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FEATURES
APPLICATIONS
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1DISCH
1THRES
1CONT
1RESET
1OUT
1TRIG
GND
VCC
2DISCH
2THRES
2CONT
2RESET
2OUT
2TRIG
NA556...D OR N PACKAGE
NE556...D, N, OR NS PACKAGE
SA556...D OR N PACKAGE
SE556...J PACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
NA556 , NE556 , SA556 , SE556DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
•Two Precision Timing Circuits Per Package•Astable or Monostable Operation•TTL-Compatible Output Can Sink or Sourceup to 150 mA•Active Pullup or Pulldown•Designed to Be Interchangeable WithSignetics NE556, SA556, and SE556
•Precision Timers From Microseconds toHours
•Pulse-Shaping Circuits•Missing-Pulse Detectors•Tone-Burst Generators•Pulse-Width Modulators•Pulse-Position Modulators•Sequential Timers•Pulse Generators
•Frequency Dividers•Application Timers•Industrial Controls•Touch-Tone Encoders
These devices provide two independent timing circuits of the NA555, NE555, SA555, or SE555 type in eachpackage. These circuits can be operated in the astable or the monostable mode with external resistor-capacitor(RC) timing control. The basic timing provided by the RC time constant can be controlled actively by modulatingthe bias of the control-voltage input.
The threshold (THRES) and trigger (TRIG) levels normally are two-thirds and one-third, respectively, of V
CC
.These levels can be altered by using the control voltage (CONT) terminal. When the trigger input falls belowtrigger level, the flip-flop is set and the output goes high. If the trigger input is above the trigger level and thethreshold input is above the threshold level, the flip-flop is reset, and the output is low. The reset (RESET) inputcan override all other inputs and can be used to initiate a new timing cycle. When RESET goes low, the flip-flopis reset and the output goes low. When the output is low, a low-impedance path is provided between thedischarge (DISCH) terminal and ground (GND).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1978–2006, Texas Instruments IncorporatedProducts conform to specifications per the terms of the Texas
On products compliant to MIL-PRF-38535, all parameters areInstruments standard warranty. Production processing does not
tested unless otherwise noted. On all other products, productionnecessarily include testing of all parameters.
processing does not necessarily include testing of all parameters.
www.ti.com
OUT
RESETVCC
CONT
GND
DISCH
THRES
TRIG
RESET can overrideTRIG, which can overrideTHRES.
NA556 , NE556 , SA556 , SE556DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
ORDERING INFORMATION
V
T
(MAX)T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKINGV
CC
= 15 V
PDIP – N Tube of 25 NE556N NE556NTube of 50 NE556D0°C to 70 °C 11.2 V SOIC – D NE556Reel of 2500 NE556DRSOP – NS Reel of 2000 NE556NSR NE556–40 °C to 85 °C 11.2 V PDIP – N Tube of 25 SA556N SA556NPDIP – N Tube of 25 NA556N NA556N–40 °C to 105 °C 11.2 V Tube of 50 NA556DSOIC – D NA556Reel of 2500 NA556DR
SE556J SE556J–55 °C to 125 °C 10.6 V CDIP – J Tube of 25
SE556JB SE556JB
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
FUNCTION TABLE(each timer)
TRIGGER THRESHOLD DISCHARGERESET OUTPUTVOLTAGE
(1)
VOLTAGE
(1)
SWITCH
Low Irrelevant Irrelevant Low OnHigh <1/3 V
DD
Irrelevant High OffHigh >1/3 V
DD
>2/3 V
DD
Low OnHigh >1/3 V
DD
<2/3 V
DD
As previously established
(1) Voltage levels shown are nominal.
FUNCTIONAL BLOCK DIAGRAM, EACH TIMER
2
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Absolute Maximum Ratings
(1)
Recommended Operating Conditions
NA556 , NE556 , SA556 , SE556DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage
(2)
18 VV
I
Input voltage CONT, RESET, THRES, and TRIG V
CC
VI
O
Output current ±225 mAD package 86θ
JA
Package thermal impedance
(3) (4)
N package 80 °C/WNS package 76θ
JC
Package thermal impedance
(5) (6)
J package 15.05 °C/WT
J
Operating virtual junction temperature 150 °CLead temperature 1,6 mm (1/16 in) from case for 60 s J package 300 °CLead temperature 1,6 mm (1/16 in) from case for 10 s D, N, or NS package 260 °CT
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values are with respect to network ground terminal.(3) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperature is P
D
= (T
J
(max) – T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 °C can affect reliability.(4) The package thermal impedance is calculated in accordance with JESD 51-7.(5) Maximum power dissipation is a function of T
J
(max), θ
JC
, and T
C
. The maximum allowable power dissipation at any allowable casetemperature is P
D
= (T
J
(max) – T
C
)/ θ
JC
. Operating at the absolute maximum T
J
of 150 °C can affect reliability.(6) The package thermal impedance is calculated in accordance with MIL-STD-883.
MIN MAX UNIT
NA556, NE556, SA556 4.5 16V
CC
Supply voltage VSE556 4.5 18V
I
Input voltage CONT, RESET, THRES, and TRIG V
CC
VI
O
Output current ±200 mANA556 –40 105NE556 0 70T
A
Operating free-air temperature °CSA556 –40 85SE556 –55 125
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Electrical Characteristics
NA556 , NE556 , SA556 , SE556DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
V
CC
= 5 V to 15 V, T
A
= 25 °C (unless otherwise noted)
NA556
NE556 SE556PARAMETER TEST CONDITIONS UNITSA556
MIN TYP MAX MIN TYP MAX
V
CC
= 15 V 8.8 10 11.2 9.4 10 10.6Threshold voltageV
T
Vlevel
V
CC
= 5 V 2.4 3.3 4.2 2.7 3.3 4I
T
Threshold current
(1)
30 250 30 250 nA4.5 5 5.6 4.8 5 5.2V
CC
= 15 V
T
A
= –55 °C to 125 °C 3 6V
TRIG
Trigger voltage level V1.1 1.67 2.2 1.45 1.67 1.9V
CC
= 5 V
T
A
= –55 °C to 125 °C 1.9I
TRIG
Trigger current TRIG at 0 V 0.5 2 0.5 0.9 µA0.3 0.7 1 0.3 0.7 1V
RESET
Reset voltage level VT
A
= –55 °C to 125 °C 1.1RESET at V
CC
0.1 0.4 0.1 0.4I
RESET
Reset current mARESET at 0 V –0.4 1.5 –0.4 –1Discharge switchI
DISCH
20 100 20 100 nAoff-state current
9 10 11 9.6 10 10.4V
CC
= 15 V
T
A
= –55 °C to 125 °C 9.6 10.4Control voltageV
CONT
V(open circuit)
2.6 3.3 4 2.9 3.3 3.8V
CC
= 5 V
T
A
= –55 °C to 125 °C 2.9 3.80.1 0.25 0.1 0.15V
CC
= 15 V,I
OL
= 10 mA
T
A
= –55 °C to 125 °C 0.20.4 0.75 0.4 0.5V
CC
= 15 V,I
OL
= 50 mA
T
A
= –55 °C to 125 °C 12 2.5 2 2.2V
CC
= 15 V,I
OL
= 100 mALow-level T
A
= –55 °C to 125 °C 2.7V
OL
Voutput voltage
V
CC
= 15 V, I
OL
= 200 mA 2.5 2.5V
CC
= 5 V,
T
A
= –55 °C to 125 °C 0.35I
OL
= 3.5 mA
0.1 0.25 0.1 0.15V
CC
= 5 V,I
OL
= 5 mA
T
A
= –55 °C to 125 °C 0.8V
CC
= 5 V, I
OL
= 8 mA 0.15 0.3 0.15 0.2512.75 13.3 13 13.3V
CC
= 15 V,I
OH
= –100 mA
T
A
= –55 °C to 125 °C 12High-levelV
OH
V
CC
= 15 V, I
OH
= –200 mA 12.5 12.5 Voutput voltage
2.75 3.3 3 3.3V
CC
= 5 V,I
OH
= –100 mA
T
A
= –55 °C to 125 °C 2V
CC
= 15 V 20 30 20 24Output low,No load
V
CC
= 5 V 6 12 6 10I
CC
Supply current mAV
CC
= 15 V 18 26 18 20Output high,No load
V
CC
= 5 V 4 10 4 8
(1) This parameter influences the maximum value of the timing resistors R and R
B
in the circuit of Figure 1 . For example, when V
CC
= 5 V,the maximum value is R = R
A
+ R
B
≈3.4 M Ω, and for V
CC
= 15 V, the maximum value is ≈10 M Ω.
4
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Operating Characteristics
NA556 , NE556 , SA556 , SE556DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
V
CC
= 5 V and 15 V
NA556
NE556 SE556TESTPARAMETER UNITSA556CONDITIONS
(1)
MIN TYP MAX MIN TYP MAX
Each timer,
1 3 0.5 1.5
(4)monostable
(3)Initial error of timing
T
A
= 25 °Cinterval
(2)
Each timer, astable
(5)
2.25% 1.5%Timer 1 – Timer 2 ±1±0.5Each timer,
50 30 100
(4)Temperature
monostable
(3)
coefficient of timing T
A
= MIN to MAX ppm/ °CEach timer, astable
(5)
150 90interval
Timer 1 – Timer 2 ±10 ±10Each timer,
0.1 0.5 0.05 0.2
(4)Supply voltage
monostable
(3)
sensitivity of timing T
A
= 25 °C %/VEach timer, astable
(5)
0.3 0.15interval
Timer 1 – Timer 2 ±0.2 ±0.1C
L
= 15 pF,Output-pulse rise time 100 300 100 200
(4)
nsT
A
= 25 °CC
L
= 15 pF,Output-pulse fall time 100 300 100 200
(4)
nsT
A
= 25 °C
(1) For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.(2) Timing-interval error is defined as the difference between the measured value and the average value of a random sample from eachprocess run.(3) Values specified are for a device in a monostable circuit similar to Figure 2 , with the following component values: R
A
= 2 k Ωto 100 k Ω,C = 0.1 µF.(4) On products compliant to MIL-PRF-38535, this parameter is not production tested.(5) Values specified are for a device in an astable circuit similar to Figure 1 , with the following component values: R
A
= 1 k Ωto 100 k Ω,C = 0.1 µF.
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APPLICATION INFORMATION
RA
RL
OUT
VCC
(5V to 15V)
VCC
CONT
RESET
DISCH
THRES
TRIG GND
OUT
Input
0.01 µF
C
RB
C
RA
Open
(see Note A)
RL
OUT
VCC
(5V to 15V)
VCC
CONT
RESET
DISCH
THRES
TRIG GND
OUT
NOTE A: Bypassing the control-voltage input to ground with a
capacitor might improve operation.This should be evaluated
for individual applications.
NA556 , NE556 , SA556 , SE556DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
Figure 1. Circuit for Astable Operation Figure 2. Circuit for Monostable Operation
6
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PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
JM38510/10902BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510
/10902BCA
M38510/10902BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510
/10902BCA
NA556D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 NA556
NA556DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 NA556
NA556N ACTIVE PDIP N 14 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 105 NA556N
NE556D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 NE556
NE556DBR ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 N556
NE556DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 NE556
NE556DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 NE556
NE556DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 NE556
NE556N ACTIVE PDIP N 14 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 NE556N
NE556NE4 ACTIVE PDIP N 14 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 NE556N
NE556NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 NE556
SA556N ACTIVE PDIP N 14 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 SA556N
SA556NE4 ACTIVE PDIP N 14 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 SA556N
SE556J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SE556J
SE556JB ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SE556JB
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 2
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
NA556DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
NE556DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
NE556DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
NE556NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
NA556DR SOIC D 14 2500 367.0 367.0 38.0
NE556DBR SSOP DB 14 2000 367.0 367.0 38.0
NE556DR SOIC D 14 2500 367.0 367.0 38.0
NE556NSR SO NS 14 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
14X .008-.014
[0.2-0.36]
TYP
-15
0
AT GAGE PLANE
-.314.308 -7.977.83[ ]
14X -.026.014 -0.660.36[ ]
14X -.065.045 -1.651.15[ ]
.2 MAX TYP
[5.08] .13 MIN TYP
[3.3]
TYP-.060.015 -1.520.38[ ]
4X .005 MIN
[0.13]
12X .100
[2.54]
.015 GAGE PLANE
[0.38]
A
-.785.754 -19.9419.15[ ]
B -.283.245 -7.196.22[ ]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
78
14
1
PIN 1 ID
(OPTIONAL)
SCALE 0.900
SEATING PLANE
.010 [0.25] C A B
www.ti.com
EXAMPLE BOARD LAYOUT
ALL AROUND
[0.05] MAX.002
.002 MAX
[0.05]
ALL AROUND
SOLDER MASK
OPENING
METAL
(.063)
[1.6]
(R.002 ) TYP
[0.05]
14X ( .039)
[1]
( .063)
[1.6]
12X (.100 )
[2.54]
(.300 ) TYP
[7.62]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
4214771/A 05/2017
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 5X
SEE DETAIL A SEE DETAIL B
SYMM
SYMM
1
78
14
DETAIL A
SCALE: 15X
SOLDER MASK
OPENING
METAL
DETAIL B
13X, SCALE: 15X
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
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