PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) 76002012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76002012A SNJ54LS 157FK 7600201EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7600201EA SNJ54LS157J 7600201FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7600201FA SNJ54LS157W 76033012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76033012A SNJ54LS 158FK 7603301EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603301EA SNJ54LS158J 7603301FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603301FA SNJ54LS158W JM38510/07903BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07903BEA JM38510/07903BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07903BFA JM38510/07904BEA OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 JM38510/07904BFA OBSOLETE CFP W 16 TBD Call TI Call TI -55 to 125 JM38510/30903B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30903B2A JM38510/30903BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30903BEA JM38510/30903BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30903BFA M38510/07903BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07903BEA M38510/07903BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07903BFA M38510/30903B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30903B2A M38510/30903BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30903BEA Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) M38510/30903BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30903BFA SN54157J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54157J SN54LS157J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS157J SN54LS158J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS158J SN54S157J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S157J SN54S158J OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 SN74157N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74157N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS157D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS157 SN74LS157DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS157 SN74LS157DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS157 SN74LS157DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS157 SN74LS157DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS157 SN74LS157DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS157 SN74LS157N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS157N SN74LS157N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS157NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS157N SN74LS157NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS157 SN74LS157NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS157 SN74LS157NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS157 Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) SN74LS158D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS158 SN74LS158DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS158 SN74LS158DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS158 SN74LS158DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS158 SN74LS158DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS158 SN74LS158DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS158 SN74LS158N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS158N SN74LS158N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS158NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS158N SN74LS158NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS158 SN74LS158NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS158 SN74LS158NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS158 SN74S157N NRND PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S157N TBD Call TI Call TI 0 to 70 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S157N3 OBSOLETE PDIP N 16 SN74S157NE4 NRND PDIP N 16 SN74S158D OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70 SN74S158DR OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70 0 to 70 SN74S157N SN74S158N OBSOLETE PDIP N 16 TBD Call TI Call TI SN74S158N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SNJ54157J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54157J SNJ54157W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54157W Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) SNJ54LS157FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76002012A SNJ54LS 157FK SNJ54LS157J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7600201EA SNJ54LS157J SNJ54LS157W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7600201FA SNJ54LS157W SNJ54LS158FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76033012A SNJ54LS 158FK SNJ54LS158J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603301EA SNJ54LS158J SNJ54LS158W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603301FA SNJ54LS158W SNJ54S157FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S 157FK SNJ54S157J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S157J SNJ54S157W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S157W SNJ54S158FK OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125 SNJ54S158J OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 SNJ54S158W OBSOLETE CFP W 16 TBD Call TI Call TI -55 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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OTHER QUALIFIED VERSIONS OF SN54157, SN54LS157, SN54LS158, SN54S157, SN54S158, SN74157, SN74LS157, SN74LS158, SN74S157, SN74S158 : * Catalog: SN74157, SN74LS157, SN74LS158, SN74S157, SN74S158 * Military: SN54157, SN54LS157, SN54LS158, SN54S157, SN54S158 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 5 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74LS157DR SOIC SN74LS158DR SN74LS158NSR SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 8.0 16.0 Q1 D 16 2500 330.0 16.4 6.5 10.3 2.1 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS157DR SOIC D 16 2500 333.2 345.9 28.6 SN74LS158DR SOIC D 16 2500 333.2 345.9 28.6 SN74LS158NSR SO NS 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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