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Page <1> V1.025/02/13
Surface Mount
Zener Diode
Features:
Planar Die Construction
350mW Power Dissipation
General Purpose, Medium Current
Ideally Suited For Automated Assembly Processes
Application:
350mW Surface mount zener diode
Maximum Rating @ Ta = 25°C unless otherwise specied
Characteristic Symbol Value Unit
Forward voltage @ IF = 10mA VF0.9 V
Power dissipation PD350 mW
Thermal resistance, junction to ambient air RθjA 357 °C/W
Operating and storage temperature range Tj, Tstg -65 to +150 °C
Note : Valid provided that device terminals are kept at ambient temperature.
Tested with pulses, TP ≤ 1ms.
Electrical Characteristics @ Ta = 25°C unless otherwise specied
Type Number Marking
Code
Zener Voltage Range Maximum Zener Impedance Maximum Reverse
Leakage Current
Vz@IZT IZT ZZT@IZT ZZK@IZK = 0.25mA IR@VR
Nom(V) Min(V) Max(V) (mA) (Ω) (μA) (V)
MMBZ5234B KE4 6.2 5.89 6.51 20 7 1,000 5 4
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Page <2> V1.025/02/13
Surface Mount
Zener Diode
Typical Characteristics @ Ta = 25°C unless otherwise specied
Package Outline
Plastic surface mounted package
SOT-23
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Page <3> V1.025/02/13
Surface Mount
Zener Diode
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without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any
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Multicomp is the registered trademark of the Group. © Premier Farnell plc 2012.
Part Number Table
Description Part Number
350mW Surface Mount Zener Diode MMBZ5234B-7-F
Package Information
Device Package Shipping
MMBZ5234B-7-F SOT-23 3,000/Tape & Reel
Dimensions : Millimetres
Soldering Footprint