Device Operating
Temperature Range Package
MC1458, C
ORDERING INFORMATION
MC1458CD, D
MC1458CP1, P1 TA = 0° to +70°CSO–8
Plastic DIP
A
+
+
B
SEMICONDUCTOR
TECHNICAL DATA
DUAL
OPERATIONAL AMPLIFIERS
(DUAL MC1741)
P1 SUFFIX
PLASTIC PACKAGE
CASE 626
D SUFFIX
PLASTIC PACKAGE
CASE 751
(SO–8)
1
1
8
8
Inputs
A
–
–
1
2
3
4
8
7
6
5
(Top View)
VEE
Output A
Output B
VCC
Inputs
B
PIN CONNECTIONS
2–84 MOTOROLA ANALOG IC DEVICE DATA
Internally Compensated,
High Performance
Dual Operational Amplifiers
The MC1458, C was designed for use as a summing amplifier, integrator,
or amplifier with operating characteristics as a function of the external
feedback components.
•No Frequency Compensation Required
•Short Circuit Protection
•Wide Common Mode and Differential Voltage Ranges
•Low Power Consumption
•No Latch–Up
MAXIMUM RATINGS (TA = +25°C, unless otherwise noted.)
Rating Symbol Value Unit
Power Supply Voltage VCC
VEE +18
–18 Vdc
Input Differential Voltage VID ±30 V
Input Common Mode Voltage (Note 1) VICM ±15 V
Output Short Circuit Duration (Note 2) tSC Continuous
Operating Ambient Temperature Range TA0 to +70 °C
Storage Temperature Range Tstg –55 to +125 °C
Junction Temperature TJ150 °C
NOTES: 1.For supply voltages less than ±15 V, the absolute maximum
input voltage is equal to the supply voltage.
2.Supply voltage equal to or less than 15 V.
Representative Schematic Diagram
Noninverting
Input
Inverting
Input
VCC
VEE
39 k
1.0 k 1.0 k50 k 50 k 50
50
25
4.5 k
7.5 k
30 pF Output
MC1458, C
2–85
MOTOROLA ANALOG IC DEVICE DATA
ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = –15 V, TA = 25°C, unless otherwise noted. (Note 3))
MC1458 MC1458C
Characteristic Symbol Min Typ Max Min Typ Max Unit
Input Offset Voltage (RS ≤ 10 k) VIO – 2.0 6.0 – 2.0 1.0 mV
Input Offset Current IIO – 20 200 – 20 300 nA
Input Bias Current IIB – 80 500 – 80 700 nA
Input Resistance ri0.3 2.0 – – 2.0 – MΩ
Input Capacitance Ci– 1.4 – – 1.4 – pF
Offset Voltage Adjustment Range VIOR –±15 – – ±15 – mV
Common Mode Input Voltage Range VICR ±12 ±13 – ±11 ±13 – V
Large Signal Voltage Gain AVOL V/mV
(VO = ±10 V, RL = 2.0 k) 20 200 – – – –
(VO = ±10 V, RL = 10 k) – – – 20 200 –
Output Resistance ro– 75 – – 75 – Ω
Common Mode Rejection (RS ≤ 10 k) CMR 70 90 – 60 90 – dB
Supply Voltage Rejection (RS ≤ 10 k) PSR – 30 150 – 30 – µV/V
Output Voltage Swing VOV
(RS ≤ 10 k) ±12 ±14 – ±11 ±14 –
(RS ≤ 2.0 k) ±10 ±13 – ±9.0 ±13 –
Output Short Circuit Current ISC – 20 – – 20 – mA
Supply Currents (Both Amplifiers) ID– 2.3 5.6 – 2.3 8.0 mA
Power Consumption PC– 70 170 – 70 240 mW
T ransient Response (Unity Gain)
(VI = 20 mV, RL ≥ 2.0 kΩ, CL ≤ 100 pF) Rise Time tTLH – 0.3 – – 0.3 – µs
(VI = 20 mV, RL ≥ 2.0 kΩ, CL ≤ 100 pF) Overshoot os – 15 – – 15 – %
(VI = 10 V, RL ≥ 2.0 kΩ, CL ≤ 100 pF) Slew Rate SR – 0.5 – – 0.5 – V/µs
ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = –15 V, TA = Thigh to Tlow, unless otherwise noted. (Note 3))*
MC1458 MC1458C
Characteristic Symbol Min Typ Max Min Typ Max Unit
Input Offset Voltage (RS ≤ 10 kΩ) VIO – – 7.5 – – 12 mV
Input Offset Current (TA = 0° to +70°C) IIO – – 300 – – 400 nA
Input Bias Current (TA = 0° to +70°C) IIB – – 800 – – 1000 nA
Output Voltage Swing VOV
(Rs ≤ 10 k) ±12 ±14 –– – –
(Rs ≤ 2 k) ±10 ±13 –±9.0 ±13 –
Large Signal Voltage Gain AVOL V/mV
(VO = ±10 V, RL = 2 k) 15 –––––
(VO = ±10 V, RL = 10 k) – – – 15 – –
*Tlow = 0°C for MC1458, C Thigh = +70°C for MC1458, C
NOTE: 3.Input pins of an unused amplifier must be grounded for split supply operation or biased at least 3.0 V above VEE for single supply operation.
MC1458, C
2–86 MOTOROLA ANALOG IC DEVICE DATA
Figure 1. Burst Noise versus Source Resistance Figure 2. RMS Noise versus Source Resistance
Figure 3. Output Noise versus Source Resistance Figure 4. Spectral Noise Density
Figure 5. Burst Noise Test Circuit
Unlike conventional peak reading or RMS meters, this system
was especially designed to provide the quick response time
essential to burst (popcorn) noise testing.
The test time employed is 10 sec and the 20 µV peak limit
refers to the operational amplifier input thus eliminating errors
in the closed loop gain factor of the operational amplifier .
RS, SOURCE RESISTANCE (Ω)
0
10
100
1000
10 100 1.0 k 10 k 100 k 1.0 M
BW = 1.0 Hz to 1.0 kHz
en,en,INPUT NOISE (peak) ( V)µ
RS, SOURCE RESISTANCE (Ω)
0.1
1.0
10
100
10 100 1.0 10 k 100 k 1.0 M
BW = 1.0 Hz to 1.0 kHz
OUTPUT
N
O
IS
E
(
r
m
s
mV)
RS, SOURCE RESISTANCE (Ω)
0
0.1
1.0
10
10 100 1.0 k 10 k 100 k 1.0 M
AV = 1000
10
1.0
e
n,
100
f, FREQUENCY (Hz)
10 100 1.0 k 100 k10 k
140
120
100
80
40
20
0
60
AV = 10, RS = 100 kΩ
INPUT NOISE ( nV/ Hz
√)
+
1.0 k Operational Amplifier
Under Test Low Pass Filter
1.0 Hz to 1.0 kHz
100 k
X 500 X 2 To Pass / Fail
Indicator
–
100 k
100 k +
+
–
–
Positive
Threshold
Voltage
Negative
Threshold
Voltage
e
n,IN
PUT
N
O
IS
E
(pe
ak
)
(V)
µ
MC1458, C
2–87
MOTOROLA ANALOG IC DEVICE DATA
V
O,
OUTPUT
VOLT
A
GE
(V )
pp
V
O,
OUTPUT
VOLT
A
GE
SWIN
G
(V
pp
)
Figure 6. Power Bandwidth
(Large Signal Swing versus Frequency) Figure 7. Open Loop Frequency Response
Figure 8. Positive Output Voltage Swing
versus Load Resistance Figure 9. Negative Output Voltage Swing
versus Load Resistance
Figure 10. Output Voltage Swing versus
Load Resistance (Single Supply Operation) Figure 11. Single Supply Inverting Amplifier
f, FREQUENCY (Hz)
10 100 1.0 k 100 k10 k
28
24
20
16
8.0
4.0
0
12
f, FREQUENCY (Hz)
0
–20
20
40
60
80
100
120
10 100 1.0 k 10 k 100 k 1.0 M 10 M10
VOLTAGE GAIN (dB)AVOL,
RL, LOAD RESISTANCE (Ω)
±15 V Supplies
±12 V
15
13
11
9.0
7.0
5.0
3.0
1.0100 200 500 700 1.0 k 2.0 k 5.0 k 7.0 k 10 k
±9.0 V
±6.0 V
V
O,
OUTPUT
VOLT
A
GE
SWIN
G
(V)
RL, LOAD RESISTANCE (Ω)
±15 V Supplies
±12 V
–15
–13
–11
–9.0
–7.0
–5.0
–3.0
–1.0100 200 500 700 1.0 k 2.0 k 5.0 k 7.0 k 10 k
±9.0 V
±6.0 V
VO, OUTPUT VOLTAGE SWING (V)
+27 V
+24 V
+21 V
+18 V
+15 V
+12 V
+9.0 V
+6.0 V
+5.0 V
+30 V Supply
28
24
20
16
12
8.0
4.0
00 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10
R
L
, LOAD RESISTANCE (kΩ)
100 µF
RL
VCC
200 k 50 k +
Vin
7
4
2
3
10 k
–
MC1558
1.0 k
200 k 50 k 100 µF
(V oltage Follower)
THD < 5%
MC1458, C
2–88 MOTOROLA ANALOG IC DEVICE DATA
Figure 12. Noninverting Pulse Response
Figure 13. Transient Response Test Circuit Figure 14. Unused OpAmp
5.0 V/DIV
10 µs/DIV
Output
Input
+RLCL
To Scope
(Input) To Scope
(Output)
–
70
75
80
90
95
100
105
85
0 2.0 4.0 6.0 8.0 10 12 14 16 18 20
VCC, |VEE|, SUPPLY VOL TAGES (V)
AV, VOLT AGE GAIN (dB)
Figure 15. Open Loop Voltage Gain
versus Supply Voltage
+
–
12–1
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Options
In Brief . . . Page
Tape and Reel Configurations 12–2. . . . . . . . . . . . . . . . . . . . .
Tape and Reel Information Table 12–4. . . . . . . . . . . . . . . . . . .
Analog MPQ Table 12–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Motorola offers the convenience of Tape and Reel
packaging for our growing family of standard integrated circuit
products. Reels are available to support the requirements of
both first and second generation pick–and–place equipment.
The packaging fully conforms to the latest EIA–481A
specification. The antistatic embossed tape provides a
secure cavity, sealed with a peel–back cover tape.
12–2 MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Configurations
Typical
User Direction of Feed
SOIC and Micro–8
DEVICES
PIN 1
Typical
User Direction of Feed
PLCC DEVICES
Typical
User Direction of Feed
DPAK and D2PAK
DEVICES
Mechanical Polarization
Typical
User Direction of Feed
SOT–23 (5 Pin)
DEVICES Typical
SOT–89 (3 Pin)
DEVICES
User Direction of Feed
Typical
SOT–89 (5 Pin)
DEVICES
User Direction of Feed
12–3
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Configurations (continued)
STYLE A
(Preferred)
TO–92 Reel Styles
Carrier Strip
Adhesive Tape
Rounded
Side
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
Feed
Rounded side of transistor and adhesive tape visible. Flat side of transistor and adhesive tape visible.
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
Feed
Adhesive Tape On
Top Side
Carrier
Strip
Adhesive Tape On
Top Side
Style M ammo pack is equivalent to Style E of reel
pack dependent on feed orientation from box.
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
Flat Side
Label
STYLE M
STYLE P
(Preferred)
ÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ
Rounded Side
Style P ammo pack is equivalent to Styles A and B of reel pack
dependent on feed orientation from box.
Flat side of transistor and
adhesive tape visible.
Rounded side of transistor and
adhesive tape visible.
TO–92 Ammo Pack Styles
Carrier Strip
Adhesive Tape Flat Side
Label
Carrier
Strip
STYLE E
Feed
Feed
H2A H2A
H
F1 F2
P2 P2
P1 P
D
W
W1
L1
W2
H2B H2B
T1
T
T2
H4 H5
H1
L
TO–92 EIA Radial Tape in Fan Fold Box or On Reel
12–4 MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Information Table
Tape Width Devices
(1)
Reel Size Device
Package
p
(mm) per Reel (inch) Suffix
SO–8, SOP–8 12 2,500 13 R2
SO–14 16 2,500 13 R2
SO–16 16 2,500 13 R2
SO–16L, SO–8+8L WIDE 16 1,000 13 R2
SO–20L WIDE 24 1,000 13 R2
SO–24L WIDE 24 1,000 13 R2
SO–28L WIDE 24 1,000 13 R2
SO–28L WIDE 32 1,000 13 R3
Micro–8 12 2,500 13 R2
PLCC–20 16 1,000 13 R2
PLCC–28 24 500 13 R2
PLCC–44 32 500 13 R2
PLCC–52 32 500 13 R2
PLCC–68 44 250 13 R2
PLCC–84 44 250 13 R2
TO–226AA (T O–92) (2) 18 2,000 13 RA, RE, RP, or RM
(Ammo Pack) only
DPAK 16 2,500 13 RK
D2PAK 24 800 13 R4
SOT–23 (5 Pin) 8 3,000 7 TR
SOT–89 (3/5 Pin) 12 1,000 7 T1
(1) Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned.
(2) Integrated circuits in TO–226AA packages are available in Styes A and E only, with optional “Ammo Pack” (Suffix RP or RM). The RA and RP configurations
are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office.
12–5
MOTOROLA ANALOG IC DEVICE DATA
Analog MPQ Table
Tape/Reel and Ammo Pack
Package Type
Package Code
MPQ
Package
Type
Package
Code
MPQ
PLCC
Case 775 0802 1000/reel
Case 776 0804 500/reel
Case 777 0801 500/reel
SOIC
Case 751 0095 2500/reel
Case 751A 0096 2500/reel
Case 751B 0097 2500/reel
Case 751G 2003 1000/reel
Case 751D 2005 1000/reel
Case 751E 2008 1000/reel
Case 751F 2009 1000/reel
Micro–8
Case 846A – 2500/reel
TO–92
Case 29 0031 2000/reel
Case 29 0031 2000/Ammo Pack
DPAK
Case 369A – 2500/reel
D2PAK
Case 936 – 800/reel
SOT–23 (5 Pin)
Case 1212 – 3000/reel
SOT–89 (3 Pin)
Case 1213 – 1000/reel
SOT–89 (5 Pin)
Case 1214 – 1000/reel
12–6 MOTOROLA ANALOG IC DEVICE DATA
13–1
MOTOROLA ANALOG IC DEVICE DATA
Packaging Information
In Brief . . .
The packaging availability for each device type is indicated
on the individual data sheets and the Selector Guide. All of the
outline dimensions for the packages are given in this section.
The maximum power consumption an integrated circuit
can tolerate at a given operating ambient temperature can be
found from the equation:
TJ(max) – TA
RθJA(Typ)
PD(TA) =
where:
PD(TA)
= Power Dissipation allowable at a given
operating ambient temperature. This must
be greater than the sum of the products of
the supply voltages and supply currents at
the worst case operating condition.
TJ(max)
= Maximum operating Junction Temperature
as listed in the Maximum Ratings Section.
See individual data sheets for TJ(max)
information.
TA
= Maximum desired operating Ambient
Temperature
RθJA(Typ)
= Typical Thermal Resistance Junction-to-
Ambient
13–2 MOTOROLA ANALOG IC DEVICE DATA
Case Outline Dimensions
LP, P, Z SUFFIX
CASE 29-04
Plastic Package
(TO-226AA/TO-92)
ISSUE AD
KC, T SUFFIX
CASE 221A-06
Plastic Package
ISSUE Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.175 0.205 4.45 5.20
B0.170 0.210 4.32 5.33
C0.125 0.165 3.18 4.19
D0.016 0.022 0.41 0.55
F0.016 0.019 0.41 0.48
G0.045 0.055 1.15 1.39
H0.095 0.105 2.42 2.66
J0.015 0.020 0.39 0.50
K0.500 ––– 12.70 –––
L0.250 ––– 6.35 –––
N0.080 0.105 2.04 2.66
P––– 0.100 ––– 2.54
R0.115 ––– 2.93 –––
V0.135 ––– 3.43 –––
R
A
P
J
L
F
B
K
G
H
SECTION X–X
C
V
D
N
N
XX
SEATING
PLANE
1
123
123
4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A
K
L
GD
N
H
Q
F
123
4
–T– SEATING
PLANE
S
R
J
U
TC
3 PL
–B–
–Y–
M
B
M
0.25 (0.010) Y
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.560 0.625 14.23 15.87
B0.380 0.420 9.66 10.66
C0.140 0.190 3.56 4.82
D0.020 0.045 0.51 1.14
F0.139 0.155 3.53 3.93
G0.100 BSC 2.54 BSC
H––– 0.280 ––– 7.11
J0.012 0.045 0.31 1.14
K0.500 0.580 12.70 14.73
L0.045 0.070 1.15 1.77
N0.200 BSC 5.08 BSC
Q0.100 0.135 2.54 3.42
R0.080 0.115 2.04 2.92
S0.020 0.055 0.51 1.39
T0.235 0.255 5.97 6.47
U0.000 0.050 0.00 1.27
13–3
MOTOROLA ANALOG IC DEVICE DATA
T SUFFIX
CASE 314C–01
Plastic Package
ISSUE A
TH SUFFIX
CASE 314A-03
Plastic Package
ISSUE D
T, TV SUFFIX
CASE 314B-05
Plastic Package
ISSUE J
1
5
15
1
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
DIM
AMIN MAX MIN MAX
MILLIMETERS
0.572 0.613 14.529 15.570
INCHES
B0.390 0.415 9.906 10.541
C0.170 0.180 4.318 4.572
D0.025 0.038 0.635 0.965
E0.048 0.055 1.219 1.397
F0.570 0.585 14.478 14.859
G0.067 BSC 1.702 BSC
J0.015 0.025 0.381 0.635
K0.730 0.745 18.542 18.923
L0.320 0.365 8.128 9.271
Q0.140 0.153 3.556 3.886
S0.210 0.260 5.334 6.604
U0.468 0.505 11.888 12.827
–T– SEATING
PLANE
L
S
E
C
FK
J
OPTIONAL
CHAMFER
5X
D5X
M
P
M
0.014 (0.356) T
G
A
U
B
Q–P–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
A
K
B
–Q–
5 PLD
G
J
C
M
Q
M
0.356 (0.014) T
L
E
–T– SEATING
PLANE
12345
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.610 0.625 15.59 15.88
B0.380 0.420 9.65 10.67
C0.160 0.190 4.06 4.83
D0.020 0.040 0.51 1.02
E0.035 0.055 0.89 1.40
G0.067 BSC 1.702 BSC
J0.015 0.025 0.38 0.64
K0.500 ––– 12.70 –––
L0.355 0.370 9.02 9.40
Q0.139 0.147 3.53 3.73
V
Q
KF
UA
B
G
–P–
M
0.10 (0.254) P M
T
5X J
M
0.24 (0.610) T
OPTIONAL
CHAMFER
SLW
E
C
H
N
–T– SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.572 0.613 14.529 15.570
B0.390 0.415 9.906 10.541
C0.170 0.180 4.318 4.572
D0.025 0.038 0.635 0.965
E0.048 0.055 1.219 1.397
F0.850 0.935 21.590 23.749
G0.067 BSC 1.702 BSC
H0.166 BSC 4.216 BSC
J0.015 0.025 0.381 0.635
K0.900 1.100 22.860 27.940
L0.320 0.365 8.128 9.271
N0.320 BSC 8.128 BSC
Q0.140 0.153 3.556 3.886
S––– 0.620 ––– 15.748
U0.468 0.505 11.888 12.827
V––– 0.735 ––– 18.669
W0.090 0.110 2.286 2.794
5X D
13–4 MOTOROLA ANALOG IC DEVICE DATA
DT-1 SUFFIX
CASE 369-07
Plastic Package
(DPAK)
ISSUE K
T, T1 SUFFIX
CASE 314D-03
Plastic Package
ISSUE D
23
4
1
23
145
DT SUFFIX
CASE 369A-13
Plastic Package
(DPAK)
ISSUE Y
4
3
1
D
A
K
B
R
V
S
FL
G
2 PL
M
0.13 (0.005) T
E
C
U
J
H
–T– SEATING
PLANE
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.235 0.250 5.97 6.35
B0.250 0.265 6.35 6.73
C0.086 0.094 2.19 2.38
D0.027 0.035 0.69 0.88
E0.033 0.040 0.84 1.01
F0.037 0.047 0.94 1.19
G0.180 BSC 4.58 BSC
H0.034 0.040 0.87 1.01
J0.018 0.023 0.46 0.58
K0.102 0.114 2.60 2.89
L0.090 BSC 2.29 BSC
R0.175 0.215 4.45 5.46
S0.020 0.050 0.51 1.27
U0.020 ––– 0.51 –––
V0.030 0.050 0.77 1.27
Z0.138 ––– 3.51 –––
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
123
4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
123
4
V
S
A
K
–T–
SEATING
PLANE
R
B
F
GD3 PL
M
0.13 (0.005) T
C
E
JH
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.235 0.250 5.97 6.35
B0.250 0.265 6.35 6.73
C0.086 0.094 2.19 2.38
D0.027 0.035 0.69 0.88
E0.033 0.040 0.84 1.01
F0.037 0.047 0.94 1.19
G0.090 BSC 2.29 BSC
H0.034 0.040 0.87 1.01
J0.018 0.023 0.46 0.58
K0.350 0.380 8.89 9.65
R0.175 0.215 4.45 5.46
S0.050 0.090 1.27 2.28
V0.030 0.050 0.77 1.27
–Q–
12345
U
K
DG
S
A
B
5 PL
J
H
L
EC
M
Q
M
0.356 (0.014) T
SEATING
PLANE
–T–
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.572 0.613 14.529 15.570
B0.390 0.415 9.906 10.541
C0.170 0.180 4.318 4.572
D0.025 0.038 0.635 0.965
E0.048 0.055 1.219 1.397
G0.067 BSC 1.702 BSC
H0.087 0.112 2.210 2.845
J0.015 0.025 0.381 0.635
K1.020 1.065 25.908 27.051
L0.320 0.365 8.128 9.271
Q0.140 0.153 3.556 3.886
U0.105 0.117 2.667 2.972
S0.543 0.582 13.792 14.783
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
13–5
MOTOROLA ANALOG IC DEVICE DATA
DP1, N, P, P1 SUFFIX
CASE 626-05
Plastic Package
ISSUE K
N, P, N-14, P2 SUFFIX
CASE 646-06
Plastic Package
ISSUE L
14
1
DP2, N, P, PC SUFFIX
CASE 648-08
Plastic Package
ISSUE R
16
1
8
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
FC
S
HGD
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
17
14 8
B
A
F
HG D K
C
N
L
J
M
SEATING
PLANE
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.715 0.770 18.16 19.56
B0.240 0.260 6.10 6.60
C0.145 0.185 3.69 4.69
D0.015 0.021 0.38 0.53
F0.040 0.070 1.02 1.78
G0.100 BSC 2.54 BSC
H0.052 0.095 1.32 2.41
J0.008 0.015 0.20 0.38
K0.115 0.135 2.92 3.43
L0.300 BSC 7.62 BSC
M0 10 0 10
N0.015 0.039 0.39 1.01
____
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
14
58
F
NOTE 2 –A–
–B–
–T–
SEATING
PLANE
H
J
GDK
N
C
L
M
M
A
M
0.13 (0.005) B M
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.40 10.16 0.370 0.400
B6.10 6.60 0.240 0.260
C3.94 4.45 0.155 0.175
D0.38 0.51 0.015 0.020
F1.02 1.78 0.040 0.070
G2.54 BSC 0.100 BSC
H0.76 1.27 0.030 0.050
J0.20 0.30 0.008 0.012
K2.92 3.43 0.115 0.135
L7.62 BSC 0.300 BSC
M––– 10 ––– 10
N0.76 1.01 0.030 0.040
__
13–6 MOTOROLA ANALOG IC DEVICE DATA
B, P, P2, V SUFFIX
CASE 648C-03
Plastic Package
(DIP–16)
ISSUE C
16
1
P SUFFIX
CASE 648E–01
Plastic Package
(DIP–16)
ISSUE O
P SUFFIX
CASE 649-03
Plastic Package
ISSUE D
24
1
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
SEATING
PLANE
112
24 13
J
G
FC
K
B
H
N
Q
PA
D
M
L
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A31.50 32.13 1.240 1.265
B13.21 13.72 0.520 0.540
C4.70 5.21 0.185 0.205
D0.38 0.51 0.015 0.020
F1.02 1.52 0.040 0.060
G2.54 BSC 0.100 BSC
H1.65 2.16 0.065 0.085
J0.20 0.30 0.008 0.012
K2.92 3.43 0.115 0.135
L14.99 15.49 0.590 0.610
M––– 10 ––– 10
N0.51 1.02 0.020 0.040
P0.13 0.38 0.005 0.015
Q0.51 0.76 0.020 0.030
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION A AND B DOES NOT INCLUDE MOLD
PROTRUSION.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.25 (0.010).
6. ROUNDED CORNER OPTIONAL.
–A–
–B–
16 9
18
D
GH
S
C
13 PL
S
B
M
0.25 (0.010) T
–T–
SEATING
PLANE
J
M
L
R
PF
K
S
A
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.760 18.80 19.30
B0.245 0.260 6.23 6.60
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.050 0.070 1.27 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.120 0.140 3.05 3.55
L0.295 0.305 7.50 7.74
M0 10 0 10
P0.200 BSC 5.08 BSC
R0.300 BSC 7.62 BSC
S0.015 0.035 0.39 0.88
____
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.840 18.80 21.34
B0.240 0.260 6.10 6.60
C0.145 0.185 3.69 4.69
D0.015 0.021 0.38 0.53
E0.050 BSC 1.27 BSC
F0.040 0.70 1.02 1.78
G0.100 BSC 2.54 BSC
J0.008 0.015 0.20 0.38
K0.115 0.135 2.92 3.43
L0.300 BSC 7.62 BSC
M0 10 0 10
N0.015 0.040 0.39 1.01
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. INTERNAL LEAD CONNECTION BETWEEN 4 AND
5, 12 AND 13.
–A–
–B–
16 9
18
F
DGE
NK
C
NOTE 5
16 PL
S
A
M
0.13 (0.005) T
–T–
SEATING
PLANE
S
B
M
0.13 (0.005) T
J16 PL
M
L
1
16
13–7
MOTOROLA ANALOG IC DEVICE DATA
A, B, N, P SUFFIX
CASE 707-02
Plastic Package
ISSUE C
18
1
P SUFFIX
CASE 710-02
Plastic Package
ISSUE B
28
1
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1
SEATING
PLANE
15
14
28
M
A
B
K
C
N
F
GD
HJ
L
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A36.45 37.21 1.435 1.465
B13.72 14.22 0.540 0.560
C3.94 5.08 0.155 0.200
D0.36 0.56 0.014 0.022
F1.02 1.52 0.040 0.060
G2.54 BSC 0.100 BSC
H1.65 2.16 0.065 0.085
J0.20 0.38 0.008 0.015
K2.92 3.43 0.115 0.135
L15.24 BSC 0.600 BSC
M0 15 0 15
N0.51 1.02 0.020 0.040
____
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
1
SEATING
PLANE
10
9
18
M
A
B
K
C
N
F
GD
H
J
LDIM MIN MAX MIN MAX
INCHESMILLIMETERS
A22.22 23.24 0.875 0.915
B6.10 6.60 0.240 0.260
C3.56 4.57 0.140 0.180
D0.36 0.56 0.014 0.022
F1.27 1.78 0.050 0.070
G2.54 BSC 0.100 BSC
H1.02 1.52 0.040 0.060
J0.20 0.30 0.008 0.012
K2.92 3.43 0.115 0.135
L7.62 BSC 0.300 BSC
M0 15 0 15
N0.51 1.02 0.020 0.040
__ __
P SUFFIX
CASE 711-03
Plastic Package
ISSUE C 40
1
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
120
40 21
B
AC
SEATING
PLANE
DFGH K
N
M
J
L
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A51.69 52.45 2.035 2.065
B13.72 14.22 0.540 0.560
C3.94 5.08 0.155 0.200
D0.36 0.56 0.014 0.022
F1.02 1.52 0.040 0.060
G2.54 BSC 0.100 BSC
H1.65 2.16 0.065 0.085
J0.20 0.38 0.008 0.015
K2.92 3.43 0.115 0.135
L15.24 BSC 0.600 BSC
M0 15 0 15
N0.51 1.02 0.020 0.040
__ __
13–8 MOTOROLA ANALOG IC DEVICE DATA
D, D1, D2 SUFFIX
CASE 751-05
Plastic Package
(SO-8, SOP-8)
ISSUE R
H, P, DP SUFFIX
CASE 738-03
Plastic Package
ISSUE E
F, P, P-3 SUFFIX
CASE 724-03
Plastic Package
(NDIP–24)
ISSUE D 24
1
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
–A–
–B–
24 13
12
1
–T–
SEATING
PLANE
24 PL
K
EF
N
C
D
G
M
A
M
0.25 (0.010) T
24 PLJ
M
B
M
0.25 (0.010) T
L
M
NOTE 1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A1.230 1.265 31.25 32.13
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.020 0.38 0.51
E0.050 BSC 1.27 BSC
F0.040 0.060 1.02 1.52
G0.100 BSC 2.54 BSC
J0.007 0.012 0.18 0.30
K0.110 0.140 2.80 3.55
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
____
20 1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
M
L
J20 PL M
B
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A25.66 27.171.010 1.070
B6.10 6.600.240 0.260
C3.81 4.570.150 0.180
D0.39 0.550.015 0.022
G2.54 BSC0.100 BSC
J0.21 0.380.008 0.015
K2.80 3.550.110 0.140
L7.62 BSC0.300 BSC
M0 15 0 15
N0.51 1.010.020 0.040
____
E1.27 1.770.050 0.070
1
11
10
20
–A–
SEATING
PLANE
K
N
FG
D20 PL
–T–
M
A
M
0.25 (0.010) T
E
B
C
F1.27 BSC0.050 BSC
8
1
SEATING
PLANE
14
58
A0.25 MCBSS
0.25 MBM
h
q
C
X 45
_
L
DIM MIN MAX
MILLIMETERS
A1.35 1.75
A1 0.10 0.25
B0.35 0.49
C0.18 0.25
D4.80 5.00
E1.27 BSCe3.80 4.00
H5.80 6.20
h
0 7
L0.40 1.25
q
0.25 0.50
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
D
EH
A
Be
B
A1
CA
0.10
13–9
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
CASE 751A-03
Plastic Package
(SO-14)
ISSUE F
14 1
D SUFFIX
CASE 751B-05
Plastic Package
(SO-16)
ISSUE J
16 1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
–B–
G
P7 PL
14 8
71 M
0.25 (0.010) B M
S
B
M
0.25 (0.010) A S
T
–T–
F
RX 45
SEATING
PLANE D14 PL K
C
J
M
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A8.55 8.75 0.337 0.344
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.228 0.244
R0.25 0.50 0.010 0.019
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
RX 45
_
G
8 PLP
–B–
–A–
M
0.25 (0.010) B S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.80 10.00 0.386 0.393
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.229 0.244
R0.25 0.50 0.010 0.019
____
DW, FP SUFFIX
CASE 751D-04
Plastic Package
(SO-20L, SO–20)
ISSUE E
20
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
–A–
–B–
20
1
11
10
S
A
M
0.010 (0.25) B S
T
D
20X
M
B
M
0.010 (0.25)
P10X
J
F
G
18X K
C
–T– SEATING
PLANE
M
RX 45
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A12.65 12.95 0.499 0.510
B7.40 7.60 0.292 0.299
C2.35 2.65 0.093 0.104
D0.35 0.49 0.014 0.019
F0.50 0.90 0.020 0.035
G1.27 BSC 0.050 BSC
J0.25 0.32 0.010 0.012
K0.10 0.25 0.004 0.009
M0 7 0 7
P10.05 10.55 0.395 0.415
R0.25 0.75 0.010 0.029
____
13–10 MOTOROLA ANALOG IC DEVICE DATA
DW SUFFIX
CASE 751E-04
Plastic Package
(SO-24L,
SOP (16+4+4)L)
ISSUE E
24
1
DW SUFFIX
CASE 751F-04
Plastic Package
(SO-28L, SOIC–28)
ISSUE E
28
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
–A–
–B– P12X
D24X
12
1324
1
M
0.010 (0.25) B M
S
A
M
0.010 (0.25) B S
T
–T–
G
22X
SEATING
PLANE K
C
RX 45
_
M
F
J
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A15.25 15.54 0.601 0.612
B7.40 7.60 0.292 0.299
C2.35 2.65 0.093 0.104
D0.35 0.49 0.014 0.019
F0.41 0.90 0.016 0.035
G1.27 BSC 0.050 BSC
J0.23 0.32 0.009 0.013
K0.13 0.29 0.005 0.011
M0 8 0 8
P10.05 10.55 0.395 0.415
R0.25 0.75 0.010 0.029
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
J
K
F
1
15
14
28
–A–
–B–
28X
14X
D
P
S
A
M
0.010 (0.25) B S
T
M
0.010 (0.25) B M
26X G–T–
SEATING
PLANE
C
X 45R
_
MDIM MIN MAX MIN MAX
INCHESMILLIMETERS
A17.80 18.05 0.701 0.711
B7.40 7.60 0.292 0.299
C2.35 2.65 0.093 0.104
D0.35 0.49 0.014 0.019
F0.41 0.90 0.016 0.035
G1.27 BSC 0.050 BSC
J0.23 0.32 0.009 0.013
K0.13 0.29 0.005 0.011
M0 8 0 8
P10.01 10.55 0.395 0.415
R0.25 0.75 0.010 0.029
____
DW SUFFIX
CASE 751G-02
Plastic Package
(SO-16L, SOP–16L,
SOP-8+8L)
ISSUE A
16
1DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A10.15 10.45 0.400 0.411
B7.40 7.60 0.292 0.299
C2.35 2.65 0.093 0.104
D0.35 0.49 0.014 0.019
F0.50 0.90 0.020 0.035
G1.27 BSC 0.050 BSC
J0.25 0.32 0.010 0.012
K0.10 0.25 0.004 0.009
M0 7 0 7
P10.05 10.55 0.395 0.415
R0.25 0.75 0.010 0.029
M
B
M
0.010 (0.25)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
–A–
–B– P8X
G14X
D16X
SEATING
PLANE
–T–
S
A
M
0.010 (0.25) B S
T
16 9
81
F
J
RX 45
_
____
M
C
K
13–11
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
CASE 751K–01
Plastic Package
(SO–16)
ISSUE O
16
1
DW SUFFIX
CASE 751N–01
Plastic Package
(SOP–16L)
ISSUE O
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4 MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM
AMIN MAX MIN MAX
INCHES
9.80 10.00 0.368 0.393
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.229 0.244
R0.25 0.50 0.010 0.019
____
18
9
16
G
P
C
K14 X D
SEATING
PLANE J
R
_
M
_
–A–
–B–
M
0.25 (0.010) B S
F
X 45
–T–
S
A
M
0.25 (0.010) B S
T
16
1
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A10.15 10.45 0.400 0.411
B7.40 7.60 0.292 0.299
C2.35 2.65 0.093 0.104
D0.35 0.49 0.014 0.019
F0.50 0.90 0.020 0.035
G1.27 BSC 0.050 BSC
J0.25 0.32 0.010 0.012
K0.10 0.25 0.004 0.009
M0 7 0 7
P10.05 10.55 0.395 0.415
R0.25 0.75 0.010 0.029
M
B
M
0.010 (0.25)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
–A–
–B– P
G
9X
D13X
SEATING
PLANE
–T–
S
A
M
0.010 (0.25) B S
T
16 9
81
F
J
RX 45
_
____
M
T
SS2.54 BSC 0.100 BSC
T3.81 BSC 0.150 BSC
C
K
13–12 MOTOROLA ANALOG IC DEVICE DATA
CASE 762-01
Plastic Medium Power Package
(SIP-9)
ISSUE C
1
9
FN SUFFIX
CASE 775-02
Plastic Package
(PLCC-20)
ISSUE C 1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
1
SEATING
PLANE
9
U
M
A
M
0.25 (0.010) T
M
A
M
0.25 (0.010) T
M
C
M
0.25 (0.010) T
D9 PL
–C–
–A–
–T–
E
B
K
N
M
V
S
Y
R
G
F
W
Q
X
J
H
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A22.40 23.00 0.873 0.897
B6.40 6.60 0.252 0.260
C3.45 3.65 0.135 1.143
D0.40 0.55 0.015 0.021
E9.35 9.60 0.368 0.377
F1.40 1.60 0.055 0.062
G2.54 BSC 0.100 BSC
H1.51 1.71 0.059 0.067
J0.360 0.400 0.014 0.015
K3.95 4.20 0.155 0.165
M30 BSC 30 BSC
N2.50 2.70 0.099 0.106
Q3.15 3.45 0.124 0.135
R13.60 13.90 0.535 0.547
S1.65 1.95 0.064 0.076
U22.00 22.20 0.866 0.874
V0.55 0.75 0.021 0.029
W2.89 BSC 0.113 BSC
X0.65 0.75 0.025 0.029
Y2.70 2.80 0.106 0.110
__
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED A T DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
XG1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T– SEATING
PLANE
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
H
VIEW S
K
K1
FG1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.385 0.395 9.78 10.03
B0.385 0.395 9.78 10.03
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 ––– 0.51 –––
K0.025 ––– 0.64 –––
R0.350 0.356 8.89 9.04
U0.350 0.356 8.89 9.04
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y––– 0.020 ––– 0.50
Z2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
____
13–13
MOTOROLA ANALOG IC DEVICE DATA
FN SUFFIX
CASE 776-02
Plastic Package
(PLCC–28)
ISSUE D 1
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED A T DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
–N–
–M–
–L–
V
WD
D
Y BRK
28 1
VIEW S
S
L–M
S
0.010 (0.250) N S
T
S
L–M
M
0.007 (0.180) N S
T
0.004 (0.100)
G1
GJ
C
ZR
E
A
SEATING
PLANE
S
L–M
M
0.007 (0.180) N S
T
–T–
B
S
L–M
S
0.010 (0.250) N S
T
S
L–M
M
0.007 (0.180) N S
T
U
S
L–M
M
0.007 (0.180) N S
T
Z
G1X
VIEW D–D
S
L–M
M
0.007 (0.180) N S
T
K1
VIEW S
H
K
FS
L–M
M
0.007 (0.180) N S
T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.485 0.495 12.32 12.57
B0.485 0.495 12.32 12.57
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 ––– 0.51 –––
K0.025 ––– 0.64 –––
R0.450 0.456 11.43 11.58
U0.450 0.456 11.43 11.58
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y––– 0.020 ––– 0.50
Z2 10 2 10
G1 0.410 0.430 10.42 10.92
K1 0.040 ––– 1.02 –––
__ __
13–14 MOTOROLA ANALOG IC DEVICE DATA
FN SUFFIX
CASE 777-02
Plastic Package
(PLCC)
ISSUE C
M SUFFIX
CASE 803C
PRELIMINARY
Plastic Package
1
1
20
–N–
–L– –M–
D
Y
D
K
VW
144
BRK
B
Z
U
X
VIEW D–D
S
L–M
M
0.007(0.180) N S
T
S
L–M
M
0.007(0.180) N S
T
G1 S
L–M
S
0.010 (0.25) N S
T
K1
F
H
S
L–M
M
0.007(0.180) N S
T
Z
G
G1
R
A
EJ
VIEW S
C
S
L–M
M
0.007(0.180) N S
T
S
L–M
M
0.007(0.180) N S
T
0.004 (0.10)
–T– SEATING
PLANE VIEW S
S
L–M
S
0.010 (0.25) N S
T
S
L–M
M
0.007(0.180) N S
T
NOTES:
1. DATUMS –L–, –M–, AND –N– ARE DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED A T DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.685 0.695 17.40 17.65
B0.685 0.695 17.40 17.65
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 ––– 0.51 –––
K0.025 ––– 0.64 –––
R0.650 0.656 16.51 16.66
U0.650 0.656 16.51 16.66
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y––– 0.020 ––– 0.50
Z2 10 2 10
G1 0.610 0.630 15.50 16.00
K1 0.040 ––– 1.02 –––
____
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
DIM
AMIN MAX MIN MAX
INCHES
12.35 12.80 0.486 0.504
MILLIMETERS
B5.10 5.45 0.201 0.215
C1.95 2.05 0.077 0.081
D0.35 0.50 0.014 0.020
E––– 0.81 ––– 0.032
F12.40* 0.488*
G1.15 1.39 0.045 0.055
H0.59 0.81 0.023 0.032
J0.18 0.27 0.007 0.011
K1.10 1.50 0.043 0.059
L0.05 0.20 0.001 0.008
M0 10
N0.50 0.85 0.020 0.033
S7.40 8.20 0.291 0.323
__
0 10
__
NOTES:
6 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
7 CONTROLLING DIMENSION: MILLIMETER.
8 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
9 MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER
SIDE.
10 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
*APPROXIMATE
A0.13 (0.005) MTBSS
0.13 (0.005) MBM
S10 PL
G
D20 PL L
C
0.10 (0.004)
SEATING
PLANE
K
N
J
M
E
1
20 11
10
–A–
–F–
–B–
–T–
13–15
MOTOROLA ANALOG IC DEVICE DATA
TV SUFFIX
CASE 821C-04
Plastic Package
(15-Pin ZIP)
ISSUE D
1
15
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. A T MAXIMUM MATERIAL CONDITION.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.684 0.694 17.374 17.627
B0.784 0.792 19.914 20.116
C0.173 0.181 4.395 4.597
D0.024 0.031 0.610 0.787
E0.058 0.062 1.473 1.574
G0.050 BSC 1.270 BSC
H0.169 BSC 4.293 BSC
J0.018 0.024 0.458 0.609
K0.700 0.710 17.780 18.034
L0.200 BSC 5.080 BSC
M0.148 0.151 3.760 3.835
R0.416 0.426 10.567 10.820
S0.157 0.167 3.988 4.242
U0.105 0.115 2.667 2.921
V0.868 REF 22.047 REF
Y0.625 0.639 15.875 16.231
B
D
U
PIN 15
15X G
R
A
PIN 1
M
–Q–
–P–
P
M
0.010 (0.254) QS
TJ15X
M
0.024 (0.610) T
K
LH
S
V
E
C
Y
–T– SEATING
PLANE
T SUFFIX
CASE 821D-03
Plastic Package
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DELETED
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. A T MAXIMUM MATERIAL CONDITION.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.681 0.694 17.298 17.627
B0.784 0.792 19.914 20.116
C0.173 0.181 4.395 4.597
D0.024 0.031 0.610 0.787
E0.058 0.062 1.473 1.574
F
G0.050 BSC 1.270 BSC
H0.110 BSC
0.407 0.584
J0.018 0.024 0.458 0.609
K
Q0.148 0.151 3.760 3.835
R0.416 0.426 10.567 10.820
U0.110 BSC 2.794 BSC
Y0.503 REF 12.776 REF
B
D
U
PIN 15
15X
G
RA
PIN 1
Q
–L–
–P–
P
M
0.010 (0.254) LS
TJ15X
M
0.024 (0.610) T
K
H
E
C
Y
–T– SEATING
PLANE
F7X
0.016 0.023
1.078 1.086
2.794 BSC
27.382 27.584
1
15
13–16 MOTOROLA ANALOG IC DEVICE DATA
FTB SUFFIX
CASE 824D–01
Plastic Package
(TQFP–44)
ISSUE O
1
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED AT
DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.530
(0.021).
44
1
34
33
11
12 22
23
DETAIL AA
–Z–
–T–
A
S
T–U
M
0.20 (0.008) Z S
AB
0.05 (0.002) T–U
S
B
V
–U–
M
Y
E
H
C–AB–
DETAIL AD
0.10 (0.004)
K
WX
VIEW AD
–T–, –U–, –Z–
F
N
SECTION AE–AE
J
D
BASE METAL
PLATING
AE
AE
G
0.05 (0.002) Z
DETAIL AA
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.950 10.050 0.392 0.396
B9.950 10.050 0.392 0.396
C1.400 1.600 0.055 0.063
D0.300 0.450 0.012 0.018
E1.350 1.450 0.053 0.057
F0.300 0.400 0.012 0.016
G0.800 BSC 0.031 BSC
H0.050 0.150 0.002 0.006
J0.090 0.200 0.004 0.008
K0.450 0.550 0.018 0.022
L8.000 BSC 0.315 BSC
M12 REF 12 REF
N0.090 0.160 0.004 0.006
Q1 5 1 5
R0.100 0.200 0.004 0.008
S11.900 12.100 0.469 0.476
V11.900 12.100 0.469 0.476
W0.200 REF 0.008 REF
X1.000 REF 0.039 REF
Y12 REF 12 REF
L
L
S
T–U
M
0.20 (0.008) Z S
AC
S
T–U
M
0.20 (0.008) Z S
AB
S
T–U
M
0.20 (0.008) Z S
AC
–AC–
Q
S
T–U
M
0.20 (0.008) Z S
AC
__
____
__
R
13–17
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 824E–02
Plastic Package
(QFP)
ISSUE A
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÉÉÉ
44
1
34
33
11
12 22
23
VIEW Y
–N–
–L–
A
S
L–M
M
0.20 (0.008) N S
H
S
L–M
M
0.20 (0.008) N S
T
0.05 (0.002) L–M
S
B
V
–M–
–T–
M
Y
E
W
C–H– DATUM
PLANE
VIEW P
0.01 (0.004)
q
–H–
DATUM
PLANE R2
K
A1 C1
VIEW P
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.90 10.10 0.390 0.398
B9.90 10.10 0.390 0.398
C2.00 2.21 0.079 0.087
D0.30 0.45 0.0118 0.0177
E2.00 2.10 0.079 0.083
F0.30 0.40 0.012 0.016
G0.80 BSC 0.031 BSC
J0.13 0.23 0.005 0.009
K0.65 0.95 0.026 0.037
M5 10 5 10
S12.95 13.45 0.510 0.530
V12.95 13.45 0.510 0.530
W0.000 0.210 0.000 0.008
Y5 10 5 10
A1 0.450 REF
0.170 0.018 REF
0.007B1
–L–, –M–, –N–
S
L–M
M
0.20 (0.008) N S
T
F
B1
SECTION J1–J1
J
D
BASE METAL
____
__
G40X
R
R1R
1
q
2
PLATING
44 PL
J1
J1
G
__
C1 1.600 REF 0.063 REF
R1
R2 5 10 5 10 1
2
____
0.130 0.005
0.130 0.300 0.005 0.012
0.130 0.300 0.005 0.012
q
q
0 7 0 7
____
PIN 1
IDENT
S
L–M
M
0.20 (0.008) N S
H
0.05 (0.002) N
S
L–M
M
0.20 (0.008) N S
T
VIEW Y
3 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.530 (0.021).
1
44
13–18 MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 840F–01
Plastic Package
ISSUE O
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
0.20 (0.008) AC
MZT–U SS
0.20 (0.008) AB
MZ T–U
S S
0.20 (0.008) AC
MZ T–U
S S
0.20 (0.008) AB
MZT–U SS
0.20 (0.008) AC
MZT–U SS
Z
0.050 (0.002)
0.050 (0.002) T–U
–Z–
–U–
–T–
L
DETAIL AA
L
1
64 49
48
16 33
17 32
A
S
BV
0.10 (0.004)
–AB–
E
H
C
Y
M
DETAIL AD
–AC–
R
DETAIL AD
W
K
X
Q
J
D
N
BASE
SECTION AE–AE
F
METAL
DETAIL AA
G
AE
AE
P
–T–, –U–, –Z–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED
AT DATUM PLANE –AC–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
DIM
AMIN MAX MIN MAX
INCHES
9.950 10.050 0.392 0.396
MILLIMETERS
B9.950 10.050 0.392 0.396
C1.400 1.600 0.055 0.063
D0.170 0.270 0.007 0.011
E1.350 1.450 0.053 0.057
F0.170 0.230 0.007 0.009
G0.500 BSC 0.020 BSC
H0.050 0.150 0.002 0.006
J0.090 0.200 0.004 0.008
K0.450 0.550 0.018 0.022
L
M
N0.090 0.160 0.004 0.006
P
Q1 5
R0.100 0.200 0.004 0.008
S11.900 12.100 0.469 0.476
V11.900 12.100 0.469 0.476
W
X
Y1.000 REF
12 REF
0.200 REF 0.039 REF
0.008 REF
0.010 BSC0.250 BSC
7.500 BSC 0.295 BSC
°12 REF
°
12 REF
°
12 REF
°
°1 °
°5
°
164
13–19
MOTOROLA ANALOG IC DEVICE DATA
DM SUFFIX
CASE 846A–02
Plastic Package
(Micro–8)
ISSUE C 1
S
B
M
0.08 (0.003) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A2.90 3.10 0.114 0.122
B2.90 3.10 0.114 0.122
C––– 1.10 ––– 0.043
D0.25 0.40 0.010 0.016
G0.65 BSC 0.026 BSC
H0.05 0.15 0.002 0.006
J0.13 0.23 0.005 0.009
K4.75 5.05 0.187 0.199
L0.40 0.70 0.016 0.028
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
–B–
–A–
D
K
G
PIN 1 ID
8 PL
0.038 (0.0015)
–T– SEATING
PLANE
C
HJL
8
13–20 MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 848B-04
Plastic Package
(TQFP–52)
ISSUE C 1
52
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION A T MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
DETAIL A
L
39
40 26
27
1
52 14
13
L
–A–
B
V
S
A–B
M
0.20 (0.008) D S
H
A–B0.05 (0.002)
S
A–B
M
0.20 (0.008) D S
C
–D–
B
V
–B–
S
A–B
M
0.20 (0.008) D S
H
A–B0.05 (0.002)
S
A–B
M
0.20 (0.008) D S
C
–H–
0.10 (0.004)
–C– SEATING
PLANE
DATUM
PLANE
M
G
H
E
CM
_
_
DETAIL C
U
_
Q
_
X
WK
T
R
DETAIL C
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.90 10.10 0.390 0.398
B9.90 10.10 0.390 0.398
C2.10 2.45 0.083 0.096
D0.22 0.38 0.009 0.015
E2.00 2.10 0.079 0.083
F0.22 0.33 0.009 0.013
G0.65 BSC 0.026 BSC
H––– 0.25 ––– 0.010
J0.13 0.23 0.005 0.009
K0.65 0.95 0.026 0.037
L7.80 REF 0.307 REF
M5 10 5 10
N0.13 0.17 0.005 0.007
Q0 7 0 7
R0.13 0.30 0.005 0.012
S12.95 13.45 0.510 0.530
T0.13 ––– 0.005 –––
U0 ––– 0 –––
V12.95 13.45 0.510 0.530
W0.35 0.45 0.014 0.018
X1.6 REF 0.063 REF
____
____
__
B
B
DETAIL A –A–, –B–, –D–
JN
D
F
BASE METAL
SECTION B–B
S
A–B
M
0.02 (0.008) D S
C
13–21
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 848D–03
Plastic Package
ISSUE C
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÇÇÇ
ÇÇÇ
VIEW AA
VIEW AA
2 X R R1
AB
AB
VIEW Y
SECTION AB–AB
ROTATED 90
_
CLOCKWISE
DIM
AMIN MAX MIN MAX
INCHES
10.00 BSC 0.394 BSC
MILLIMETERS
A1 5.00 BSC 0.197 BSC
B10.00 BSC 0.394 BSC
B1 5.00 BSC 0.197 BSC
C––– 1.70 ––– 0.067
C1 0.05 0.20 0.002 0.008
C2 1.30 1.50 0.051 0.059
D0.20 0.40 0.008 0.016
E0.45 0.030
F0.22 0.35 0.009 0.014
G0.65 BSC
0.75 0.018
0.026 BSC
J0.07 0.20 0.003 0.008
K0.50 REF 0.020 REF
R1 0.08 0.20 0.003 0.008
S12.00 BSC 0.472 BSC
S1 6.00 BSC 0.236 BSC
U0.09 0.16 0.004 0.006
V12.00 BSC 0.472 BSC
V1 6.00 BSC 0.236 BSC
W0.20 REF 0.008 REF
Z1.00 REF 0.039 REF
C
L
–X–
X=L, M, N
1
13
14 26
27
39
4052
4X TIPS
4X N0.20 (0.008) H L–M N0.20 (0.008) T L–M
3X VIEW Y
SEATING
PLANE
C0.10 (0.004) T
4X θ3
4X θ2
S
0.05 (0.002)
0.25 (0.010)
GAGE PLANE
C2
C1
W
K
E
Z
S
L–M
M
0.13 (0.005) N S
T
PLATING BASE METAL
D
JU
B V
B1
A
S
V1
A1
S1
–L–
–N–
–M–
–H–
–T–
θ1
θ
G
θ1
θ
θ3
θ2
07
__
12
513
___
07
__
0
_
0
_
––– –––
REF 12
_
REF
13
_
5
_
52 1
13–22 MOTOROLA ANALOG IC DEVICE DATA
B SUFFIX
CASE 859–01
Plastic Package
(SDIP)
ISSUE O
56
1
–A–
–B–
–T–
56 29
128
SEATING
PLANE
J56 PL
D56 PL S
A
M
0.25 (0.010) T
N
FG
E
S
B
M
0.25 (0.010) T
K
CH
L
M
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A2.035 2.065 51.69 52.45
B0.540 0.560 13.72 14.22
C0.155 0.200 3.94 5.08
D0.014 0.022 0.36 0.56
E0.035 BSC 0.89 BSC
F0.032 0.046 0.81 1.17
G0.070 BSC 1.778 BSC
H0.300 BSC 7.62 BSC
J0.008 0.015 0.20 0.38
K0.115 0.135 2.92 3.43
L0.600 BSC 15.24 BSC
M0 15 0 15
N0.020 0.040 0.51 1.02
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)
B SUFFIX
CASE 858–01
Plastic Package
ISSUE O
–A–
121
42 22
–B–
SEATING
PLANE
–T–
S
A
M
0.25 (0.010) TS
B
M
0.25 (0.010) T
L
H
M
J42 PL
D42 PL
FGNK
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A1.435 1.465 36.45 37.21
B0.540 0.560 13.72 14.22
C0.155 0.200 3.94 5.08
D0.014 0.022 0.36 0.56
F0.032 0.046 0.81 1.17
G0.070 BSC 1.778 BSC
H0.300 BSC 7.62 BSC
J0.008 0.015 0.20 0.38
K0.115 0.135 2.92 3.43
L0.600 BSC 15.24 BSC
M0 15 0 15
N0.020 0.040 0.51 1.02
____
42
1
13–23
MOTOROLA ANALOG IC DEVICE DATA
FB, FTB SUFFIX
CASE 873-01
Plastic Package
(TQFP–32)
ISSUE A
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION A T MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
U
B
L
DETAIL A
L
–A–
32
25
24
16
17
18
9
V
S
A–B
M
0.20 (0.008) D S
C
S
A–B
M
0.20 (0.008) D S
H
A–B0.05 (0.002)
S
A–B
M
0.20 (0.008) D S
C
A–B0.05 (0.002)
S
A–B
M
0.20 (0.008) D S
H
–D– A
S
–B–
–C–
SEATING
PLANE
–H– DATUM
PLANE
M
G
DETAIL C
M
H
CE
0.01 (0.004)
–H–
DATUM
PLANE
T
DETAIL C
R
KQ
X
DETAIL A
B
B
P
–A–, –B–, –D–
S
A–B
M
0.20 (0.008) D S
C
J
F
N
D
SECTION B–B
BASE
METAL
VIEW ROTATED 90 CLOCKWISE
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A6.95 0.274 0.280
B6.95 7.10 0.274 0.280
C1.40 1.60 0.055 0.063
D0.273 0.373 0.010 0.015
E1.30 1.50 0.051 0.059
F0.273 ––– 0.010 –––
G0.80 BSC 0.031 BSC
H––– 0.20 ––– 0.008
J0.119 0.197 0.005 0.008
K0.33 0.57 0.013 0.022
L5.6 REF 0.220 REF
M6 8 6 8
N0.119 0.135 0.005 0.005
P0.40 BSC 0.016 BSC
Q5 10 5 10
R0.15 0.25 0.006 0.010
S8.85 9.15 0.348 0.360
T0.15 0.25 0.006 0.010
U5 11 5 1 1
V8.85 9.15 0.348 0.360
X1.00 REF 0.039 REF
__ __
__ __
____
7.10
13–24 MOTOROLA ANALOG IC DEVICE DATA
T SUFFIX
CASE 894-03
Plastic Package
(23-Pin SZIP)
ISSUE B
1
23
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF
THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
AMIN MAX MIN MAX
MILLIMETERS
0.684 0.694 17.374 17.627
INCHES
B1.183 1.193 30.048 30.302
C0.175 0.179 4.445 4.547
D0.026 0.031 0.660 0.787
E0.058 0.062 1.473 1.574
F0.165 0.175 4.191 4.445
G0.050 BSC 1.270 BSC
H0.169 BSC 4.293 BSC
J0.014 0.020 0.356 0.508
K0.625 0.639 15.875 16.231
L0.770 0.790 19.558 20.066
M0.148 0.152 3.760 3.861
N0.148 0.152 3.760 3.861
P0.390 BSC 9.906 BSC
R0.416 0.424 10.566 10.770
S0.157 0.167 3.988 4.242
U0.105 0.115 2.667 2.921
V0.868 REF 22.047 REF
W0.200 BSC 5.080 BSC
Y0.700 0.710 17.780 18.034
PIN 1
D
–N– M
A
P
L
B
F
U
R
GPIN 23
23X
S
Q
M
0.010 (0.254) N S
T
YKV
H
S
E
C
W
M
0.024 (0.610) T
J
23X
–T–
SEATING
PLANE
13–25
MOTOROLA ANALOG IC DEVICE DATA
FTA SUFFIX
CASE 932–02
Plastic Package
(TQFP–48)
ISSUE D
DIM
AMIN MAX MIN MAX
INCHES
7.000 BSC 0.276 BSC
MILLIMETERS
A1 3.500 BSC 0.138 BSC
B7.000 BSC 0.276 BSC
B1 3.500 BSC 0.138 BSC
C1.400 1.600 0.055 0.063
D0.170 0.270 0.007 0.011
E1.350 1.450 0.053 0.057
F0.170 0.230 0.007 0.009
G0.500 BASIC 0.020 BASIC
H0.050 0.150 0.002 0.006
J0.090 0.200 0.004 0.008
K0.500 0.700 0.020 0.028
M12 REF 12 REF
N0.090 0.160 0.004 0.006
P0.250 BASIC 0.010 BASIC
Q1 5 1 5
R0.150 0.250 0.006 0.010
S9.000 BSC 0.354 BSC
S1 4.500 BSC 0.177 BSC
V9.000 BSC 0.354 BSC
V1 4.500 BSC 0.177 BSC
W0.200 REF 0.008 REF
X1.000 REF 0.039 REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
__
____
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÉÉÉ
A
A1
–T–
Z
0.200 (0.008) AB T–U
–U–
4X
Z0.200 (0.008) AC T–U
4X
B
B1
1
12
13 24
25
36
37
48
–Z–
S1
S
V
V1
P
AE AE
–T–, –U–, –Z–
DETAIL Y
DETAIL Y
BASE METAL
NJ
F
D
S
T–U
M
0.080 (0.003) Z S
AC
SECTION AE–AE
–AB–
–AC– AD
G0.080 (0.003) AC
M
_
TOP & BOTTOM
Q
_
W
K
X
E
C
H
0.250 (0.010)
GAUGE PLANE
R
9
DETAIL AD
48 1
13–26 MOTOROLA ANALOG IC DEVICE DATA
D2T SUFFIX
CASE 936–03
Plastic Package
ISSUE B
D2T SUFFIX
CASE 936A–02
Plastic Package
(D2PAK)
ISSUE A
V
U
TERMINAL 4
A
123
K
F
B
J
S
H
DG
C
M
0.010 (0.254) T
E
ML
P
N
R
–T–
OPTIONAL
CHAMFER
5 REF
A
123
K
B
S
H
D
G
C
E
ML
P
N
R
V
U
TERMINAL 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
DIM
AMIN MAX MIN MAX
MILLIMETERS
0.386 0.403 9.804 10.236
INCHES
B0.356 0.368 9.042 9.347
C0.170 0.180 4.318 4.572
D0.026 0.036 0.660 0.914
E0.045 0.055 1.143 1.397
G0.067 BSC 1.702 BSC
H0.539 0.579 13.691 14.707
K0.050 REF 1.270 REF
L0.000 0.010 0.000 0.254
M0.088 0.102 2.235 2.591
N0.018 0.026 0.457 0.660
P0.058 0.078 1.473 1.981
R5 REF
S0.116 REF 2.946 REF
U0.200 MIN 5.080 MIN
V0.250 MIN 6.350 MIN
__
45
M
0.010 (0.254) T
–T–
OPTIONAL
CHAMFER
5 REF5 REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
DIM
AMIN MAX MIN MAX
MILLIMETERS
0.386 0.403 9.804 10.236
INCHES
B0.356 0.368 9.042 9.347
C0.170 0.180 4.318 4.572
D0.026 0.036 0.660 0.914
E0.045 0.055 1.143 1.397
F0.051 REF 1.295 REF
G0.100 BSC 2.540 BSC
H0.539 0.579 13.691 14.707
J0.125 MAX 3.175 MAX
K0.050 REF 1.270 REF
L0.000 0.010 0.000 0.254
M0.088 0.102 2.235 2.591
N0.018 0.026 0.457 0.660
P0.058 0.078 1.473 1.981
R
S0.116 REF 2.946 REF
U0.200 MIN 5.080 MIN
V0.250 MIN 6.350 MIN
__
123
1
5
13–27
MOTOROLA ANALOG IC DEVICE DATA
DT, DTB SUFFIX
CASE 948E–02
Plastic Package
(TSSOP–20)
ISSUE A
DTB SUFFIX
CASE 948F–01
Plastic Package
(TSSOP–16, TSSOP–16L)
ISSUE O
DIM
AMIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B4.30 4.50 0.169 0.177
C1.20 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.27 0.37 0.011 0.015
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
____
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
110
1120
PIN 1
IDENT
A
B
–T–0.100 (0.004)
C
DGH
SECTION N–N
K
K1
JJ1
N
N
M
F
–W–
SEATING
PLANE
–V–
–U–
S
U
M
0.10 (0.004) V S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
––– –––
S
U0.15 (0.006) T
ÇÇÇ
ÇÇÇ
ÇÇÇ
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C––– 1.20 ––– 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.18 0.28 0.007 0.011
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
____
SECTION N–N
SEATING
PLANE
IDENT.
PIN 1
18
16 9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
L
2X L/2
–U–
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V S
T
0.10 (0.004)
–T–
–V–
–W–
0.25 (0.010)
16X REFK
N
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
1
20
1
16
13–28 MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948G–01
Plastic Package
(TSSOP–14)
ISSUE O
1
14
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C––– 1.20 ––– 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
L–U–
SEATING
PLANE
0.10 (0.004)
–T–
ÇÇÇ
ÇÇÇ
SECTION N–N
DETAIL E
JJ1
K
K1
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
–W–
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
–V–
14X REFK
N
N
13–29
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948H–01
Plastic Package
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A7.70 7.90 0.303 0.311
B4.30 4.50 0.169 0.177
C––– 1.20 ––– 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.27 0.37 0.011 0.015
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
L–U–
SEATING
PLANE
0.10 (0.004)
–T–
ÇÇÇ
ÇÇÇ
SECTION N–N
DETAIL E
J
J1
K
K1
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
–W–
0.25 (0.010)
13
24
12
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
–V–
24X REFK
N
N
1
24
13–30 MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948J–01
Plastic Package
(TSSOP–8)
ISSUE O
1
8
ÇÇÇ
ÇÇÇ
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A2.90 3.10 0.114 0.122
B4.30 4.50 0.169 0.177
C––– 1.20 ––– 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
____
SECTION N–N
SEATING
PLANE
IDENT.
PIN 1
14
85
SEE DETAIL E
JJ1
B
C
D
A
K
K1
H
G
ÉÉ
ÉÉ
DETAIL E
F
M
L
2X L/2
–U–
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V S
T
0.10 (0.004)
–T–
–V–
–W–
0.25 (0.010)
8x REFK
N
N
M SUFFIX
CASE 967–01
Plastic Package
(EIAJ–20)
ISSUE O
DIM MIN MAX MIN MAX
INCHES
––– 2.05 ––– 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
12.35 12.80 0.486 0.504
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
––– 0.81 ––– 0.032
A1
HE
Q1
LE
_
10
_
0
_
10
_
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION A T MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
HE
A1
LEQ1
_
c
A
ZD
E
20
110
11
b
M
0.13 (0.005)
e
0.10 (0.004)
VIEW P
DETAIL P
M
L
A
b
c
D
E
e
L
M
Z
1
20
13–31
MOTOROLA ANALOG IC DEVICE DATA
FTB SUFFIX
CASE 976–01
Plastic Package
(TQFP–20)
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.000 BSC 0.157 BSC
A1 2.000 BSC 0.079 BSC
B4.000 BSC 0.157 BSC
B1 2.000 BSC 0.079 BSC
C1.400 1.600 0.055 0.063
D0.170 0.270 0.007 0.011
E1.350 1.450 0.053 0.057
F0.170 0.230 0.007 0.009
G0.650 BSC 0.026 BSC
H0.050 0.150 0.002 0.006
J0.090 0.200 0.004 0.008
K0.500 0.700 0.020 0.028
M12 REF 12 REF
N0.090 0.160 0.004 0.006
P0.250 BSC 0.010 BSC
Q1 5 1 5
R0.150 0.250 0.006 0.010
S6.000 BSC 0.236 BSC
S1 3.000 BSC 0.118 BSC
V6.000 BSC 0.236 BSC
V1 3.000 BSC 0.118 BSC
W0.200 REF 0.008 REF
X1.000 REF 0.039 REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
__
____
DETAIL AD
DETAIL Y
4X
4X
1
5
6
11
16
10
15
20
S
S1
A
A1
–U–
T–U0.200 (0.008) Z
AB
9
B
B1
–T–
V
V1
–Z–
T–U0.200 (0.008) ZAB
–AC–
–AB–
0.080 (0.003) AC
R
DETAIL AD DETAIL Y
AE AE
K
X
W
G
TOP & BOTTOM SECTION AE–AE
M
Q
_
_
CE
H0.250 (0.010)
GAUGE
PLANE
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
F
D
N
J
–T–, –U–, –Z–
S
T–U
S
0.080 (0.003) Z S
AC
120
13–32 MOTOROLA ANALOG IC DEVICE DATA
FTA SUFFIX
CASE 977–01
Plastic Package
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.000 BSC 0.157 BSC
A1 2.000 BSC 0.079 BSC
B4.000 BSC 0.157 BSC
B1 2.000 BSC 0.079 BSC
C1.400 1.600 0.055 0.063
D0.170 0.270 0.007 0.011
E1.350 1.450 0.053 0.057
F0.170 0.230 0.007 0.009
G0.500 BSC 0.020 BSC
H0.050 0.150 0.002 0.006
J0.090 0.200 0.004 0.008
K0.500 0.700 0.020 0.028
M12 REF 12 REF
N0.090 0.160 0.004 0.006
P0.250 BSC 0.010 BSC
Q1 5 1 5
R0.150 0.250 0.006 0.010
S6.000 BSC 0.236 BSC
S1 3.000 BSC 0.118 BSC
V6.000 BSC 0.236 BSC
V1 3.000 BSC 0.118 BSC
W0.200 REF 0.008 REF
X1.000 REF 0.039 REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
__
____
DETAIL AD
DETAIL Y
4X
4X
1
6
7
13
19
12
18
24
S
S1
A
A1
–U–
T–U0.200 (0.008) Z
AB
9
B
B1
–T–
V
V1
–Z–
T–U0.200 (0.008) ZAB
–AC–
–AB–
0.080 (0.003) AC
R
DETAIL AD
DETAIL Y
AE AE
K
X
W
G
TOP & BOTTOM
SECTION AE–AE
M
Q
_
_
CE
H0.250 (0.010)
GAUGE
PLANE
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
F
D
N
J
–T–, –U–, –Z–
P
S
T–U
S
0.080 (0.003) Z S
AC
124
13–33
MOTOROLA ANALOG IC DEVICE DATA
N SUFFIX
CASE 1212–01
Plastic Package
(SOT–23)
ISSUE O
1
DIM MIN MAX
MILLIMETERS
A1 0.00 0.10
A2 1.00 1.30
B0.30 0.50
C0.10 0.25
D2.80 3.00
E2.50 3.10
E1 1.50 1.80
e0.95 BSC
e1 1.90 BSC
L
L1 0.45 0.75
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DATUM C IS A SEATING PLANE.
A
1
5
23
4
D
E1
B
L1
E
e
e1
C
M
0.10 C S
BS
A
B5X
A2
A1
S
0.05
C
L
0.20 –––
H SUFFIX
CASE 1213–01
Plastic Package
(SOT–89)
ISSUE O
1
DIM MIN MAX
MILLIMETERS
A2 1.40 1.60
B0.37 0.57
B1 0.32 0.52
C0.30 0.50
D4.40 4.60
D1 1.50 1.70
E––– 4.25
E1 2.40 2.60
e1.50 BSC
e1 3.00 BSC
L1 0.80 –––
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCING
PER ASME Y14.5M, 1994.
3. DATUM C IS A SEATING PLANE.
AD
E1
B
L1
E
D1
e
e1
C
M
0.10 C S
BS
A
M
0.10 C S
BS
A
B
B1 2X
A2 C
