EXBQ16P333J - Panasonic

Design and speciﬁ cations are each subject to change without notice. Ask factory for the current technical speciﬁ cations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Chip Resistor Networks

11 12

Product Code

Thick Film

Resistor

Network

Number of

Terminals

Circuit Configuration

Code

Common Terminal Position The first two digits are

significant figures of

resistance value and

the third one denotes

the number of zeros

following.

Resistance Value Resistance

Tolerance

Suffix for Special

Requirements

Dimension Code of

Chip Resistor Network

Type: inches

Dimensions

4.0 mm҂2.1 mm

6.4 mm҂3.1 mm

3.8 mm҂1.6 mm

Center common circuit

EXBD, EXBE

Diagonal common circuit

(Terminal 5 and Terminal 10)

EXBA10P

D:1206

E:1608

A:2512

Q:1506

3.2 mm҂1.6 mm

One side common circuit

(Terminal 16)

EXBQ16P

Diagonal common circuit

(Terminal 1 and Terminal 6)

EXBA10E

±5%

No through hole

Through holes

Pull up resistors

0.4 mm pitch 0.635 mm pitch

EXBE10C EXBA10P

Direct placement on the bus line

IC IC

VCC

IC IC

VCC

IC IC

VCC

■Features

● High density placing for digital signal circuits

·Bussed 8 or 15 resistors for pull up/down circuits

EXBD: 3.2 mm  1.6 mm  0.55 mm, 0.635 mm pitch

EXBE: 4.0 mm  2.1 mm  0.55 mm, 0.8 mm pitch

EXBA: 6.4 mm  3.1 mm  0.55 mm, 1.27 mm pitch

EXBQ: 3.8 mm  1.6 mm  0.45 mm, 0.5 mm pitch

·Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB

(“High density placing” is shown below)

● High speed mounting using conventional placing machine

Chip Resistor Networks

Type: EXBD:1206

EXBE:1608

EXBA:2512

EXBQ:1506

■Explanation of Part Numbers

Feb. 2006

Chip Resistor Networks

Design and speciﬁ cations are each subject to change without notice. Ask factory for the current technical speciﬁ cations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

I03

0.3±0.2

0.5±0.2

f0.3+0.1

–0.2

0.3±0.2

0.25±0.20

0.5±0.2

0.8±0.1

4.0±0.2

0.25±0.20

0.35±0.20 0.4±0.2 0.35±0.20

0.4±0.2

0.5±0.2

0.4±0.2

2.1±0.2

0.55±0.10

f0.3+0.1

–0.2

0.7±0.2

0.3±0.2

6.4±0.2

1.27±0.10

0.5±0.2

3.1±0.2

0.55±0.10

I03

EXBA10E

I03

EXBA10P

0.25±0.10

0.3±0.1 0.25±0.10

0.35±0.15

0.35

0.15

0.40±0.15

1.60±0.15

0.55±0.10

0.2±0.1

0.33±0.15 0.2±0.1

0.2±0.1

0.2

0.1

f0.2±0.1

3.20±0.15

0.635±0.10

0.40±0.15

0.15

+0.15

–0.05

0.15

+0.20

–0.05

0.15

+0.15

–0.05

0.3±0.1

0.2±0.1

0.25±0.15

3.8±0.2

0.5±0.1

0.30±0.15

1.6±0.2

0.45±0.10

472

10 9 8 7

2345

10 6

987

234

10 6

987

234

234 678

111213141516

Protective coating

Thick film

resistive element

Electrode (Inner)

Electrode (Between)

Electrode (Outer)

Alumina substrate

Protective coating

Electrode

(Inner)

Thick film

resistive element

100

–60 –40 –20

020406080

100120 140160 180

–55 °C70°C

125 °C

Rated Load (%)

Ambient Temperature (°C)

EXBD EXBE EXBA EXBQ

Mass (Weight)[1000 pcs.] : 10 g Mass (Weight)[1000 pcs.] : 16 g Mass (Weight)[1000 pcs.] : 40 g Mass (Weight)[1000 pcs.] : 9 g

EXBD, EXBE EXBA EXBQ

Item Speciﬁ cations

Series EXBD EXBE EXBA EXBQ

Resistance Range 47  to 1 M (E12)

100  to 470 k (E6 series)

Resistance Tolerance ±5%

Number of Terminals 10 terminals 16 terminals

Number of Resistors 8 resistors 15 resistors

Power Rating at 70 °C 0.05 W/element 0.063 W/element 0.025 W/element

Limiting Element Voltage

(Maximum Rated Continuous Working Voltage)(1)

25V 50 V 25V

Maximum Overload Voltage(2) 50 V 100 V 50 V

T. C. R. ±200  10–6/ °C(ppm/ °C)

Category Temperature Range

(Operating Temperature Range) –55 °C to +125 °C

EXBA10P EXBA10E

■Construction (Example : EXBD)

■Dimensions in mm (not to scale)

■Circuit Conﬁ guration

Power Derating Curve

For resistors operated in ambient temperature above

70 °C, power rating shall be derated in accordance

with the ﬁ gure on the right.

(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=Power Rating  Resistance Value, or Limiting Element Voltage

(maximum RCWV) listed above, whichever less.

(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined

from SOTV=2.5  RCWV✽ or Maximum Overload Voltage list ed above which ev er less.

■Ratings

Feb. 2006

Design and speciﬁ cations are each subject to change without notice. Ask factory for the current technical speciﬁ cations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Chip Resistor Networks

TTA

fD0

fD1(Only Emboss)

■Packaging Methods (Taping)

● Standard Quantity

● Taping Reel

● Carrier Tape (Unit : mm)

(Unit : mm)

Punched Carrier Embossed Carrier

Type Kind of Taping Pitch (P1)Quantity

EXBD

Punched Carrier Taping 4 mm

5000 pcs./reel

EXBQ

EXBE 4000 pcs./reel

EXBA Embossed Carrier Taping

Type A B W F E P1P2P0fD0TfD1

EXBD 2.00±0.20 3.60±0.20

8.00±0.20 3.50±0.05 1.75±0.10

4.00±0.10 2.00±0.05 4.00±0.10 1.50+0.10

0.84±0.10 –

EXBQ 1.90±0.20 4.10±0.20 0.64±0.05 –

EXBE 2.50±0.20 4.40±0.20

12.00±0.30 5.50±0.20 1.75±0.20 1.10±0.20 1.50+0.10

EXBA 3.50±0.20 6.80±0.20 –0

–0

Type fAfBfCWT

EXBD

180.0+0 60 min. 13.0±1.0

9.0±1.0 11.4 ±1.0

EXBQ

EXBE 13.0±1.0 15.4±2.0

EXBA

–3.0

Feb. 2006

Chip Resistor Networks

Design and speciﬁ cations are each subject to change without notice. Ask factory for the current technical speciﬁ cations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

4.4

2.2

0.2

0.4 to 0.5

1.27

4.4

2.2

0.2

1.27

EXBA10P EXBA10E

1.27 0.635 1.27 0.635

0.4 to 0.5

0.8

0.4 to 0.5

3.3 to 3.4

5.0 to 5.4

0.35 to 0.4

1.4 to1.5

3.1 to 3.5

2.1 to2.5

4.3 to 4.7

1.27 0.4 to 0.6

3.4

1.4

5.2

3.3

0.5

0.8 0.4 0.35 to 0.4

0.1 to 0.15

0.635

0.9 to 1.1

2.0 to 2.6

0.3 to 0.4

0.2 to 0.3

2.6 to 2.8

3.6 to 4.2

0.50

0.9 to1.1

2.0 to 2.6

0.20 to 0.25

■Recommended Land Pat tern (mm)

✽ When designing high density land patterns, examine the reliability of isolation among the lines and adopt the chip re-

sistor networks.

EXBD EXBE

For

popular

pattern

Pitch 0.635 mm

Pitch 0.8 mm

For high

density

pattern

✽

Pitch 0.4 mm···

Through-hole less

EXBA EXBQ

For

popular

pattern

Pitch 1.27 mm

Pitch 0.5 mm

For high

density

pattern

✽

Pitch 0.635 mm···

Through-hole less

Feb. 2006

Design and speciﬁ cations are each subject to change without notice. Ask factory for the current technical speciﬁ cations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Chip Resistor Networks

Preheating

Peak

Heating

Temperature

Time

Temperature Time

Preheating 140 °C to 160 °C 60 s to 120 s

Main heating Above 200 °C 30 s to 40 s

Peak 235 ± 5 °C max. 10 s

Temperature Time

Preheating 150 °C to 180 °C 60 s to 120 s

Main heating Above 230 °C 30 s to 40 s

Peak max. 260 °C max. 10 s

■Recommended Soldering Conditions

Recommendations and precautions are described below.

●Recommended soldering conditions for reﬂ ow

For soldering (Example : Sn/Pb)

For lead-free soldering (Example : Sn/Ag/Cu)

Safety Precautions

● Flow soldering

Please contact us regarding ﬂ ow sol der ing of EXBA se ries. We do not recommend ﬂ ow soldering to the

Chip Resistor Networks: EXBD/EXBE/EXBQ, because sol der bridging may occur due to the narrow 0.635 mm/

0.8 mm/0.5 mm pitch of EXBD/EXBE/EXBQ type.

The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors

shown on page ER3 of this catalog.

1. Take measures against mechanical stress during and after mounting of Chip Resistor Networks (hereafter called the

resistors) so as not to damage their electrodes and pro tec tive coatings.

Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur.

2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and eval u ate the op er a tions

of the resistors when installed in your products before use.

Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.

3. Do not use halogen-based or other high-activity ﬂ ux. Otherwise, the residue may impair the resistors' per for mance

and/or reliability.

4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a

soldering iron with a high temperature tip, ﬁ nish soldering as quickly as possible (within three seconds at 350 °C max.).

5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing

problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.

6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors'

protective coatings and bodies may be chipped, affecting their performance.

7. Av oid excessi ve bending of printed circuit boards in order to protect the resistors from abnormal stress.

· Reﬂ ow soldering shall be performed a maximum of

two times.

· Please contact us for additional information when

used in conditions other than those speciﬁ ed.

· Please measure the temperature of the terminals

and study every kind of solder and printed circuit

board for solderability be fore ac tu al use.

Feb. 2006

– ER3 –

Safety Precautions

(Common precautions for Fixed Resistors)

• When using our products, no matter what sort of equipment they might be used for, be sure to make a written

agreement on the speciﬁ cations with us in advance. The design and speciﬁ cations in this catalog are subject

to change without prior notice.

• Do not use the products beyond the speciﬁ cations described in this catalog.

• This catalog explains the quality and performance of the products as individual components. Be fore use, check

and evaluate their operations when installed in your products.

• Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment

where a defect in these products may cause the loss of human life or other signiﬁ cant damage, such as damage to

vehicles (au to mo bile, train, vessel), trafﬁ c lights, medical equipment, aerospace equipment, elec tric heating

ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment.

✽ Systems equipped with a protection circuit and a protection device

✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault

(1) Precautions for use

• These products are designed and manufactured for general and stan dard use in general elec tron ic

equipment (e.g. AV equipment, home electric ap pli anc es, ofﬁ ce equipment, information and com mu ni ca tion

equipment)

• These products are not intended for use in the following special conditions. Be fore using the products, care ful ly

check the effects on their quality and performance, and determine whether or not they can be used.

1. In liquid, such as water, oil, chemicals, or organic solvent

2. In direct sunlight, outdoors, or in dust

3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2

4. Electric Static Discharge (ESD) Environment

These components are sensitive to static electricity and can be damaged under static shock (ESD).

Please take measures to avoid any of these environments.

Smaller components are more sensitive to ESD environment.

5. Electromagnetic Environment

Avoid any environment where strong electromagnetic waves exist.

6. In an environment where these products cause dew condensation

7. Sealin g o r coating of these products or a printed circuit board on which these products are mounted, with resin

or other materials

• These products generate Joule heat when energized. Carefully position these products so that their heat will not

affect the other components.

• Carefully position these products so that their temperatures will not exceed the category temperature range due

to the effects of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or

inﬂ ammables, such as vinyl-coated wires, near these products .

• Note that non -cleaning solder, halogen-based highly active ﬂ ux, or water-soluble ﬂ ux may deteriorate the

performance or reliability of the products.

• Carefully select a ﬂ ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the

performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave

water res i dues. Otherwise, the insulation performance may be deteriorated.

(2) Precautions for storage

The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your

company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °

C and a relative humidity of 45 % to 85 %.

Even within the above guarantee periods, do not store these products in the fol low ing conditions. Otherwise, their

elec tri cal performance and/or solderability may be deteriorated, and the packaging materials (e.g. tap ing ma te ri als)

may be de formed or deteriorated, resulting in mounting failures.

1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2

2. In direct sunlight

Package markings include the product number, quantity, and country of origin.

In principle, the country of origin should be indicated in English.

Feb. 2006