1SMB15CAT3G - LITTELFUSE

Speciﬁcations are subject to change without notice.

Revised: 11/17/17

TVS Diodes

Surface Mount > 600W > 1SMB10CAT3G Series

• Working Peak Reverse Voltage Range − 10 V to 75 V

• Standard Zener Breakdown Voltage Range −

11.7 V to 91.7 V

• Peak Power − 600 Watts @ 1 ms

• ESD Rating of Class 3 (> 16 kV) per Human Body Model

• Maximum Clamp Voltage @ Peak Pulse Current

• Low Leakage < 5 µA Above 10 V

• UL 497B for Isolated Loop Circuit Protection

• Response Time is Typically < 1 ns

• Pb−Free Packages are Available

Features

The 1SMB10CAT3Gv series is designed to protect voltage

sensitive components from high voltage, high energy

transients. They have excellent clamping capability, high

surge capability, low zener impedance and fast response

time. The 1SMB10CAT3G series is supplied in the

Littelfuse exclusive, cost-effective, highly reliable package

and is ideally suited for use in communication systems,

automotive, numerical controls, process controls, medical

equipment, business machines, power supplies and

many other industrial/consumer applications.

Description

Parameter Symbol Value Unit

Peak Power Dissipation (Note 1) @ TL =

25°C, Pulse Width = 1 ms PPK 600 W

DC Power Dissipation @ TL = 75°C

Measured Zero Lead Length (Note 2)

Derate Above 75°C

Thermal Resistance from Junction−

to−Lead

R JL

3.0

mW/°C

°C/W

DC Power Dissipation (Note 3) @ TA =

25°C Derate Above 25°C

Thermal Resistance from Junction–to–

Ambient

RθJA

0.55

4.4

226

mW/°C

°C/W

Operating and Storage

Temperature Range TJ, Tstg

-65 to

+150 °C

Maximum Ratings and Thermal Characteristics

1SMB10CAT3G Series

Functional Diagram

Bi-directional

Uni-directional

Cathode Anode

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are

stress ratings only. Functional operation above the Recommended Operating Conditions is

not implied. Extended exposure to stresses above the Recommended Operating Conditions

may affect device reliability.

1. 10 X 1000 µs, non−repetitive

2. 1” square copper pad, FR−4 board

3. FR−4 board, using Littelfuse minimum recommended footprint, as shown in 403A-03

case outline dimensions spec

*Please see 1SMB5.0AT3 to 1SMB170AT3 for Unidirectional devices

Additional Information

Samples

Resources

Datasheet

OBSOLETE/EOL

DATE June/30/2018 PCN/ECN# LFPCN41246

REPLACED BY SMBJ Series

Speciﬁcations are subject to change without notice.

Revised: 11/17/17

TVS Diodes

Surface Mount > 600W > 1SMB10CAT3G Series

Symbol Parameter

IPP Maximum Reverse Peak Pulse Current

VCClamping Voltage @ IPP

VRWM Working Peak Reverse Voltage

IRMaximum Reverse Leakage Current @ VRWM

VBR Breakdown Voltage @ IT

ITTest Current

I-V Curve Characteristics (TA = 25°C unless otherwise noted)

RWM

Speciﬁcations are subject to change without notice.

Revised: 11/17/17

TVS Diodes

Surface Mount > 600W > 1SMB10CAT3G Series

Electrical Characteristics

Device* Device

Marking

RWM

(Note 6)

IR @

VRWM

Breakdown Voltage VC @ IPP

(Note 8) C Typ.

(Note 9)

VBR @ IT (V) (Note 7) @ ITVCIPP

Volts µA MIN NOM MAX mA Volts Amps pF

1SMB10CAT3G KXC 10 5.0 11.1 11.69 12.27 1.0 17.0 35.3 805

1SMB11CAT3G KZC 11 5.0 12.2 12.84 13.5 1.0 18.2 33.0 740

1SMB12CAT3G LEC 12 5.0 13.3 14.00 14.7 1.0 19.9 30.2 680

1SMB13CAT3G LGC 13 5.0 14.4 15.16 15.9 1.0 21.5 27.9 630

1SMB14CAT3G LKC 14 5.0 15.6 16.42 17.2 1.0 23.2 25.8 590

1SMB15CAT3G LMC 15 5.0 16.7 17.58 18.5 1.0 24.4 24.0 555

1SMB16CAT3G LPC 16 5.0 17.8 18.74 19.7 1.0 26.0 23.1 520

1SMB17CAT3G LRC 17 5.0 18.9 19.90 20.9 1.0 27.6 21.7 490

1SMB18CAT3G LTC 18 5.0 20.0 21.06 22.1 1.0 29.2 20.5 465

1SMB20CAT3G LVC 20 5.0 22.2 23.37 24.5 1.0 32.4 18.5 425

1SMB22CAT3G LXC 22 5.0 24.4 25.69 27.0 1.0 35.5 16.9 390

1SMB24CAT3G LZC 24 5.0 26.7 28.11 29.5 1.0 38.9 15.4 366

1SMB26CAT3G MEC 26 5.0 28.9 30.42 31.9 1.0 42.1 14.2 330

1SMB28CAT3G MGC 28 5.0 31.1 32.74 34.4 1.0 45.4 13.2 310

1SMB30CAT3G MKC 30 5.0 33.3 35.06 36.8 1.0 48.4 12.4 290

1SMB33CAT3G MMC 33 5.0 36.7 38.63 40.6 1.0 53.3 11.3 265

1SMB36CAT3G MPC 36 5.0 40.0 42.11 44.2 1.0 58.1 10.3 245

1SMB40CAT3G MRC 40 5.0 44.4 46.74 49.1 1.0 64.5 9.3 220

1SMB43CAT3G MTC 43 5.0 47.8 50.32 52.8 1.0 69.4 8.6 210

1SMB45CAT3G MVC 45 5.0 50.0 52.63 55.3 1.0 72.2 8.3 200

1SMB48CAT3G MXC 48 5.0 53.3 56.11 58.9 1.0 77.4 7.7 190

1SMB51CAT3G MZC 51 5.0 56.7 59.69 62.7 1.0 82.4 7.3 175

1SMB54CAT3G NEC 54 5.0 60.0 63.16 66.32 1.0 87.1 6.9 170

1SMB58CAT3G NGC 58 5.0 64.4 67.79 71.18 1.0 93.6 6.4 155

1SMB60CAT3G NKC 60 5.0 66.7 70.21 73.72 1.0 96.8 6.2 150

1SMB64CAT3G NMC 64 5.0 71.1 74.84 78.58 1.0 103 5.8 145

1SMB75CAT3G NRC 75 5.0 83.3 91.65 92.07 1.0 121 4.9 125

4. A transient suppressor is normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the

DC or continuous peak operating voltage level.

5. VBR measured at pulse test current IT at an ambient temperature of 25°C.

6. Surge current waveform per Figure 2 and derate per Figure 3 of the General Data − 600 Watt at the beginning of this group.

7. Bias Voltage = 0 V, F = 1 MHz, TJ = 25°C

Speciﬁcations are subject to change without notice.

Revised: 11/17/17

TVS Diodes

Surface Mount > 600W > 1SMB10CAT3G Series

Figure 1. Pulse Rating Curve

Ratings and Characteristic Curves

Figure 2. Pulse Waveform

Figure 3. Pulse Derating Curve Figure 4. Typical Junction Capacitance vs. Bias Voltage

Typical Protection Circuit

NONREPETITIVE

PULSE WAVEFORM

SHOWN IN FIGURE 2

100

0.1 s1 s1 0 s 100 s1 ms 10 ms

0.1

Speciﬁcations are subject to change without notice.

Revised: 11/17/17

TVS Diodes

Surface Mount > 600W > 1SMB10CAT3G Series

Application Notes

Response Time

In most applications, the transient suppressor device is

placed in parallel with the equipment or component to be

protected. In this situation, there is a time delay associated

with the capacitance of the device and an overshoot

condition associated with the inductance of the device and

the inductance of the connection method. The capacitive

effect is of minor importance in the parallel protection

scheme because it only produces a time delay in the

transition from the operating voltage to the clamp voltage

as shown in Figure 5.

The inductive effects in the device are due to actual turn-on

time (time required for the device to go from zero current

to full current) and lead inductance. This inductive effect

produces an overshoot in the voltage across the

equipment or component being protected as shown in

Figure 6. Minimizing this overshoot is very important in the

application, since the main purpose for adding a transient

suppressor is to clamp voltage spikes. The SMB series

have a very good response time, typically < 1 ns and

negligible inductance. However, external inductive effects

could produce unacceptable overshoot. Proper circuit

layout minimum lead lengths and placing the suppressor

device as close as possible to the equipment or

components to be protected will minimize this overshoot.

Some input impedance represented by Zin is essential

to prevent overstress of the protection device. This

impedance should be as high as possible, without

restricting the circuit operation.

Duty Cycle Derating

The data of Figure 1 applies for non-repetitive conditions

and at a lead temperature of 25ºC. If the duty cycle

increases, the peak power must be reduced as indicated

by the curves of Figure 7. Average power must be derated

as the lead or ambient temperature rises above 25ºC. The

average power derating curve normally given on data

sheets may be normalized and used for this purpose.

At ﬁrst glance the derating curves of Figure 7 appear to be

in error as the 10 ms pulse has a higher derating factor

than the 10 s pulse. However, when the derating factor for

a given pulse of Figure 7 is multiplied by the peak power

value of Figure 1 for the same pulse, the results follow the

expected trend.

Figure 6.

Figure 7. Typical Derating Factor for Duty Cycle

Figure 5.

Speciﬁcations are subject to change without notice.

Revised: 11/17/17

TVS Diodes

Surface Mount > 600W > 1SMB10CAT3G Series

Dimensions

Part Marking System

Soldering Footrpint

Physical Speciﬁcations

Case Void-free, transfer-molded, thermosetting

plastic

Polarity Cathode indicated by polarity band

Mounting Position Any

Finish All external surfaces are corrosion

resistant and leads are readily solderable

Leads Modiﬁed L−Bend providing more contact

area to bond pads

ORDERING INFORMATION

Device Package Shipping

1SMBxxCAT3G SMB

(Pb−Free)

2,500 /

Tape & Reel

Flow/Wave Soldering (Solder Dipping)

Peak Temperature : 260 ºC

Dipping Time : 10 seconds

inches

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.

Dim

Inches Millimeters

Min Nom Max Min Nom Max

A0.075 0.087 0.090 1.90 2.20 2.28

A1 0.002 0.004 0.007 0.05 0.10 0.19

b0.077 0.080 0.087 1.96 2.03 2.20

c0.006 0.009 0.012 0.15 0.23 0.31

D0.130 0.140 0.156 3.30 3.56 3.95

E0.160 0.170 0.181 4.06 4.32 4.60

HE0.205 0.214 0.220 5.21 5.44 5.60

L0.030 0.040 0.063 0.76 1.02 1.60

L1 0.020 REF 0.51 REF

POLARITY INDICATOR

OPTIONAL AS NEEDED

(SEE STYLES)

Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and

test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete

Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics.