Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol ES3A ES3B ES3C ES3D Unit
Device mar king code EA EB EC ED
Maximum repetitive peak reverse voltage VRRM 50 100 150 200 V
Maximum RMS voltage VRMS 35 70 105 140 V
Maximum DC blocking voltage VDC 50 100 150 200 V
Maximum average forward rectified current at TL = 100°C IF(AV) 3.0 A
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC Method) IFSM 100 A
Typical ther mal resistance (1) RΘJA 47
RΘJL 12 °C/W
Operating junction and storage temperature range TJ, TSTG – 55 to +150°C °C
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Maximum instantaneous forward voltage at 3.0A (2) VF0.90 V
Maximum DC reverse current TA = 25°C IR10 µA
at rated DC blocking voltage TA = 100°C 500
Maximum reverse recovery time trr 20 ns
IF= 0.5A, IR= 1.0A, Irr = 0.25A
Maximum reverse recovery time TJ = 25°C 30
IF=3.0A, VR=30V, di/dt=50A/µs, Irr=10% IRM TJ = 100°C trr 50 ns
Maximum stored charge TJ = 25°C Qrr 15 nC
IF=3.0A, VR=30V, di/dt=50A/µs, Irr=10% IRM TJ = 100°C 35
Typical junction capacitance at 4.0V, 1MHz CJ45 pF
Notes: (1) Units mounted on P.C.B. with 0.31 x 0.31” (8.0 x 8.0mm) copper pad areas
(2) Pulse test: 300µs pulse width, 1% duty cycle
Features
• Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
• Ideally suited for use in very high frequency switching
power supplies, inver ters and as free wheeling diodes
• Ultrafast recover y time for high efficiency
• Excellent high temperature switching
• Glass passivated junction
•
High temperature soldering guaranteed: 250°C/10 seconds,
at terminals
Mechanical Data
Case: JEDEC DO-214AB molded plastic body over
passivated chip
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Weight: 0.007 ounce, 0.21 gram
DO-214AB (SMC)