CE SM4001 THRU SM4007
CHENYI ELECTRONICS SURFACE MOUNT GALSS PASSIVATED JUNCTION RECTIFIER
Reverse Voltage - 50 to 1000 Volts
Forward Current - 1.0Ampere
FEATURES
. The plasitc package carries Underwrites Laboratory MELF(DO-213AB)
Flammability Classification 94V-0
. For surface mounted applications
. Glass passivated junction
. High temperature soldering guaranteed: 250 /10 seconds, at terminals
MECHANICAL DATA
. Case: JEDEC SMA(DO-214AB) molded plastic
. Terminals: Lead solderable per MIL-STD-750,method 2026
. Polarity: Color band denotes cathode end
. Mounting Position: Any Dimensions in inches and (millimeters)
. Weight: 0.0041 ounce, 0.116 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(Ratings at 25 ambient temperature unless otherwise specified,Single phase,half wave 60Hz,resistive or inductive)
load. For capacitive load,derate current by 20%)
Symbols SM
4001 SM
4002 SM
4003 SM
4004 SM
4005 SM
4006 SM
4007 Units
Maximum Recurrent peak reverse voltage VRRM 50 100 200 400 600 800 1000 Volts
Maximum RMS voltage VRMS 35 70 140 280 420 560 700 Volts
Maximum DC blocking voltage VDC 50 100 200 400 600 800 100 Volts
Maximum average forward rectified current
0.375"(9.5mm) lead length at TA=75
Peak forward surge current (8.3ms
half sing wave superimposed on rated load
(JEDEC method)
Maximum instantaneous forward voltage at 1.0 A VFVolts
Maximum reverse TA=25
current at rated DC Blocking Voltage TA=125
(Note 2) R JA
(Note 3) R JL
Typical Junction Capacitance(Note 1) CJpF
Maximum DC Blocking Voltage temperature TA
Notes: 1.Measured at 1MHz and applied reverse voltage of 4.0V DC.
1.Thermal resistance from junction to ambient, 0.24 X 0.24"(6.0 X 6.0mm) copper pads to each terminals
1.Thermal resistance from junction to terminals, 0.24 X 0.24"(6.0 X 6.0mm) copper pads to each terminals
A
50.0
I(AV) 1.0 Amp
IFSM Amps30.0
5.0
1.1
IR
Typical Thermal Resistance 75.0
30.0
+150.0
15.0
Operating and storage temperature range TJ TSTG -65 to +175
/W
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