HLMP-AJ64/65
Precision Optical Performance Orange
New 5mm Mini Oval LEDs
Data Sheet
Description
These Precision Optical Performance Oval LEDs are specif-
ically designed for mono color/video and passenger infor-
mation signs. The oval shaped radiation pattern and high
luminous intensity ensure that these devices are excellent
for wide field of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
The package epoxy contains both UV-A and UV-B inhibi-
tors to reduce the effects of long term exposure to direct
sunlight.
Features
• Well defined spatial radiation pattern
• Available in Orange color (605nm)
• High brightness material
• Superior resistance to moisture
• Standoff and Non-standoff Package
• Tinted and diffused
• Typical viewing angle: 30° x 70°
Applications
• Mono color signs
Measured at base of lens
5.20 ± 0.20
0.205 ± 0.008
8.70 ± 0.20
0.342 ± 0.008
2.54 ± 0.3
0.100 ± 0.012
1.0
0.038
3.80 ± 0.20
0.150 ± 0.008
MIN.
0.8
0.016
MAX. EPOXY MENISCUS
CATHODE LEAD
24.00
0.945 MIN.
0.50 ± 0.10
0.020 ± 0.004 Sq Typ
Package Dimensions
Package drawing A
Package drawing B
Measure at base of lens
5.2 ± 0.20
0.205 ± 0.008
8.70 ± 0.20
0.342 ± 0.008
2.54 ± 0.3
0.100 ± 0.012
1.0
0.038
3.80 ± 0.20
0.150 ± 0.008
MIN.
0.8
0.032 MAX. EPOXY MENISCUS
CATHODE LEAD
24.00
0.945 MIN.
0.50 ± 0.10
0.020 ± 0.004
1.50 ± 0.15
0.0591 ± 0.006
11.70 ± 0.50
0.4606 ± 0.02
Sq Typ
Notes:
All dimensions in millimeters (inches).
Tolerance is ± 0.20mm unless other specified
2
Device Selection Guide
Part Number Color and Dominant
Wavelength λd (nm) Typ
Luminous Intensity Iv
(mcd) at 20 mA-Min [1,2,4]
Luminous Intensity Iv
(mcd) at 20 mA-Max [1,2,4] Package Drawing
HLMP-AJ64-YZ0DD Orange 605 1990 2900 A
HLMP-AJ65-YZ0DD Orange 605 1990 2900 B
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. Tolerance for each bin limit is ± 15%.
Part Numbering System
Note:
Please refer to AB 5337 for complete information about part numbering system.
Packaging Option
DD: Ammopack
Color Bin Selection
0: Full Distribution
Maximum Intensity Bin
0: No maximum intensity limit
Minimum Intensity Bin
Refer to Device Selection Guide.
Standoff / Non Standoff
4: Non standoff
5: Standoff
Package
A: 5mm Mini Oval 30° x 70°
HLMP – A J 6x – x x x xx
3
Absolute Maximum Ratings
TJ = 25°C
Parameter Orange Unit
DC Forward Current [1] 50 mA
Peak Forward Current 100 [2] mA
Power Dissipation 120 mW
Reverse Voltage 5 (IR = 100 μA) V
LED Junction Temperature 130 °C
Operating Temperature Range -40 to +100 °C
Storage Temperature Range -40 to +100 °C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty Factor 30%, frequency 1KHz.
Electrical / Optical Characteristics
TJ = 25°C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage VF1.8 2.1 2.4 V IF = 20 mA
Reverse Voltage VR5 V IF = 100 μA
Dominant Wavelength [1] λd600 605 612 nm IF = 20 mA
Peak Wavelength λPEAK 609 nm Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Thermal Resistance RθJ-PIN 240 °C/W LED Junction-to anode lead
Luminous Efficacy [2] ηV335 lm/W Emitted Luminous Power/Emitted
Radiant Power
Thermal coefficient of λd0.083 nm/°C IF = 20 mA; +25°C ≤ TJ ≤ + 100°C
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is
the luminous efficacy in lumens/watt.
4
Figure 1. Relative Intensity vs Wavelength Figure 2.Forward Current vs Forward Voltage
Figure 3. Relative Intensity vs Forward Current Figure 4. Maximum Forward Current vs Ambient Temperature
Figure 5. Radiation Pattern – Major Axis Figure 6. Radiation Pattern – Minor Axis
0
20
40
60
80
100
0 1 2 3
FORWARD VOLTAGE - V
FORWARD CURRENT-mA
0
10
20
30
40
50
60
0 20 40 60 80 100
TA - AMBIENT TEMPERATURE - C
IF MAX - MAXIMUM FORWARD CURRENT - mA
0.0
0.2
0.4
0.6
0.8
1.0
500 550 600 650 700
WAVELENGTH - nm
RELATIVE INTENSITY
0.0
1.0
2.0
3.0
4.0
5.0
0 20 40 60 80 100
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
NORMALIZED INTENSITY
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
NORMALIZED INTENSITY
5
0.1
1
10
-40 -20 0 20 40 60 80 100 120 140
TJ - JUNCTION TEMPERATURE - °C
RELATIVE LIGHT OUTPUT
(NORMALIZED AT TJ=25°C)
-0.2
-0.15
-0.1
-0.05
0
0.05
0.1
0.15
0.2
-40 -20 0 20 40 60 80 100 120 140
TJ - JUNCTION TEMPERATURE - °C
FORWARD VOLTAGE SHIFT-V
Figure 7. Relative Light Output vs Junction Temperature Figure 8. Relative Forward Voltage vs Junction Temperature
Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)
Bin
Intensity (mcd) at 20mA
Min Max
Y 1990 2400
Z 2400 2900
Tolerance for each bin limit is ± 15%
VF Bin Table (V at 20mA)
Bin ID Min Max
VD 1.8 2.0
VA 2.0 2.2
VB 2.2 2.4
Tolerance for each bin limit is ± 0.05V
Avago Color Bin on CIE 1931 Chromaticity Diagram
Orange Color Bin Limit
Bin ID Min. Max
1 600 604
2 604 608
3 608 612
Tolerance for each bin limit is ± 0.5nm
0.280
0.300
0.320
0.340
0.360
0.380
0.400
0.500 0.550 0.600 0.650 0.700 0.750 0.800
X
Y
Orange 1
2
3
6
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
1.59 mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature 105°C Max. -
Preheat time 60 sec Max -
Peak temperature 260°C Max. 260°C Max.
Dwell time 5 sec Max. 5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
Anode
InGaN Device
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 260°C and the solder
contact time does not exceeding 5sec. Over-stressing the LED during
soldering process might cause premature failure to the LED due to
delamination.
Avago Technologies LED Configuration
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
Note: In order to further assist customer in designing jig accurately
that fit Avago Technologies’ product, 3D model of the product is
available upon request.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
7
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Ammo Packs Drawing
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
60 sec Max
TIME (sec)
260°C Max
105°C Max
TEMPERATURE (°C)
CATHODE
6.35±1.30
0.250±0.051
12.70±1.00
0.500±0.039
18.00±0.50
0.7085±0.0195
9.125±0.625
0.3595±0.0245
12.70±0.30
0.500±0.012
0.70±0.20
0.0276±0.0075 A A
VIEW A – A
4.00±0.20
0.1575±0.0075
ØTYP.
20.5±1.00
0.8070±0.0394
8
Packaging Box for Ammo Packs
Note: The dimension for ammo pack is applicable for the device with standoff and without standoff.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 260C
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
260C
Lam
p
s Bab
y
Label
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved.
AV02-2055EN - August 21, 2009
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 260C
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
260C
Lam
p
s Bab
y
Label
Acronyms and Definition:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color
bin and VF bin)
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
(ii) Avago Baby Label (Only available on bulk packaging)
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for
sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
