Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
Pin Functions.................................................................... 3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................4
6.5 Electrical Characteristics.............................................5
6.6 Typical Characteristics................................................7
7 Detailed Description........................................................9
7.1 Overview..................................................................... 9
7.2 Functional Block Diagram........................................... 9
7.3 Feature Description.....................................................9
7.4 Device Functional Modes..........................................12
8 Application and Implementation.................................. 13
8.1 Application Information............................................. 13
8.2 Typical Application.................................................... 13
8.3 Dos and Don'ts..........................................................15
9 Layout.............................................................................18
9.1 Layout Guidelines..................................................... 18
9.2 Layout Example........................................................ 18
10 Device and Documentation Support..........................19
10.1 Device Support....................................................... 19
10.2 Community Resources............................................19
10.3 Trademarks.............................................................19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision L (November 2018) to Revision M (March 2021) Page
• Specified device dimensions in Features section............................................................................................... 1
• Updated application curve titles........................................................................................................................14
Changes from Revision K (February 2016) to Revision L (November 2018) Page
• Updated Features section to specify how many rails can be sequenced by a single device ............................ 1
• Added feature that devices can be cascaded ....................................................................................................1
• Specified device dimensions in Features section............................................................................................... 1
• Specified FPGA Power Supply Sequencing in Applications...............................................................................1
• Added note in description about open drain FLAG pins..................................................................................... 1
• Added I/O column to Pin Functions table........................................................................................................... 3
• Changed Part Nomenclature section to Device Nomenclature section............................................................ 19
Changes from Revision J (December 2014) to Revision K (February 2016) Page
• Changed Handling Ratings to ESD Ratings and moved storage temperature to Absolute Maximum Ratings ...
4
• Removed “Customized Timing and Sequence” section ...................................................................................12
• Added cross references to timing diagrams..................................................................................................... 19
Changes from Revision I (March 2013) to Revision J (August 2014) Page
• Added Handling Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................. 4
Changes from Revision H (March 2013) to Revision I (March 2013) Page
• Changed layout of National Data Sheet to TI format........................................................................................ 19
LM3880
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