SFH 4641
SFH 4646
Engwinklige LED im MIDLED-Gehäuse (940 nm)
Narrow beam LED in MIDLED package (940 nm)
Lead (Pb) Free Product - RoHS Compliant
This data sheet is under
PCN-revision
(OS-PCN-2009-021-A2). Not
to be used for design-in. PCN data sheet can be provided on request.
2012-03-15 1
SFH 4641 SFH 4646
Wesentliche Merkmale
• Infrarot LED mit hoher Ausgangsleistung
• Kurze Schaltzeiten
• Enger Abstrahlwinkel (± 15°)
• Geringe Bauhöhe
• Als Toplooker und Sidelooker einsetzbar
•SFH 4641: Gurtung als Toplooker
SFH 4646: Gurtung als Sidelooker
Anwendungen
• Infrarotbeleuchtung für Kameras
• IR-Datenübertragung
• Sensorik in der Automobiltechnik
• Fernsteuerung
Sicherheitshinweise
Je nach Betriebsart emittieren diese Bauteile
hochkonzentrierte, nicht sichtbare Infrarot-
Strahlung, die gefährlich für das menschliche
Auge sein kann. Produkte, die diese Bauteile
enthalten, müssen gemäß den Sicherheits-
richtlinien der IEC-Normen 60825-1 und 62471
behandelt werden.
Typ
Type
Bestellnummer
Ordering Code
Strahlstärkegruppierung1) (IF = 70 mA, tp = 20 ms)
Radiant Intensity Grouping1)
Ie (mW/sr)
SFH 4641
SFH 4646
Q65110A8098
Q65110A8099
≥ 16 (typ. 40)
≥ 16 (typ. 40)
1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr
Features
• High Power Infrared LED
• Short switching times
• Narrow halfangle (± 15°)
• Low profile component
• Usable as top-looking and side-looking device
•SFH 4641: Taping as Toplooker
SFH 4646: Taping as Sidelooker
Applications
• Infrared Illumination for cameras
• IR Data Transmission
• Automotive sensors
• Remote controls
Safety Advices
Depending on the mode of operation, these
devices emit highly concentrated non visible
infrared light which can be hazardous to the
human eye. Products which incorporate these
devices have to follow the safety precautions
given in IEC 60825-1 and IEC 62471.
2012-03-15 2
SFH 4641, SFH 4646
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
Top , Tstg – 40 … + 100 °C
Sperrspannung
Reverse voltage
VR5 V
Vorwärtsgleichstrom
Forward current
IF70 mA
Stoßstrom, tp = 25 μs, D = 0
Surge current
IFSM 700 mA
Verlustleistung
Power dissipation
Ptot 140 mW
Wärmewiderstand Sperrschicht - Umgebung bei
Montage auf FR4 Platine, Padgröße je 16 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 16 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
Montage auf Metall-Block
Thermal resistance junction - soldering point,
mounted on metal block
RthJA
RthJS
380
220
K/W
K/W
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 70 mA
λpeak 950 nm
Centroid-Wellenlänge der Strahlung
Centroid wavelength
IF = 70 mA
λcentroid 940 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 70 mA
Δλ 42 nm
Abstrahlwinkel
Half angle
ϕ± 15 Grad
deg.
Aktive Chipfläche
Active chip area
A0.04 mm2
SFH 4641, SFH 4646
2012-03-15 3
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L × B
L × W
0.2 × 0.2 mm²
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 70 mA, RL = 50 Ω
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 70 mA, RL = 50 Ω
tr, tf11 ns
Durchlassspannung
Forward voltage
IF = 70 mA, tp = 20 ms
IF = 500 mA, tp = 100 µs
VF
VF
1.6 (< 2.0)
2.4 (< 3.0)
V
V
Sperrstrom
Reverse current
IRnot designed for
reverse
operation
μA
Gesamtstrahlungsfluss
Total radiant flux
IF = 70 mA, tp = 20 ms
Φe typ 33 mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 70 mA
Temperature coefficient of Ie or Φe,
IF = 70 mA
TCI– 0.5 %/K
Temperaturkoeffizient von VF, IF = 70 mA
Temperature coefficient of VF, IF = 70 mA
TCV– 3.5 mV/K
Temperaturkoeffizient von λ, IF = 70 mA
Temperature coefficient of λ, IF = 70 mA
TCλ+ 0.3 nm/K
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
2012-03-15 4
SFH 4641, SFH 4646
Strahlstärke Ie in Achsrichtung1)
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol Werte
Values
Einheit
Unit
-S -T -U -V
Strahlstärke
Radiant intensity
IF = 70 mA, tp = 20 ms
Ie min
Ie max
16
32
25
50
40
80
63
125
mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 500 mA, tp = 25 µs
Ie typ 120 185 295 465 mW/sr
1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) /
Only one bin in one packing unit (variation lower 2:1)
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
OHF03823
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0
100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0
ϕ
SFH 4641, SFH 4646
2012-03-15 5
Relative Spectral Emission
Irel = f (λ)
Forward Current IF = f (VF)
Single pulse, tp = 100 μs
800
0nm
%
OHF04134
20
40
60
80
100
I
rel
λ
850 900 950 1025
OHF03828
F
I
10
-4
0.5 1 1.5 2 2.5 V3
10
0
A
0
F
V
-1
10
5
5
10
-2
-3
5
10
Radiant Intensity
Single pulse, tp = 25 μs
Permissible Pulse Handling
Capability IF = f (τ), TA = 25 °C,
duty cycle D = parameter
Ie
Ie 70 mA = f (IF)
OHF03827
10
-2
mA
I
F
0
10
1
10
2
10
3
1055
1
10
5
-1
10
5
0
10
I
(70 mA)
e
I
e
0-5
F
I
A
t
p
s
OHF04058
-4
10 -3
10 -2
10 -1
10 0
10 1
10 2
1010
T
t
T
D
=
P
P
t
I
F
0.05
0.5
0.1
0.3
0.005
0.01
0.02
=
D
0.2
0.1
0.2
0.3
0.4
0.5
0.6
0.7
1
Max. Permissible Forward Current
IF = f (TA), RthJA = 380 K/W
Permissible Pulse Handling
Capability IF = f (τ), TA = 85 °C,
duty cycle D = parameter
0
0˚C
T
I
F
mA
OHF04057
A
20 40 60 80
100 120
10
20
30
40
50
60
70
80
2012-03-15 6
SFH 4641, SFH 4646
Maßzeichnung
Package Outlines
Maße in mm / Dimensions in mm.
Gehäuse / Package MID mit klarem Silikonverguss / MID casted with clear Silicone
Anschlussbelegung
Pin configuration
Pad 1 = Anode / anode
Pad 2 = Kathode / cathode
SFH 4641, SFH 4646
2012-03-15 7
Gurtung / Polarität und Lage Verpackungseinheit 2000/Rolle, ø180 mm
oder 9000/Rolle, ø330 mm
Method of Taping / Polarity and Orientation Packing unit 2000/reel, ø180 mm
or 9000/reel, ø330 mm
Maße in mm (inch) / Dimensions in mm (inch).
Maße in mm (inch) / Dimensions in mm (inch).
OHAY2431
8 (0.315)
1.75 (0.069)
4 (0.157)
2.55 (0.100) ±0.05 (0.002)
0.3 (0.012) ±0.02 (0.001)
±0.05 (0.002)
1.75 (0.069)
3.4 (0.134)
±0.05 (0.002)
2˚
1.5 (0.059) +0.1 (0.004)
3.5 (0.138)
±0.05 (0.002)
2 (0.079) ±0.05 (0.002)
Pad 1 Orientation
SFH 4641
OHAY2430
2.3 (0.091)
8 (0.315)
4 (0.157)
3.3 (0.130)
±0.15 (0.006)
±0.15 (0.006)
0.3 (0.012)
±0.02 (0.001)
±0.05 (0.002)
2.45 (0.096)
3.25 (0.128)
±0.05 (0.002)
2˚
±0.05 (0.002)
2 (0.079)
1.7 (0.067)
±0.05 (0.002)
±0.05 (0.002)
3.5 (0.138)
±0.05 (0.002)
1.75 (0.069)
1.5 (0.059)
+0.1 (0.004)
Pad 1 Orientation
Optical axis/viewing direction
SFH 4641
SFH 4646
2012-03-15 8
SFH 4641, SFH 4646
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
Maße in mm / Dimensions in mm.
Verarbeitungshinweis: Das Gehäuse ist mit Silikon vergossen. Mechanischer Stress auf der
Bauteiloberfläche sollte so gering wie möglich gehalten werden.
Handling indication: The package is casted with silicone. Mechanical stress at the surface of
the unit should be as low as possible.
OHF02422
4.0
2.4
1.35
Padgeometrie für
heat dissipation
Lötstopplack
Solder resist
verbesserte Wärmeableitung
Paddesign for improved
Cu-Fläche > 16 mm
Cu-area
2
SFH 4641
4.5
1.7
1.25
verbesserte Wärmeableitung
OHF02421
Solder resist
Cu-Fläche > 16 mm
Paddesign for improved
Lötstopplack
heat dissipation
Padgeometrie für
Cu-area
2
SFH 4646
SFH 4641, SFH 4646
2012-03-15 9
Lötbedingungen Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)
Published by
OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50 100 150 200 250 300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C +0 ˚C
-5 ˚C
245 ˚C ±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C -0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min