"MIL SPECS o00 M@ o000L25 0030759 & MEMILS TINCH-POUNDT. TNCH-POUND] MIL -S-19500/440A(ER) 40 June 1991 SUPERSEDING MIL-S-19500/440(ER) 17 November 1970 MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, POWER TYPE 2N5927, JANTX AND JANTXY This specification is approved for use by US Amy Laboratory Command, Department of the Army, and is available for use by all Departments and Agencies of the Department of Defense. 1, SCOPE 1.1 Scope. This specification covers the detail requirements for a NPN, silicon, power transistor. Two levels of product assurance are provided for each device type as specified in MIL-S-19500. 1.2 Physical dimensions. See figure 1. 1.3 Maximum ratings. | PT | | | l | | | | T | IYopo sIVceg)=sdWVego odHg Mg SCE Tstg 61 Ty I Rou | ; I 3 | | ! | | and ! | | V/ | oa | | | fo poy PY | | | | | | | | I | | | | | T rr. ,. Tt, J ! W | W |V de | Vde | V de {Adc iA de | Cc | c C/W ~ | ~ | | | | | | 350 | 200 {150 | 120 | 10 | 20 | 100 1-65 to |] +200 | 0.5 | | | | | | I 1 +200 | | | 1/ Between Tc *25C and Tc = +200C, linear derating factor (average) = 2.0 w/C, 2/ Pulsed (see 4.5.1) = 120 A. ] | Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be { of use in improving this document should be addressed to: US Army Laboratory Command, | Improvement (DD Form 1426) appearing at the end of this document or by letter. | | | | ATTN: SLCET-RE, Fort Monmouth, NJ 07703-5302 by using the Standardization Document | AMSC N/A FSC 5961 DISTRIBUTION STATEMENT A. Approved for public release; distribution js unlimited.MIL SPECS 000 M@ 0000125 0030760 4 MEMILS 1.4 Primary electrical characteristics. | i ; Nee l/ Vee 1/ ! VcE(sat) 4 i i f it it iI it iI It 120 A i 7OAd . C c Cc = dc = Cc : |="40 A de [="120 A dc 1270 A dc [=20 A dc {="120 A dc|=70 A dc} | c | Voce IVce iVcE iVce Voce iVce tig = 24 A ac lig = 7 A de i l= 2V dc l= 4V de |[2=2Vde l= 2Vde t= 4V de J=2V del { i | | | | | | | | ! ] i J | i i ] T i | Min | Min | Min | Min | Min | Min | Min 9 Max | Min Max i; Te 0 { 10 | 30 | | | | : { | | | | i 2.0 V del 0.75 V dc; | Max | Max i Max | Max | Max ! Max | i 150 i | 40 | 126 | 3.0 | 15 | ' 1/ Pulsed (see 4.5.1). q | I | | | | Limits ! Ingal ton | te 1 ty | | \ | | | | Vog = 10 V de | . | tf Ip = 5 A de | In = 70 A de | | if = 100 kHz | | I | I I I | Min 5 ! | | | | i i : i ' | Max ' 20 | 7.0 us } 4.@us | 6.C us | | ' l i : 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Inaex of Specifications and Standards (DODISS) and supplement thereto, citec in the solicitation (see 6.2). SPECIFICATION MILITARY MIL-S-19500 - Semiconductor Devices, General Specification for. STANDARCG MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of federai and military specifications, standards, and handbooks are available from the Standardization Documents Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.)MIL SPECS 000 M@@ 0000125 0030761 & MMMILS MIL-S-19500/440A(ER) leg 1.078 gee 4.313 4/047 . COLLECTOR 4.048. (SEE NOTE 4) 797 a .784 90 156 MAX .2e66 219 Lee AT / VIEW B LZ. .500-20 . 160 | be A g0 4.750 UNF-2A . 420 4.359 THREAD EMITTER .512 | 425 = 425 . Inches mm [| Inches mm "350 ato 7998 OIA .078 1.98 | .500 12.70 tB0 OIA J . .109 2.77 | .512 13.00 * .120 3.05 | .688 17.48 . -156 3.96 | .781 = 19.48 voy | 1160 4.06 | .797 20.34 - 455 180 964.57 | 828 21.03 _ "422: .210 85.33 | .865 21.97 . 219 5.56 | .915 23.24 P* .266 66.76 | 1.047 26.35 j . 281 7.14 | 1.048 26.62 328 8.33 | 1.078 27.38 VIEW A .350 8.89 | 1.313 33.35 =e VIEW B 422 10.72 | 1.359 34.42 .425 10.80 | 1.750 44.45 455 11.56 | NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Maximum pitch diameter of plated thread shall be basic P.D. (.4675). 4. Collector is electrically connected to case. FIGURE 1. Physical dimensions.MIL SPECS 000 M@ 0000125 00307be & MMILS MIL-S-19500/440A(ER) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for related associated detail specifications, specification sheets, or MS standards), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Detail specification. The individual item requirements shall be in accordance with MIL-S-19500, aia as specified herein. 3.2 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein Sha as specitied 1 =3- ; 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be aS Specified in MIL-S-19500, and figure 1 herein, 3.3.1 Lead material and finish. Lead material shall] be Kovar or Alloy 52 and a copper core is permitted. Lead finish shall be gold or tin or solder. Where a choice of lead material or finish is desired, it shall be specified in the acquisition document (see 6.2}. 3.4 Marking. Devices shall be marked in accordance with MIL-S-19500, except at the option of the manufacturer, the following marking may be omitted from the body of the device: a. Country of origin. b. Manufacturer's identification. 4. QUALITY ASSURANCE PROVISIONS 4,1 Sampling and inspection. Sampling and inspection shall be in accordance with MIL-S-19500, and as specified herein. 4.1.1 Inspection lot. Applicable to the semiconductor devices covered herein, the term "inspection Poet shall be as defined in 4.3.2.1 of MIL-S-19500 except that the 6-week period time limitation stipulated therein shall be considered as not compulsory. 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-S-19500, and as specified herein. 4.2.1 Group E inspection. Group E inspection shall be conducted in accordance with MIL-S-19500 and table V herein. 4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with MIL-S-19500 (table II), and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein shal] not be acceptable,MIL SPECS oo0 Me O000beS UOS07bS T MMNILS MIL-S-19500/440A(ER) | value or 200 pA dc, whichever is greater. Ahpgy = #25 percent of Fee I herein. qT I Measurement T [ Screen (see table II T ] ! of MIL-S-19500) | JANTX and JANTXV levels | | T | 4 { 5,000 G minimum | { | I | | T 9 | Not applicable. | | | ll ! Ices and Kreq | | | 7 | 12 | Burn-in (see 4.3.1). { I I | | 13 | alcgsy = 100 percent of initial | | | | | | | subgroup 2, 1/ This test shall be performed any time before screen 10. 4.3.1 Power burn-in conditions. Power burn-in conditions are in accordance with MIL-STD-750, method 1039, test condition 8 and as follows: Ta = 30C #5C. Vor > 4.5 V de. Ty = 187.5C #12.5C. NOTE: No heat sink or forced air cooling on the devices shall be permitted. 4.3.2 Thermal resistance. Thermal resistance measurements shal] be conducted in accordance with method 3131 of MIL-STD-750. The following details shall apply: a. Iw measurement - ------------- 10 mA. b. Vege measurement voltage- --------- 25 V. c. Iy collector heating current - ---- - - 10 A. d. Vy collector-emitter heating voltage - -- 20 . e. ty heating time ------------- Steady-state (see MIL-STD-750, method 2131 for definition). f. twp measurement delay time - - ---- - - 20 us maximum. g. tsy sample window time ---------- 10 us (maximum). 4.4 Quality conformance inspection. Quality conformance inspection shall be in accordance with MIL-S-19500, and as specified herein. 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-S-19500, and table T herein. 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in table IVb (JAN and JANTX) of MIL-S-19500, and table II herein. Electrical measurements (end points) and delta requirements shall be in accordance with the applicable steps of table V herein.MIL SPECS o00 Me 00001e5 0030764 1 MENILS MIL-S-19500/440A(ER) TABLE I. Group A inspection. | | | | | - | Inspection | MIL-STD~750 | Symbol | Limits [Unit | | i | | | | | | | IMethod| Conditions | | Min | Max | | I i | | | | | | {| Subgroup 1 ! | | | ] {Visual and mechanical | 2071 | | | | | | | examination | | | | | | | I l | | | | | | | Swerciet | | PoP |Breakdown voltage, | 3011 [Bias condition D, pulsed (see 4.5.1), IV(gryceo | 120 | lV de | | collector to emitter rl IIc = 200 mA dc ! ! | | | | | \ [Collector to emitter | 3041 [Bias condition C, Vgp = 0 V de; IlcES1 | | 2 |mA del ! cutoff current i IVoep = 150 V de l | | | { | | | | | | | Emitter to base | 3061 {Bias condition D, Veg = 10 V dc Ilepo i | 1 {mA del | current | | | | | | | | | | | | | \ | IBase emitter voltage | 3066 |Test condition B, pulsed (see 4.5.1), IVpe1 | 1 1.5 | V del | | IIc = 70 Adc, Voce = 2 V de | | | { { | | | | | | | l |Base emitter voltage | 3066 |Test condition B, pulsed (see 4.5.1), IVgez2 | 1 3.0 | V del | IIc = 120 Adc, Vcg = 4.0 V de | | | | | | | | { | | | | \Collector to emitter | 3071 II = 70 A dc, pulsed (see 4.5.1), IVoe(sat)a! | 0.751 del | voltage (saturated) | lIp = 7 Ade | | | | | | | | | | | | | [Collector to emitter | 3071 | Pulsed | (see 4.5.1), Ic = 120 A de, IVce(sat)2! | 2.0 | del voltage (saturated) Ie A dc | | | | | | | | | | |Forward-current | 3076 \Vc cE 2 V de, Ic = 20 A de, threes | 30 | 120 | | {| transfer ratio | IpuTsed (see 4.5. 1) | | i | | | | \ | | | | | |Forward-current | 3076 | Voce = 2V dc, Ic = 70 A dc, lheee !10 | 401 | { transfer ratio | |pulsed (see 4.5.1) | | | | | | | | | | | | | |Forward-current | 3076 IVce = 2 V dc, Ic = 40 A de, [hFE3 115 {| 501 | transfer ratio | Ipulsed (see 4.5.1) | | | | | | I | | | { | | | Subgroup 3 ! ! | | | | | | | | |High temperature | [Te = +150C | | | | | |} operation: | | | | I { | | { | | i | | | | Collector to emitter| 3041 |Bias condition C, lIceso | | 10 ImA del | cutoff current ! ICE = = 100 V dc, Vpe = 0 V de ! ! | | | | | | | [Low temperature | ITa = -65 C | | | { | | operation: l { I | | | | | | | | | | | | Forward-current | 3076 2 V de; Ic = 70 A de, |PrES ! 10 | | | | | | transfer ratio ot sed (see 4.5.1) See footnote at end of table.MIL SPECS 000 MM 0000325 0030765 3 MEMILS MIL -S-19500/440A( ER) TABLE I. Group A inspection - Continued. I T ] l | Inspection MIL-STD-750 Symbol Limits [Unit | | T I | | Method| Conditions Min | Max | T ! Subgroup 4 | |Pulse response 3251 [Test condition B, ge = 70 V de, | | Re = 19, Vpeq = 8.5 V dc, Ry = 12, Vpe2 = 10 V de | Turn-on time ton 7.0 | us l | Storage time ts 1 4.0 | us | Fall time tr 6.0 i us IMagnitude of common 3306 [Voce = 10 V dc, Ihfel 5 20 short-circuit = 100 kHz forward-current transfer ratio Subgroup 5 Safe operating area Tc = 100C, t = 1s, 1 cycle, (de operation) se . e figure 2 Test 1 Ic = 50 A dc, Vee = 4.0 V de Test 2 Ic = 4 Adc, Ver = 50 V de Test 3 Ic = 850 mA dc, Vcr = 120 V dc Subgroups 6 and 7 | ! | | | | l I | I | 1 | | | | | emitter sma ty signal | | | | | | i | | | | | | | | | | Not applicable | | | | | | | | | | | | | | i | | | | | | | | | | | | | | | | | | | | | | | | Ha ! | | | | | | | | | | | | | | | | | | | / For sampling plan, see MIL-S-19500.Ic (AMPS) MIL SPECS FIGURE 2. o00 M@ 0000125 0030766 5 MBMILS MIt-S-19500/440A(ER) Voge (VOLTS) Maximum safe operating area graph (continuous dc).MIL SPECS 000 M@ O0001e5 OOS07b? 7 MMNMILS MIL-S-19500/440A(ER) TABLE II. Group B inspection for JANTX and JANTXY. r | Inspection 1/ | r Subgroup 1 i I |Solderability | {Resistance to solvents | | Subgroup 2 Thermal shock (temperature cycling) Hermetic seal a. Fine leak b. Gross Teak | | | | | { | | Electrical measurements Subgroup 3 Electrical measurements Subgroup 4 Decap internal visual (design verification) Bond strength Subgroup 5 Thermal resistance Subgroup 6 High-temperature life (nonoperating) Electrical measurements | | | | | { | | | | | | | | | { { | | | | | | | | | Steady-state operation life ] | MIL-STD-750 | I Conditions Condition C See table V, steps 1 and 2. 1027. |T t = 30C 45C, Vop > 4.5 V de, Ty = 187.5C, #12, 2.5C, 340 hours minimum. See table V, steps 3 and 4 2075 2037 |Test condition A, all internal leads for each device shail be pulled separately. 3101 0.5C/W maximum, see 4.3.2 ~~ & Oo " 1032 +200C 4 4 @ w See footnotes at end of table.Electrical measurements TVeLAM = 125 V dc, L = 68 pH, R ic amping diode- 2N5926 (emitter- base 3 shorted) Ise table V, steps 1 and 2. MIL SPECS 000 @ 0000125 0030766 4 MBNILS MIL -S-19500/440A(ER) TABLE II. Group B inspection for JANTX and JANTXV - Continued. i | | ! Inspection 1/ | MIL-STD-750 | i | |Method | Conditions | ] | | I Subgroup 7 J | | | I | | [Safe operating area | 3053 ILoad condition C, unclamped inductive load, | | (switching) | ITc = +25C, single 10 ms pulse, tr = tf < i us, | | | IRppi = 12, Repo = , Vppy = 6.2 V de, | | | lVeap2 = OV de, Ic = "50 A dc, Veco = 25 V de, L = 5 mH, | | 1 | | |Safe operating area 2/ | 3053 |Load condition B, Ty = 25C, single 2 ms pulse, | | (clamped switching | Ith = te < lus, Repi = lo, Repo = 209, | destructive) ! \VBpi = 8.5 V de, VBp2 3. V dc, Ic = 70 A de, | | I | | | | | I | | 1/ For sampling plan, see MIL-S-19500. 2/ Device fails if clamp voltage is not reached. 10MIL SPECS 000 M 00001e5 0030769 0 MEMILS MIL-S-19500/440A(ER) TABLE III. Group C inspection (all quality levels). Inspection 1/ MIL-STD-750 Method Conditions Subgroup 1 Physical dimensions 2066 Subgroup 2 See figure 1. Thermal shock (glass 1056 |Condition B strain) Terminal strength 2036 (terminal torque) Condition Di; 6 inch-ounces, 15 seconds, base emitter only Terminal strength 2036 [Condition D2; 20 inch-pounds (stud torque) Hermetic seal 1071 . Fine leak Moisture resistance 1021 Soldering heat 2031 |One cycle Electrical See table V, steps 1 and 2. measurements Subgroup 3 Shock 2016 15 blows each orientation (Xj, Y> Yo, and 24) Vibration, variable 2056 110 g's frequency Constant acceleration | 2006 [5,000 g's Electrical measurements See table V, steps 1 and 2. Subgroup 4 Salt atmosphere (corrosion) | | { | | | | | | { | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | I | | 1041 | | | | | | i | | | | | | | | | | | { | I | | | a | b. Gross leak | | | | { | | | | | | | | | | | | | | | { | | | | | | See footnote at end of table. llMIL SPECS 000 W@ 00001e5 0030770 7 MMMNILS MIL-S-19500/440A(ER) TABLE III. Group C inspection (all quality levels) - Continued. Inspection / MIL-STD-750 Conditions Subgroup 5 Not applicable . Subgroup 6 Steady-state operation life 1027 |Continue from group B, subgroup 3 to 1,000 hours Electrical measurements See table V, steps 3 and 4. ----- | T | | | | | | | | | | | | 1/ For sampling plan, see MIL-S-19500. 12MIL SPECS 000 @ 0000125 00350771 5 MMILS MIL-S-19500/440A(ER) TABLE IV. Group E inspection (for qualification only). I | | ij | Inspection | MIL-STD-750 { Sampling | | | | | plan | | |Method| Conditions | | | | { | { l | | | | ! Subgroup 1 | | { 22 devices | | | lc=0 | | Thermal shock | 1051 {250 cycles | | | temperature cycling | | | ! | | | | Electrical measurements ! {See table V, steps 1, 2, and 5. ! | | Subgroup 2 | | | 22 devices | | | | {c= 0 | |Steady-state dc | 1039 |Condition A, 340 hours. | | | blocking life 1 or | | | | | 1049 | | | { [ I | {Electrical measurements | |See table V, steps 3 and 4. | | | | | | | Subgroup 3 | { | | | | | | | [Destructive physical | 2101 [Photos of cross sections shall be | | | analysis | |submitted in the qualification | { | | lreport. Vendors shall retain | | [ | [duplicate photos. | | | Subgroup 4 | | | 10 devices | | | | lc=0 | | Thermal resistance [| 3101 |Rgyc = 0.5C/W maximum, | | { | isee 4.3.2 | | | | | | | | Subgroup 5 | | ! { | | [Not applicable | | | | | | | | | | Subgroup 6 | | | | | [ESD [| 1020 | | 10 devices | { { | | c=0 | 13MIL SPECS 000 M@ 00001c5 0030772 O MEMILS MIL-S-19500/440A(ER) TABLE V. Electrical end-point measurements. | | | T | oT I | J i MIL -STD-750 | | Limits | i | Step | Inspection | I | Symbol | i | Unit | | | |Method | Conditions I | Min | Max | i | | | | | | | | | | \ | [ | | | | | 11 |Collector to emitter | 3041 |Bias condition A, lIces1 { | 2 I|mA de | | | cutoff current | iVpp = 0 V de, | j | l { || | Ree 0 Vd Loial i 2 |Forward-current | 3076 IVcp = 2 V de, heey $30 | 90 | | | | transfer ratio | lI = 20 A de, | | | | | ! |pul sed (see 4.5.1). ! ! ! | 1 3 [Collector to emitter | 3041 {Bias condition A, laIces, | 100 percent of { | | cutoff current | IVpe = 0 V dc, | 1 initial value | I I I IVcgp = 150 V de | | or 200 yA de, | | | | | | | whichever is I | | | | | | greater. I | | | | | | | | | | 4 |Forward-current | 3076 [Vcgp = 2 V de, | ahpey | 425 percent i | | transfer ratio | IIc = 20 A dc, i | change in initial | ! | |pulsed (see 4.5.1) | | recorded value. | I | | 14MIL SPECS 000 MM 0000125 0030773 2 MENMILS MH. -S-19500/440A( ER) 4.4.3 Group C inspection. Group C inspection shal] be conducted in accordance with the conditions specified for subgroup testing in table V of MIL-S-19500, and table III herein. Electrical measurements (end-points) and delta requirements shall be in accordance with the applicable steps of table V herein. 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows. 4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750. * 5. PACKAGING 5,1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-S-19500. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Notes. The notes specified in MIL-S-19500 are applicable to this specification. 6.2 Acquisition requirements. Acquisition documents must specify the following: a. Title, number, and date of this specification. b. Issue of DODISS to be cited in the solicitation, and if required, the specific issue of individual documents referenced herein (see 2.1). c. Lead material and finish may be specified (see 3.3.1). 6.3 Substitution information. Devices covered by this specification are substitutable for the manufacturer's and users PINs. This information in no way implies that manufacturer's part or identifying numbers are suitable as substitutes for the PIN's. 6.4 Changes from previous issue. Marginal notations are not used in this revision to identify Changes with respect to the previous issue due to the extensiveness of the changes. CONCLUDING MATERIAL Custodian: Preparing activity: Army - ER Army - ER Review activity: Agent: DLA - ES DLA - ES (Project 5961-A007 ) 15