HLMP-AJ64/65 Precision Optical Performance Orange New 5mm Mini Oval LEDs Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for mono color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight. * Well defined spatial radiation pattern * Available in Orange color (605nm) * High brightness material * Superior resistance to moisture * Standoff and Non-standoff Package * Tinted and diffused * Typical viewing angle: 30 x 70 Applications * Mono color signs Package Dimensions Package drawing A 8.70 0.20 0.342 0.008 1.0 MIN. 0.038 24.00 MIN. 0.945 CATHODE LEAD Measured at base of lens 3.80 0.20 0.150 0.008 2.54 0.3 0.100 0.012 5.20 0.20 0.205 0.008 0.50 0.10 Sq Typ 0.020 0.004 0.8 MAX. EPOXY MENISCUS 0.016 Package drawing B 24.00 MIN. 0.945 11.70 0.50 0.4606 0.02 8.70 0.20 0.342 0.008 1.50 0.15 0.0591 0.006 1.0 MIN. 0.038 CATHODE LEAD 5.2 0.20 0.205 0.008 2.54 0.3 0.100 0.012 0.8 MAX. EPOXY MENISCUS 0.032 Notes: All dimensions in millimeters (inches). Tolerance is 0.20mm unless other specified 0.50 0.10 Sq Typ 0.020 0.004 Measure at base of lens 3.80 0.20 0.150 0.008 Device Selection Guide Part Number Color and Dominant Wavelength d (nm) Typ Luminous Intensity Iv (mcd) at 20 mA-Min [1,2,4] Luminous Intensity Iv (mcd) at 20 mA-Max [1,2,4] Package Drawing HLMP-AJ64-YZ0DD Orange 605 1990 2900 A HLMP-AJ65-YZ0DD Orange 605 1990 2900 B Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. Tolerance for each bin limit is 15%. Part Numbering System HLMP - A J 6x - x x x xx Packaging Option DD: Ammopack Color Bin Selection 0: Full Distribution Maximum Intensity Bin 0: No maximum intensity limit Minimum Intensity Bin Refer to Device Selection Guide. Standoff / Non Standoff 4: Non standoff 5: Standoff Package A: 5mm Mini Oval 30 x 70 Note: Please refer to AB 5337 for complete information about part numbering system. 2 Absolute Maximum Ratings TJ = 25C Parameter Orange Unit DC Forward Current [1] 50 mA Peak Forward Current 100 [2] mA Power Dissipation 120 mW Reverse Voltage 5 (IR = 100 A) V LED Junction Temperature 130 C Operating Temperature Range -40 to +100 C Storage Temperature Range -40 to +100 C Notes: 1. Derate linearly as shown in Figure 4. 2. Duty Factor 30%, frequency 1KHz. Electrical / Optical Characteristics TJ = 25C Parameter Symbol Min. Typ. Max. Units Test Conditions Forward Voltage VF 1.8 2.1 2.4 V IF = 20 mA Reverse Voltage VR 5 V IF = 100 A Dominant Wavelength [1] d 600 nm IF = 20 mA Peak Wavelength PEAK 609 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Thermal Resistance RJ-PIN 240 C/W LED Junction-to anode lead Luminous Efficacy [2] V 335 lm/W Emitted Luminous Power/Emitted Radiant Power 0.083 nm/C IF = 20 mA; +25C TJ + 100C Thermal coefficient of d 605 612 Notes: 1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp. 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/V where IV is the luminous intensity in candelas and V is the luminous efficacy in lumens/watt. 3 100 0.8 80 FORWARD CURRENT-mA RELATIVE INTENSITY 1.0 0.6 0.4 0.2 0.0 500 550 600 WAVELENGTH - nm 650 IF MAX - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 4.0 3.0 2.0 1.0 0 20 40 60 DC FORWARD CURRENT - mA 80 100 40 30 20 10 0 0.8 0.8 0.6 0.4 0.2 -30 0 30 ANGULAR DISPLACEMENT-DEGREE Figure 5. Radiation Pattern - Major Axis 3 50 1.0 -60 1 2 FORWARD VOLTAGE - V 60 1.0 0.0 -90 0 0 20 40 60 TA - AMBIENT TEMPERATURE - C 80 100 Figure 4. Maximum Forward Current vs Ambient Temperature NORMALIZED INTENSITY NORMALIZED INTENSITY Figure 3. Relative Intensity vs Forward Current 4 20 Figure 2.Forward Current vs Forward Voltage 5.0 0.0 40 0 700 Figure 1. Relative Intensity vs Wavelength 60 60 90 0.6 0.4 0.2 0.0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT-DEGREE Figure 6. Radiation Pattern - Minor Axis 90 10 0.2 FORWARD VOLTAGE SHIFT-V RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ=25C) 0.15 1 0.1 0.05 0 -0.05 -0.1 -0.15 0.1 -40 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE - C 120 -0.2 140 -40 -20 0 20 40 60 80 100 120 TJ - JUNCTION TEMPERATURE - C Figure 7. Relative Light Output vs Junction Temperature Figure 8. Relative Forward Voltage vs Junction Temperature Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio) Orange Color Bin Limit Intensity (mcd) at 20mA Bin ID Min. Max Bin Min Max 1 600 604 Y 1990 2400 2 604 608 Z 2400 2900 3 608 612 Tolerance for each bin limit is 0.5nm Tolerance for each bin limit is 15% VF Bin Table (V at 20mA) Bin ID Min Max VD 1.8 2.0 VA 2.0 2.2 VB 2.2 2.4 Tolerance for each bin limit is 0.05V Avago Color Bin on CIE 1931 Chromaticity Diagram 0.400 0.380 Orange 0.360 1 Y 2 0.340 3 0.320 0.300 0.280 0.500 5 0.550 0.600 0.650 X 0.700 0.750 0.800 140 Precautions: Lead Forming: * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. * For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. * If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies' high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260C and the solder contact time does not exceeding 5sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED Configuration Soldering and Handling: * Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. * LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron's tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. Note: Electrical connection between bottom surface of LED die and InGaNisDevice the lead frame achieved through conductive paste. * Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. 1.59 mm * ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. * Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105C Max. - Preheat time 60 sec Max - Peak temperature 260C Max. 260C Max. Dwell time 5 sec Max. 5 sec Max Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. * Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 6 Anode Note: In order to further assist customer in designing jig accurately that fit Avago Technologies' product, 3D model of the product is available upon request. * At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. * If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. * Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) * Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED 260C Max TEMPERATURE (C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255C 5C (maximum peak temperature = 260C) 105C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) 60 sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Ammo Packs Drawing 6.351.30 0.2500.051 12.701.00 0.5000.039 CATHODE 20.51.00 0.80700.0394 18.000.50 0.70850.0195 9.1250.625 0.35950.0245 12.700.30 0.5000.012 0.700.20 A 0.02760.0075 A VIEW A - A 7 O 4.000.20 TYP. 0.15750.0075 Packaging Box for Ammo Packs Note: The dimension for ammo pack is applicable for the device with standoff and without standoff. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin 8 Lamps Baby Label RoHS Compliant e3 max temp 260C (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF Bin BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin "VB" only) (ii) Color bin incorporate with VF Bin BIN: 2VB VB: VF bin "VB" (Applicable for part number that have both color bin and VF bin) 2: Color bin 2 only DISCLAIMER: Avago's products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2009 Avago Technologies. All rights reserved. AV02-2055EN - August 21, 2009