LM567/LM567C
March 25, 2012
Tone Decoder
General Description
The LM567 and LM567C are general purpose tone decoders
designed to provide a saturated transistor switch to ground
when an input signal is present within the passband. The cir-
cuit consists of an I and Q detector driven by a voltage
controlled oscillator which determines the center frequency of
the decoder. External components are used to independently
set center frequency, bandwidth and output delay.
Features
■20 to 1 frequency range with an external resistor
■Logic compatible output with 100 mA current sinking
capability
■Bandwidth adjustable from 0 to 14%
■High rejection of out of band signals and noise
■Immunity to false signals
■Highly stable center frequency
■Center frequency adjustable from 0.01 Hz to 500 kHz
Applications
■Touch tone decoding
■Precision oscillator
■Frequency monitoring and control
■Wide band FSK demodulation
■Ultrasonic controls
■Carrier current remote controls
■Communications paging decoders
Connection Diagrams
Metal Can Package
697501
Top View
Order Number LM567H or LM567CH
See NS Package Number H08C
OBSOLETE
Dual-In-Line and Small Outline Packages
697502
Top View
Order Number LM567CM
See NS Package Number M08A
Order Number LM567CN
See NS Package Number N08E
© 2012 Texas Instruments Incorporated 6975 SNOSBQ4C www.ti.com
LM567/LM567C Tone Decoder
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the Texas Instruments Sales Office/
Distributors for availability and specifications.
Supply Voltage Pin 9V
Power Dissipation (Note 2) 1100 mW
V815V
V3−10V
V3V4 + 0.5V
Storage Temperature Range −65°C to +150°C
Operating Temperature Range
LM567H −55°C to +125°C
LM567CH, LM567CM, LM567CN 0°C to +70°C
Soldering Information
Dual-In-Line Package
Soldering (10 sec.) 260°C
Small Outline Package
Vapor Phase (60 sec.) 215°C
Infrared (15 sec.) 220°C
See AN-450 “Surface Mounting Methods and Their Effect
on Product Reliability” for other methods of soldering
surface mount devices.
Electrical Characteristics
AC Test Circuit, TA = 25°C, V+ = 5V
Parameters Conditions LM567 LM567C/LM567CM Units
Min Typ Max Min Typ Max
Power Supply Voltage Range 4.75 5.0 9.0 4.75 5.0 9.0 V
Power Supply Current Quiescent RL = 20k 6 8 7 10 mA
Power Supply Current Activated RL = 20k 11 13 12 15 mA
Input Resistance 18 20 15 20 kΩ
Smallest Detectable Input Voltage IL = 100 mA, fi = fo 20 25 20 25 mVrms
Largest No Output Input Voltage IC = 100 mA, fi = fo10 15 10 15 mVrms
Largest Simultaneous Outband Signal to
Inband Signal Ratio
6 6 dB
Minimum Input Signal to Wideband Noise
Ratio
Bn = 140 kHz −6 −6 dB
Largest Detection Bandwidth 12 14 16 10 14 18 % of fo
Largest Detection Bandwidth Skew 1 2 2 3 % of fo
Largest Detection Bandwidth Variation
with Temperature
±0.1 ±0.1 %/°C
Largest Detection Bandwidth Variation
with Supply Voltage
4.75–6.75V ±1 ±2 ±1 ±5 %V
Highest Center Frequency 100 500 100 500 kHz
Center Frequency Stability (4.75–5.75V) 0 < TA < 70
−55 < TA < +125
35 ± 60
35 ± 140
35 ± 60
35 ± 140
ppm/°C
ppm/°C
Center Frequency Shift with Supply
Voltage
4.75V–6.75V
4.75V–9V
0.5 1.0
2.0
0.4 2.0
2.0
%/V
%/V
Fastest ON-OFF Cycling Rate fo/20 fo/20
Output Leakage Current V8 = 15V 0.01 25 0.01 25 µA
Output Saturation Voltage ei = 25 mV, I8 = 30 mA
ei = 25 mV, I8 = 100 mA
0.2
0.6
0.4
1.0
0.2
0.6
0.4
1.0 V
Output Fall Time 30 30 ns
Output Rise Time 150 150 ns
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions
which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters
where no limit is given, however, the typical value is a good indication of device performance.
Note 2: The maximum junction temperature of the LM567 and LM567C is 150°C. For operating at elevated temperatures, devices in the TO-5 package must be
derated based on a thermal resistance of 150°C/W, junction to ambient or 45°C/W, junction to case. For the DIP the device must be derated based on a thermal
resistance of 110°C/W, junction to ambient. For the Small Outline package, the device must be derated based on a thermal resistance of 160°C/W, junction to
ambient.
Note 3: Refer to RETS567X drawing for specifications of military LM567H version.
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LM567/LM567C
Schematic Diagram
697503
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LM567/LM567C
Typical Performance Characteristics
Typical Frequency Drift
697510
Typical Bandwidth Variation
697511
Typical Frequency Drift
697512
Typical Frequency Drift
697513
Bandwidth vs Input Signal
Amplitude
697514
Largest Detection Bandwidth
697515
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LM567/LM567C
Detection Bandwidth as a
Function of C2 and C3
697516
Typical Supply Current vs
Supply Voltage
697517
Greatest Number of Cycles
Before Output
697518
Typical Output Voltage vs
Temperature
697519
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LM567/LM567C
Typical Applications
Touch-Tone Decoder
697505
Component values (typ)
R1 6.8 to 15k
R2 4.7k
R3 20k
C1 0.10 mfd
C2 1.0 mfd 6V
C3 2.2 mfd 6V
C4 250 mfd 6V
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LM567/LM567C
Oscillator with Quadrature Output
697506
Connect Pin 3 to 2.8V to Invert Output
Oscillator with Double Frequency Output
697507
Precision Oscillator Drive 100 mA Loads
697508
AC Test Circuit
697509
fi = 100 kHz + 5V
*Note: Adjust for fo = 100 kHz.
Applications Information
The center frequency of the tone decoder is equal to the free
running frequency of the VCO. This is given by
The bandwidth of the filter may be found from the approxi-
mation
Where:
Vi = Input voltage (volts rms), Vi ≤ 200mV
C2 = Capacitance at Pin 2(μF)
7 www.ti.com
LM567/LM567C
LM567C MDC MWC
Tone Decoder
697523
Die Layout (C - Step)
Die/Wafer Characteristics
Fabrication Attributes General Die Information
Physical Die Identification LM567C Bond Pad Opening Size (min) 91µm x 91µm
Die Step C Bond Pad Metalization 0.5% COPPER_BAL.
ALUMINUM
Physical Attributes Passivation VOM NITRIDE
Wafer Diameter 150mm Back Side Metal BARE BACK
Dise Size (Drawn) 1600µm x 1626µm
63.0mils x 64.0mils
Back Side Connection Floating
Thickness 406µm Nominal
Min Pitch 198µm Nominal
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
Die Bond Pad Coordinate Locations (C - Step)
(Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used
SIGNAL NAME PAD# NUMBER X/Y COORDINATES PAD SIZE
X Y X Y
OUTPUT
FILTER
1 -673 686 91 x 91
LOOP FILTER 2 -673 -419 91 x 91
INPUT 3 -673 -686 91 x 91
V+ 4 -356 -686 91 x 91
TIMING RES 5 673 -122 91 x 91
TIMING CAP 6 673 76 91 x 91
GND 7 178 686 117 x 91
OUTPUT 8 -318 679 117 x 104
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LM567/LM567C
IN U.S.A
Tel #: 1 877 Dial Die 1 877 342 5343
Fax: 1 207 541 6140
IN EUROPE
Tel: 49 (0) 8141 351492 / 1495
Fax: 49 (0) 8141 351470
IN ASIA PACIFIC
Tel: (852) 27371701
IN JAPAN
Tel: 81 043 299 2308
9 www.ti.com
LM567/LM567C
Physical Dimensions inches (millimeters) unless otherwise noted
Metal Can Package (H)
Order Number LM567H or LM567CH
NS Package Number H08C
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LM567/LM567C
Small Outline Package (M)
Order Number LM567CM
NS Package Number M08A
Molded Dual-In-Line Package (N)
Order Number LM567CN
NS Package Number N08E
11 www.ti.com
LM567/LM567C
Notes
LM567/LM567C Tone Decoder
www.ti.com
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