CPC1330GRTR - Zilog - Product.Live

INTEGRATED CIRCUITS DIVISION

www.ixysic.com

DS-CPC1330-R05 1

CPC1330

Single-Pole, Normally Open

4-Pin OptoMOS® Relay

Part Number Description

CPC1330G 4-Pin DIP (100/Tube)

CPC1330GR 4-Pin Surface Mount (100/Tube)

CPC1330GRTR 4-Pin Surface Mount (1000/Reel)

Parameters Ratings Units

Peak Blocking Voltage 350 VP

Load Current 120 mArms / mADC

On-Resistance (max) 30 

Applications

Features

Description

Approvals

Ordering Information

Pin Configuration

The CPC1330G is a single-pole normally-open

(1-Form-A) Solid State Relay with an enhanced input

to output isolation barrier of 5000Vrms.

The relay output is constructed with efficient

MOSFET switches that use IXYS Integrated Circuits

Division's patented OptoMOS architecture. The input,

a highly efficient GaAlAS infrared LED, controls the

optically coupled output.

• Instrumentation

• Multiplexers

• Data Acquisition

• Electronic Switching

• I/O Subsystems

• Meters (Watt-Hour, Water, Gas)

• Medical Equipment—Patient/Equipment Isolation

• Security

• Aerospace

• Industrial Controls

• UL Certified Component: File E76270

• CSA Certified Component: Certificate 1172007

• EN/IEC 60950-1 Certified Component:

TUV Certificate B 10 05 49410 006

• 5000Vrms Input/Output Isolation

• 350VP Blocking Voltage

• 100% Solid State

• Low Drive Power Requirements (TTL/CMOS

Compatible)

• Arc-Free With No Snubbing Circuits

• No EMI/RFI Generation

• Small 4-Pin Package

• Machine Insertable, Wave Solderable

Switching Characteristics

of Normally Open Devices

Form-A

ILOAD

10%

90%

ton toff

+ Control

– Control

Load

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CPC1330

Absolute Maximum Ratings are stress ratings. Stresses in

excess of these ratings can cause permanent damage to

the device. Functional operation of the device at conditions

beyond those indicated in the operational sections of this

data sheet is not implied.

Parameter Ratings Units

Peak Blocking Voltage 350 VP

Reverse Input Voltage 5 V

Input Control Current 50 mA

Peak (10ms) 1 A

Input Power Dissipation 1100 mW

Total Package Dissipation 2550 mW

Isolation Voltage, Input to Output 5000 Vrms

Operational Temperature -40 to +85 ºC

Storage Temperature -40 to +125 ºC

1 Derate linearly 1.33 mW / ºC

2 Derate linearly 3.00 mW / ºC

Absolute Maximum Ratings @ 25ºC

Electrical Characteristics @ 25ºC

Parameters Conditions Symbol Min Typ Max Units

Output Characteristics

Load Current

Continuous - IL- - 120 mArms / mADC

Peak t=10ms ILPK - - ±350 mAP

On-Resistance IL=120mA RON -2530 

Off-State Leakage Current VL=350VPILEAK -- 1 A

Switching Speeds

Turn-On IF=5mA, VL=10V ton -- 2 ms

Turn-Off toff -- 1

Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -25 - pF

Input Characteristics

Input Control Current to Activate IL=120mA IF- 0.33 2 mA

Input Control Current to Deactivate - IF0.2 0.3 - mA

Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V

Reverse Input Current VR=5V IR--10 A

Common Characteristics

Input to Output Capacitance - CI/O -3 - pF

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CPC1330

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PERFORMANCE DATA*

*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application

department.

01.17 1.19 1.21 1.23 1.25

LED Forward Voltage Drop (V)

Device Count (N)

Typical LED Forward Voltage Drop

(N=50, IF=5mA, TA=25ºC)

0.85 1.00 1.15 1.250.90 1.10 1.20

Turn-On (ms)

Device Count (N)

Typical Turn-On Time

(N=50, IF=5mA, IL=120mA, TA=25ºC)

0.21 0.23 0.25 0.270.260.240.22

Turn-Off (ms)

Device Count (N)

Typical Turn-Off Time

(N=50, IF=5mA, IL=120mA, TA=25ºC)

0.30 0.32 0.340.29 0.31 0.33 0.35

LED Current (mA)

Device Count (N)

Typical IF for Switch Operation

(N=50, IL=120mA, TA=25ºC)

0.28 0.30 0.320.27 0.29 0.31 0.33

LED Current (mA)

Device Count (N)

Typical IF for Switch Dropout

(N=50, IL=120mA, TA=25ºC)

23.5 24.5 25.5 26.524 25 26

Device Count (N)

Typical On-Resistance Distribution

(N=50, IL=120mA, TA=25ºC)

On-Resistance (:)

370 380 390 400375 385 395

Blocking Voltage (VP)

Device Count (N)

Typical Blocking Voltage Distribution

(N=50, TA=25ºC)

LED Forward Voltage Drop (V)

Typical LED Forward Voltage Drop

vs. Temperature

Temperature (ºC)

1.8

1.6

1.4

1.2

1.0

0.8

-40 -20 0 20 40 60 80 120100

= 50mA

= 30mA

= 20mA

= 10mA

= 5mA

LED Forward Current (mA)

Turn-On (ms)

05 1015202530354045

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

Typical Turn-On

vs. LED Forward Current

(IL=120mA)

LED Forward Current (mA)

Turn-Off (ms)

05 1015202530354045

0.7

0.6

0.5

0.4

0.3

0.2

0.1

Typical Turn-Off

vs. LED Forward Current

(IL=120mA)

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CPC1330

PERFORMANCE DATA*

*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application

department.

IF = 5mA

IF = 10mA

Turn-On (ms)

-40

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

-20 0 20 40 60 80 100

Temperature (ºC)

Typical Turn-On vs. Temperature

(IL=80mA)

Turn-Off (ms)

-40

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

-20 0 20 40 60 80 100

IF = 5mA

IF = 10mA

Typical Turn-Off vs. Temperature

(IL=80mA)

Temperature (ºC)

-40

-20 0 20 40 60 80 100

Typical On-Resistance

vs. Temperature

(IF=10mA, IL=80mA)

On-Resistance (:)

Temperature (ºC)

LED Current (mA)

-40

1.2

1.0

0.8

0.6

0.4

0.2

-20 0 20 40 60 80 100

Typical IF for Switch Operation

vs. Temperature

(IL=80mA)

Temperature (ºC)

LED Current (mA)

-40

1.2

1.0

0.8

0.6

0.4

0.2

-20 0 20 40 60 80 100

Typical IF for Switch Dropout

vs. Temperature

(IL=80mA)

Temperature (ºC) Load Voltage (V)

Load Current (mA)

150

100

-50

-100

-150 -3 -2 -1 0 1 2 3

Typical Load Current

vs. Load Voltage

(IF=5mA, TA=25ºC)

Load Current (mA)

180

160

140

120

100

-40 -20 0 20 40 60 80 120100

= 2mA

= 10mA

Maximum Load Current

vs. Temperature

Temperature (ºC)

Blocking Voltage (VP)

-40

400

395

390

385

380

375

370

365

-20 0 20 40 60 80 100

Temperature (ºC)

Typical Blocking Voltage

vs. Temperature

Leakage (PA)

-40

0.016

0.014

0.012

0.010

0.008

0.006

0.004

0.002

-20 0 20 40 60 80 100

Typical Leakage vs. Temperature

Measured Across Pins 3 & 4

Temperature (ºC)

Time

Load Current (A)

10μs

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

1ms100μs 100ms 1s

10ms 10s 100s

Energy Rating Curve

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CPC1330

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Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to

the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product

evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper

operation of our devices when handled according to the limitations and information in that standard as well as to any

limitations set forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according

to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device Moisture Sensitivity Level (MSL) Rating

CPC1330G / CPC1330GR MSL 1

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Reflow Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020

must be observed.

Device Maximum Temperature x Time

CPC1330G / CPC1330GR 250ºC for 30 seconds

Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to

remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as

an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary

if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.

Cleaning methods that employ ultrasonic energy should not be used.

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CPC1330

MECHANICAL DIMENSIONS

PC Board Pattern (Top View)

Dimensions

(inches)

PIN 1

6.350 ± 0.127

(0.250 ± 0.005)

4.572 ± 0.127

(0.180 ± 0.005)

0.991

(0.039)

9º (ALL)

3.30 ± 0.050

(0.130 ± 0.002)

0.254

(0.010)

9.144 ± 0.508

(0.360 ± 0.020)

7.620 ± 0.250

(0.300 ± 0.010)

7.620 ± 0.127

(0.300 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

6 - 0.800 DIA.

(6 - 0.031 DIA.)

6.350 ± 0.127

(0.250 ± 0.005)

9º (ALL)

0.457 ± 0.076

(0.018 ± 0.003)

2.540 ± 0.127

(0.100 ± 0.005) 3.175

(0.125)

0.508

(0.020)

2.159

(0.085)

Dimensions

(inches)

PCB Land Pattern

PIN #1

6.350 ± 0.127

(0.250 ± 0.005)

0.991

(0.039)

9.525

(0.375)

2.540 ± 0.127

(0.100 ± 0.005)

7.620 ± 0.254

(0.300 ± 0.010)

0.635 ± 0.254

(0.025 ± 0.010)

0.254

(0.010)

3.300 ± 0.050

(0.130 ± 0.002)

3.480 ± 0.076

(0.137 ± 0.003)

2.287

(0.09)

8.80

(0.346)

1.60

(0.063)

0.95

(0.037)

9º ± 1º

(ALL)

0.102 min / 0.254 max

(0.004 min / 0.010 max)

4.572 ± 0.127

(0.180 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

2.287 ± 0.127

(0.090 ± 0.005)

CPC1330G

CPC1330GR

INTEGRATED CIRCUITS DIVISION

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make

changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated

Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to

its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe

property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-CPC1330-R05

12/22/2012

For additional information please visit our website at: www.ixysic.com

CPC1330

Dimensions

(inches)

NOTES:

1. All dimensions meet EIA-481-C requirements

2. Unless otherwise noted, tolerances = ±0.10 (0.004)

Embossment

Embossed

Carrier

330.2 Dia

(13.00 Dia)

Top Cover

Tape Thickness

0.102 Max

(0.004 Max) K0=4.20

(0.165)

K1=3.70

(0.146)

W=16.00±0.30

(0.630±0.012)

A0=10.01

(0.394)

P=12.00

(0.472)

B0=5.00

(0.197)

CPC1330GRTR Tape & Reel