SML-M13x/MN2x Series
Data Sheet
■Features
■Outline
•
Compact LED with reflector
•
Die is located at the center of the package,achieving
equivalent distribution of light emission.
■Size
■Dimensions
■Recommended Solder Pattern
■Specifications
Typ. I
F
Max. V
R
Min.*2
Typ.
Max.*2
I
F
Min. Typ. I
F
(V) (mA) (µA) (V) (nm) (nm) (nm) (mA) (mcd) (mcd) (mA)
625 630 635 40 75
615 620 625 63 120
602 605 608
587 590 593
569 572 575 25 45
557 560 563 6.3 16
3.0 - 527 - 56 140
464 470 476 14 36
56 140
(x,y)(0.30, 0.28)
*1 : 1/10,1kHz *2 : Measurement tolerance:±1nm、*3:Brightness for white color is noted with chromaticity coordinate(x,y).
160
Blue
68
70
100*
1
2.9
100
SML-M13VT
SML-M13UT
SML-M13DT
SML-M13YT
SML-M13MT
SML-M13PT
SMLMN2ECT(C)
SMLMN2BCT(C) 5
Power
Forward Peak Forward
20 10 5 20 20
Emitting
Color
Green
Dominant Wavelength λ
D
/Chromaticity coordinate(x,y)
Luminous Intensity I
V
Dissipation
T
opr
(ºC) T
stg
(ºC)
I
FP
(mA)
V
R
(V)
Current
Current
Voltage
P
D
(mW)
I
F
(mA)
Part No.
Chip Structure
Absolute Maximum Ratings (Ta=25ºC) Electrical and Optical Characteristics (Ta=25ºC)
Reverse
Operating Temp.
Storage Temp.
Forward Voltage V
F
Reverse Current I
R
AlGaInP
Red
75
30 5 -40 〜 +85
-40 〜 +100
2.0
Orange
SMLMN2WB1CW(C)
*3
White
InGaN 20 12
-40 〜 +100 -40 〜 +100
5 10 12 5
Yellow
Yellowish green
81 2.2
Tolerance : ±0.2
(unit : mm) (unit : mm)
20125 (0805)
2.0×1.25mm (t=0.8mm)
Color
Type V U D Y
M P BWB
E
1.1
1.1
1.25
1.25
PCB Bonding Direction
2-R0.3
2.0
1.4
0.8
0.3
1.25
0.85
0.9
1.0
Through Hole
Electrode
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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©2019 ROHM Co., Ltd. All rights reserved 1/10 2019.3 - Rev.009
[Data Sheet]
■Electrical Characteristics Curves
Fig.1 Forward Current
Fig.2 Luminous Intensity -
- Forward Voltages
Atmosphere Temperature
Fig.3 Luminous Intensity - Forward Current
Fig.4 Derating
Reference
[SML-M13x/MN2x series]
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 5 10 15 20 25 30
0.4
0.6
0.8
1
1.2
1.4
1.6
-40 -20 0 20 40 60 80 100
1
10
100
1.5 2.0 2.5
Ta=25ºC
FORWARD CURRENT : IF[mA]
FORWARD VOLTAGE : VF[V]
IF=20mA
RELATIVE LUMINOUS INTENSITY [a.u.]
ATMOSPHERE TEMPERATURE : Ta [ºC]
Ta=25ºC
RELATIVE LUMINOUS INTENSITY
FORWARD CURRENT : IF[mA]
MAXIMUM FORWARD CURRENT : [mA]
AMBIENT TEMPERATURE : Ta [ºC]
SML-M13VT
SML-M13UT
SML-M13DT
SML-M13YT
SML-M13MT
SML-M13PT
SML
-M13VT
SML
-M13UT
SML
-M13DT
SML
-M13YT
SML
-M13MT
SML
-M13PT
SML-M13VT
SML-M13UT
SML-M13DT
SML-M13YT
SML-M13MT
SML-M13PT
0
10
20
30
40
-40 -20 0 20 40 60 80 100
SML
-M13VT
SML
-M13UT
SML
-M13DT
SML
-M13YT
SML
-M13MT
SML
-M13PT
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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©2019 ROHM Co., Ltd. All rights reserved 2/10 2019.3 - Rev.009
[Data Sheet]
■Electrical Characteristics Curves
Fig.1 Forward Current
Fig.2 Luminous Intensity -
- Forward Voltages
Atmosphere Temperature
Fig.3 Luminous Intensity - Forward Current
Fig.4 Derating
Reference
[SML-M13x/MN2x series]
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
0.0 5.0 10.0 15.0 20.0
0.4
0.6
0.8
1
1.2
1.4
1.6
-40-30-20-10 0 10 20 30 40 50 60 70 80 90100
1
10
100
2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
FORWARD CURRENT : IF[mA]
FORWARD VOLTAGE : VF[V]
IF=5mA
ATMOSPHERE TEMPERATURE : Ta [ºC]
RELATIVE LUMINOUS INTENSITY [a.u.]
RELATIVE LUMINOUS INTENSITY
FORWARD CURRENT : IF[mA]
MAXIMUM FORWARD CURRENT : [mA]
AMBIENT TEMPERATURE : Ta [ºC]
Ta=25ºC
Ta=25ºC
SMLMN2BCT(C)
SMLMN2WB1CW(C)
SMLMN2ECT(C)
SMLMN2BCT(C)
SMLMN2WB1CW(C)
SMLMN2ECT(C)
SMLMN2BCT(C)
SMLMN2WB1CW(C)
SMLMN2ECT(C)
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
-40 -20 0 20 40 60 80 100 120
SMLMN2BCT(C)
SMLMN2WB1CW(C)
SMLMN2ECT(C)
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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©2019 ROHM Co., Ltd. All rights reserved 3/10 2019.3 - Rev.009
[Data Sheet]
■Viewing Angle
[SML-M13x/MN2x series]
Reference
SCANNING ANGLE (deg) SCANNING ANGLE (deg)
RELATIVE INTENSITY (%) RELATIVE INTENSITY (%)
SCANNING ANGLE (deg) SCANNING ANGLE (deg)
RELATIVE INTENSITY (%) RELATIVE INTENSITY (%)
SML-M13VT
SML-M13UT
SML-M13DT
SML-M13YT
SML-M13MT
SML-M13PT
SMLMN2BCT(C)
SMLMN2WB1CW(C)
SMLMN2ECT(C)
X
X X
X -
--
- Y
YY
Y
050 100
90
80
70
60
50
40
30
20
10
0
10
20
30
40
50
60
70
80
90
100 50
X
XX
X Y
YY
Y
ｽｷｬﾝ方向
(Scanning Direction)
X'
X'X'
X' Y'
Y'Y'
Y'
050 100
90
80
70
60
50
40
30
20
10
0
10
20
30
40
50
60
70
80
90
100 50
X'
X' X'
X' -
--
- Y'
Y'Y'
Y'
ｽｷｬﾝ方向
(Scanning Direction)
X
X X
X -
--
- Y
YY
Y
100100
90
80
70
050
60
50
40
30
20
10
0
10
20
30
40
50
60
70
80
90
50
ｽｷｬﾝ方向
(Scanning Direction)
X
XX
XY
YY
Y
X'
X' X'
X' -
--
- Y'
Y'Y'
Y'
100 100
90
80
70
050
60
50
40
30
20
10
0
10
20
30
40
50
60
70
80
90
50
ｽｷｬﾝ方向
(Scanning Direction)
X'
X'X'
X' Y'
Y'Y'
Y'
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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©2019 ROHM Co., Ltd. All rights reserved 4/10 2019.3 - Rev.009
[Data Sheet]
■Rank Reference of Brightness*
*Measurement tolerance:±10%
■Chromaticity Diagram
[SML-M13x/MN2x series]
0.23
0.24
0.25
0.26
0.27
0.28
0.29
0.30
0.31
0.32
0.33
0.34
0.35
0.36
0.26 0.27 0.28 0.29 0.30 0.31 0.32 0.33 0.34
CIE x
CIE y
0
3
2
4
Red(V,U)
(Ta=25ºC, I
F
＝20mA)
K
L
M
N
P
Q
R
S
T
U
V
W
4.0〜6.3 6.3〜10 10〜16 16〜25 25〜40 40〜63 63〜100 100〜160 160〜250 250〜400 400〜630
630〜1000
Orange(D)
(Ta=25ºC, I
F
＝20mA)
K
L
M
N
P
Q
R
S
T
U
V
W
4.0〜6.3 6.3〜10 10〜16 16〜25 25〜40 40〜63 63〜100 100〜160 160〜250 250〜400 400〜630
630〜1000
Yellow(Y)
(Ta=25ºC, I
F
＝20mA)
K
L
M
N
P
Q
R
S
T
U
V
W
4.0〜6.3 6.3〜10 10〜16 16〜25 25〜40 40〜63 63〜100 100〜160 160〜250 250〜400 400〜630
630〜1000
Yellowish Green(M)
(Ta=25ºC, I
F
＝20mA)
K
L
M
N
P
Q
R
S
T
U
V
W
4.0〜6.3 6.3〜10 10〜16 16〜25 25〜40 40〜63 63〜100 100〜160 160〜250 250〜400 400〜630
630〜1000
Green(P,E)
(Ta=25ºC, I
F
＝20mA(P),Ta=25ºC, IF＝5mA(E))
K
L
M
N
P
Q
R
S
T
U
V
W
4.0〜6.3 6.3〜10 10〜16 16〜25 25〜40 40〜63 63〜100 100〜160 160〜250 250〜400 400〜630
630〜1000
K
L
M
N
P
Q
R
S
T
U
V
W
3.6〜5.6 5.6〜9 9〜14 14〜22 22〜36 36〜56 56〜90 90〜140 140〜220 220〜360 360〜560 560〜900
Blue(B)
(Ta=25ºC, I
F
＝5mA)
K
L
M
N
P
Q
R
S
T
U
V
W
3.6〜5.6 5.6〜9 9〜14 14〜22 22〜36 36〜56 56〜90 90〜140 140〜220 220〜360 360〜560 560〜900
White(WB)
(Ta=25ºC, I
F
＝5mA)
K
L
M
N
P
Q
R
S
T
U
V
W
3.6〜5.6 5.6〜9 9〜14 14〜22 22〜36 36〜56 56〜90 90〜140 140〜220 220〜360 360〜560 560〜900
Rank
Iv (mcd)
Iv (mcd)
SML-M13DT
SML-M13YT
SML-M13VT
SML-M13UT
Rank
Rank
Iv (mcd)
Iv (mcd)
SMLMN2WB1CW(C)
Rank
Iv (mcd)
Rank
Rank
SML-M13MT
Iv (mcd)
SMLMN2BCT(C)
SML-M13PT
SMLMN2ECT(C)
Rank
Iv (mcd)
Rank
Iv (mcd)
1
5
（Ｔａ＝25℃、If=5mA)
x
y
x
y
x
y
0.286 0.244 0.280 0.252 0.296 0.259
0.280 0.252 0.273 0.261 0.291 0.268
0.291 0.268 0.285 0.279 0.310 0.297
0.296 0.259 0.291 0.268 0.313 0.284
x
y
x
y
x
y
0.291 0.268 0.313 0.284 0.310 0.297
0.285 0.279 0.310 0.297 0.307 0.312
0.307 0.312 0.330 0.330 0.330 0.347
0.310 0.297 0.330 0.310 0.330 0.330
Measurement tolerance：±0.01
0 1 2
4 53
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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©2019 ROHM Co., Ltd. All rights reserved 5/10 2019.3 - Rev.009
[Data Sheet]
■Taping(T86)
Unit:ｍｍ
Note)Tolerance is within ±0.2mm unless
otherwise specified.
■Part No. Construction
■Packing Specification
ROHM LED products are being shipped with desiccant (silica gel) included in moisture-proof bags.
or enclosing the humidity indication card inside the bag is available upon request.
Please contact the nearest sales office or distributer if necessary.
Pasting the moisture sensitive label on the outer surface of the moisture-proof bags
[SML-M13x/MN2x series]
8.0
1.1
±0.1
3.5
5.5
0～0.5
1.7
4
±0.1
2
±0.05
2.5
φ180
φ60
φ13
11.4
±1
φ1.5
+0.1
0
0
-3
+1
0
1.75
±0.1
Packing quantity
3,000pcs / reel Pull
direction
*"-"will be taken out for emitting color Special Code will be applied for Chromaticity rank Rank sign
WB/B/E series. Emitting color WB/B/E series. (for white LED） (Brightness Rank)*
Series name Package Type Chip type Emitting Color Resin Color Taping Specification
SML
P1 0 V T
E1 1 U W
D1
2U2 B
H1
3D
M1
4Y3
01 5Y2 notice）S1 series、81 seires
Z1/ZN
6Y
A1 7W
81/82
8
M2
K1 M
*Concerning the Brightness rank.
S1 F
*Please refer to the rank chart above for
P2 P
luminous intensity classification.
52 E
*Part name is individual for each rank.
P34
B
*When shipped as sample,the part name will
P36
WB
be a representative part name.
VN
T
General products are free of ranks.
RGB
Please contact sales if rank appointment
SCM
01
is needed.
Red/Green/Blue
Chip LED
3.0x1.5 t=2.2mm
1.0x1.0 t=0.2mm
Blue
1.5x1.0 t=0.2mm
White
3.5x2.8 t=0.6mm
Phototransistors
3.2x1.6 t=1.85mm
Green
1.0x1.0 t=0.2mm
Green
1.3x1.5 t=0.6mm
Green
Cathode at sprocket hole side(the back)
1.6x1.15 t=0.55mm T68
Cathode at sprocket hole side(the top)
3.4x1.25 t=1.1mm
T86
4.5x2.0 t=0.6mm
Yellowish green
Black
2.0x1.25 t=0.8mm
Ultra High Brightness type
3.0x2.0 t=1.3mm
3.5x2.8 t=1.9mm
High Brightness type
Yellowish green
Red
Yellow
Yellow
Yellow
Yellow
Chip LED
1.0x0.6 t=0.2mm
1.6x0.8 t=0.36mm
1.6x0.8 t=0.55mm
Low Current Type
Red
Milkey White
T87
Anode at sprocket hole side(the top)
1
Orange
6 S8
3
For white LED,
csthode at sprocket hole side
Standard Type
Red
Transparent Colorless
T86
Cathode at sprocket hole side(the top)
3 U T T1S M L － M
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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©2019 ROHM Co., Ltd. All rights reserved 6/10 2019.3 - Rev.009
[Data Sheet]
１．Storage
If the product is heated during the reflow under the condition of hygroscopic state,
it may vaporize and expand which will influence the performance of the product.
Therefore, the package is waterproof. Please use the product following the conditions:
・Using Conditions
・Baking
Bake the product in case of below:
①The expiration date is passed.
②The color of indicator (silica gel) turned from blue to colorless or from green to pink.
・Baking Conditions
２．Application Methods
２－１．Precaution for Drive System and Off Mode
Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that
please do not apply voltage neither forward nor reverse. Especially, for the products with the
Ag-paste used in the die bonding, there’s high possibility to cause electro migration and result
２－２．About Derating
It is considered that derating characteristics will not result in LED chip's electrical destruction.
Even within the derating, the reliability and luminous life can be affected depending on operating
conditions and ambient environment. So we would be appreciate it if you can confirm with your
application again.
２－３．About product life
Depending on operating conditions and environment(applied current, ambient temperature and
humidity, corrosive gas), decreasing of luminosity and change of chromaticity may occur even
within the specification conditions.
Please contact our sales office if you use it for the following applications.
①It requires long luminosity life
②It is always lit
２－４．Applied Stress on Product
The top of the LED is very soft, which the silicon resin is used as sealing resin.
Therefore, please pay attention to the overstress on it which may influence its reliability.
２－５．Usage
The Product is LED. We are not responsible for the usage as the diode such as Protection Chip,
Rectifier, Switching and so on.
①Before using 5〜30℃ 30〜70%RH
②After opening
package
5〜30℃
Please storing in the airtight container
Below 70%RH Within 72h
with our desiccant (silica gel)
(Even if the product is within the expiration date.)
60±3℃
40〜48h
Below 20%RH
Remark
so please try not to apply stress on it.
・Recommend bake once.
Within 1 year
from Receiving Storage with waterproof package
Classification
Temperature
Humidity
Expiration Date
Remark
[SML-M13x/MN2x series]
Temperature
Time
Humidity
■Precaution (Surface Mount Device)
・Bake products in reel.
・Reel and embossed tape are easy to be deformed when baking,
applies on the products. If drive by constant voltage, it may cause current deviation of the LED and
result in deviation of luminous intensity, so we recommend to drive by constant current.
(Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode,
in function failure.
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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©2019 ROHM Co., Ltd. All rights reserved 7/10 2019.3 - Rev.009
[Data Sheet]
３．Others
３－１．Surrounding Gas
Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or
alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of
the plating surface ) or optical characteristics changes (light intensity, chrominance) and change
in quality of cause die bonding (Ag-paste) materials. All of the above will function failure of
Therefore, please pay attention to the storage environment for mounted product (concern the
３－２．Electrostatic Damage
The product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged
by the electrostatic discharge. Please take appropriate measures to avoid the static electricity from
human body and earthing of production equipment. Especially, InGaN type LEDs have lower resistance
value of electrostatic discharge and it is recommended to introduce the ESD protection circuit.
The resistance values of electrostatic discharge (actual values) vary with products, therefore,
please call our Sales staffs for inquiries.
３－３． Electromagnetic Wave
Applications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED,
therefore please evaluate before using it.
[SML-M13x/MN2x series]
the products.
generated gas of the surrounding parts of the products and the atmospheric environment).
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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©2019 ROHM Co., Ltd. All rights reserved 8/10 2019.3 - Rev.009
[Data Sheet]
Stress strength according to
he mounting position:
A＞B＞C＞D
so please pay attention to the touch on product.
We recommend the soldering pattern that shows on the right.
It will be different according to mounting situation of circuit board,
therefore, please concern before designing.
※The product has adopted the electrode structure that it should solder
with back electrode of the product.
Thus, please be informed that the shape of electrode pin of
solder fillet formation is not guaranteed.
The through hole on electrode surface is for conduction of front
and rear electrodes but not for formation of solder fillet.
・Do not expose the product in the environment of high temperature (over 100℃) or rapid temperature
shift (within 3℃/sec. of temperature gradient) during the flow soldering of surrounding parts.
the mounter to control the product stabilization. In addition, it is recommended to set ionizer
one of its specific characteristics is that solder will penetrate into LED. Thus, there's high possibility
that will influence its reliability.Therefore, please be informed, concerning it before using it.
４－２. Automatic Mounting
４-２-１. Silicon Resin Sealing Product
The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stress
directly on the sealing section.
４-２-２. Mini Package (Smaller than 1608 size)
・Vibration may result in low mounting rate since it will cause the static electricity of product and
adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of
with other parts within the usage limitation after open the moistureproof package.
[SML-M13x/MN2x series]
４－１. Soldering
・The max for reflowing is 2 times, please finish the second reflow soldering and flow soldering
・No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin
expansion and moisture absorption at humidity will cause heat stress during soldering process and
４．Mounting
finally has bad influence on the product’s reliability.
・The product is not guaranteed for flow soldering.
In case of carrying out flow soldering of surrounding parts without recommended conditions, please
contact us for inquiries.
・Please set appropriate reflow temperature based on our product usage conditions and specification.
・Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions,
it may cause the discoloration of the resin.
・For our product that has no solder resist, because of its solder amount and soldering conditions,
４－５．Soldering Pattern for Recommendation
to prevent electrostatic charge.
４－３. Mounting Location
The stress like bending stress of circuit board dividing after mounting, may cause LED package crack
or damage of LED internal junction, therefore, please concern the mounting direction and position
to avoid bending or screwing with great stress of the circuit board.
４―４. Mechanical Stress after Mounting
The mechanical stress may damage the LED after Circuit Mounting,
1.1mm
1.1mm
1.25mm
1.25mm
PCB Bonding Direction
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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©2019 ROHM Co., Ltd. All rights reserved 9/10 2019.3 - Rev.009
[Data Sheet]
[SML-M13x/MN2x series]
４－６．Reflow Profile
For reflow profile, please refer to the conditions below:(※)
■Meaning of marks, Conditions
Mark
Meanings
Conditions
Ts
max
Maximum of pre-heating temperature
180℃
Ts
min
Minimum of pre-heating temperature
140℃
t
s
Time from Tsmin to Tsmax
Over 60sec.
Reference temperature
230〜250℃
t
L
Retention time for TL
Within 40sec.
T
P
Peak temperature
250℃(Max)
ΔT
D
/Δt
Temperature decreasing rate
Over -3℃/sec.
T
L
②HAND SOLDERING CONDITION
LED products do not contain reinforcement material such as a glass fillers.
RECOMMENDED CONDITION
Condition ) Temp. of iron top less than
325℃ within 3 sec.
So thermal stress by soldering greatly influence its reliability.
Please keep following points for manual soldering.
ITEM
a)
reflow furnaces before using, because stress from circuit boards and temperature variations of reflow
４－７．Attention Points in Soldering Operation
This product was developed as a surface mount LED especially suitable for reflow soldering.
So reflow soldering is recommended. In case of implementing manual soldering,
please take care of following points.
①SOLDER USED
furnaces vary by customer’s own conditions.
Sn-Cu，Sn-Ag-Cu，Sn-Ag-Bi-Cu
Please follow the conditions below if the cleaning is necessary after soldering.
Ultrasonic Cleaning
15W／Below 1 liter (capacity of tank)
Drying
Under 100℃ within 3 minutes
Solvent
We recommend to use alcohols solvent such as, isopropyl alcohols
Temperature
Under 30℃ within 3 minutes
Heating method
Heating on PCB pattern, not direct to the
LED. (Fig-1)
４－８．Cleaning after Soldering
t
P
Time for peak temperature
Within 10sec.
ΔT
R
/Δt
Temperature rising rate
Under 3℃/sec.
b)
Handling after
soldering
Please handle after the part temp.
goes down to room temp.
※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and
Fig-1 SOLDERING IRON
SOLDERING LAND
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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©2019 ROHM Co., Ltd. All rights reserved 10/10 2019.3 - Rev.009
R1102
A
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© 201 ROHM Co., Ltd. All rights reserved.
Notice
ROHM Customer Support System
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Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
Notes
The information contained herein is subject to change without notice.
Before you use our Products, please contact our sales representative
and verify the latest specifica-
tions :
Although ROHM is continuously working to improve product reliability and quality, semicon-
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-
cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
The Products specified in this document are not designed to be radiation tolerant.
For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
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