© 2007 Microchip Technology Inc. DS21985B-page 1
MCP131X/2X
Features
• Low supply current: 1 µA (typical),10 µA (max.)
• Precision monitoring trip point options:
- 2.9V and 4.6V (Standard Offerings)
- 2.0V to 4.7V in 100 mV increments,
(Contact the local Microchip Sales Office)
• Reset s microcontroller in a powe r-l oss event
• Reset Delay Time Out Option:
- 1.4 ms, 30 ms, 200 ms, or 1.6s (typical)
• Watchdog Timer Input Time Out Options:
- 6.3 ms, 102 ms, 1.6s, or 25.6s (typical)
• Manual Reset (MR) input (active-low)
• Single and Complementary Reset output(s)
• Reset Output Options:
- Push-Pull (active-high or active-low)
- Open-Drain (internal or external Pull-up)
• Temperature Range:
- -40°C to +85°C for trip points 2.0 to 2.4V and,
- -40°C to + 125°C for trip points > 2.5V
• Voltage Range: 1.0V to 5.5V
• Lead Free Packaging
Description
The MCP131X/2X are voltage supervisor devices
designed to keep a microcontroller in Reset until the
system voltage has reached and stabilized at the
proper level for reliable system operation. The table
below shows the available features for these devi ces .
Package Types
Block Diagram
Device Features
1
2
3
5
4
MCP1317
1
2
3
5
4
MCP1318/18M/21
1
2
3
5
4
MCP1319/19M/22
1
2
3
5
4
MCP1316/16M/20 SOT-23-5
RST RST
VSS
MR WDI
VDD VDD
RST
VSS
MR WDI
VSS
RST WDI
VDD RST
VSS
RST MR
VDD
VDD
Comparator
+
–Output
Driver
RST
Reference
VSS
RST
Noise Filter
Watchdog
MR
WDI
Note: Features available depend on the device
Voltage
Device
Reset Output A Reset Output B
WDI Input MR Input
Type Pull-up
Resistor Active
Level Type Pull-up
Resistor Active
Level
MCP1316 Push-Pull — Low — — — Yes Yes
MCP1316M Open-Drain Internal Low — — — Yes Yes
MCP1317 Push-Pull — High — — — Yes Yes
MCP1318 Push-Pull — Low Push-Pull — High Yes No
MCP1318M Open-Drain Internal Low Push-Pull — High Yes No
MCP1319 Push-Pull — Low Push-Pull — High No Yes
MCP1319M Open-Drain Internal Low Push-Pull — High No Yes
MCP1320 Open-Drain External Low — — — Yes Yes
MCP1321 Open-Drain External Low Push-Pull — High Yes No
MCP1322 Open-Drain External Low Push-Pull — High No Yes
Voltage Supervisor
MCP131X/2X
DS21985B-page 2 © 2007 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage (VDD to VSS). . . . . . . . . . . . . . . . . . . . . . 7.0V
Input current (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
Output current (RST) . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
Voltage on all inputs and outputs, except Open-Drain RST
(with no internal pull-up resistor), w.r.t. VSS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.6V to (VDD + 1.0V)
Voltage on Open-Drain RST
(with no internal pull-up resistor) w.r.t. VSS . . -0.6 V to 13.5V
Stor age temperature . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Ambient temp. with power applied . . . . . . . .-40°C to +125°C
Maximum Junction temp. with power applied . . . . . . . .150°C
Power Dissipation (TA ≤ 70°C):
5-Pin SOT-23A .......................................................240 mW
ESD protection on all pins..................................................≥ 4kV
† Notice: Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 10 0 kΩ
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125 °C.
Parameters Sym Min Typ Max Units Conditions
Operating Voltage Range VDD 1.0 — 5.5 V
Specified VDD Value to VOUT Low VDD 1.0 — — V I RST = 10 µA, V RST < 0.3V
Operating Current: IDD — 5 10 µA Watchdog Timer Active
— 1 2 µA Watchdog Timer Inactive
—12µAV
DD < VTRIP
— 5 10 µA Reset Delay Timer Active
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysterysis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-Cir-
cuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage
requirements). The total time that the RST pin can be above the maximum device operational voltage
(5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device oper-
ational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information,
refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered vo lt ag e trip poin t; minimum ord er volume requ irement . Info rmation availa ble upo n reque st.
© 2007 Microchip Technology Inc. DS21985B-page 3
MCP131X/2X
VDD T rip Point MCP13XX-20 VTRIP 1.970 2.00 2.030 V TA = +25°C (Note 1)
(Note 6) 1.950 2.00 2.050 V TA = -40°C to +85°C (Note 2)
MCP13XX-21 2.069 2.10 2.132 V TA = +25°C (Note 1)
(Note 6) 2.048 2.10 2.153 V TA = -40°C to +85°C (Note 2)
MCP13XX-22 2.167 2.20 2.233 V TA = +25°C (Note 1)
(Note 6) 2.145 2.20 2.255 V TA = -40°C to +85°C (Note 2)
MCP13XX-23 2.266 2.30 2.335 V TA = +25°C (Note 1)
(Note 6) 2.243 2.30 2.358 V TA = -40°C to +85°C (Note 2)
MCP13XX-24 2.364 2.40 2.436 V TA = +25°C (Note 1)
(Note 6) 2.340 2.40 2.460 V TA = -40°C to +85°C (Note 2)
MCP13XX-25 2.463 2.50 2.538 V TA = +25°C (Note 1)
(Note 6) 2.438 2.50 2.563 V TA = -40°C to +125°C (Note 2)
MCP13XX-26 2.561 2.60 2.639 V TA = +25°C (Note 1)
(Note 6) 2.535 2.60 2.665 V TA = -40°C to +125°C (Note 2)
MCP13XX-27 2.660 2.70 2.741 V TA = +25°C (Note 1)
(Note 6) 2.633 2.70 2.768 V TA = -40°C to +125°C (Note 2)
MCP13XX-28 2.758 2.80 2.842 V TA = +25°C (Note 1)
(Note 6) 2.730 2.80 2.870 V TA = -40°C to +125°C (Note 2)
MCP13XX-29 2.857 2.90 2.944 V TA = +25°C (Note 1)
2.828 2.90 2.973 V TA = -40°C to +125°C (Note 2)
MCP13XX-30 2.955 3.00 3.045 V TA = +25°C (Note 1)
(Note 6) 2.925 3.00 3.075 V TA = -40°C to +125°C (Note 2)
MCP13XX-31 3.054 3.10 3.147 V TA = +25°C (Note 1)
(Note 6) 3.023 3.10 3.178 V TA = -40°C to +125°C (Note 2)
MCP13XX-32 3.152 3.20 3.248 V TA = +25°C (Note 1)
(Note 6) 3.120 3.20 3.280 V TA = -40°C to +125°C (Note 2)
MCP13XX-33 3.251 3.30 3.350 V TA = +25°C (Note 1)
(Note 6) 3.218 3.30 3.383 V TA = -40°C to +125°C (Note 2)
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysterysis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-Cir-
cuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications fo r voltage
requirements). The total time that the RST pin can be above the maximum device operational voltage
(5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device oper-
ational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information,
refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered vo lt ag e trip poin t; minimum ord er volume requ irement . Info rmation availa ble upo n reque st.
MCP131X/2X
DS21985B-page 4 © 2007 Microchip Technology Inc.
VDD T rip Point (Con’t) MCP13XX-34 VTRIP 3.349 3.40 3.451 V TA = +25°C (Note 1)
(Note 6) 3.315 3.40 3.385 V TA = -40°C to +125°C (Note 2)
MCP13XX-35 3.448 3.50 3.553 V TA = +25°C (Note 1)
(Note 6) 3.413 3.50 3.588 V TA = -40°C to +125°C (Note 2)
MCP13XX-36 3.546 3.60 3.654 V TA = +25°C (Note 1)
(Note 6) 3.510 3.60 3.690 V TA = -40°C to +125°C (Note 2)
MCP13XX-37 3.645 3.70 3.756 V TA = +25°C (Note 1)
(Note 6) 3.608 3.70 3.793 V TA = -40°C to +125°C (Note 2)
MCP13XX-38 3.743 3.80 3.857 V TA = +25°C (Note 1)
(Note 6) 3.705 3.80 3.895 V TA = -40°C to +125°C (Note 2)
MCP13XX-39 3.842 3.90 3.959 V TA = +25°C (Note 1)
(Note 6) 3.803 3.90 3.998 V TA = -40°C to +125°C (Note 2)
MCP13XX-40 3.940 4.00 4.060 V TA = +25°C (Note 1)
(Note 6) 3.900 4.00 4.100 V TA = -40°C to +125°C (Note 2)
MCP13XX-41 4.039 4.10 4.162 V TA = +25°C (Note 1)
(Note 6) 3.998 4.10 4.203 V TA = -40°C to +125°C (Note 2)
MCP13XX-42 4.137 4.20 4.263 V TA = +25°C (Note 1)
(Note 6) 4.095 4.20 4.305 V TA = -40°C to +125°C (Note 2)
MCP13XX-43 4.236 4.30 4.365 V TA = +25°C (Note 1)
(Note 6) 4.193 4.30 4.408 V TA = -40°C to +125°C (Note 2)
MCP13XX-44 4.334 4.40 4.466 V TA = +25°C (Note 1)
(Note 6) 4.290 4.40 4.510 V TA = -40°C to +125°C (Note 2)
MCP13XX-45 4.433 4.50 4.568 V TA = +25°C (Note 1)
(Note 6) 4.388 4.50 4.613 V TA = -40°C to +125°C (Note 2)
MCP13XX-46 4.531 4.60 4.669 V TA = +25°C (Note 1)
4.485 4.60 4.715 V TA = -40°C to +125°C (Note 2)
MCP13XX-47 4.630 4.70 4.771 V TA = +25°C (Note 1)
(Note 6) 4.583 4.70 4.818 V TA = -40°C to +125°C (Note 2)
VDD T rip Point Tempco TTPCO — ±40 — ppm/°C
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 10 0 kΩ
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125 °C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysterysis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-Cir-
cuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage
requirements). The total time that the RST pin can be above the maximum device operational voltage
(5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device oper-
ational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information,
refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered vo lt ag e trip poin t; minimum ord er volume requ irement . Info rmation availa ble upo n reque st.
© 2007 Microchip Technology Inc. DS21985B-page 5
MCP131X/2X
Threshold Hysteresis MCP13XX-20 VHYS 0.020 —0.120 V TA = +25°C (Note 3)
(Note 3)(Note 6) (Note 6) V TA = -40°C to +85°C
MCP13XX-21 0.021 —0.126 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +85°C
MCP13XX-22 0.022 —0.132 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +85°C
MCP13XX-23 0.023 —0.138 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +85°C
MCP13XX-24 0.024 —0.144 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +85°C
MCP13XX-25 0.025 —0.150 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-26 0.026 —0.156 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-27 0.027 —0.162 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-28 0.028 —0.168 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-29 0.029 — 0.174 V TA = +25°C (Note 3)
(Note 6) VT
A = -40°C to +125°C
MCP13XX-30 0.030 —0.180 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-31 0.031 —0.186 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-32 0.032 —0.192 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-33 0.033 —0.198 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysterysis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-Cir-
cuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications fo r voltage
requirements). The total time that the RST pin can be above the maximum device operational voltage
(5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device oper-
ational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information,
refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered vo lt ag e trip poin t; minimum ord er volume requ irement . Info rmation availa ble upo n reque st.
MCP131X/2X
DS21985B-page 6 © 2007 Microchip Technology Inc.
Threshold Hysteresis MCP13XX-34 VHYS 0.034 —0.204 V TA = +25°C (Note 3)
(Continued) (Note 3)(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-35 0.035 —0.210 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-36 0.036 —0.216 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-37 0.037 —0.222 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-38 0.038 —0.228 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-39 0.039 —0.234 V TA = +25°C (Note 1)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-40 0.040 —0.240 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-41 0.041 —0.246 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-42 0.042 —0.252 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-43 0.043 —0.258 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-44 0.044 —0.264 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-45 0.045 —0.270 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
MCP13XX-46 0.046 — 0.276 V TA = +25°C (Note 3)
(Note 6) VT
A = -40°C to +125°C
MCP13XX-47 0.047 —0.282 V TA = +25°C (Note 3)
(Note 6) (Note 6) V TA = -40°C to +125°C
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 10 0 kΩ
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125 °C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysterysis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-Cir-
cuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage
requirements). The total time that the RST pin can be above the maximum device operational voltage
(5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device oper-
ational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information,
refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered vo lt ag e trip poin t; minimum ord er volume requ irement . Info rmation availa ble upo n reque st.
© 2007 Microchip Technology Inc. DS21985B-page 7
MCP131X/2X
RST/RST Low-Level Output Voltage VOL ——0.3VI
OL = 50 µA, 1.0V ≤ VDD ≤ 1.5V
——0.3VI
OL = 100 µA,
1.5V < VDD ≤ 2.5V
——0.3VI
OL = 2 mA, 2.5V < VDD ≤ 4.5V
——0.3VI
OL = 4 mA, VDD > 4.5V
RST/RST High-Level Output Voltage VOH VDD –
0.7 —— VI
OH = 2.5 mA, VDD ≥ 2.5V
(Push-Pull Outputs only) VDD –
0.7 —— VI
OH = 500 µA, VDD ≥ 1.5V
Input Low Voltage (MR and WDI pins) VIL V
SS —0.3V
DD V
Input High V oltage (MR and WDI pins) VIH 0.7VDD —V
DD V
Open-Drain High Voltage on Output
(Note 4) VODH — — 13.5
(4) V Open-Drain Output pin only,
VDD = 3.0V, Time voltage >
5.5V applied ≤ 100 s,
current into pin limited to 2 mA,
+25°C operation recom-
mended
(Note 4, Note 5)
Input Leakage Current (MR and WDI) IIL ——±1µAV
SS ≤ VPIN ≤ VDD
Open-Drain Output Leakage Current
(MCP1316M, MCP1318M,
MCP1319M, MCP1320, MCP1321,
and MCP1322 only)
IOD —0.0031.0 µA
Pull-up Resistance MR pin RPU —52—kΩ V
DD = 5.5V
WDI pin — 52 — kΩ V
DD = 5.5V
RST pin — 4.7 — kΩ V
DD = 5.5V,
MCP131XM devices only
Input Pin Capacitance (MR and WDI) CI — 100 — pF
Output Pin Capacitive Loading
(RST and RST)CO — — 50 pF This is the tester loading to
meet the AC timing specifica-
tions.
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysterysis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-Cir-
cuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications fo r voltage
requirements). The total time that the RST pin can be above the maximum device operational voltage
(5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device oper-
ational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information,
refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered vo lt ag e trip poin t; minimum ord er volume requ irement . Info rmation availa ble upo n reque st.
MCP131X/2X
DS21985B-page 8 © 2007 Microchip Technology Inc.
FIGURE 1-1: Device Voltage and Reset Pin Waveform s.
TABLE 1-1: DEVICE VOLTAGE AND RESET PIN TIMINGS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 10 0 kΩ
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125 °C.
Parameters Sym Min Typ Max Units Conditions
Falling VDD Trip Point Detected
to RST or RST Active tRPD —650 — µsV
DD ramped from
VTRIPMAX + 250 mV down to
VTRIPMIN – 200 mV,
VDD falling @ 5 mV/µs,
CL = 50 pF (Note 1)
VDD Rise Rate tRR Note 3
Reset active time
(MR Rising Edge, POR/BOR
Inactive, or WDT time out) to RST/
RST Inactive
tRST 1.0 1.4 2.0 ms Note 2
20 30 40 ms Note 2
140 200 280 ms Standard Time Out
1120 1600 2240 ms Note 2
RST Rise Time after RST Active
(Push-Pull Outputs only) tRT — 5 — µs For RST 10% to 90% of VDD,
CL = 50 pF (Note 1)
RST Rise Time after RST Inactive
(Push-Pull Outputs only) —5 —µsFor RST 10% to 90% of VDD,
CL = 50 pF (Note 1)
RST Fall Time after RST Inactive tFT — 5 — µs For RST 90% to 10% of VDD,
CL = 50 pF (Note 1)
RST Fall Time after RST Active — 5 — µs For RST 90% to 10% of VDD,
CL = 50 pF (Note 1)
Note 1: These parameters are for design guidance only and are not 100% tested.
2: Custom ordered Reset active time; minimum order volume requirement.
3: Designed to be independent of VDD rise rate. Device characterization was done with a rise rate as slow as
0.1 V/s (@ +25°C).
VTRIPMAX
VTRIPMIN
VTRIP
1V
VDD
VTRIPAC + VHYS
tRST
RST
RST
tRR
tRST
tRPD
VDD < 1V is outside the device operating specification. The RST (or RST) output state is
unknown while VDD < 1V.
© 2007 Microchip Technology Inc. DS21985B-page 9
MCP131X/2X
FIGURE 1-2: MR and Reset Pin Waveforms.
TABLE 1-2: MR AND RESET PIN TIMINGS
FIGURE 1-3: WDI and Reset Pin Waveforms.
TABLE 1-3: WDI AND RESET PIN TIMINGS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
MR Pulse Width tMR 1— —µs
MR Active to RST/RST Active tMRD —235 — nsV
DD = 5.0V
MR Input Noise filter tNF —150 — nsV
DD = 5.0V
Note 1: These parameters are for design guidance only and are not 100% tested.
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
WDI Pulse Width tWP 50 — — ns
Watchdog Time Out Period tWD 4.3 6.3 9.3 ms Note 1
71 102 153 ms Note 1
1.12 1.6 2.4 sec Standard Time Out
17.9 25.6 38.4 sec Note 1
Note 1: Custom ordered WatchDog Timer time out; minimum order volume requirement.
MR
RST
tRST
tMR
RST
tMRD
tNF
RST
RST
WDI (Note 1) tWP
tWD tWD
tRST
Note 1: The WDI pin was a weak pull-up resistor which is disabled after the 1st falling edge on the WDI pin.
MCP131X/2X
DS21985B-page 10 © 2007 Microchip Technology Inc.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP1316), TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range TA-40 — +85 °C MCP13XX-25 (or below)
Specified Temperature Range TA-40 — +125 °C Except MCP13XX-25 (or below)
Maximum Junction Temperature TJ——+150°C
Storage Temperature Range TA-65 — +150 °C
Package Thermal Resistances
Thermal Resistance, 5L-SOT23 θJA — 255.9 — °C/W
© 2007 Microchip Technology Inc. DS21985B-page 11
MCP131X/2X
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-1: IDD vs. Temperature (Reset
Power-up Timer Inactive and Watchdog Timer
Inactive) (MCP1318M-4.6).
FIGURE 2-2: IDD vs. Temperature (Reset
Power-up Timer Inactive and Watchdog Timer
Inactive) (MCP1319-2.9).
FIGURE 2-3: IDD vs. Temperature (Reset
Power-up Timer Inactive and Watchdog Timer
Inactive) (MCP1316-2.0).
FIGURE 2-4: IDD vs. Temperature (Reset
Power-up Timer Active) (MCP1318M-4.6).
FIGURE 2-5: IDD vs. Temperature (Reset
Power-up Timer Active) (MCP1319-2.9).
FIGURE 2-6: IDD vs. Temperature (Reset
Power-up Timer Active) (MCP1316-2.0).
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provide d for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified pow er supply range) and therefore outside the warranted range.
0
0.2
0.4
0.6
0.8
1
1.2
-100 -50 0 50 100 150
Temperature (°C)
IDD (µA)
1.0V 1.5V 2.0V
3.0V 4.3V 4.5V
4.8V 5.0V 5.5V
0
0.2
0.4
0.6
0.8
1
1.2
1.4
-100 -50 0 50 100 150
Temperature (°C)
IDD (µA)
1.0V 1.5V 2.5V
2.7V 3.2V 4.0V
4.5V 5.0V 5.5V
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
-100 -50 0 50 100 150
Temperature (°C)
IDD (µA)
1.0V 1.5V 1.8V
2.2V 2.5V 4.0V
4.5V 5.0V 5.5V
0
1
2
3
4
5
6
-100 -50 0 50 100 150
Temperature (°C)
Idd (µA)
4.8V 5.0V 5.5V
0
1
2
3
4
5
6
-100 -50 0 50 100 150
Temperature (°C)
IDD (µA)
3.2V 4.0V 4.5V 5.0V 5.5V
0
1
2
3
4
5
6
7
-100 -50 0 50 100 150
Temperature (°C)
IDD (µA)
2.2V 2.5V 4.0V 4.5V 5.0V 5.5V
MCP131X/2X
DS21985B-page 12 © 2007 Microchip Technology Inc.
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, R PU = 100 kΩ (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-7: IDD vs. Temperature
(Watchdog Timer Active) (MCP1318M-4.6).
FIGURE 2-8: IDD vs. Temperature
(Watchdog Timer Active) (MCP1319-2.9).
FIGURE 2-9: IDD vs. Temperature
(Watchdog Timer Active) (MCP1316-2.0).
0
1
2
3
4
5
6
7
-100 -50 0 50 100 150
Temperature (°C)
IDD (µA)
4.8V 5.0V 5.5V
MCP1319 does not
have a Watchdog Timer
0
1
2
3
4
5
6
7
-100 -50 0 50 100 150
Temperature (°C)
IDD (µA)
2.2V 2.5V 4.0V 4.5V 5.0V 5.5V
© 2007 Microchip Technology Inc. DS21985B-page 13
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-10: IDD vs. VDD (Reset Power-
up Timer Inactive and Watchdog Timer Inactive)
(MCP1318M-4.6).
FIGURE 2-11: IDD vs. VDD (Reset Power-
up Timer Inactive and Watchdog Timer Inactive)
(MCP1319-2.9).
FIGURE 2-12: IDD vs. VDD (Reset Power-
up Timer Inactive and Watchdog Timer Inactive)
(MCP1316-2.0).
FIGURE 2-13: IDD vs. VDD (Reset Power-
up Timer Active or Watchdog Timer Active)
(MCP1318M-4.6).
FIGURE 2-14: IDD vs. VDD (Reset Power-
up Timer Active or Watchdog Timer Active)
(MCP1319-2.9).
FIGURE 2-15: IDD vs. VDD (Reset Power-
up Timer Active or Watchdog Timer Active)
(MCP1316-2.0).
0
0.2
0.4
0.6
0.8
1
1.2
0.0 1.0 2.0 3.0 4.0 5.0 6.0
VDD (V)
IDD (µA)
-45°C
25°C
90°C
130°C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0.0 1.0 2.0 3.0 4.0 5.0 6.0
VDD (V)
IDD (µA)
-45°C
25°C
90°C
130°C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
0.0 1.0 2.0 3.0 4.0 5.0 6.0
VDD (V)
IDD (µA)
-45°C
25°C
90°C
130°C
0
1
2
3
4
5
6
4.6 4.8 5.0 5.2 5.4 5.6
VDD (V)
IDD (µA)
-45°C 25°C 90°C 130°C
0
1
2
3
4
5
6
0.0 1.0 2.0 3.0 4.0 5.0 6.0
VDD (V)
IDD (µA)
-45°C 25°C 90°C 130°C
0
1
2
3
4
5
6
7
2.0 3.0 4.0 5.0 6.0
VDD (V)
IDD (µA)
-45°C 25°C 90°C 130°C
MCP131X/2X
DS21985B-page 14 © 2007 Microchip Technology Inc.
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, R PU = 100 kΩ (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-16: VTRIP and VHYST vs.
Temperature (MCP1318M-4.6).
FIGURE 2-17: VTRIP and VHYST vs.
Temperature (MCP1319-2.9).
FIGURE 2-18: VTRIP and VHYST vs.
Temperature (MCP1316-2.0).
FIGURE 2-19: VOL vs. IOL
(MCP1318M-4.6).
FIGURE 2-20: VOL vs. IOL
(MCP1319-2.9).
FIGURE 2-21: VOL vs. IOL
(MCP1316-2.0).
4.550
4.600
4.650
4.700
4.750
4.800
-50 0 50 100 150
Temperatur e (°C)
VTRIP (V)
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
VTRIP Hyst (%)
VHYST
VTRIP Down
VTRIP Up
2.880
2.900
2.920
2.940
2.960
2.980
3.000
3.020
-50 0 50 100 150
Temperature (°C)
VTRIP (V)
3.0
3.1
3.1
3.2
3.2
3.3
3.3
3.4
3.4
3.5
VTRIP Hyst (%)
VHYST
VTRIP Down
VTRIP Up
1.990
2.000
2.010
2.020
2.030
2.040
2.050
-50 0 50 100 150
Temperature (°C)
VTRIP (V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VTRIP Hyst (%)
VHYST
VTRIP Down
VTRIP Up
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.00 2.00 4.00 6.00 8.00 10.00
IOL (mA)
VOL (V)
1V 2V 3V 4.3V 4.5V 4.8V 5V 5.5V
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.00 2.00 4.00 6.00 8.00 10.00
IOL (mA)
VOL (V)
1V 2.5V 2.7V 3.2V 4V 4.5V 5V 5.5V
0
0.002
0.004
0.006
0.008
0.01
0.012
0.014
0.016
0.018
0.02
0.00 0.05 0.10 0.15 0.20 0.25
IOL (mA)
VOL (V)
1V
1.8V
© 2007 Microchip Technology Inc. DS21985B-page 15
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-22: VOL vs. Temperature
(MCP1318M-4.6 @ VDD = 4.5V).
FIGURE 2-23: VOL vs. Temperature
(MCP1319-2.9 @ VDD = 2.7V).
FIGURE 2-24: VOL vs. Temperature
(MCP1316-2-0 @ VDD = 1.8V).
FIGURE 2-25: VOH vs. IOH
(MCP1318M-4.6 @ 25C).
FIGURE 2-26: VOH vs. IOH
(MCP1319-2.9 @ 25C).
FIGURE 2-27: VOH vs. IOH
(MCP1316-2.0 @ 25C).
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
-50 0 50 100 150
Tempera t ure (°C)
VOL (V)
0 mA
0.05 mA
0.1 mA
0.15 mA
0.2 mA
0
0.05
0.1
0.15
0.2
0.25
-50 0 50 100 150
Temperature (°C)
VOL (V)
0 mA
0.05 mA
0.1 mA
0.15 mA
0.2 mA
0
0.002
0.004
0.006
0.008
0.01
0.012
0.014
0.016
-50 0 50 100 150
Temperature (°C)
VOL (V)
0 mA
0.05 mA
0.1 mA
0.15 mA
0.2 mA
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0.00 1.00 2.00 3.00 4.00 5.00 6.00
IOH (mA)
VOH (V)
1.5V
3V
4.5V
4.3V
2V
0
1
2
3
4
5
6
0.00 1.00 2.00 3.00 4.00 5.00 6.00
IOH (mA)
VOH (V)
1.5V
3.2V
2.7V
2.5V
5.5V
5V
4.5V
4V
0
1
2
3
4
5
6
0.00 1.00 2.00 3.00 4.00 5.00 6.00
IOH (mA)
VOH (V)
5.5V
5V
4.5V
4V
2.5V
2.2V
MCP131X/2X
DS21985B-page 16 © 2007 Microchip Technology Inc.
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, R PU = 100 kΩ (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-28: tRPD vs. Temperature
(MCP1318M-4.6).
FIGURE 2-29: tRPD vs. Temperature
(MCP1319-2.9).
FIGURE 2-30: tRPD vs. Temperature
(MCP1316-2.0).
FIGURE 2-31: tRPU vs. Temperature
(MCP1318M-4.6).
FIGURE 2-32: tRPU vs. Temperature
(MCP1319-2.9).
FIGURE 2-33: tRPU vs. Temperature
(MCP1316-2.0).
0
50
100
150
200
250
300
350
-100 -50 0 50 100 150
Temperature (°C)
tRPD (µs)
5V
5.5V
0
50
100
150
200
250
300
350
400
450
-100 -50 0 50 100 150
Temperatur e ( °C)
tRPD (µs)
3.2V 4V 4.5V 5V 5.5V
0
50
100
150
200
250
300
350
-100 -50 0 50 100 150
Temperatur e ( °C)
tRPD (µs)
2.5V 4V 4.5V 5V 5.5V
190
195
200
205
210
215
220
225
230
-100 -50 0 50 100 150
Temperature (°C)
tRPU (ms)
4.8 V 5 V 5.5 V
200
205
210
215
220
225
230
235
240
245
250
-100 -50 0 50 100 150
Temperatur e ( °C)
tRPU (ms)
3.2 V 4 V 4.5 V 5 V 5.5 V
200
205
210
215
220
225
230
235
240
245
250
-100 -50 0 50 100 150
Temperature (°C)
tRPU (ms)
2.5 V 4 V 4.5 V 5 V 5.5 V 2.2 V
© 2007 Microchip Technology Inc. DS21985B-page 17
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-34: Transient Duration vs.
VTRIP (min) – VDD.
FIGURE 2-35: Open-Drain Leakage
Current vs. Temperature (MCP1320-2.0).
FIGURE 2-36: MR Low to Reset
Propagation Delay (MCP1318M-4.6).
FIGURE 2-37: MR Low to Reset
Propagation Delay (MCP1319-2.9).
FIGURE 2-38: MR Low to Reset
Propagation Delay (MCP1316-2.0).
0
500
1000
1500
2000
2500
3000
3500
0.001 0.01 0.1 1 10
Reset Th r eshold Over drive (V) VTRIPMin - V
DD
Transient Duration (µs)
VRST=2.0V VRST=2.9V VRST=4.6V
2.0V
2.9V
0
0.002
0.004
0.006
0.008
0.01
0.012
-100 -50 0 50 100 150
Temperature (°C)
Open-Drain Leakage (µA)
2.2 V 2.5 V 4 V 4.5 V 5 V 5.5 V
MCP1318M does not
have a MR pin
0
50
100
150
200
250
300
350
-100 -50 0 50 100 150
Temperature (°C)
tMRD (ns)
3.2 V 4 V 4.5 V 5 V 5.5 V
0
50
100
150
200
250
300
350
400
450
-100 -50 0 50 100 150
Temperature (°C)
tMRD (ns)
2.2 V 2.5 V 4 V 4.5 V 5 V 5.5 V
MCP131X/2X
DS21985B-page 18 © 2007 Microchip Technology Inc.
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, R PU = 100 kΩ (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-39: VDD Falling to Reset
Propagation Delay vs. Temperature
(MCP1318M-4.6).
FIGURE 2-40: VDD Falling to Reset
Propagation Delay vs. Temperature (MCP1319-
2.9).
FIGURE 2-41: VDD Falling to Reset
Propagation Delay vs. Temperature (MCP1316-
2.0).
FIGURE 2-42: Normalized Reset Time Out
Period vs. Temperature (MCP1318M-4.6).
FIGURE 2-43: Normalized Reset Time Out
Period vs. Temperature (MCP1319-2.9).
FIGURE 2-44: Normalized Reset Time Out
Period vs. Temperature (MCP1316-2.0).
0
100
200
300
400
500
600
700
800
900
1000
-100 -50 0 50 100 150
Temperatur e ( °C)
tRPD (µs)
5V to 0V
5V to 4.5V
0
50
100
150
200
250
-100 -50 0 50 100 150
Temperature (°C)
tRPD (µs)
5V to 2.7V
5V to 0V
VTRIP
Typ + 0.3V to
VTRIP Min - 0.2V
0
50
100
150
200
250
-100 -50 0 50 100 150
Temperatur e ( °C)
tRPD (µs)
5V to 0V
5V to 1.8V
VTRIP
Typ + 0.2V to
VTRIP Min - 0.2V
0.12
0.125
0.13
0.135
0.14
0.145
-100 -50 0 50 100 150
Temperature (°C)
Normalized Reset Timeout
Period
MCP1318M-4.6
0.125
0.13
0.135
0.14
0.145
0.15
-100 -50 0 50 100 150
Temperature (°C)
Normalized Reset T ime ou t
Period
MCP1319-2.9
0.125
0.13
0.135
0.14
0.145
0.15
-100 -50 0 50 100 150
Temperature (°C)
Normalized Reset T ime ou t
Period
MCP1316-2.0
© 2007 Microchip Technology Inc. DS21985B-page 19
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
FIGURE 2-45: Normalized Watchdog Time
Out Period vs. Temperature (MCP1318M-4.6).
FIGURE 2-46: Normalized Watchdog Time
Out Period vs. Temperature (MCP1319-2.9).
FIGURE 2-47: Normalized Watchdog Time
Out Period vs. Temperature (MCP1316-2.0).
FIGURE 2-48: Max VDD Transient Duration
vs. Reset Threshol d Ove r dr ive.
FIGURE 2-49: “M” Part # Pull-up
Characteristics (MCP1318M-4.6).
0.9
0.95
1
1.05
1.1
1.15
1.2
1.25
-100 -50 0 50 100 150
Temperature (°C)
Normalized Watchdog
Timeout Period
`
MCP1318M-4.6
MCP1319 does not
have a Watchdog Timer
0.9
0.95
1
1.05
1.1
1.15
1.2
1.25
-100 -50 0 50 100 150
Temperature ( °C )
Normalized Watchdog
Timeout Period
`
MCP1316-2.0
0
100
200
300
400
500
600
0.001 0.01 0.1 1 10
Reset Threshold Overdrive (V) VTRIPMin - V
DD
Transient Duration (µS)
VRST=2.0V VRST=2.9V VRST=4.6V
MCP131X/2X
DS21985B-page 20 © 2007 Microchip Technology Inc.
3.0 PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
Pin No. Device Symbol Pin
Type
Buffer/
Driver
Type Function
SOT23-5
1 MCP1316M (1),
MCP1318M (1),
MCP1319M (1),
MCP1320,
MCP1321,
MCP1322
RST O Open-Drain Reset Output (active-low)
Goes active (Low) if one of these conditions occurs:
1. If VDD falls below the selected Reset voltage
threshold.
2. If the MR pin is forced low.
3. If the WDI pin does not detect an edge transition
within the minimum selected time out period.
4. During power-up.
VDD Falling:
Open-Drain = VDD > VTRIP
L = VDD < VTRIP
VDD Rising:
Open-Drain = VDD > VTRIP + VHYS
L = VDD < VTRIP + VHYS
MCP1316,
MCP1318,
MCP1319
OPush-PullVDD Falling:
H = VDD > VTRIP
L = VDD < VTRIP
VDD Rising:
H = VDD > VTRIP + VHYS
L = VDD < VTRIP + VHYS
MCP1317 RST O Push-Pull Reset Output (active-high)
Goes active (High) if one of these conditions occurs:
1. If VDD falls below the selected Reset voltage
threshold.
2. If the MR pin is forced low.
3. If the WDI pin does not detect an edge transition
within the minimum selected time out period.
4. During power-up.
VDD Falling:
H = VDD < VTRIP
L = VDD > VTRIP
VDD Rising:
H = VDD < VTRIP + VHYS
L = VDD > VTRIP + VHYS
2AllV
SS — P The grou nd reference for the device.
Note 1: Open-Drain output with internal pull-up resistor.
© 2007 Microchip Technology Inc. DS21985B-page 21
MCP131X/2X
3 MCP1316,
MCP1316M,
MCP1317,
MCP1320
MR I ST Manual Reset input for a Reset switch.
This input allows a push button switch to be directly con-
nected to the MCP131X/2X MR pin, whi ch can the n be
used to force a system Reset. This input filters (ignores)
noise pulses that occur on the MR pin.
L = Switch is depressed (shorted to ground). This forces
the RST/RST pins Active.
H = Switch is open (internal pull-up resisto r pulls signal
high). State of the RST/RST pins determined by
other system conditions.
MCP1318,
MCP1318M,
MCP1319,
MCP1319M,
MCP1321,
MCP1322
RST O Push-Pull Reset Output (active-high)
Goes active (High) if one of these conditions occurs:
1. If VDD falls below the selected Reset voltage
threshold.
2. If the MR pin is forced low.
3. If the WDI pin does not detect an edge transition
within the minimum selected time out period.
4. During power-up.
VDD Falling:
H = VDD < VTRIP
L = VDD > VTRIP
VDD Rising:
H = VDD < VTRIP + VHYS
L = VDD > VTRIP + VHYS
4 MCP1316,
MCP1316M,
MCP1317,
MCP1318,
MCP1318M,
MCP1320,
MCP1321
WDI I ST Watchdog Timer Input
The WDT period is specified at th e time of device order.
The Standard WDT period is 1.6s typical.
An edge transition on the WDI pin resets the Watchdog
T imer counter (no time out). A Falling Edge is required to
start the WDT Timer.
MCP1319,
MCP1319M,
MCP1322
MR I ST Manual Reset input for a Reset switch.
This input allows a push button switch to be directly con-
nected to the MCP131X/2X MR pin, whi ch can the n be
used to force a system Reset. This input filters (ignores)
noise pulses that occur on the MR pin.
L = Switch is depressed (shorted to ground). This forces
the RST/RST pins Active.
H = Switch is open (internal pull-up resisto r pulls signal
high). State of the RST/RST pins determined by
other system conditions.
5AllV
DD — P The positive supply for the device.
TABLE 3-1: PIN FUNCTION TABLE (CONTINUED)
Pin No. Device Symbol Pin
Type
Buffer/
Driver
Type Function
SOT23-5
Note 1: Open-Drain output with internal pull-up resistor.
MCP131X/2X
DS21985B-page 22 © 2007 Microchip Technology Inc.
3.1 Ground Terminal (VSS)
VSS provides the negative reference for the analog
input voltage. Typically, the circuit ground is used.
3.2 Supply Voltage (VDD)
VDD can be used for power supply monitoring or a
voltage level that requires monitoring.
3.3 Reset Output (RST and RST)
There are four types of Reset output pins. These are:
1. Open-Drain active-low Reset, External pull-up
resistor required
2. Open-Drain active-low Reset, Internal pull-up
resistor
3. Push-Pull active-low Reset
4. Push-Pull active-high Reset
Some devices have both an active-low and active-high
Reset output.
3.3.1 ACTIVE-LOW (RST) - OPEN-DRAIN,
EXTERNAL PULL-UP RESISTOR
The RST open-drain output remains low while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD) returns to a high level (VTRIP +
VHYS), the device will remain in Reset for the Reset
delay timer (TRST). After that time expires, the RST pin
will float, and an exte rnal pu ll-up resistor is required to
bring the output to the high state.
3.3.2 ACTIVE-LOW (RST) - OPEN-DRAIN,
INTERNAL PULL-UP RESISTOR
The RST open-drain output remains low while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD) returns to a high level (VTRIP +
VHYS), the device will remain in Reset for the Reset
delay timer (TRST). After that time expires, the RST pin
will be pulled hi gh by an internal pull-up resistor (typi-
cally 4.7 kΩ).
3.3.3 ACTIVE-LOW (RST) - PUSH-PULL
The RST push-pull output remains low while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD) returns to a high level (VTRIP +
VHYS), the device will remain in Reset for the Reset
delay timer (TRST). After that time expires, the RST pin
will be driven to the high state.
3.3.4 ACTIVE-HIGH (RST) - PUSH-PULL
The RST push-pull output remains high while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD) returns to a high level (VTRIP +
VHYS), the device will remain in Reset for the Reset
delay timer (TRST). After that time expires, the RST pin
will be driven to the low state.
3.4 Manual Reset Input (MR)
The Manual Reset (MR) input pin allows a push button
switch to easily be connected to the system. When the
push button is depressed, it forces a system Reset.
This pin has circuitry that filters noise that may be
present on the MR signal.
The MR pin is active-low and has an internal pull-up
resistor.
3.5 Watchdog Input
In some systems, it is desirable to have an external
Watchdog Timer to monitor the operation of the sys-
tem. This is done by requiring the embedded controller
to “pet” the Watchdog Timer within a predetermined
time frame (TWD). If the MCP131X/2X is not “petted”
within this time frame, the MCP131X/2X will force the
Reset pin(s) active.
The embedded controller “pets” the MCP131X/2X by
forcing an edge transition on the WDI pin. The WDT
Timer is activated by the first falling edge on the WDI
pin.
The standard offering devices have a typical W atchdog
T imer period (TWD) of 1.6 s. Table 1-3 shows the avail -
able Watchdog Timer periods.
© 2007 Microchip Technology Inc. DS21985B-page 23
MCP131X/2X
4.0 OPERATIONAL DESCRIPTION
For many of today’s microcontroller applications, care
must be taken to prevent low-power conditions that can
cause many different system problems. The most
common causes are brown-out conditions, where the
system supply drops below the operating level momen-
tarily. The second most common cause is when a
slowly decaying power supply causes the
microcontroller to begin executing instructions without
sufficient voltage to sustain volatile memory (RAM),
thus producing indeterminate results. Figure 4-1 shows
a typical application circuit.
The MCP131X/2X family is voltage supervisor devices
designed to keep a microcontroller in Reset until the
system voltage has reached and stabilized at the
proper level for reliable system operation. These
devices also operate as protection from brown-out
conditions when the system supply voltage drops
below a safe operating level.
Some MCP131X/2X family members include a Watch-
dog Timer feature that after being enabled (by a falling
edge on the WDI pin), mon itors the WDI pin for falling
edges. If an edge transition is not detected within the
expected timeframe, the MCP131X/2X devices will
force the Reset pin active. This is useful to ensure that
the embedded system’s Host Controller program is
operating as expected.
Some MCP131X/2X family members include a Manual
Reset feature that allows a push button switch to be
directly connected to the MCP131X/2X devices (on the
MR pin). This allows the system to easily be reset from
the external control of the push button switch.
A superset block diagram is shown in Figure 4-2, with
device specific block diagrams shown in Figure 4-3
through Figure 4-12.
FIGURE 4-1: Typical Application Circuit.
FIGURE 4-2: Family Block Diag ra m
VDD
VDD
MCLR
(Reset input)
(active-low)
VSS
PIC®
Microcontroller
RPU(1)
Note 1: Resistor RPU may be required with the
MCP1320, MCP1321, or MCP1322 due
to the open-drain outp ut.
Resistor RPU may not be required with
the MCP1316M, MCP1318M, or
MCP1319M due to the internal pull-up
resistor.
The MCP1316, MCP1317, MCP1318,
and MCP1319 do not require the
external pull-up resisto r.
2: Not all devices offer the active-high
Reset output pin.
0.1
µF MCP13XX
VDD
RST
VSS
RST (2)
WDI I/O
To system
device that
requires active-
high resets
Push button
switch
MR
VDD
Comparator
+
–Output
Driver
RST
Reference
VSS
RST
Noise Filter
Watchdog
MR
WDI
Note: Features available depend on the device.
Voltage
MCP131X/2X
DS21985B-page 24 © 2007 Microchip Technology Inc.
4.0.1 DEVICE SPECIFIC BLOCK
DIAGRAMS
FIGURE 4-3: MCP1316 Block Di ag ra m .
FIGURE 4-4: MCP1316M Bloc k Diagra m.
FIGURE 4-5: MCP1317 Block Di ag ra m .
FIGURE 4-6: MCP1318 Block Diagram.
FIGURE 4-7: MCP1318 M Bloc k Diag ra m .
VDD
Comparator
+
–Output
Driver RST
Reference
VSS
Noise Filter
Watchdog
MR
WDI
Voltage
VDD
Comparator
+
–Output
Driver RST
Reference
VSS
Noise Filter
Watchdog
MR
WDI
Voltage
VDD
Comparator
+
–Output
Driver
Reference
VSS
RST
Noise Filter
Watchdog
MR
WDI
Voltage
VDD
Comparator
+
–Output
Driver
RST
Reference
VSS
RST
Watchdog
WDI
Voltage
VDD
Comparator
+
–Output
Driver
RST
Reference
VSS
RST
Watchdog
WDI
Voltage
© 2007 Microchip Technology Inc. DS21985B-page 25
MCP131X/2X
FIGURE 4-8: MCP1319 Block Diag ra m .
FIGURE 4-9: MCP1319M Bloc k Diagra m.
.
FIGURE 4-10: MC P1 320 Blo ck D iag ra m .
FIGURE 4-11: MCP1321 Block Diagram.
FIGURE 4-12: MCP1322 Block Diagram.
VDD
Comparator
+
–Output
Driver
RST
Reference
VSS
RST
Noise Filter
MR
Voltage
VDD
Comparator
+
–Output
Driver
RST
Reference
VSS
RST
Noise Filter
MR
Voltage
VDD
Comparator
+
–Output
Driver RST
Reference
VSS
Noise Filter
Watchdog
MR
WDI
Voltage
VDD
Comparator
+
–Output
Driver RST
Reference
VSS
RST
Watchdog
WDI
Voltage
VDD
Comparator
+
–Output
Driver RST
Reference
VSS
RST
Noise Filter
MR
Voltage
MCP131X/2X
DS21985B-page 26 © 2007 Microchip Technology Inc.
4.1 Reset Voltage Trip Point (VTRIP)
Operation
The device’s Reset voltage trip point (VTRIP) is selected
when the device is ordered. As the voltage on the
device’s VDD pin is above or below this selected trip
point, the output of the Reset pin (RST/RST) will be
forced to either the inactive or active state.
For the voltage trip point, there is a minimum trip voltage
(VTRIPMIN) and a maximum trip voltage (VTRIPMAX). The
voltage that the devi ce “actually” trip s at will be referre d
to as VTRIP. The trip voltage is specifie d for the falling of
the device VDD.
There is also a hysteresis (VHYS) on the trip point. This
is so that noise on the device voltage (VDD) does not
cause the Reset pin (RST/RST) to “jitter” (change
between driving an active and inactive state).
The Reset pin (RST or RST) will be forced active if any
of the following occurs:
• The Manual Reset input (MR) goes low
• The Watchdog Timer times out
•V
DD goes below the threshold
• During device power-up
After the device exits the Reset condition, the delay
circuitry will hold the RST and RST pins active until the
appropriate Reset delay time (tRST) has elapsed.
TABLE 4-1: RESET PIN STATES
Device
State of RST Pin wh en: State of RST (3) Pin when:
Ouput Driver
VDD <
VTRIP VDD > VTRIP +
VHYS VDD <
VTRIP VDD > VTRIP +
VHYS
MCP1316 LH——Push-pull
MCP1316M LH
(2) — — Open-drain
(2)
MCP1317 ——H LPush-pull
MCP1318 LHHLPush-pull
MCP1318M LH
(2) H L Open-drain
(2)
MCP1319 LHHLPush-pull
MCP1319M LH
(2) H L Open-drain
(2)
MCP1320 LH
(1) — — Open-drain
(1)
MCP1321 LH
(1) H L Open-drain
(1)
MCP1322 LH
(1) H L Open-drain
(1)
Note 1: Requires External Pull-u p resistor.
2: Has Internal Pull-up resistor.
3: The RST pin output is always push-pull.
© 2007 Microchip Technology Inc. DS21985B-page 27
MCP131X/2X
4.1.1 POWER-UP/RISING VDD
As the device VDD rises, the device’s Reset circuit will
remain active until the voltage rises above the “actual”
trip point (VTRIP) plus the hysteresis (VHYS).
Figure 4-13 shows a power-up sequence and the
waveform of the RST and RST pins.
As the device powers up, the voltage will start below
the valid operating voltage of the device. At this volt-
age, the Reset output value is not valid. Once the volt-
age is above the min imum operating voltage (1V) and
below the selected VTRIP, the Reset output will be
active.
Once the device voltage rises above the “actual” trip
point (VTRIP) plus the hysteresis (VHYS), the Reset delay
timer (tRST) starts. When the Reset delay timer times
out, the Reset output (RST/R ST) is driven in active.
FIGURE 4-13: Reset pin Operation on a
Power-up.
4.1.2 POWER-DOWN/BROWN-OUTS
As the device powers-down/brown-outs, the voltage
(VDD) falls from a voltage above the devices trip point
(VTRIP). The devices “actua l” trip point voltage (VTRIP)
will be between the minimum trip point (VTRIPMIN) and
the maximum trip point (VTRIPMAX). Once the device
voltage (VDD) goes below this voltage, the Reset pin(s)
will be forced to the active state. There is a hysteresis
on this trip point. This is so that noise on the device volt-
age (VDD) does not ca use the Reset pin (RST/RST) to
“jitter” (change between driving an active and inactive).
Figure 4-14 shows the waveform of the RST pin as
determined by the VDD voltage, while Table 4-1 shows
the state of the RST pin.
4.1.2.1 Operation of RST pin with Internal
Pull-Up Resistor
The internal pull-up resistor has a typical value of
4.7 kΩ. The intern al pull-up eliminates the need for an
external resistor.
To reduce the current consumption of the device, when
the RST pin is driving low, the resistor is disconnected.
FIGURE 4-14: RST Operation as determined by the VTRIP and VHYS.
Note: While the Reset delay timer (tRST) is
active, additional system current is con-
sumed.
VTRIPMAX
VTRIPMIN
VTRIP
1V
VDD
VTRIP + VHYS
tRST
RST
RST
Note: Only the MCP1316M, MCP1318M, and
MCP1319M devices have an open-drain
RST output pin with an internal pull-up
resistor.
VDD VTRIPMAX
VTRIPMIN VTRIP
VTRIP
VTRIP + VHYS
RST
1V
< 1V is outside the
device specifications
tRPD
tRST
tRPD tRST
MCP131X/2X
DS21985B-page 28 © 2007 Microchip Technology Inc.
4.2 Reset Delay Timer (tRST)
The Reset delay timer ensures that the MCP131X/2X
device will “hold” the embedded system in Reset until
the system voltage has stabilized. There are several
time-out options to better meet the requirements of
different applications. These Reset delay timer time
outs are shown in Table 4-2. The S tandard offering time
out is typically 200 ms.
The Reset delay timer (tRST) starts after the device volt-
age rises above the “actual” trip point (VTRIP) plus the
hysteresis (VHYS). When the Reset delay timer times
out, the Reset output pin (RST/RST) is driven inactive.
TABLE 4-2: RESET DELAY TIMER
TIME OUTS (1)
Figure 4-15 illustrates when the Reset delay timer
(tRST) is active or inactive.
FIGURE 4-15: Reset Power-up T imer
Waveform.
4.2.1 EFFECT OF TEMPERATURE ON
RESET POWER-UP TIMER (TRPU)
The Reset delay timer time out period (tRST)
determines how long the device remains in the Reset
condition. This time out is affected by both the device
VDD and temperature. Typical responses for different
VDD values and temp eratures are shown in Figures 2-
33, 2-32 and 2-31.
Note: While the Reset delay timer (tRST) is
active, additional system current is con-
sumed.
tRST Units
Min Typ Max
1.0 1.4 2.0 ms
20 30 40 ms
140 200 280 ms
1120 1.6 2.24 sec
↑↑
This is the mini-
mum time that the
Reset delay ti mer
will “hold” the
Reset pin active
after VDD rises
above
VTRIP + VHYS
This is the maxi-
mum time that the
Reset delay timer
will “hold” the
Reset pin active
after VDD rises
above
VTRIP + VHYS
Note 1: Shaded rows are custom ordered time
outs.
VTRIP
VDD
RST tRST
Reset Delay
Timer Inactive
Reset
Delay
Timer
Inactive
Reset Delay
Timer Active
See Figures 2-12,
2-10 and 2-11
See Figures 2-15,
2-14 and 2-13
See Figures 2-12,
2-10 and 2-11
© 2007 Microchip Technology Inc. DS21985B-page 29
MCP131X/2X
4.3 Negative Going VDD Transients
The minimum pulse width (time) required to cause a
Reset may be an important criteria in the implementa-
tion of a Power-on Reset (POR) circuit. This time is
referred to as transient duration. The MCP131X/2X
devices are designed to reject a level of negative-going
transients (glitches) on the power supply line.
Transient duration is the amount of time needed for
these supervisory devices to respond to a drop in VDD.
The transient duration time (tTRAN) is dependant on the
magnitude of VTRIP – VDD (overdrive). Any combination
of duration and overdrive that lies under the duration/
overdrive curve will not genera te a Reset signal. Gen-
erally speaking, the transient duration time decreases
with and increases in the VTRIP – VDD voltage. Combi-
nations of duration and overdrive that lies above the
duration/overdrive curve are detected as a brown-out
or power-down condition.
Figure 4-16 shows a typical transient duration vs.
Reset comparator overdrive, for which the MCP131X/
2X will not generate a Reset pulse. It shows that the far-
ther below the trip point the transient pulse goes, the
duration of the pulse required to cause a Reset gets
shorter. Figure 4-16 shows the transient response
characteristics for the MCP131X/2X.
Transient immunity can be improved by adding a
bypass cap acitor (typically 0.1 µF) as close as possible
to the VDD pin of the MCP131X/2X device.
FIGURE 4-16: Example of Typical
Transient Duration Waveform.
4.4 Manual Reset Input
The Manual Reset input pin (MR) allows the Reset pins
(RST/RST) to be manually forced to their active states.
The MR pin has circuitry to filter noise pulses that may
be present on the pin. Figure 4-17 shows a block dia-
gram for using the MCP131X/2X with a push button
switch. To minimize the required external components,
the MR input has an internal pull-up resistor.
A mechanical push button or active logic signal can
drive the MR input.
Once MR has been low for a time, tMRD (the Manual
Reset delay time), the Reset output pins are forced
active. The Reset output pins will remain in their active
states for the Reset delay timer time out period (tRST)
Figure 4-18 shows a waveform for the Manual Reset
switch input and the Reset pins output.
FIGURE 4-17: Push Button Reset and
Watchdog Timer.
FIGURE 4-18: MR Input – Push Button.
4.4.1 NOISE FILTER
The noise filter filters out noise spikes (glitches) on the
Manual Reset pin (MR). Noise spikes less than 100 ns
(typical) are filtered.
Time (µs)
0V
Supply Voltage
5V
VTRIP(MIN) - VDD
tTRANS
VTRIP(MAX)
VTRIP(MIN)
(Overdrive)
(Duration)
VDD
MR
VSS
RST
WDI I/O
MCLR
+5V
MCP13XX PIC® MC U
RST
VIL
tMR
RST
tMRD
VIH
tRST
MR
The MR input typically ignores input pulses
of 100 ns.
MCP131X/2X
DS21985B-page 30 © 2007 Microchip Technology Inc.
4.5 Watchdog Timer
The purpose of the Watchdog Timer (WDT) is to
increase system reliability. The Watchdog Timer fea-
ture can be used to dete ct when the Host Controller ’s
program flow is not as expected. The Watchdog Timer
monitors for activity on the Watchdog Input pin (WDI).
The WDI pin is expected to be strobed within a given
time frame. When this time frame is exceeded, without
an edge transition on the WDI pin, the Reset pin is
driven active to reset the system. This stops the Host
Controller from continuing its erratic behavior (“run-
away” code execution).
The Watchdog Timer is external to the main portion of
the control system and monitors the operation of the
system. This feature is enabled by a falling edge on the
WDI pin (after device POR). Monitoring is then done by
requiring the embedded controller to force an edge
transition (falling or rising) on the WDI pin (“pet the
Watchdog”) within a pre determined time frame (TWD).
If the MCP131X/2X does not detect an edge on the
WDI pin within the expected time frame, the MCP131X/
2X device will force the Reset pin active.
The Watchdog Timer is in the disabled state when:
• The Device Powers up
• A POR event occurred
• A WDT event occurred
• A Manual Reset (MR) event occurred
When the Watchdog Timer is in the disabled state, the
WDI pin has an internal smart pull-up resistor enabled.
This pull-up resistor has a typical value of 52 kΩ. This
pull-up resistor holds the WDI signa l in the high state,
until it is forced to another state.
After the embedded controller has initialized, if the
W atchdog Timer feature is to be used, then the embed-
ded controller can force the WDI pin low (VIL). This also
enables the Watchdog Timer feature and disab les the
WDI pull-up resistor. Disabling the pull-up resistor
reduces the device’s current consumption. The pull-up
resistor will remain disconnected until the device has a
power-on, a Reset event occurs, or after the WDT time
out.
Once the Watchdog Timer has been enabled, the Host
Contoller must force an edge transition (falling or rising)
on the WDI pin before the minimum Watchdog Timer
time out to ensure that the Watchdog Timer does not
force the Reset pins (RST/RST) to the active st ate.
If an edge transition does not occur before the maxi-
mum time out occurs, then the MCP131X/2X wil l force
the Reset pins to their active state.
The MCP131X/2X supports four time outs. The stan-
dard offering devices have a typical Watchdog Timer
period (TWDT) of 1.6 s. Table 4-3 shows the available
Watchdog Timer periods. The tWDT time out is a
function of the device voltage and temperature.
Figure 4-19 shows a block diagram for using the
MCP131X/2X with a PIC® microcontroller (MCU) and
the Watchdog input.
TABLE 4-3: WATCHDOG TIMER
PERIODS (1)
FIGURE 4-19: Watchdog Timer.
The software routine that strobes WDI is critical. The
code must be in a section of software that is executed
frequently enough so the time between edge transi-
tions is less than the Watchdog time out period. One
common technique controls the Host Controllers I/O
line from two sections of the program. The software
might set the I/O line hig h while operating in the F ore-
ground mode and set it low while in the Background or
Interrupt modes. If both modes do not execute cor-
rectly, the Watchdog Timer issues reset pulses.
tWDT Units
Min Typ Max
4.3 6.3 9.3 ms
71 102 153 ms
1.12 1.6 2.4 sec
17.9 25.6 38.4 sec
↑↑
If the time between
WDI edges is less
than this, it
ensures that the
MCP131X/2X
never forces a
reset
If the time
between WDI
edges is greater
than this, it
ensures that the
MCP131X/2X
always forces a
reset
Note 1: Shaded rows are custom ordered Watch-
dog T imer Periods (tWDT) time outs. For
information on ordering devices with
these tWDT time outs, please contact your
local Microchip sales office. Minimum
purchase volumes are required.
VCC
GND
RST
WDI
MCLR
+5V MCP13XX
0.1
10 kΩ
I/O
PIC®
3-Terminal
Regulator
+5V
µF MCU
(example:
MCP1700)
© 2007 Microchip Technology Inc. DS21985B-page 31
MCP131X/2X
5.0 APPLICATION INFORMATION
This section shows application related information that
may be useful for your particular design requirements.
5.1 Supply Monitor Noise Sensitivity
The MCP131X/2X devices are optimized for fast
response to negative-going changes in VDD. Systems
with an inordinate amount of electrical noise on VDD
(such as systems using relays) may require a 0.01 µF
or 0.1 µF bypass capacitor to reduce detection sensitiv-
ity. This capacitor should be installed as close to the
MCP131X/2X as possible to keep the capacitor lead
length short.
FIGURE 5-1: Typical Application Circuit
with Bypass Capacitor.
5.2 Conventional Voltage Monitoring
Figure 5-2 and Figure 5-3 show the MCP131X/2X in
conventional voltage monito ri ng ap plications.
FIGURE 5-2: Battery Voltage Monitor.
FIGURE 5-3: Power Good Monitor.
5.3 Using in PIC® Microcontroller,
ICSP™ Applications
Figure 5-4 shows the typical application circuit for using
the MCP132X for voltage superviory function when the
PIC microcontroller will be pr ogrammed via the In-Cir-
cuit Serial Programming™ (ICSP™) feature. Additional
information is available in TB087, “Using Voltage
Supervisors with PIC® Microcontroller Systems which
Implement In-Circuit Serial Programming™”,
DS91087.
FIGURE 5-4: Typical Application Circuit
for PIC® Microcontroller with the ICSP™
Feature.
MCP131X/2X
VDD
RST
VSS
0.1 µF
RST
WDI
MR
VDD
RST
VSS
BATLOW
MCP131X/2X
+
––
VDD
RST
VSS
Power Good
MCP131X/2X
+
–
Pwr
Sply
Note: This operation can only be done using the
device with the Open-Drain RST pin
(MCP1320, MCP1321, and MCP1322).
Devices that have the internal pull-up
resistor are not recommended due to the
current path of the internal pull-up resistor .
Note: It is recommended that the current into the
RST pin be current limited by a 1 kΩ
resistor.
MCP132X
VDD
VDD/VPP
VDD
RST MCLR
Reset input)
(Active-Low)
VSS VSS
PIC®
Microcontroller
RPU
0.1 µF
1kΩ
MCP131X/2X
DS21985B-page 32 © 2007 Microchip Technology Inc.
5.4 Modifying The Trip Point, VTRIP
Although the MCP131X/2X device has a fixed voltage
trip point (VTRIP), it is sometimes necessary to make
custom adjustments. This can be accomplished by
connecting an external resistor divider to the
MCP131X/2X VDD pin. This causes the VSOURCE volt-
age to be at a higher voltage than when the MCP131X/
2X input equals its VTRIP voltage (Figure 5-5).
To maintain detector accuracy, the bleeder current
through the divider sh ould be significantly higher than
the 10 µA maximum operating current require d by the
MCP131X/2X. A reasonable value for this bleeder
current is 1 mA (100 times the 10 µA required by the
MCP131X/2X). For example, if VTRIP = 2V and the
desired trip point is 2.5V, the value of R1 + R2 is 2.5 kΩ
(2.5V/1 mA). The value of R1 + R2 can be round ed to
the nearest standard value and plugged into the equa-
tion of Figure 5-5 to calculate values for R1 and R2. 1%
tolerance resisto rs are recommended.
FIGURE 5-5: Modify Trip-Point using
External Resistor Divider.
5.5 MOSFET Low-Drive Protection
Low operating power and small physical size make the
MCP131X/2X series ideal for many voltage detector
applications. Figure 5-6 shows a low-voltage gate drive
protection circuit that prevents overheating of the logic-
level MOSFET due to insufficient gate voltage. When
the input signal is below the threshold of the MCP131X/
2X, its output grounds the gate of the MOSFET.
FIGURE 5-6: MOSFET Low-Drive
Protection.
5.6 Low-Power Applications
In some low-power applications, the longer that the
microcontroller (such as a PIC MCU) can be in the
“Sleep mode”, the lower the average system current
consumption will be.
The WDT feature can be used to “wake-up” the PIC MCU
at a regular interval to service the required tasks before
returning to sleep. This “wake-up” occurs after the PIC
MCU detects a MCLR reset during Sleep mode (for mid-
range family; POR = ‘1’, BOR = ‘1’, TO = ‘1’, and PD = ‘1’).
Note: In this example, VSOURCE must be
greater than (VTRIP)
MCP131X/2X
VDD RST
VSS
R1
VSOURCE
R2
or RST
VSOURCE
R1
R1R2
+
--------------------
×VTRIP
=
Where:
VSOURCE = Voltage to be monitored
VTRIP = Threshold Voltage setting
VDD
RST
VSS
MCP131X/2X
270Ω
MTP3055EL
VDD
RL
VTRIP
© 2007 Microchip Technology Inc. DS21985B-page 33
MCP131X/2X
5.7 Controllers and Processors With
Bidirectional I/O Pins
Some microcontrollers have bidirectional Reset pins.
Depending on the current drive capability of the control-
ler pin, an indeterminate logic level may result if there
is a logic conflict. This can be avoided by adding a
4.7 kΩ resistor in series with the output of the
MCP131X/2X (Figure 5-7). If there are other compo-
nents in the system that require a Reset signal, they
should be buffered so as not to load the Reset line. If
the other components are require d to follow the Reset
I/O of the microcontroller, the buffer should be con-
nected as shown with the solid line.
FIGURE 5-7: Interfacing the MCP131X/
2X Push-Pull output s to a Bidirectional Reset I/O.
5.8 RESET Signal Integrity During
Power-Down
The MCP131X/2X Reset output i s valid to V DD = 1.0V.
Below this 1.0V, the output becomes an "o pen circuit"
and does not sink or source current. This means
CMOS logic inputs to the microcontroller will be floating
at an undetermined voltage. Most digital systems are
completely shut down well above this voltage.
However, in situations where the Reset signal must be
maintained valid to VDD = 0V, external circuitry is
required.
For devices where the Reset signal is active-low , a pull-
down resistor must be connected from the MCP131X/
2X Reset pin(s) to ground to discharge stray capaci-
tances and hold the output low (Figure 5-8).
Similarly for devices where the Reset signal is active-
high, a pull-up resistor to VDD is required to ensure a
valid high Reset signal for VDD below 1.0V.
This resistor value, though not critical, should be
chosen such that it does not appreciably load the Reset
pin(s) under normal operation (100 kΩ will be suitable
for most applications).
FIGURE 5-8: Ensuring a valid active-low
Reset pin output state as VDD approaches 0V.
MCP13XX
VDD
RST
GND
MCLR
GND
Buffered Reset
To Other System
Components
MCU
4.7 kΩ
Buffer
PIC®
MCP13XX
VDD
VDD
R1
100 kΩ
RST
GND
MCP131X/2X
DS21985B-page 34 © 2007 Microchip Technology Inc.
6.0 STANDARD DEVICE
OFFERINGS
Table 7-1 shows the standard devices that are avail-
able and their respective configuration. The config ura-
tion includes the:
• Voltage Trip Point (VTRIP)
• Reset Time Out (tRST)
• Watchdog Time Out (tWDT)
Table 7-1 also shows the order number for that given
device configuration.
7.0 CUSTOM CONFIGURATIONS
Table 7-2 shows the codes that specify the desired
Reset time out (tRST) and Watchdog Timer time out
(tWDT) for custom devices.
The voltage trip point (VTRIP) is specified by the two
digits of the desired typical trip point voltage. As an
example, if the desired VTRIP selection has a typical
VTRIP of 2.7V, the code is 27.
TABLE 7-1: STANDARD VERSIONS
TABLE 7-2: DELAY TIME OUT ORDERING CODES
Device Reset
Threshold (V)
Reset Time Out (ms) Watchdog Time Out (s)
Minimum Typical Minimum Typical Order Number
MCP1316 2.90 140 200 1.12 1.6 MCP1316T-29LE/OT
MCP1316 4.60 140 200 1.12 1.6 MCP1316T-46LE/OT
MCP1316M 2.90 140 200 1.12 1.6 MCP1316MT-29LE/OT
MCP1316M 4.60 140 200 1.12 1.6 MCP1316MT-46LE/OT
MCP1317 2.90 140 200 1.12 1.6 MCP1317T-29LE/OT
MCP1317 4.60 140 200 1.12 1.6 MCP1317T-46LE/OT
MCP1318 2.90 140 200 1.12 1.6 MCP1318T-29LE/OT
MCP1318 4.60 140 200 1.12 1.6 MCP1318T-46LE/OT
MCP1318M 2.90 140 200 1.12 1.6 MCP1318MT-29LE/OT
MCP1318M 4.60 140 200 1.12 1.6 MCP1318MT-46LE/OT
MCP1319 2.90 140 200 — — MCP1319T-29LE/OT
MCP1319 4.60 140 200 — — MCP1319T-46LE/OT
MCP1319M 2.90 140 200 — — MCP1319MT-29LE/OT
MCP1319M 4.60 140 200 — — MCP1319MT-46LE/OT
MCP1320 2.90 140 200 1.12 1.6 MCP1320T-29LE/OT
MCP1320 4.60 140 200 1.12 1.6 MCP1320T-46LE/OT
MCP1321 2.90 140 200 1.12 1.6 MCP1321T-29LE/OT
MCP1321 4.60 140 200 1.12 1.6 MCP1321T-46LE/OT
MCP1322 2.90 140 200 — — MCP1322T-29LE/OT
MCP1322 4.60 140 200 — — MCP1322T-46LE/OT
Typical Delay Time (ms) Typical Delay Time (ms)
Code Reset WDT Comment Code Reset WDT Comment
A1.6 6.3 Note 1 J200.0 6.3 Note 1
B1.6 102.0 Note 1 K200.0 102.0 Note 1
C1.6 1600.0 Note 1 L 200.0 1600.0 Delay timings for standard
device offerings
D1.6 25600.0 Note 1 M200.0 25600.0 Note 1
E30.0 6.3 Note 1 N1600.0 6.3 Note 1
F30.0 102.0 Note 1 P1600.0 102.0 Note 1
G30.0 1600.0 Note 1 Q1600.0 1600.0 Note 1
H30.0 25600.0 Note 1 R1600.0 25600.0 Note 1
Note 1: This delay timing combination is not the standard offering. For information on ordering devices with these
delay times, contact your local Microchip sales office. Minimum purchase volumes are required.
© 2007 Microchip Technology Inc. DS21985B-page 35
MCP131X/2X
8.0 DEVELOPMENT TOOLS
8.1 Evaluation/Demonstration Boards
The SOT-23-5/6 Evaluation Board (VSUPEV2) can be
used to evaluate the characteristics of the MCP131X/
2X devices.
This blank PCB has footprints for:
• Pull-up Resistor
• Pull-down Resi stor
• Loading Capacitor
• In-line Re si stor
There is also a power supply filtering capacitor.
For evaluating the MCP131X/2X devices, the selected
device should be installed into the Option A footprint.
FIGURE 1: SOT-23-5/6 Voltage
Supervisor Evaluation Board (VSUPEV2).
This board may be purchased directly from the
Microchip web site at www.microchip.com.
MCP131X/2X
DS21985B-page 36 © 2007 Microchip Technology Inc.
9.0 PACKAGING INFORMATION
9.1 Package Marking Information
5-Pin SOT-23
Part Number SOT -23
MCP1316T-29LE/OT QANN
MCP1316MT-29LE/OT QBNN
MCP1317T-29LE/OT QCNN
MCP1318T-29LE/OT QDNN
MCP1318MT-29LE/OT QENN
MCP1319T-29LE/OT QFNN
MCP1319MT-29LE/OT QGNN
MCP1320T-29LE/OT QHNN
MCP1321T-29LE/OT QJNN
MCP1322T-29LE/OT QKNN
MCP1316T-46LE/OT QLNN
MCP1316MT-46LE/OT QMNN
MCP1317T-46LE/OT QPNN
MCP1318T-46LE/OT QQNN
MCP1318MT-46LE/OT QRNN
MCP1319T-46LE/OT QSNN
MCP1319MT-46LE/OT QTNN
MCP1320T-46LE/OT QUNN
MCP1321T-46LE/OT QVNN
MCP1322T-46LE/OT QWNN
Example:
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
XXNN QANN
© 2007 Microchip Technology Inc. DS21985B-page 37
MCP131X/2X
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1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWSZZZPLFURFKLSFRPSDFNDJLQJ
8QLWV 0,//,0(7(56
'LPHQVLRQ/LPLWV 0,1 120 0$;
1XPEHURI3LQV 1
/HDG3LWFK H %6&
2XWVLGH/HDG3LWFK H %6&
2YHUDOO+HLJKW $ ±
0ROGHG3DFNDJH7KLFNQHVV $ ±
6WDQGRII $ ±
2YHUDOO:LGWK ( ±
0ROGHG3DFNDJH:LGWK ( ±
2YHUDOO/HQJWK ' ±
)RRW/HQJWK / ±
)RRWSULQW / ±
)RRW$QJOH ±
/HDG7KLFNQHVV F ±
/HDG:LGWK E ±
φ
N
b
E
E1
D
123
e
e1
A
A1
A2 c
L
L1
0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%
MCP131X/2X
DS21985B-page 38 © 2007 Microchip Technology Inc.
9.2 Product Tape and Reel Specifications
FIGURE 9-1: EMBOSSED CARRIER DIMENSIONS (8 MM TAPE ONLY)
FIGURE 9-2: 5-LEAD SOT-23 DEVICE TAPE AND REEL SPECIFICATIONS
Top
Cover
Tape
K0
P
W
B0
A0
TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS
Case
Outline Package
Type
Carrier
Dimensions Cavity
Dimensions Output
Quantity
Units
Reel
Diameter in
mm
W
mm P
mm A0
mm B0
mm K0
mm
OT SOT-23 3L 8 4 3.2 3.2 1.4 3000 180
User Direction of Feed
P, Pitch
Standard Reel Component Orientation Reverse Reel Component Orientation
W, Width
of Carrier
Tape
Pin 1
Pin 1
Device
Marking
© 2007 Microchip Technology Inc. DS21985B-page 39
MCP131X/2X
APPENDIX A: REVISION HISTORY
Revision B (October 2007)
• Clarified that devices with a Voltage Trip Point
≤2.4V are tested from -4 0°C to + 85°C. Devices
with a Voltage Trip Point ≥ 2.5V are tested from
-40°C to +125°C.
Revision A (November 2005)
• Original Release of this Document.
MCP131X/2X
DS21985B-page 40 © 2007 Microchip Technology Inc.
NOTES:
© 2007 Microchip Technology Inc. DS21985B-page 41
MCP131X/2X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP1316T: MicroPower Voltage Detector
(Tape and Reel)
MCP1316MT: MicroPower Voltage Detector
(Tape and Reel)
MCP1317T: MicroPower Voltage Detector
(Tape and Reel)
MCP1318T: MicroPower Voltage Detector
(Tape and Reel)
MCP1318MT: MicroPower Voltage Detector
(Tape and Reel)
MCP1319T: MicroPower Voltage Detector
(Tape and Reel)
MCP1319MT: MicroPower Voltage Detector
(Tape and Reel)
MCP1320T: MicroPower Voltage Detector
(Tape and Reel)
MCP1321T: MicroPower Voltage Detector
(Tape and Reel)
MCP1322T: MicroPower Voltage Detector
(Tape and Reel)
VTRIP Options:
(Note 1) 29 = 2.90V
46 = 4.60V
Time Out Options:
(Note 1) L=t
RST = 200 ms (typ),
tWDT = 1.6 s (typ)
Temperature Range: I = -40°C to +85°C
(Only for trip points 2.0V to 2.4V)
E = -40°C to +125°C
(For trip point ≥ 2.5V)
Package: OT = SOT-23, 5-lead
Note 1: Custom ordered voltage t rip points and time outs ava ilable. Please
contact your local Microchip sales office for additional information.
Minimum purchase volumes are required.
PART NO. XX X
Temperature
VTRIP
Options
Device
Examples:
a) MCP1316T-29LE/OT: 5-Lead SOT-23-5
b) MCP1316T-46LE/OT: 5-Lead SOT-23-5
c) MCP1316MT-29LE/OT: 5-Lead SOT-23-5
d) MCP1316MT-46LE/OT: 5-Lead SOT-23-5
a) MCP1317T-29LE/OT: 5-Lead SOT-23-5
b) MCP1317T-46LE/OT: 5-Lead SOT-23-5
a) MCP1318T-29LE/OT: 5-Lead SOT-23-5
b) MCP1318MT-29LE/OT: 5-Lead SOT-23-5
c) MCP1318T-46LE/OT: 5-Lead SOT-23-5
d) MCP1318MT-46LE/OT: 5-Lead SOT-23-5
a) MCP1319T-29LE/OT: 5-Lead SOT-23-5
b) MCP1318MT-29LE/OT: 5-Lead SOT-23-5
c) MCP1319T-46LE/OT: 5-Lead SOT-23-5
d) MCP1318MT-46LE/OT: 5-Lead SOT-23-5
a) MCP1320T-29LE/OT: 5-Lead SOT-23-5
b) MCP1320T-46LE/OT: 5-Lead SOT-23-5
a) MCP1321T-29LE/OT: 5-Lead SOT-23-5
b) MCP1321T-46LE/OT: 5-Lead SOT-23-5
a) MCP1322T-29LE/OT: 5-Lead SOT-23-5
b) MCP1322T-46LE/OT: 5-Lead SOT-23-5
Range
XX
Package
X
Tape/Reel
Option
/
X
Time Out
Options
MCP131X/2X
DS21985B-page 42 © 2007 Microchip Technology Inc.
NOTES:
© 2007 Microchip Technology Inc. DS21985B-page 43
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safet y applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify
and hold harmless Microchip from any and all damages,
claims, suits, or expenses resulting from such use. No
licenses are conveyed, implicitly or otherwise, under any
Microchip intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICST ART, PRO MA TE, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The
Embedded Control Solutions Company are registered
trademarks of Microchip Technology Incorporated in the
U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of product s is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Dat a
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digit al Millennium Copyright Act. If such acts
allow unauthorized access to you r software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:200 2 certif ication for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperi pherals, nonvola tile memo ry and
analog product s. In addition, Microchip ’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21985B-page 44 © 2007 Microchip Technology Inc.
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