SD2931-12MR 150 W - 50 V moisture resistant HF/VHF DMOS transistor Datasheet - production data Description The SD2931-12MR is a gold metallized Nchannel MOS field-effect RF power transistor. Electrically identical to the standard SD2931 MOSFET, it is intended for use in 50 V DC large signal applications up to 230 MHz. The SD2931-12MR is mechanically compatible with the SD2931 but offers better thermal capability (25% lower thermal resistance), representing the best-in-class in transistors for ISM applications, where reliability and ruggedness are critical factors. M174MR Epoxy sealed Figure 1: Pin connection 1. Drain 4 1 3 2 The SD2931-12MR benefits from the latest generation of environmentally designed packaging, ruggedized against cyclic high moisture operation and severe storage conditions. 2. Source 3. Gate 4. Source Table 1: Device summary Features Gold metallization Excellent thermal stability Common source, push-pull configuration POUT = 150 W min. with 14 dB gain @ 175 MHz Thermally enhanced packaging for lower junction temperatures GFS and VGS sort marked on unit Moisture resistant package specifically designed to operate in extreme environments September 2013 Order code Marking Package Packaging SD2931-12MR SD2931-12MR(1) M174MR Plastic tray Notes: (1) For more details please refer to "Marking, packing and shipping specifications". DocID023650 Rev 2 This is information on a product in full production. 1/18 www.st.com Contents SD2931-12MR Contents 1 Electrical data .................................................................................. 3 1.1 Maximum rating................................................................................. 3 1.2 Thermal data ..................................................................................... 3 2 Electrical characteristics ................................................................ 4 3 Impedance ....................................................................................... 5 4 Transient thermal impedance ......................................................... 6 5 Typical performance ....................................................................... 8 5.1 Typical performance (175 MHz) ........................................................ 9 5.1.1 5.3 Test circuit (175 MHz) ...................................................................... 10 Typical performance (30 MHz) ........................................................ 12 5.3.1 Test circuit (30 MHz) ........................................................................ 13 6 Marking, packing and shipping specifications............................ 14 7 Package information ..................................................................... 15 7.1 8 2/18 M174MR package information ........................................................ 15 Revision history ............................................................................ 17 DocID023650 Rev 2 SD2931-12MR Electrical data 1 Electrical data 1.1 Maximum rating T CASE= 25 C Table 2: Absolute maximum rating Symbol 1.2 Parameter Value Unit V(BR)DSS Drain source voltage 125 V VDGR Drain-gate voltage (RGS = 1MW) 125 V VGS Gate-source voltage 20 V ID Drain current 20 A PDISS Power dissipation 389 W TJ Max. operating junction temperature 200 C TSTG Storage temperature -65 to +150 C Thermal data Table 3: Thermal data Symbol RthJC Parameter Junction to case thermal resistance DocID023650 Rev 2 Value 0.45 Unit C/W 3/18 Electrical characteristics 2 SD2931-12MR Electrical characteristics T CASE= 25 C Table 4: Static Symbol Test conditions Min. 125 Typ. Max. Unit V(BR)DSS VGS = 0 V IDS = 100 mA IDSS VGS = 0 V VGS = 0 V VDS = 5 V VDS = 50 V 20 50 A VGS = 20 V VDS = 0 V 250 nA VDS = 10 V ID = 250 mA VGS = 10 V I D = 10 A GFS VDS = 10 V ID=5A CISS VGS = 0 V VDS = 50 V COSS VGS = 0 V CRSS VGS = 0 V IGSS VGS(Q) (1) VDS(ON) (1) V see table below 3.0 V V see table below mho f = 1 MHz 480 pF VDS = 50 V f = 1 MHz 190 pF VDS = 50 V f = 1 MHz 18 pF Notes: (1) VGS(Q) and GFS sorted with alpha/numeric code marked on unit. Table 5: VGS and GFS sorts VGS GFS I 2.65 - 3.15 6.0 - 6.5 J 2.65 - 3.15 6.5 - 7.0 K 2.65 - 3.15 7.0 - 7.5 Table 6: Dynamic Symbol 4/18 Test conditions POUT VDD = 50 V f = 175MHz IDQ = 250 mA GPS VDD = 50 V f = 175MHz IDQ = 250 mA POUT = 150 W D VDD = 50 V f = 175MHz IDQ = 250 mA POUT = 150 W Load mismatch VDD = 50 V IDQ = 250 mA POUT = 150 W f = 175MHz all phase angles DocID023650 Rev 2 Min. Typ. 150 Max. Unit W 14 15 dB 55 65 % 10:1 VSWR SD2931-12MR 3 Impedance Impedance Figure 2: Impedance data schematic D ZDL Typical input impedance G Typical load impedance ZIN S Table 7: Impedance data f Z IN() Z DL() 30 MHz 1.7 - j 5.7 6.8 + j 0.9 175 MHz 1.2 - j 2.0 2.0 + j 2.4 DocID023650 Rev 2 5/18 Transient thermal impedance 4 SD2931-12MR Transient thermal impedance Figure 3: Transient thermal impedance Single - repetitive pulse Thermal impedance -ZTHJ - C (C / W) 0.50 single pulse 10% 0.45 20% 0.40 30% 40% 0.35 50% 60% 0.30 70% 80% 0.25 90% 0.20 0.15 0.10 0.05 0.00 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Rectangular power pulse width (sec) 6/18 DocID023650 Rev 2 1.E+01 AM09280V1 SD2931-12MR Transient thermal impedance Figure 4: Transient thermal impedance model DissipatedPower_Watts R1 R=0.023 Ohm C C1 C=.0020978 F R R2 R=.072 Ohm C C2 C=.0021832 F R R3 R=.200 Ohm C C3 C=.0244758 F R R4 R=.155 Ohm C C4 C=.2057373 F AM09281V1 DocID023650 Rev 2 7/18 Typical performance 5 SD2931-12MR Typical performance Figure 5: Capacitance vs. drain voltage Figure 6: Drain current vs. gate voltage 10000 20 Tc=-20 C f =1M Hz Tc=+25 C 15 1000 Ciss 10 Tc=+80 C C oss 100 VDS = 10 V 5 Crss 10 0 10 20 30 40 50 0 2 2.5 3 VDS, DR AIN-SOURC E VOLTAGE (V) 3.5 4 4.5 5 5.5 6 VGS, GATE-SOURCE VOLTAGE (V) Figure 7: Gate-source voltage vs. case temperature Figure 8: Maximum thermal resistance vs. case temperature 0.6 0.56 0.52 0.48 0.44 25 35 45 65 T , CASE TEMPERATURE (C) C T , CASE TEMPERATURE (C) C Figure 9: Safe operating area 8/18 55 DocID023650 Rev 2 75 85 SD2931-12MR 5.1 Typical performance Typical performance (175 MHz) Figure 10: Output power vs. input power Figure 11: Output power vs. input power at different Tc 270 270 240 Tc =-20 C 240 Vdd= 50V 210 Tc =+25 C 210 180 180 Vdd= 40V 150 150 120 120 90 90 60 Vdd= 50V Idq= 250mA f= 175MHz 60 f= 175MHz Idq= 250mA 30 Tc =+80 C 30 0 0 0 5 10 15 20 0 25 5 10 15 20 25 P , INPUT POWER (W) P , INPUT POWER (W) Figure 12: Power gain vs. output power Figure 13: Efficiency vs. output power IN IN 18 80 16 70 14 60 12 50 40 10 Vdd=50V Idq=250mA f=175Mhz 8 Vdd=50V Idq=250mA f=175Mhz 30 20 6 0 50 100 P OUT 150 200 0 250 50 100 , INPUT POWER (W) P 150 200 250 , INPUT POWER (W) OUT Figure 14: Output power vs. supply voltage Figure 15: Drain current vs. gate-source voltage 20 270 Pin =10W 240 Tc=-20 C 210 Tc=+25 C 15 Pin =5W 180 150 10 Pin =2.5W Tc=+80 C 120 90 5 60 Idq= 250mA f= 175MHz 30 0 0 24 28 32 36 40 VDD, DRAIN VOLTAGE (V) 44 48 52 2 2.5 3 V GS DocID023650 Rev 2 3.5 4 4.5 5 5.5 6 , GATE-SOURCE VOLTAGE (V) 9/18 Typical performance 5.1.1 SD2931-12MR Test circuit (175 MHz) Figure 16: 175 MHz test circuit schematic (production test circuit) VG +50V Table 8: 175 MHz test circuit parts list Component 10/18 Description T1 4:1 transformer, 25 flexible coax .090 OD 6" long T2 1:4 transformer, 25 semi-rigid coax .141 OD 6" long FB1 Toroid X 2, 0.5" OD .312" ID 850 2 turns FB2, FB3 VK200 FB4 Shield bead, 1" OD 0.5" ID 850 3 turns L1 1/4 wave choke, 50 semi-rigid coax .141 OD 12" Long PCB 0.62" woven fiberglass, 1 oz. copper, 2 Sides, r = 2.55 R1, R3 470 1 W chip resistor R2 360 1/2 W resistor R4 20 k 10 turn potentiometer R5 560 1 W resistor C1, C11 470 pF ATC chip cap C2 43 pF ATC chip cap C3, C8, C9 Arco 404, 12-65 pF C4 Arco 423, 16-100 pF C5 120 pF ATC chip cap C6 0.01 F ATC chip cap C7 30 pF ATC chip cap C10 91 pF ATC chip cap C12, C15 1200 pF ATC chip cap C13, C14,C16, C17 0.01 F / 500 V chip cap C18 10 F 63 V electrolytic capacitor DocID023650 Rev 2 SD2931-12MR Typical performance Figure 17: 175 MHz test circuit photomaster Figure 18: 175 MHz test circuit DocID023650 Rev 2 11/18 Typical performance 5.3 SD2931-12MR Typical performance (30 MHz) Figure 19: Output power vs. input power Figure 20: Power gain vs. output power 2 50 30 Vdd = 50 V 29 2 00 28 Gp (dB) Pout (W) 1 50 Vd d = 40 V 27 1 00 26 50 25 f = 3 0 MH z ID Q = 2 5 0 m A 0 0 0 .1 0 .2 0 .3 0 .4 f = 3 0 MH z VD D = 5 0 V ID Q = 2 5 0 m A 24 0 .5 0 40 80 1 20 P in ( W ) 1 60 2 00 P o ut (W ) Figure 21: Efficiency vs. output power Figure 22: Output power vs. supply voltage 70 200 P in = 0 .3 1 W 60 180 160 P in = 0 .2 2 W 50 40 120 Pout (W) Nd (%) 140 30 100 P in = 0 .1 3 W 80 20 60 f = 30 MHz VD D = 5 0 V ID Q = 2 5 0 m A 10 40 f = 30 MHz ID Q = 2 50 m A 20 0 0 0 40 80 120 160 24 200 28 32 36 40 Vd d (V) P o u t (W ) Figure 23: Output power vs. gate-source voltage 1 80 T = + 2 5 C 1 60 T = -2 0 C 1 40 1 20 Pout (W) T = + 8 0 C 1 00 80 60 VD D = 5 0 V ID Q = 2 5 0 m A f = 3 0 MHz P in = C o n s ta n t 40 20 0 0 1 2 3 VG S (V) 12/18 DocID023650 Rev 2 4 5 6 44 48 52 SD2931-12MR 5.3.1 Typical performance Test circuit (30 MHz) Figure 24: 30 MHz test circuit schematic (production test circuit) +50V VG+ Table 9: 30 MHz test circuit part list Component Description T1 9:1 transformer, 25 flexible coax with extra shield .090 OD 15" long T2 1:4 transformer, 50 flexible coax .225 OD 15" long FB1 Toroid 1.7" OD .30" ID 220 4 turns FB2 Surface mount EMI shield bead FB3 Toroid 1.7" OD .300" ID 220 3 turns RFC1 Toroid 0.5" OD 0.30" ID 125 4 turns 12 awg wire PCB 0.62" woven fiberglass, 1 oz. copper, 2 Sides, r = 2.55 R1, R3 1 kohm 1 W chip resistor R2 680 ohm 3 W wirewound resistor C1,C4,C6,C7,C8,C9, C11,C12,C13 0.1 F ATC chip cap C2,C3 750 pF ATC chip cap C5 470 pF ATC chip cap C10 10 F 63 V electrolytic capacitor C14 100 F 63 V electrolytic capacitor DocID023650 Rev 2 13/18 Marking, packing and shipping specifications 6 SD2931-12MR Marking, packing and shipping specifications Table 10: Packing and shipping specifications Order code Packaging Pcs per tray Dry pack humidity VGS and GFS code Lot code SD2931-12MR Plastic tray 25 < 10% Not mixed Not mixed Figure 25: Marking layout for SD2391-12MR AM14750V1 Table 11: Marking specifications Symbol X VGS and GFS sort CZ Assembly plant xxx Last 3 digits of diffusion lot VY Diffusion plant MAR CZ 14/18 Description Country of origin Test and finishing plant y Assembly year yy Assembly week DocID023650 Rev 2 SD2931-12MR Package information 7 Package information 7.1 M174MR package information Figure 26: M174MR drawing 8410504_A DocID023650 Rev 2 15/18 Package information SD2931-12MR Table 12: M174MR mechanical data Dim. mm Min. A 5.56 B Max. 5.84 3.18 C 6.22 6.48 D 18.29 18.54 E 3.18 F 24.64 24.89 G 12.07 12.83 H 0.08 0.18 I 2.11 3.00 J 3.81 4.45 K 16/18 Typ. 8.00 L 25.53 26.67 M 3.05 3.30 DocID023650 Rev 2 SD2931-12MR 8 Revision history Revision history Table 13: Document revision history Date Revision 20-Feb-2013 1 10-Sep-2013 2 Changes First issue. Document promoted from preliminary data to full datasheet. Formatting and minor text changes. DocID023650 Rev 2 17/18 SD2931-12MR Please Read Carefully Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT AUTHORIZED FOR USE IN WEAPONS. NOR ARE ST PRODUCTS DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER'S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR "AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL" INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 18/18 DocID023650 Rev 2 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: STMicroelectronics: SD2931-12MR