1
Standard Products
UT54ACS14/UT54ACTS14
Hex Inverting Schmitt Triggers
Datasheet
November 2010
www.aeroflex.com/logic
FEATURES
1.2μ CMOS (ACTS14) and 0.6μ CRH CMOS process
(ACS14)
- Latchup immune
High speed
Low power consumption
Single 5 volt supply
Available QML Q or V processes
Flexible package
- 14-pin DIP
- 14-lead flatpack
UT54ACS14 - SMD 5962-96524
UT54ACTS14 - SMD 5962-96525
DESCRIPTION
The UT54ACS14 and the UT54ACTS14 are hex inverters. The
circuits perform the Boolean function Y = A.
The devices are characterized over full military temperature
range of -55°C to +125°C.
FUNCTION TABLE
LOGIC SYMB OL
PINOUTS 14-Pin DIP
Top View
14-Lead Flatpa ck
Top View
LOGIC DIAGRAM
INPUT OUTPUT
A Y
H L
L H
Y1
Y2
Y3
Y4
(1)
A1
(5)
A3
(11)
A5 (13)
A6
Note:
1. Logic symbol in accordance with ANSI/IEEE standard 91-1984 and
IEC Publication 617-12.
1
(3)
A2
(9)
A4
(2)
(10)
(12)
(4)
(8)
Y5
Y6
(6)
A1
Y1
A2
Y2
A3
Y3
VSS
VDD
A6
Y6
A5
Y5
A4
Y4
114
213
312
411
510
69
78
VDD
A6
Y6
A5
Y5
A4
Y4
A1
Y1
A2
Y2
A3
Y3
VSS
114
213
312
411
510
69
78
Y4
Y3
Y1
Y2
Y6
Y5
A4
A3
A1
A2
A6
A5
2
OPERATIONAL ENVIRONMENT1
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at
these or any other conditions beyond limits indicated in the operational sections is not recommended. E xposure to absolute maximum rating conditions for extended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
PARAMETER LIMIT UNITS
Total Dose 1.0E6 (ACTS14)
5.0E5 (ACS14) rads(Si)
SEU Threshold 280 MeV-cm2/mg
SEL Threshold 120 MeV-cm2/mg
Neutron Fluence 1.0E14 n/cm2
SYMBOL PARAMETER LIMIT UNITS
VDD Supply voltage -0.3 to 7.0 V
VI/O Voltage any pin -.3 to VDD +.3 V
TSTG Storage Temperature range -65 to +150 °C
TJMaximum junction temperature +175 °C
TLS Lead temperature (soldering 5 seconds) +300 °C
ΘJC Thermal resistance junction to case 20 °C/W
IIDC input current ±10 mA
PDMaximum power dissipation 1 W
SYMBOL PARAMETER LIMIT UNITS
VDD Supply voltage 4.5 to 5.5 V
VIN Input voltage any pin 0 to VDD V
TCTemperature range -55 to + 125 °C
3
DC ELECTRICAL CHARACTERISTICS 7
(VDD = 5.0V ±10%; VSS = 0V 6, -5 5 °C < TC < +125°C); Unless otherw ise noted, Tc is per the temperature range ordered.
SYMBOL PARAMETER CONDITION MIN MAX UNIT
VT+ Schmitt Trigger, positive going1 th reshold
ACTS
ACS 2.25
.7VDD V
VT- Schmitt Trigger, negative going1 threshold
ACTS
ACS 0.5
.3VDD
V
VHSchmitt Trigger , typical range of hysteresis
2ACTS
ACS
0.3
0.6 0.9
1.5 V
IIN Input leakage current
ACTS/ACS VIN = VDD or VSS -1 1μA
VOL Low-level output voltage 3
ACTS
ACS IOL = 8.0mA
IOL = 100μA0.40
0.25 V
VOH High-level output voltag e 3
ACTS
ACS IOH = -8.0mA
IOH = -100μA
.7VDD
VDD-0.25 V
IOS Short-circuit output current 2,4
ACTS/ACS VO = VDD and VSS -200 200 mA
IOL Output current10
(Sink)
VIN = VDD or VSS
VOL = 0.4V
8mA
IOH Output current10
(Source)
VIN = VDD or VSS
VOH = VDD - 0.4V
-8 mA
Ptotal Power dissipatio n 2, 8, 9 CL = 50pF 1.8 mW/
MHz
IDDQ Quiescent Supply Cur rent VDD = 5.5V 10 μA
ΔIDDQ Quiescent Supply Current Delta
ACTS For input under test
VIN = VDD - 2.1V
For all other inputs
VIN = VDD or VSS
VDD = 5.5V
3.1 mA
CIN Input capacitance 5ƒ = 1MHz @ 0V 15 pF
COUT Output capacitance 5 ƒ = 1MHz @ 0V 15 pF
4
Notes:
1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: VIH = VIH(min) + 20%, - 0%; VIL = VIL(max) + 0%, -
50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are
guaranteed to VIH(min) and VIL(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-3853 5, for current density ≤ 5.0E5 amps/cm 2, the maximum product of load capacitance (per output buf fer) times frequency should not exceed 3,765
pF/MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and VSS at
frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All ACTS specifications are valid for radiation dose <1E6 rads(Si), and all ACS specifications are valid for radiation dose <5E5 rads(Si).
8. Power does not include power contribution of any TTL output sink current.
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
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AC ELECTRICAL CHARACTERISTICS 2
(VDD = 5.0V ±10%; VSS = 0V 1, -55°C < TC < +125°C); Unless otherwise noted, Tc is per the temperature range ordered.
Notes:
1. Maximum allowable relative shift equals 50mV.
2. For the ACTS version, all specifications are valid for radiation dose <1E6 rads(Si). For the ACS version, all spec ifications are valid for radiation dose <5E5 rads(Si).
SYMBOL PARAMETER MINIMUM MAXIMUM UNIT
tPHL Input to Yn 2 14 ns
tPLH Input to Yn 2 13 ns
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PACKAGING Side-Brazed Packages
7
FLATPACK PACKAGES
8
UT54ACS14/UT 54ACTS14: SMD
5962 ***** ** * * **
Lead Finish: (Notes 1 & 2)
A = Solder
C = Gold
X = Optional
Package Type:
X = 14-lead ceramic bottom-brazed dual-in-line Flatpack
C = 14-lead ceramic side-brazed dip
Class Designator:
Q = QML Class Q
V = QML Class V
Device Type:
01
Drawing Number:
96524 = UT54ACS14
96525 = UT54AC TS14
Total Dose: (Notes 3 & 4)
R = 1E5 rads(Si)
F = 3E5 rads(Si)
G = 5E5 rads(Si)
H = 1E6 rads(Si)
Notes:
1. Lead finish (A,C, or X) must be specif i ed.
2. If an “X” is specified when ordering, part marking will match the lead finish and will be either “A” (solder) or “C” (gold).
3. Total dose radiation must be specified when o rdering. QML Q and QML V not available without radiation hardening. For prototype inquiries, contact factory.
4. Device type 02 is only offer ed with a TID toler ance guarantee of 3E5 rads(Si) or 1E6 rads(Si) and is tested in accordance with MIL-STD-883 Test Method 1019
Condition A and section 3.11.2. Device type 03 is only offered with a TID tolerance guarantee of 1E5 rads(Si), 3E5 rads(Si), and 5E5 rads(Si), and is tested in
accordance with MIL-STD-8 83 Test Method 1019 Condition A.
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