CREAT BY ART
- Ideal for automated placement
- Reliable low cost construction utilizing molded plastic technique
- High surge current capability
- Small size, simple installation
- UL Recognized File # E-326243
- Halogen-free according to IEC 61249-2-21 definition
- AEC-Q101 Qualified
Molding compound, UL flammability classification rating 94V-0
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
SYMBOL Unit
V
RRM
V
V
RMS
V
V
DC
V
I
2
tA
2
s
trr ns
C
J
pF
R
θJA
°C/W
T
J
°C
T
STG
°C
Document Number: DS_D1410011 Version: F14
Note 2: Reverse Recovery Test Condition: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
400 600
Maximum reverse recovery time (Note 2) 150
Typical junction capacitance per leg 13
Operating junction temperature range - 55 to +150
Storage temperature range - 55 to +150
Note 1: Pulse Test with PW=300μs, 1% Duty Cycle
RMB2S RMB4S RMB6S
200 400
Maximum DC reverse current T
J
=25 °C
at rated DC blocking voltage T
J
=125 °C I
R
5
100 μA
Typical thermal resistance 85
Rating for fusing (t<8.3ms) 3.74
Maximum instantaneous forward voltage (Note 1)
I
F
= 0.4 V
F
1.00 V
Maximum DC blocking voltage
Maximum average forward current
60Hz sine wave resistance load
On glass-expoxy P.C.B.
On aluminum substrate
I
F(AV)
0.5
0.8
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
30 A
200
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25°C unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
600
140 280 420
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
TO-269AA (MBS)
MECHANICAL DATA
Case: TO-269AA (MBS)
Polarity: Polarity as marked on the body
Weight: 0.12 g (approximately)
RMB2S thru RMB6S
Taiwan Semiconductor
Miniature Glass Passivated Fast Recover
y
Surface Mount Brid
g
e Rectifiers
FEATURES
- Moisture sensitivity level: level 1, per J-STD-020
PART NO.
Note 2: Whole series with green compound
PART NO.
(T
A
=25°C unless otherwise noted)
Document Number: DS_D1410011 Version: F14
RMB2S thru RMB6S
Taiwan Semiconductor
ORDERING INFORMATION
PACKING CODE PACKING CODE
SUFFIX PACKAGE
RATINGS AND CHARACTERISTICS CURVES
PREFERRED P/N PACKING CODE PACKING CODE
SUFFIX
AEC-Q101 qualified
Green compound
DESCRIPTION
RMB2S RCG RMB2S RC G
3,000 / 13" Paper reel
PACKING
RC MBS
Note 1: "x" defines voltage from 200V (RMB2S) to 600V (RMB6S)
EXAMPLE
RMBxS
(Note 1,2) G
0
0.2
0.4
0.6
0.8
1
0 20 40 60 80 100 120 140 160
AVERAGE FORWARD CURRENT (A)
AMBIENT TEMPERATURE (oC)
FIG.1 FORWARD CURRENT DERATING CURVE
Aluminum Substrate
Glass Epoxy P.C.B.
0
5
10
15
20
25
30
35
1 10 100
PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 2 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT PER LEG
8.3ms Single Half Sine Wave
0.01
0.1
1
10
100
0 20406080100
INSTANTANEOUS REVERSE CURRENT (μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
PER LEG
TJ=125°C
TJ=25°C
0.1
1
10
0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
PER LEG
Min Max Min Max
A 4.50 4.90 0.177 0.193
B 0.56 0.84 0.022 0.033
C 3.60 5.00 0.142 0.197
D - 6.90 - 0.272
E 2.20 2.60 0.087 0.102
F 2.30 2.70 0.091 0.106
G - 0.20 - 0.008
H - 2.90 - 0.114
I 0.95 1.53 0.037 0.060
J 0.70 1.10 0.028 0.043
K 0.15 0.35 0.006 0.014
L 1.10 2.12 0.043 0.083
P/N = Specific Device Code
YW = Date Code
F = Factory Code
Document Number: DS_D1410011 Version: F14
0.067
TO-269AA (MBS)
RMB2S thru RMB6S
Taiwan Semiconductor
0.051
0.248
E1.3
A
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm)
0.319
C4.4
Unit (inch)
SUGG ESTED PAD LAYOUT
0.035
0.173
B0.9
Unit (inch)
MARKING DIAGRAM
F6.3
Symbol Unit (mm)
1.7
D8.1
0
5
10
15
20
25
30
0.1 1 10 100
CAPACITANCE (pF) A
REVERSE VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
PER LEG
f=1.0MHz
Vsig=50mVp-p
CREAT BY ART
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1410011 Version: F14
RMB2S thru RMB6S
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
