FEATURES :
* For surface mount applications
* Low profile package
* Built-in stran relief,
ideal for automated placement
* Fast switching for high efficiency
* Glass passivated chip junction
* High temperature soldering :
* Pb / RoHS Free
* Case : SMC Molded plastic
* Epoxy : UL94V-O rate flame retardant
* Lead : Lead Formed for Surface Mount
* Polarity : Color band denotes cathode end
* Mounting position : Any
* Weight : 0.21 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
C ambient temperature unless otherwise specified
Hz, resistive or inductive load
For capacitive load, derate current by
SYMBOLRS3A RS3B RS3D RS3G RS3J RS3K UNIT
Maximum Repetitive Peak Reverse Voltage VRRM 50 100 200 400 600 800 V
Maximum RMS Voltage VRMS 35 70 140 280 420 560 V
Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 V
Maximum Average Forward Rectified Current at TL = 55 °CIF(AV) A
Maximum Peak Forward Surge Current,
8.3ms Single half sine wave superimposed
on rated load (JEDEC Method) TL = 75 °C
Maximum Instantaneous Forward Voltage at IF = 3.0 A VFV
Maximum DC Reverse Current TA = 25 °CIRµA
at Rated DC Blocking Voltage TA = 125 °CIR(H) µA
Maximum Reverse Recovery Time ( Note 1 ) Trr 250 500 ns
Typical Junction Capacitance ( Note 2 ) CJpF
Typical thermal resistance ( Junction to Ambient ) ( Note 3 ) RθJA °C/W
Typical thermal resistance ( Junction to Lead ) ( Note 3 ) RθJL °C/W
Operating Junction and StorageTemperature Range TJ, TSTG °C
Notes :
( 1 ) Reverse Recovery Test Conditions : IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A.
( 2 ) Measured at 1.0 MHz and applied reverse voltage of 4.0 VDC
( 3 ) On P.C.B with 0.3 x 0.3" (8.0 x 8.0 mm ) copper pad areas.
Page 1 of 2 Rev. 01 : September 30, 2005
RATING
IFSM 100 A
SURFACE MOUNT
1.3
10
250
3.0
- 55 to + 150
60
150
50
15
SMC (DO-214AB)
Dimensions in inches and (millimeter)
0.305(7.75)
0.320(8.13)
0.245(6.22)
0.121(3.07)
0.115(2.92)
0.220(5.59)
0.012(0.305)
0.103(2.62)
0.280(7.11)
0.060(1.52)
0.260(6.60)
0.079(2.00)
0.006(0.152)
0.030(0.76)
0.008(0.203)
0.004(0.102)