1. Product profile
1.1 General description
Single planar Schottky barrie r diode with an integrated guard ring for stress protection,
encapsulated in a SOT416 (SC-75) ultra small Surfa ce -M o un te d De vice (SMD) plastic
package.
1.2 Features
Low forward voltage: max. 400 mV
Low capacitance: max. 10 pF
Ultra small SMD plastic package
AEC-Q101 qualified
1.3 Applications
Ultra high-speed switching
Voltage clamping
Protection circuits
Blocking diode
1.4 Quick reference data
[1] Pulse test: tp≤300 μs; δ≤0.02.
BAT54T
Single Schottky barrier diode
Rev. 01 — 14 December 2009 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IFforward current - - 200 mA
VRreverse voltage - - 30 V
VFforward voltage IF=10mA [1] --400mV
BAT54T_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 14 December 2009 2 of 9
NXP Semiconductors BAT54T
Single Schottky barrier diode
2. Pinning information
3. Ordering information
4. Marking
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 anode
2 not connected
3 cathode
12
3
006aaa436
1
3
2
n.c.
Table 3. Ordering information
Type number Package
Name Description Version
BAT54T SC-75 plastic surface-mounted package; 3 leads SOT416
Table 4. Marking codes
Type number Marking code
BAT54T ZW
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRreverse voltage - 30 V
IFforward current - 200 mA
IFRM repetitive peak forward
current tp≤1s; δ≤0.5 - 300 mA
IFSM non-repetitive peak
forward current square wave
tp= 100 μs-4A
tp=1ms - 2 A
tp=10ms - 1 A
Ptot total power dissipation Tamb ≤25 °C[1] -150mW
Tjjunction temperature - 150 °C
Tamb ambient temperature −55 +150 °C
Tstg storage temperature −65 +150 °C
BAT54T_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 14 December 2009 3 of 9
NXP Semiconductors BAT54T
Single Schottky barrier diode
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Soldering point of cathode tab.
7. Characteristics
[1] Pulse test: tp≤300 μs; δ≤0.02.
[2] When switched from IF= 10 mA to IR=10mA; R
L= 100 Ω; measured at IR=1mA.
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1] - - 833 K/W
Rth(j-sp) thermal resistance from
junction to solder point [2] - - 350 K/W
Table 7. Characteristics
Tamb =25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage [1]
IF= 0.1 mA - - 240 mV
IF= 1 mA - - 320 mV
IF= 10 mA - - 400 mV
IF= 30 mA - - 500 mV
IF= 100 mA - - 800 mV
IRreverse current VR=25V --2 μA
trr reverse recovery
time [2] --5 ns
Cddiode capacitance VR=1V; f=1MHz --10pF
BAT54T_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 14 December 2009 4 of 9
NXP Semiconductors BAT54T
Single Schottky barrier diode
(1) Tamb = 125 °C
(2) Tamb =85°C
(3) Tamb =25°C
(1) Tamb = 125 °C
(2) Tamb =85°C
(3) Tamb =25°C
Fig 1. Forward current as a function of forward
voltage; typical values Fig 2. Reverse current as a function of reverse
voltage; typical values
f=1MHz; T
amb =25°C
Fig 3. Diod e capacitance as a function of reverse voltage; typical values
103
102
10−1
IF
(mA)
VF (V)
10
1
1.20.80.40
msa892
(3)(2)(1)
(3)(2)(1)
0102030
VR (V)
103
102
10−1
IR
(μA)
10
1
(1)
(2)
(3)
msa893
0102030
0
5
10
15
V
R
(V)
C
d
(pF)
msa891
BAT54T_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 14 December 2009 5 of 9
NXP Semiconductors BAT54T
Single Schottky barrier diode
8. Test information
9. Package outline
(1) IR=1mA
Fig 4. Re verse recovery time test circuit and waveforms
trr
(1)
+ I
F
t
output signal
t
r
t
p
t
10 %
90 %
V
R
input signal
V = V
R
+
I
F
×
R
S
R
S
= 50 ΩI
F
D.U.T.
R
i
= 50 Ω
SAMPLING
OSCILLOSCOPE
mga881
Fig 5. Package outline SOT416 (SC-75)
04-11-04Dimensions in mm
0.95
0.60
1.8
1.4
1.75
1.45
0.9
0.7
0.25
0.10
1
0.30
0.15
12
30.45
0.15
BAT54T_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 14 December 2009 6 of 9
NXP Semiconductors BAT54T
Single Schottky barrier diode
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
Table 8. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
BAT54T SOT416 4 mm pitch, 8 mm tape and reel -115 -135
Fig 6. Reflow soldering footprint SOT416 (SC-75)
solder lands
solder resist
occupied area
solder paste
sot416_
fr
0.85
1.7
2.2
2
0.5
(3×)
0.6
(3×)
1
1.3
Dimensions in mm
BAT54T_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 14 December 2009 7 of 9
NXP Semiconductors BAT54T
Single Schottky barrier diode
12. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BAT54T_1 20091214 Product data sheet - -
BAT54T_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 14 December 2009 8 of 9
NXP Semiconductors BAT54T
Single Schottky barrier diode
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warrant ies as to t he accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short dat a sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full informatio n see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict wit h the short data sheet, the
full data sheet shall pre va il.
13.3 Disclaimers
General — In formation in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give an y represent ations or
warranties, expressed or impli ed, as to the accuracy or completeness of such
information and shall have no liability for th e co nsequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, milit ary, aircraft,
space or life support equipment, nor in app lications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applic ations that are described herein for any of these
products are for il lustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ra tings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other co nditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may af fect device reliability .
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between inf ormation in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Not hing in this document may be interpret ed or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property right s.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All refe renced brands, produc t names, service names and trademarks
are the property of their respective ow ners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contain s data from the objective specification for product develop ment.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors BAT54T
Single Schottky barrier diode
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 14 December 2009
Document identifier: BAT54T_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
10 Packing information . . . . . . . . . . . . . . . . . . . . . 6
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
14 Contact information. . . . . . . . . . . . . . . . . . . . . . 8
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
