VS-MBRB20..CTPbF, VS-MBR20..CT-1PbF Series
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Revision: 16-Jan-12 1Document Number: 94305
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Schottky Rectifier, 2 x 10 A
FEATURES
150 °C TJ operation
Center tap D2PAK and TO-262 packages
Low forward voltage drop
High frequency operation
High purity, high temperature epoxy
encapsulation for enhanced mechanical
strength and moisture resistance
Guard ring for enhanced ruggedness and long term
reliability
Meets MSL level 1, per J-STD-020, LF maximum peak of
260 °C
Halogen-free according to IEC 61249-2-21 definition
Compliant to RoHS Directive 2002/95/EC
AEC-Q101 qualified
DESCRIPTION
This center tap Schottky rectifier has been optimized for
low reverse leakage at high temperature. The proprietary
barrier technology allows for reliable operation up to 150 °C
junction temperature. Typical applications are in switching
power supplies, converters, freewheeling diodes, and
reverse battery protection.
PRODUCT SUMMARY
Package TO-263AB (D2PAK), TO-262AA
IF(AV) 2 x 10 A
VR35 V, 45 V
VF at IF0.72 V
IRM max. 15 mA at 125 °C
TJ max. 150 °C
Diode variation Common cathode
EAS 8 mJ
VS-MBRB20..CTPbF
D2PAK TO-262
VS-MBR20..CT-1PbF
Base
common
cathode
Anode Anode
Common
cathode
13
2
2
Base
common
cathode
Anode Anode
Common
cathode
13
2
2
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL CHARACTERISTICS VALUES UNITS
IF(AV) Rectangular waveform (per device) 20
A
IFRM TC = 135 °C (per leg) 20
VRRM 35/45 V
IFSM tp = 5 μs sine 1060 A
VF10 Apk, TJ = 125 °C 0.57 V
TJRange - 65 to 150 °C
VOLTAGE RATINGS
PARAMETER SYMBOL VS-MBRB2035CTPbF
VS-MBR2035CT-1PbF
VS-MBRB2045CTPbF
VS-MBR2045CT-1PbF UNITS
Maximum DC reverse voltage VR35 45 V
Maximum working peak reverse voltage VRWM
VS-MBRB20..CTPbF, VS-MBR20..CT-1PbF Series
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Revision: 16-Jan-12 2Document Number: 94305
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
(1) Pulse width < 300 μs, duty cycle < 2 %
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum average
forward current
per leg IF(AV) TC = 135 °C, rated VR
10
A
per device 20
Peak repetitive forward current per leg IFRM Rated VR, square wave, 20 kHz, TC = 135 °C 20
Non-repetitive peak surge current IFSM
5 μs sine or
3 μs rect. pulse
Following any rated load condition
and with rated VRRM applied 1060
Surge applied at rated load conditions halfwave,
single phase, 60 Hz 150
Non-repetitive avalanche energy per leg EAS TJ = 25 °C, IAS = 2 A, L = 4 mH 8 mJ
Repetitive avalanche current per leg IAR
Current decaying linearly to zero in 1 μs
Frequency limited by TJ maximum
VA = 1.5 x VR typical
2A
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum forward voltage drop VFM (1)
20 A TJ = 25 °C 0.84
V10 A TJ = 125 °C 0.57
20 A 0.72
Maximum instantaneous
reverse current IRM (1) TJ = 25 °C Rated DC voltage 0.1 mA
TJ = 125 °C 15
Threshold voltage VF(TO) TJ = TJ maximum 0.354 V
Forward slope resistance rt17.6 m
Maximum junction capacitance CTVR = 5 VDC (test signal range 100 kHz to 1 MHz), 25 °C 600 pF
Typical series inductance LSMeasured from top of terminal to mounting plane 8.0 nH
Maximum voltage rate of change dV/dt Rated VR10 000 V/μs
THERMAL - MECHNICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction temperature range TJ- 65 to 150 °C
Maximum storage temperature range TStg - 65 to 175
Maximum thermal resistance,
junction to case per leg RthJC DC operation 2.0
°C/W
Typical thermal resistance,
case to heatsink RthCS Mounting surface, smooth and greased 0.50
Approximate weight 2g
0.07 oz.
Mounting torque minimum Non-lubricated threads 6 (5) kgf · cm
(lbf · in)
maximum 12 (10)
Marking device
Case style TO-263AB (D2PAK) MBRB2035CT
MBRB2045CT
Case style TO-262AA MBR2035CT-1
MBR2045CT-1
VS-MBRB20..CTPbF, VS-MBR20..CT-1PbF Series
www.vishay.com Vishay Semiconductors
Revision: 16-Jan-12 3Document Number: 94305
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 1 - Maximum Forward Voltage Drop Characteristics
(Per Leg)
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage (Per Leg)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage (Per Leg)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics (Per Leg)
1
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
10
100
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
VFM - Forward Voltage Drop (V)
IF - Instantaneous Forward Current (A)
0.0001
0.1
1
10
0.01
0.001
100
I
R
- Reverse Current (mA)
V
R
- Reverse Voltage (V)
1051520 40 45
25 30 35
0
TJ = 150 °C TJ = 125 °C
TJ = 100 °C TJ = 75 °C
TJ = 50 °C
TJ = 25 °C
100
1000
CT - Junction Capacitance (pF)
VR - Reverse Voltage (V)
10 20 40 50300
TJ = 25 °C
0.01
0.1
1
10
0.00001 0.0001 0.001 0.01 0.1 1
t1 - Rectangular Pulse Duration (s)
ZthJC - Thermal Impedance (°C/W)
10
D = 0.75
D = 0.50
D = 0.33
D = 0.25
D = 0.20
Single pulse
(thermal resistance)
PDM
t1
t2
Notes:
1. Duty factor D = t1/t2
2. Peak TJ = PDM x ZthJC + TC
100
VS-MBRB20..CTPbF, VS-MBR20..CT-1PbF Series
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Revision: 16-Jan-12 4Document Number: 94305
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current (Per Leg)
Fig. 6 - Forward Power Loss Characteristics (Per Leg)
Fig. 7 - Maximum Non-Repetitive Surge Current (Per Leg)
Note
(1) Formula used: TC = TJ - (Pd + PdREV) x RthJC;
Pd = Forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = Inverse power loss = VR1 x IR (1 - D); IR at VR1 = Rated VR
120
125
130
135
140
145
150
Allowable Case Temperature (°C)
I
F(AV)
- Average Forward Current (A)
63912
15
0
DC
See note (1)
Square wave (D = 0.50)
Rated VR applied
0
4
8
6
2
10
Average Power Loss (W)
I
F(AV)
- Average Forward Current (A)
4268 1610 12 14
0
DC
RMS limit
D = 0.20
D = 0.25
D = 0.33
D = 0.50
D = 0.75
100
1000
I
FSM
- Non-Repetitive Surge Current (A)
t
p
- Square Wave Pulse Duration (µs)
100 1000 10 000
10
At any rated load condition
and with rated VRRM applied
following surge
VS-MBRB20..CTPbF, VS-MBR20..CT-1PbF Series
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Revision: 16-Jan-12 5Document Number: 94305
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
ORDERING INFORMATION TABLE
2- Essential part number
3-
4- Current rating (20 = 20 A)
5-
8- None = Tube
TRL = Tape and reel (left oriented - for D2PAK only)
Voltage ratings
PbF = Lead (Pb)-free (for TO-262 and D2PAK tube)
7-
35 = 35 V
45 = 45 V
None = D2PAK
-1 = TO-262
B = D2PAK
None = TO-262
7
7
None
= -1
6- CT = Essential part number
3 = B
3 None
TRR = Tape and reel (right oriented - for D2PAK only)
9-
P = Lead (Pb)-free (for D2PAK TRR and TRL)
1- Vishay Semiconductors product
Device code
51 32 4 6 7 8 9
VS- MBR B 20 45 CT -1 TRL PbF
ORDERING INFORMATION (Example)
PREFERRED P/N QUANTITY PER T/R MINIMUM ORDER QUANTITY PACKAGING DESCRIPTION
VS-MBRB2035CTPBF 50 1000 Antistatic plastic tube
VS-MBR2035CT-1PBF 50 1000 Antistatic plastic tube
VS-MBRB2035CTTRLP 800 800 13" diameter reel
VS-MBRB2035CTTRRP 800 800 13" diameter reel
VS-MBRB2045CTPBF 50 1000 Antistatic plastic tube
VS-MBR2045CT-1PBF 50 1000 Antistatic plastic tube
VS-MBRB2045CTTRLP 800 800 13" diameter reel
VS-MBRB2045CTTRRP 800 800 13" diameter reel
LINKS TO RELATED DOCUMENTS
Dimensions www.vishay.com/doc?95014
Part marking information www.vishay.com/doc?95008
Packaging information www.vishay.com/doc?95032
SPICE model www.vishay.com/doc?95504
Document Number: 95014 For technical questions concerning discrete products, contact: diodes-tech@vishay.com www.vishay.com
Revision: 31-Mar-09 For technical questions concerning module products, contact: ind-modules@vishay.com 1
D2PAK, TO-262
Outline Dimensions
Vishay High Power Products
DIMENSIONS FOR D2PAK in millimeters and inches
Notes
(1) Dimensioning and tolerancing per ASME Y14.5 M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall not
exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Datum A and B to be determined at datum plane H
(6) Controlling dimension: inch
(7) Outline conforms to JEDEC outline TO-263AB
SYMBOL MILLIMETERS INCHES NOTES SYMBOL MILLIMETERS INCHES NOTES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
A 4.06 4.83 0.160 0.190 D1 6.86 8.00 0.270 0.315 3
A1 0.00 0.254 0.000 0.010 E 9.65 10.67 0.380 0.420 2, 3
b 0.51 0.99 0.020 0.039 E1 7.90 8.80 0.311 0.346 3
b1 0.51 0.89 0.020 0.035 4 e 2.54 BSC 0.100 BSC
b2 1.14 1.78 0.045 0.070 H 14.61 15.88 0.575 0.625
b3 1.14 1.73 0.045 0.068 4 L 1.78 2.79 0.070 0.110
c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.066 3
c1 0.38 0.58 0.015 0.023 4 L2 1.27 1.78 0.050 0.070
c2 1.14 1.65 0.045 0.065 L3 0.25 BSC 0.010 BSC
D 8.51 9.65 0.335 0.380 2 L4 4.78 5.28 0.188 0.208
c
B
Detail A
c2
AA
A
± 0.004 B
M
A
Lead tip
(3)
(3)
View A - A
(E)
(D1)
E1
B
H
A1
Detail “A”
Rotated 90 °CW
Scale: 8:1
L
Gauge
plane
0° to 8°
L3
L4
Seating
plane
Section B - B and C - C
Scale: None
(4)
(4)
(b, b2)
b1, b3
(c) c1
Base
Metal
Plating
Conforms to JEDEC outline D2PAK (SMD-220)
132
D
C
A
L2
E
(2)(3)
(2)
4
H
BB
2 x b
2 x b2
L1
0.010 AB
MM
(3)
e
2 x
Pad layout
MIN.
11.00
(0.43)
MIN.
9.65
(0.38)
MIN.
3.81
(0.15)
MIN.
2.32
(0.08)
17.90 (0.70)
15.00 (0.625)
2.64 (0.103)
2.41 (0.096)
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
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2 For technical questions concerning module products, contact: ind-modules@vishay.com Revision: 31-Mar-09
Outline Dimensions
Vishay High Power Products D2PAK, TO-262
DIMENSIONS FOR TO-262 in millimeters and inches
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall not
exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Controlling dimension: inches
(6) Outline conform to JEDEC TO-262 except A1 (maximum), b
(minimum) and D1 (minimum) where dimensions derived the
actual package outline
SYMBOL MILLIMETERS INCHES NOTES
MIN. MAX. MIN. MAX.
A 4.06 4.83 0.160 0.190
A1 2.03 3.02 0.080 0.119
b 0.51 0.99 0.020 0.039
b1 0.51 0.89 0.020 0.035 4
b2 1.14 1.78 0.045 0.070
b3 1.14 1.73 0.045 0.068 4
c 0.38 0.74 0.015 0.029
c1 0.38 0.58 0.015 0.023 4
c2 1.14 1.65 0.045 0.065
D 8.51 9.65 0.335 0.380 2
D1 6.86 8.00 0.270 0.315 3
E 9.65 10.67 0.380 0.420 2, 3
E1 7.90 8.80 0.311 0.346 3
e 2.54 BSC 0.100 BSC
L 13.46 14.10 0.530 0.555
L1 - 1.65 - 0.065 3
L2 3.56 3.71 0.140 0.146
(4)
(4) Base
metal
Plating b1, b3
(b, b2)
c1
c
Section B - B and C - C
Scale: None
Section A - A
(3)
E1
(3)D1
E
B
A
A
A
c2
c
A1
Seating
plane
Lead tip
(3)
(2) (3)
(2)
A
E
(Datum A)
L1
L2
BB
CC
3
2
1
L
D
2 x e
3 x b2
3 x b
0.010 A B
MM
Modified JEDEC outline TO-262
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
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Revision: 12-Mar-12 1Document Number: 91000
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