in a sus-

pended state will output indeterminate data. The device ignores a PROGRAM com-

mand to a sector that is in an ERASE SUSPEND state; it also sets the flag status register

bit 4 to 1: program failure/protection error, and leaves the write enable latch bit un-

changed. The commands allowed during an erase suspend state include the WRITE

LOCK REGISTER command, the WRITE VOLATILE CONFIGURATION REGISTER com-

128Mb, 3V, Multiple I/O Serial Flash Memory

ERASE Operations

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mand, and the WRITE ENHANCED VOLATILE CONFIGURATION REGISTER command.

When the ERASE operation resumes, it does not check the new lock status of the WRITE

LOCK REGISTER command.

During a PROGRAM SUSPEND operation, a READ operation is possible in any page ex-

cept the one in a suspended state. Reading from a page that is in a suspended state will

output indeterminate data. The commands allowed during a program suspend state in-

clude the WRITE VOLATILE CONFIGURATION REGISTER command and the WRITE

ENHANCED VOLATILE CONFIGURATION REGISTER command.

It is possible to nest a PROGRAM/ERASE SUSPEND operation inside a PROGRAM/

ERASE SUSPEND operation just once. Issue an ERASE command and suspend it. Then

issue a PROGRAM command and suspend it also. With the two operations suspended,

the next PROGRAM/ERASE RESUME command resumes the latter operation, and a sec-

ond PROGRAM/ERASE RESUME command resumes the former (or first) operation.

Table 25: Suspend Parameters

Parameter Condition Typ Max Units Notes

Erase to suspend Sector erase or erase resume to erase suspend 150 – µs 1

Program to suspend Program resume to program suspend 5 – µs 1

Subsector erase to sus-

pend

Subsector erase or subsector erase resume to erase sus-

pend

50 – µs 1

Suspend latency Program 7 – µs 2

Suspend latency Subsector erase 15 – µs 2

Suspend latency Erase 15 – µs 3

Notes: 1. Timing is not internally controlled.

2. Any READ command accepted.

3. Any command except the following are accepted: SECTOR, SUBSECTOR, or BULK ERASE;

WRITE STATUS REGISTER; WRITE NONVOLATILE CONFIGURATION REGISTER; and PRO-

GRAM OTP.

Table 26: Operations Allowed/Disallowed During Device States

Note 1 applies to entire table

Operation

Standby

State

Program or

Erase State

Subsector Erase Suspend or

Program Suspend State

Erase Suspend

State Notes

READ Yes No Yes Yes 2

PROGRAM Yes No No Yes/No 3

ERASE Yes No No No 4

WRITE Yes No No No 5

WRITE Yes No Yes Yes 6

READ Yes Yes Yes Yes 7

SUSPEND No Yes No No 8

Notes: 1. The device can be in only one state at a time. Depending on the state of the device,

some operations are allowed (Yes) and others are not (No). For example, when the de-

vice is in the standby state, all operations except SUSPEND are allowed in any sector. For

all device states except the erase suspend state, if an operation is allowed or disallowed

128Mb, 3V, Multiple I/O Serial Flash Memory

ERASE Operations

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in one sector, it is allowed or disallowed in all other sectors. In the erase suspend state, a

PROGRAM operation is allowed in any sector except the one in which an ERASE opera-

tion has been suspended.

2. All READ operations except READ STATUS REGISTER and READ FLAG REGISTER. When is-

sued to a sector or subsector that is simultaneously in an erase suspend state, the READ

operation is accepted, but the data output is not guaranteed until the erase has comple-

ted.

3. All PROGRAM operations except PROGRAM OTP. In the erase suspend state, a PROGRAM

operation is allowed in any sector (Yes) except the sector (No) in which an ERASE opera-

tion has been suspended.

4. Applies to the SECTOR ERASE or SUBSECTOR ERASE operation.

5. Applies to the following operations: WRITE STATUS REGISTER, WRITE NONVOLATILE

CONFIGURATION REGISTER, PROGRAM OTP, and BULK ERASE.

6. Applies to the following operations: WRITE ENABLE, WRITE DISABLE, CLEAR FLAG STA-

TUS REGISTER, WRITE LOCK REGISTER, WRITE VOLATILE, and ENHANCED VOLATILE CON-

FIGURATION REGISTER.

7. Applies to the READ STATUS REGISTER or READ FLAG STATUS REGISTER operation.

8. Applies to the PROGRAM SUSPEND or ERASE SUSPEND operation.

PROGRAM/ERASE RESUME Command

To initiate the PROGRAM/ERASE RESUME command, S# is driven LOW. The command

code is input on DQ0. The operation is terminated by driving S# HIGH.

When this command is executed, the status register write in progress bit is set to 1, and

the flag status register program erase controller bit is set to 0. This command is ignored

if the device is not in a suspended state.

128Mb, 3V, Multiple I/O Serial Flash Memory

ERASE Operations

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ONE TIME PROGRAMMABLE Operations

READ OTP ARRAY Command

To initiate a READ OTP ARRAY command, S# is driven LOW. The command code is in-

put on DQ0, followed by three bytes and dummy clock cycles. Each address bit is latch-

ed in during the rising edge of C. Data is shifted out on DQ1, beginning from the speci-

fied address and at a maximum frequency of fC (MAX) on the falling edge of the clock.

The address increments automatically to the next address after each byte of data is shif-

ted out. There is no rollover mechanism; therefore, if read continuously, after location

40h, the device continues to output data at location 40h. The operation is terminated by

driving S# HIGH at any time during data output.

Figure 30: READ OTP Command

7 8 Cx

MSB

DQ0

LSB

Command

A[MAX]

A[MIN]

3 4 Cx

MSB

DQ[1:0]

LSB

Command

A[MAX]

A[MIN]

MSB

DOUT DOUT DOUT DOUT DOUT

LSB

Dummy cycles

1 2 Cx

MSB

DQ[3:0]

LSB

Command

A[MAX]

A[MIN]

MSB

DOUT DOUT DOUT

LSB

Dummy cycles

Extended

MSB

DOUT DOUT DOUT DOUT DOUT

LSB

DOUT DOUT DOUT DOUT

Dummy cycles

Dual

Quad

DQ1 High-Z

Don’t Care

Note: 1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).

For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.

For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.

PROGRAM OTP ARRAY Command

To initiate the PROGRAM OTP ARRAY command, the WRITE ENABLE command must

be issued to set the write enable latch bit to 1; otherwise, the PROGRAM OTP ARRAY

command is ignored and flag status register bits are not set. S# is driven LOW and held

LOW until the eighth bit of the last data byte has been latched in, after which it must be

driven HIGH. The command code is input on DQ0, followed by three bytes and at least

one data byte. Each address bit is latched in during the rising edge of the clock. When S#

is driven HIGH, the operation, which is self-timed, is initiated; its duration is tPOTP.

There is no rollover mechanism; therefore, after a maximum of 65 bytes are latched in

and subsequent bytes are discarded.

128Mb, 3V, Multiple I/O Serial Flash Memory

ONE TIME PROGRAMMABLE Operations

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PROGRAM OTP ARRAY programs, at most, 64 bytes to the OTP memory area and one

OTP control byte. When the operation is in progress, the write in progress bit is set to 1.

The write enable latch bit is cleared to 0, whether the operation is successful or not, and

the status register and flag status register can be polled for the operation status. When

the operation completes, the write in progress bit is cleared to 0.

If the operation times out, the write enable latch bit is reset and the program fail bit is

set to 1. If S# is not driven HIGH, the command is not executed, flag status register error

bits are not set, and the write enable latch remains set to 1.

The OTP control byte (byte 64) is used to permanently lock the OTP memory array.

Table 27: OTP Control Byte (Byte 64)

Bit Name Settings Description

0 OTP control byte 0 = Locked

1 = Unlocked

(Default)

Used to permanently lock the OTP array (byte 64). When bit 0 = 1, the

OTP array can be programmed. When bit 0 = 0, the OTP array is read only.

Once bit 0 has been programmed to 0, it can no longer be changed to 1.

PROGRAM OTP ARRAY is ignored, write enable latch bit remains set, and

flag status register bits 1 and 4 are set.

Figure 31: PROGRAM OTP Command

7 8 Cx

MSB

DQ0

LSB

Command

A[MAX]

A[MIN]

MSB

DIN DIN DIN DIN DIN

LSB

DIN DIN DIN DIN

3 4 Cx

MSB

DQ[1:0]

LSB

Command

A[MAX]

A[MIN]

MSB

DIN DIN DIN DIN DIN

LSB

1 2 Cx

MSB

DQ[3:0]

LSB

Command

A[MAX]

A[MIN]

MSB

DIN DIN DIN

LSB

Extended

Dual

Quad

Note: 1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).

For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.

For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.

128Mb, 3V, Multiple I/O Serial Flash Memory

ONE TIME PROGRAMMABLE Operations

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XIP Mode

Execute-in-place (XIP) mode allows the memory to be read by sending an address to the

device and then receiving the data on one, two, or four pins in parallel, depending on

the customer requirements. XIP mode offers maximum flexibility to the application,

saves instruction overhead, and reduces random access time.

Activate or Terminate XIP Using Volatile Configuration Register

Applications that boot in SPI and must switch to XIP use the volatile configuration reg-

ister. XIP provides faster memory READ operations by requiring only an address to exe-

cute, rather than a command code and an address.

To activate XIP requires two steps. First, enable XIP by setting volatile configuration reg-

ister bit 3 to 0. Next, drive the XIP confirmation bit to 0 during the next FAST READ op-

eration. XIP is then active. Once in XIP, any command that occurs after S# is toggled re-

quires only address bits to execute; a command code is not necessary, and device oper-

ations use the SPI protocol that is enabled. XIP is terminated by driving the XIP confir-

mation bit to 1. The device automatically resets volatile configuration register bit 3 to 1.

Note: For devices with basic XIP, indicated by a part number feature set digit of 2 or 4, it

is not necessary to set the volatile configuration register bit 3 to 0 to enable XIP. Instead,

it is enabled by setting the XIP confirmation bit to 0 during the first dummy clock cycle

after any FAST READ command.

Activate or Terminate XIP Using Nonvolatile Configuration Register

Applications that must boot directly in XIP use the nonvolatile configuration register. To

enable a device to power-up in XIP using the nonvolatile configuration register, set non-

volatile configuration register bits [11:9]. Settings vary according to protocol, as ex-

plained in the Nonvolatile Configuration Register section. Because the device boots di-

rectly in XIP, the confirmation bit is already set to 0, and after the next power cycle, XIP

is active. Once in XIP, a command code is unnecessary, and device operations use the

SPI protocol currently enabled. XIP is terminated by driving the XIP confirmation bit to

Figure 32: XIP Mode Directly After Power-On

VCC

DQ0

DQ[3:1]

DOUT

Xb DOUT DOUT DOUT DOUT

DOUT DOUT DOUT DOUT DOUT

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

tVSI (<100µ)

NVCR check:

XIP enabled

Dummy cycles

Mode 3

Mode 0

A[MAX] MSB

A[MIN] LSB

128Mb, 3V, Multiple I/O Serial Flash Memory

XIP Mode

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Note: 1. Xb is the XIP confirmation bit and should be set as follows: 0 to keep XIP state; 1 to exit

XIP mode and return to standard read mode.

Confirmation Bit Settings Required to Activate or Terminate XIP

The XIP confirmation bit setting activates or terminates XIP after it has been enabled or

disabled. This bit is the value on DQ0 during the first dummy clock cycle in the FAST

READ operation. XIP requires at least one additional clock cycle to send the XIP confir-

mation bit to the memory on DQ0 during the first dummy clock cycle.

Table 28: XIP Confirmation Bit

Bit Value Description

0 Activates XIP: While this bit is 0, XIP remains activated.

1 Terminates XIP: When this bit is set to 1, XIP is terminated and the device returns to SPI.

Table 29: Effects of Running XIP in Different Protocols

Protocol Effect Notes

Extended I/O,

Dual I/O

In a device with a dedicated part number where RST# is enabled, a LOW pulse on RST#

resets XIP and the device to the state it was in previous to the last power-up, as defined

by the nonvolatile configuration register.

Dual I/O Values of DQ1 during the first dummy clock cycle are "Don't Care."

Quad I/O Values of DQ[3:1] during the first dummy clock cycle are "Don't Care."

In a device with a dedicated part number where RST# is enabled, a LOW pulse on RST#

resets XIP and the device to the state it was in previous to the last power-up, as defined

by the nonvolatile configuration register.

Note: 1. In a device with a dedicated part number, memory can be reset only when the device is

deselected.

Terminating XIP After a Controller and Memory Reset

The system controller and the device can become out of synchronization if, during the

life of the application, the system controller is reset without the device being reset. In

such a case, the controller can reset the memory to power-on reset if the memory has

reset functionality. (Reset is available in devices with a dedicated part number.)

If reset functionality is not available, has been disabled, or is not supported by the con-

troller, the controller must execute the following sequence to terminate XIP in the

memory device. In quad I/O protocol, drive DQ0 = 1 with S# held LOW for seven clock

cycles; S# must driven HIGH before the eighth clock cycle. In dual I/O protocol, drive

DQ0 = 1 with S# held LOW for 13 clock cycles; S# must driven HIGH before the four-

teenth clock cycle. If the device is in extended protocol, drive DQ0 = 1 with S# held LOW

for 25 clock cycles; S# must driven HIGH before the twenty-sixth clock cycle.

These sequences cause the controller to set the XIP confirmation bit to 1, thereby termi-

nating XIP. However, it does not reset the device or interrupt PROGRAM/ERASE opera-

tions that may be in progress. After terminating XIP, the controller must execute RESET

ENABLE and RESET MEMORY to implement a software reset and reset the device.

128Mb, 3V, Multiple I/O Serial Flash Memory

XIP Mode

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Power-Up and Power-Down

Power-Up and Power-Down Requirements

At power-up and power-down, the device must not be selected; that is, S# must follow

the voltage applied on VCC until VCC reaches the correct values: VCC,min at power-up and

VSS at power-down.

To avoid data corruption and inadvertent WRITE operations during power-up, a power-

on reset circuit is included. The logic inside the device is held to RESET while VCC is less

than the power-on reset threshold voltage shown here; all operations are disabled, and

the device does not respond to any instruction. During a standard power-up phase, the

device ignores all commands except READ STATUS REGISTER and READ FLAG STATUS

power-up, the device is in standby power mode; the write enable latch bit is reset; the

write in progress bit is reset; and the lock registers are configured as: (write lock bit, lock

down bit) = (0,0).

Normal precautions must be taken for supply line decoupling to stabilize the VCC sup-

ply. Each device in a system should have the VCC line decoupled by a suitable capacitor

(typically 100nF) close to the package pins. At power-down, when VCC drops from the

operating voltage to below the power-on-reset threshold voltage shown here, all opera-

tions are disabled and the device does not respond to any command.

Note: If power-down occurs while a WRITE, PROGRAM, or ERASE cycle is in progress,

data corruption may result.

VPPH must be applied only when VCC is stable and in the VCC,min to VCC,max voltage

range.

Figure 33: Power-Up Timing

CC,min

Chip

reset

Chip selection not allowed

Polling allowed

VTW =

VTR

Time

Device fully accessible

CC,max

SPI protocol Starting protocol

defined by NVCR

WIP = 1

WEL = 0

WIP = 0

WEL = 0

128Mb, 3V, Multiple I/O Serial Flash Memory

Power-Up and Power-Down

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Table 30: Power-Up Timing and VWI Threshold

Note 1 applies to entire table

Symbol Parameter Min Max Unit

tVTR VCC,min to read – 150 µs

tVTW VCC,min to device fully accessible – 150 µs

VWI Write inhibit voltage 1.5 2.5 V

Note: 1. Parameters listed are characterized only.

Power Loss Rescue Sequence

If a power loss occurs during a WRITE NONVOLATILE CONFIGURATION REGISTER

command, after the next power-on, the device might begin in an undetermined state

(XIP mode or an unnecessary protocol). If this happens, until the next power-up, a res-

cue sequence must reset the device to a fixed state (extended SPI protocol without XIP).

After the rescue sequence, the issue should be resolved by running the WRITE NONVO-

LATILE CONFIGURATION REGISTER command again. The rescue sequence is com-

posed of two parts that must be run in the correct order. During the entire sequence,

tSHSL2 must be at least 50ns. The first part of the sequence is DQ0 (PAD DATA) and

DQ3 (PAD HOLD) equal to 1 for the situations listed below:

• 7 clock cycles within S# LOW (S# becomes HIGH before 8th clock cycle)

• + 13 clock cycles within S# LOW (S# becomes HIGH before 14th clock cycle)

• + 25 clock cycles within S# LOW (S# becomes HIGH before 26th clock cycle)

The second part of the sequence is exiting from dual or quad SPI protocol by using the

following FFh sequence: DQ0 and DQ3 equal to 1 for 8 clock cycles within S# LOW; S#

becomes HIGH before 9th clock cycle.

After this two-part sequence the extended SPI protocol is active.

128Mb, 3V, Multiple I/O Serial Flash Memory

Power-Up and Power-Down

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AC Reset Specifications

Table 31: AC RESET Conditions

Note 1 applies to entire table

Parameter Symbol Conditions Min Typ Max Unit

Reset pulse

width

tRLRH2 50 – – ns

Reset recovery

time

tRHSL Device deselected (S# HIGH) and is in XIP mode – – 40 ns

Device deselected (S# HIGH) and is in standby mode – – 40 ns

Commands are being decoded, any READ operations are

in progress or any WRITE operation to volatile registers

are in progress

– – 40 ns

Any device array PROGRAM/ERASE/SUSPEND/RESUME,

PROGRAM OTP, NONVOLATILE SECTOR LOCK, and ERASE

NONVOLATILE SECTOR LOCK ARRAY operations are in

progress

– – 30 µs

While a WRITE STATUS REGISTER operation is in progress – tW – ms

While a WRITE NONVOLATILE CONFIGURATION REGIS-

TER operation is in progress

–tWNVCR – ms

On completion or suspension of a SUBSECTOR ERASE op-

eration

–tSSE – s

Software reset

recovery time

tSHSL3 Device deselected (S# HIGH) and is in standby mode – – 90 ns

On completion of any device array PROGRAM/ERASE/

SUSPEND/RESUME, SECTOR ERASE, PROGRAM OTP, PAGE

PROGRAM, DUAL INPUT FAST PROGRAM, EXTENDED

DUAL INPUT FAST PROGRAM, QUAD INPUT FAST PRO-

GRAM, or EXTENDED QUAD INPUT FAST PROGRAM op-

eration

– – 30 µs

On completion or suspension of a WRITE STATUS REGIS-

TER operation

–tW – ms

On completion or suspension of a WRITE NONVOLATILE

CONFIGURATION REGISTER operation

–tWNVCR – ms

On completion or suspension of a SUBSECTOR ERASE op-

eration

–tSSE – s

S# deselect to

reset valid

tSHRV Deselect to reset valid in quad output or in QIO-SPI 2 – – ns

Notes: 1. Values are guaranteed by characterization; not 100% tested.

2. The device reset is possible but not guaranteed if tRLRH < 50ns.

128Mb, 3V, Multiple I/O Serial Flash Memory

AC Reset Specifications

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Figure 34: Reset AC Timing During PROGRAM or ERASE Cycle

tSHRH

tRLRH

tRHSL

RESET#

Don’t Care

Figure 35: Reset Enable

DQ0

01234567 01234567

Reset enable Reset memory

tSHSL2 tSHSL3

Figure 36: Serial Input Timing

tSLCH

tCHSL

tDVCH tCHDX tCLCH

tCHCL

tCHSH tSHCH

tSHSL

DQ0

DQ1 High-Z High-Z

MSB in LSB in

Don’t Care

128Mb, 3V, Multiple I/O Serial Flash Memory

AC Reset Specifications

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Figure 37: Write Protect Setup and Hold During WRITE STATUS REGISTER Operation (SRWD = 1)

Don’t Care

High-Z High-Z

W#/VPP

DQ0

DQ1

tWHSL tSHWL

128Mb, 3V, Multiple I/O Serial Flash Memory

AC Reset Specifications

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Figure 38: Hold Timing

tHLCH

tCHHL tHHCH

tHLQZ

tCHHH

tHHQX

DQ0

DQ1

HOLD#

Don’t Care

128Mb, 3V, Multiple I/O Serial Flash Memory

AC Reset Specifications

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Figure 39: Output Timing

tCL tCH

DQ0

DQ1

LSB out

Address

LSB in

Don’t Care

tCLQX tCLQX tSHQZ

tCLQV tCLQV

Figure 40: VPPH Timing

DQ0

tVPPHSL

End of command

(identified by WIP polling)

VPPH

VPP

128Mb, 3V, Multiple I/O Serial Flash Memory

AC Reset Specifications

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Absolute Ratings and Operating Conditions

Stresses greater than those listed may cause permanent damage to the device. This is a

stress rating only. Exposure to absolute maximum rating and operating conditions for

extended periods may adversely affect reliability. Stressing the device beyond the abso-

lute maximum ratings may cause permanent damage.

Table 32: Absolute Ratings

Symbol Parameter Min Max Units Notes

TSTG Storage temperature –65 150 °C

TLEAD Lead temperature during soldering – See note 1 °C

VCC Supply voltage –0.6 4.0 V

VPP Fast program/erase voltage –0.2 10 V

VIO Input/output voltage with respect to ground –0.6 VCC + 0.6 V

VESD Electrostatic discharge voltage

(human body model)

–2000 2000 V 2

Notes: 1. Compliant with JEDEC Standard J-STD-020C (for small-body, Sn-Pb or Pb assembly),

RoHS, and the European directive on Restrictions on Hazardous Substances (RoHS)

2002/95/EU.

2. JEDEC Standard JESD22-A114A (C1 = 100pF, R1 = 1500Ω, R2 = 500Ω).

Table 33: Operating Conditions

Symbol Parameter Min Max Units

VCC Supply voltage 2.7 3.6 V

VPPH Supply voltage on VPP 8.5 9.5 V

TAAmbient operating temperature –40 85 °C

TAAmbient operating temperature, automotive –40 125 °C

Table 34: Input/Output Capacitance

Note 1 applies to entire table

Symbol Description Test Condition Min Max Units

CIN/OUT Input/output capacitance

(DQ0/DQ1/DQ2/DQ3)

VOUT = 0V – 8 pF

CIN Input capacitance (other pins) VIN = 0V – 6 pF

Note: 1. These parameters are sampled only, not 100% tested. TA = 25°C at 54 MHz.

128Mb, 3V, Multiple I/O Serial Flash Memory

Absolute Ratings and Operating Conditions

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Table 35: AC Timing Input/Output Conditions

Symbol Description Min Max Units Notes

CLLoad capacitance 30 30 pF 1

– Input rise and fall times – 5 ns

Input pulse voltages 0.2VCC to 0.8VCC V 2

Input timing reference voltages 0.3VCC to 0.7VCC V

Output timing reference voltages VCC/2 VCC/2 V

Notes: 1. Output buffers are configurable by user.

2. For quad/dual operations: 0V to VCC.

Figure 41: AC Timing Input/Output Reference Levels

0.8VCC

0.2VCC

0.7VCC

0.5VCC

0.3VCC

Input levels1I/O timing

reference levels

Note: 1. 0.8VCC = VCC for dual/quad operations; 0.2VCC = 0V for dual/quad operations.

128Mb, 3V, Multiple I/O Serial Flash Memory

Absolute Ratings and Operating Conditions

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DC Characteristics and Operating Conditions

Table 36: DC Current Characteristics and Operating Conditions

Parameter Symbol Test Conditions Typ(1) Max Unit

Input leakage current ILI – – ±2 µA

Output leakage current ILO – – ±2 µA

Standby current ICC1 S = VCC, VIN = VSS or VCC 14 100 µA

Standby current (automotive) Icc1 S = VCC, VSS = V or VCC 14 150 µA

Operating current

(fast-read extended I/O)

ICC3 C = 0.1VCC/0.9VCC at 108 MHz, DQ1

= open

– 15 mA

C = 0.1VCC/0.9VCC at 54 MHz, DQ1

= open

– 6 mA

Operating current (fast-read dual I/O) C = 0.1VCC/0.9VCC at 108 MHz – 18 mA

Operating current (fast-read quad I/O) C = 0.1VCC/0.9VCC at 108 MHz – 20 mA

Operating current (program) ICC4 S# = VCC – 20 mA

Operating current (write status regis-

ter)

ICC5 S# = VCC – 20 mA

Operating current (erase) ICC6 S# = VCC – 20 mA

Note: 1. Typical values given for TA = 25C and nominal Vcc

Table 37: DC Voltage Characteristics and Operating Conditions

Parameter Symbol Conditions Min Max Unit

Input low voltage VIL –0.5 0.3VCC V

Input high voltage VIH 0.7VCC VCC + 0.4 V

Output low voltage VOL IOL = 1.6mA – 0.4 V

Output high voltage VOH IOH = –100µA VCC - 0.2 – V

128Mb, 3V, Multiple I/O Serial Flash Memory

DC Characteristics and Operating Conditions

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AC Characteristics and Operating Conditions – Standard

Table 38: AC Characteristics and Operating Conditions – Standard Specifications

Parameter Symbol Min Typ1Max Unit Notes

Clock frequency for all commands other than

READ (SPI-ER, QIO-SPI protocol)

fC DC – 108 MHz –

Clock frequency for READ commands fR DC – 54 MHz –

Clock HIGH time tCH 4 – – ns 2

Clock LOW time tCL 4 – – ns 1

Clock rise time (peak-to-peak) tCLCH 0.1 – – V/ns 3, 4

Clock fall time (peak-to-peak) tCHCL 0.1 – – V/ns 3, 4

S# active setup time (relative to clock) tSLCH 4 – – ns –

S# not active hold time (relative to clock) tCHSL 4 – – ns –

Data in setup time tDVCH 2 – – ns –

Data in hold time tCHDX 3 – – ns –

S# active hold time (relative to clock) tCHSH 4 – – ns –

S# not active setup time (relative to clock) tSHCH 4 – – ns –

S# deselect time after a READ command tSHSL1 20 – – ns –

S# deselect time after a nonREAD command tSHSL2 50 – – ns –

Output disable time tSHQZ – – 8 ns 3

Clock LOW to output valid under 30pF tCLQV – – 7 ns –

Clock LOW to output valid under 10pF – – 5 ns –

Output hold time (clock LOW) tCLQX 1 – – ns –

Output hold time (clock HIGH) tCHQX 1 – – ns –

HOLD command setup time (relative to clock) tHLCH 4 – – ns –

HOLD command hold time (relative to clock) tCHHH 4 – – ns –

HOLD command setup time (relative to clock) tHHCH 4 – – ns –

HOLD command hold time (relative to clock) tCHHL 4 – – ns –

HOLD command to output Low-Z tHHQX – – 8 ns 3

HOLD command to output High-Z tHLQZ – – 8 ns 3

Write protect setup time tWHSL 20 – – ns 5

Write protect hold time tSHWL 100 – – ns 5

Enhanced VPPH HIGH to S# LOW for extended

and dual I/O page program

tVPPHSL 200 – – ns 6

WRITE STATUS REGISTER cycle time tW – 1.3 8 ms –

Write NONVOLATILE CONFIGURATION REGIS-

TER cycle time

tWNVCR – 0.2 3 s –

CLEAR FLAG STATUS REGISTER cycle time tCFSR – 40 – ns –

WRITE VOLATILE CONFIGURATION REGISTER

cycle time

tWVCR – 40 – ns –

WRITE VOLATILE ENHANCED CONFIGURATION

tWRVECR – 40 – ns –

128Mb, 3V, Multiple I/O Serial Flash Memory

AC Characteristics and Operating Conditions – Standard

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Table 38: AC Characteristics and Operating Conditions – Standard Specifications (Continued)

Parameter Symbol Min Typ1Max Unit Notes

PAGE PROGRAM cycle time (256 bytes) tPP – 0.5 5 ms 7

PAGE PROGRAM cycle time (n bytes) – int(n/8) ×

0.0158

5 ms 7

PAGE PROGRAM cycle time, VPP = VPPH (256

bytes)

– 0.4 5 ms 7

PROGRAM OTP cycle time (64 bytes) – 0.2 – ms 7

Subsector ERASE cycle time tSSE – 0.25 0.8 s –

Sector ERASE cycle time tSE – 0.7 3 s –

Sector ERASE cycle time (with VPP = VPPH) – 0.6 3 s –

Bulk ERASE cycle time tBE – 170 250 s –

Bulk ERASE cycle time (with VPP = VPPH) – 160 250 s –

Notes: 1. Typical values given for TA = 25 °C.

2. tCH + tCL must add up to 1/fC.

3. Value guaranteed by characterization; not 100% tested.

4. Expressed as a slew-rate.

5. Only applicable as a constraint for a WRITE STATUS REGISTER command when STATUS

6. VPPH should be kept at a valid level until the PROGRAM or ERASE operation has comple-

ted and its result (success or failure) is known.

7. When using the PAGE PROGRAM command to program consecutive bytes, optimized

timings are obtained with one sequence including all the bytes versus several sequences

of only a few bytes (1 < n < 256).

8. int(A) corresponds to the upper integer part of A. For example int(12/8) = 2, int(32/8) = 4

int(15.3) =16.

AC Characteristics and Operating Conditions – Enhanced

Table 39: AC Characteristics and Operating Conditions – Enhanced Specifications

Note 1 applies to entire table.

Parameter Symbol Min Typ Max Unit Notes

PAGE PROGRAM cycle time (256 bytes) tPP – 0.2 0.4 ms 2

PAGE PROGRAM cycle time (n bytes) – int(n/8) ×

0.01

0.4 ms 2, 3

PAGE PROGRAM cycle time, VPP = VPPH (256

bytes)

– 0.2 0.4 ms 2

PROGRAM OTP cycle time (64 bytes) – 0.2 – ms 2

Subsector ERASE cycle time tSSE – 0.06 0.2 s –

Sector ERASE cycle time tSE – 0.3 1 s –

Sector ERASE cycle time (with VPP = VPPH) – 0.3 1 s –

128Mb, 3V, Multiple I/O Serial Flash Memory

AC Characteristics and Operating Conditions – Enhanced

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Table 39: AC Characteristics and Operating Conditions – Enhanced Specifications (Continued)

Note 1 applies to entire table.

Parameter Symbol Min Typ Max Unit Notes

Bulk ERASE cycle time tBE – 46 250 s –

Bulk ERASE cycle time (with VPP = VPPH) – 46 250 s –

Notes: 1. These values are valid for product N25Q128A13Exx4xx from week code 36 2014 on-

wards.

2. When using the PAGE PROGRAM command to program consecutive bytes, optimized

timings are obtained with one sequence including all the bytes versus several sequences

of only a few bytes (1 < n < 256).

3. int(A) corresponds to the upper integer part of A. For example int(12/8) = 2, int(32/8) = 4

int(15.3) =16.

128Mb, 3V, Multiple I/O Serial Flash Memory

AC Characteristics and Operating Conditions – Enhanced

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Package Dimensions

Figure 42: V-PDFN-8 6mm x 5mm Sawn (MLP8) – Package Code: F7

0.20 TYP

Seating plane

Leads coplinarity

Pin 1 ID

laser marking

1.27

TYP

3.00 ±0.20

0.6 +0.15

-0.1

0.02 +0.03

-0.02

0.40 +0.08

-0.05

3.00 ±0.20

0.80 ±0.10

6 TYP

Pin 1 ID

option

5 TYP

0.08 C

0.1 C

Notes: 1. All dimensions are in millimeters.

2. See Part Number Ordering Information for complete package names and details.

128Mb, 3V, Multiple I/O Serial Flash Memory

Package Dimensions

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Figure 43: V-PDFN-8 8mm x 6mm (MLP8) – Package Code: F8

8.00 TYP

6.00 TYP 4.80 TYP

5.16 TYP

0.2

MIN

0.50 -0.05

+0.10

(NE - 1) × 1.27 TYP

Pin 1 ID

Ø0.3

1.27

TYP

0.05 MAX

0.40 +0.08

-0.05

0.85 TYP/

1 MAX

Pin 1 ID R 0.20

ddd C

bbb C

eee C A B

aaa CA

aaa C

fff C

Notes: 1. All dimensions are in millimeters.

2. See Part Number Ordering Information for complete package names and details.

128Mb, 3V, Multiple I/O Serial Flash Memory

Package Dimensions

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Figure 44: T-PBGA-24b05 6mm x 8mm – Package Code: 12

Ball A1 ID

1.20 MAX

6 ±0.10

0.20 MIN

1.00 TYP

8 ±0.10

4.00

Ball A1 ID

4.00

0.79 TYP

Seating

plane

0.1 A

24X Ø0.40 ±0.05

5 4 3 2 1

Notes: 1. All dimensions are in millimeters.

2. See Part Number Ordering Information for complete package names and details.

128Mb, 3V, Multiple I/O Serial Flash Memory

Package Dimensions

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Figure 45: T-PBGA-24b05 6mm x 8mm – Package Code: 14

0.2 MIN

1.08 ±0.12

3 CTR

6 ±0.1

1 TYP

8 ±0.1

1 TYP

Ball A1 IDBall A1 ID

Seating plane

0.1 A

24X Ø0.4

Dimensions apply

to solder balls post-

reflow on Ø0.4 SMD

ball pads.

5 CTR

13 24

Notes: 1. All dimensions are in millimeters.

2. See Part Number Ordering Information for complete package names and details.

128Mb, 3V, Multiple I/O Serial Flash Memory

Package Dimensions

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Figure 46: SOP2-16 (300 mils body width) – Package Code: SF

0.23 MIN/

0.32 MAX

0.40 MIN/

1.27 MAX

0.20 ±0.1

2.5 ±0.15

10.30 ±0.20

7.50 ±0.10

10.00 MIN/

10.65 MAX

0.33 MIN/

0.51 MAX

0.1 Z

0° MIN/8° MAX

1.27 TYP

h x 45°

Notes: 1. All dimensions are in millimeters.

2. See Part Number Ordering Information for complete package names and details.

128Mb, 3V, Multiple I/O Serial Flash Memory

Package Dimensions

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Figure 47: SOP2-8 (208 mils body width) – Package Code: SE

0.1 MAX

1.70 MIN/

1.91 MAX 1.78 MIN/

2.16 MAX 0.15 MIN/

0.25 MAX

5.08 MIN/

5.49 MAX

5.08 MIN/

5.49 MAX

0.5 MIN/

0.8 MAX

0.05 MIN/

0.25 MAX 0º MIN/

10º MAX

7.70 MIN/

8.10 MAX

0.36 MIN/

0.48 MAX

1.27 TYP

Notes: 1. All dimensions are in millimeters.

2. See Part Number Ordering Information for complete package names and details.

128Mb, 3V, Multiple I/O Serial Flash Memory

Package Dimensions

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Part Number Ordering Information

Micron Serial NOR Flash devices are available in different configurations and densities.

Verify valid part numbers by using Micron’s part catalog search at micron.com. To com-

pare features and specifications by device type, visit micron.com/products. Contact the

factory for devices not found.

For more information on how to identify products and top-side marking by the process

identification letter, refer to technical note TN-12-24, "Serial Flash Memory Device

Marking for the M25P, M25PE, M25PX, and N25Q Product Families."

Table 40: Part Number Information

Part Number

Category Category Details Notes

Device type N25Q = Serial NOR Flash memory, Multiple Input/Output (Single, Dual, Quad I/O), XIP

Density 128 = 128Mb

Technology A = 65nm

Feature set 1 = Byte addressability; HOLD pin; Micron XIP

2 = Byte addressability; HOLD pin; Basic XIP

3 = Byte addressability; RST# pin; Micron XIP

4 = Byte addressability; RST# pin; Basic XIP

Operating voltage 3 = VCC = 2.7 to 3.6V

Block structure E = Uniform (64KB and 4KB)

Package

(RoHS-compliant)

F7 = V-PDFN-8 6mm x 5mm Sawn (MLP8 6mm x 5mm)

F8 = V-PDFN-8 8mm x 6mm (MLP8 8mm x 6mm)

12 = T-PBGA-24b05 6mm x 8mm

14 = T-PBGA-24b05 6mm x 8mm, 4x6 ball array

SF = SOP2-16 300 mils body width (SO16W)

SE = SOP2-8 208 mils body width (SO8W)

Temperature and

test flow

4 = IT: –40°C to +85°C; Device tested with standard test flow

A = Automotive temperature range: –40 to +125°C; Device tested with high reliability cer-

tified test flow

H = IT: –40°C to +85°C; Device tested with high reliability certified test flow

Security features 0 = Default 1

Shipping material E = Tray

F = Tape and reel

G = Tube

Note: 1. Additional secure options are available upon customer request.

128Mb, 3V, Multiple I/O Serial Flash Memory

Part Number Ordering Information

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Table 41: Package Details

Micron SPI

and JEDEC

Package

Name

Shortened

Package

Name Package Description

M25P

M45PE

Symbol

N25Q

Symbol

M25P

M45PE Pack-

age Names

Alternate

Package Name

V-PDFN-8

6mm x 5mm

Sawn

DFN/6mm x

5mm Sawn

Very thin, plastic small-out-

line, 8 terminal pads (no

leads), 6mm x 5mm Sawn

MS F7 MLP8, DFN8,

VDFPN8,

VFQFPN8

V-PSON1-8/6mm

x 5mm Sawn,

VSON

V-PDFN-8

8mm x 6mm

DFN/8mm x

6mm

Very thin, plastic small out-

line, 8 terminal pads (no

leads), 8mm x 6mm

ME F8 MLP8, VDFPN8 V-PSON1-8/8mm

x 6mm, VSON

T-PBGA-

24b05/6mm x

8mm

TBGA 24 Thin plastic ball grid array, 24

balls, 6mm x 8mm

ZM 12 TBGA24 6mm x

8mm

–

T-PBGA-

24b05/6mm x

8mm

4x6 ball array

TBGA 24 Thin plastic ball grid array, 24

balls, 6mm x 8mm,

4x6 ball array

– 14 TBGA24 6mm x

8mm

4x6 ball array

–

SOP2- 16/

300 mil

SO16W Small-outline integrated cir-

cuit, 16 pins, wide (300 mil)

MF SF SO16 wide 300

mil body width

SOIC-16/300 mil,

SOP 16L 300 mil

SOP2- 8/

208 mil

SO8W Small-outline integrated cir-

cuit, 8-pins, wide (208 mil)

MW SE SO8 wide 208

mil body width

–

128Mb, 3V, Multiple I/O Serial Flash Memory

Part Number Ordering Information

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Revision History

Rev. T – 02/2018

• Added Important Notes and Warnings section for further clarification aligning to in-

dustry standards

Rev. S – 11/2014

• Reviewed the SFDP table

Rev. R - 07/2014

• Added ICC1 for automotive

• Added AC characteristics and operating conditions table for enhanced program and

erase speed devices

Rev. Q – 05/2014

• Added to volatile configuration register, XIP settings column: description of Enable

and Disable.

Rev. P – 06/2013

• Added T-PBGA-24b05 6mm x 8mm, 4x6 ball array ballout and package information

Rev. O – 04/2013

• Updated the Nonvolatile Configuration Register Bit Definitions table

Rev. N – 01/2013

• Updated SOP2-8 (208 mils body width) - Package Code: SE in Package Dimensions

• Updated the READ ID Operation figure in READ ID Operations

• Updated ERASE Operations

• Added link to part number chart in Part Number Ordering Information

• Updated part numbers in Features

Rev. M – 07/2012

• Updated part numbers

Rev. L – 06/2012

• Updated tSSE specification in AC Reset Conditions table

Rev. K – 02/2012

• Changed status register bit 6 to indicate block protect instead of reserved

Rev. J – 12/2011

• Updated note for Read ID Data Out table

128Mb, 3V, Multiple I/O Serial Flash Memory

Revision History

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Rev. I – 10/2011

• Added READ ENHANCED VOLATILE CONFIGURATION REGISTER command and

WRITE ENHANCED VOLATILE CONFIGURATION REGISTER command to Command

Set

Rev. H – 08/2011

• Updated SOP2-8 (208 mils body width) - Package Code: SE in Package Dimensions

Rev. G – 08/2011

• Micron rebrand

Rev. F – 02/2011

• Updated order information

Rev. E – 01/2011

• Updated functionality

Rev. D – 10/2010

• Added the following packages: F6 = VDFPN8 6 x 5 mm (MLP 6 x 5) (RoHS compliant);

SE = SO8W (SO8 208 mils body width) (RoHS compliant)

• Changed the Typical specification for Erase to Suspend and Subsector

• Erase to Suspend in Operations Allowed / Disallowed During Device States

• Added tBE with VPP = VPPH and tSE with sector erase VPP = VPPH, TYP = 0.6s, MAX = 3s

to AC Characteristics

• Made miscellaneous text edits

Rev. C – 02/2010

• Corrected typographical error “iA” to “uA” for VOH in DC Characteristics

• Made the following specification changes in AC Characteristics: tW: changed MAX

from 15s to 8ms; tWNVCR: changed TYP from 1 to 0.2 and MAX from 15 to 3; tPP:

changed TYP from int(n/8) x 0.025 to int(n/8) x 0.015; tSSE: changed TYP from 150ms

to 0.2s and MAX from 500ms to 2s; tSE: changed TYP from 1s to 0.7s; tBE: changed

TYP from 256s to 170s and MAX from 770s to 250s

Rev. B – 05/2009

• Added the TBGA ballout and package information

• Updated PROGRAM/ERASE/SUSPEND operations; Device Protection; Read and Write

Volatile Configuration Register; Fast POR; Power-Up Timing graphics; Order Informa-

tion

Rev. A – 01/2009

• Initial release

128Mb, 3V, Multiple I/O Serial Flash Memory

Revision History

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8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000

www.micron.com/products/support Sales inquiries: 800-932-4992

Micron and the Micron logo are trademarks of Micron Technology, Inc.

All other trademarks are the property of their respective owners.

This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.

Although considered final, these specifications are subject to change, as further product development and data characterization some-

times occur.

128Mb, 3V, Multiple I/O Serial Flash Memory

Revision History

09005aef845665fe

n25q_128mb_3v_65nm.pdf - Rev. T 02/18 EN 83 Micron Technology, Inc. reserves the right to change products or specifications without notice.