Document Number: 94310 For technical questions, contact: diodestech@vishay.com www.vishay.com
Revision: 16-Mar-10 1
Schottky Rectifier, 2 x 15 A
VS-MBRB30..CTPbF, VS-MBR30..CT-1PbF Series
Vishay High Power Products
FEATURES
150 °C TJ operation
Low forward voltage drop
High frequency operation
Center tap D2PAK and TO-262 packages
High purity, high temperature epoxy
encapsulation for enhanced mechanical
strength and moisture resistance
Guard ring for enhanced ruggedness and long
term reliability
Meets MSL level 1, per J-STD-020, LF maximum peak of
260 °C
Halogen-free according to IEC 61249-2-21 definition
Compliant to RoHS directive 2002/95/EC
AEC-Q101 qualified
DESCRIPTION
This center tap Schottky rectifier has been optimized for low
reverse leakage at high temperature. The proprietary barrier
technology allows for reliable operation up to 150 °C
junction temperature. Typical applications are in switching
power supplies, converters, freewheeling diodes, and
reverse battery protection.
PRODUCT SUMMARY
IF(AV) 2 x 15 A
VR35 V/45 V
IRM 100 mA at 125 °C
VS-MBRB30..CTPbF
D2PAK TO-262
VS-MBR30..CT-1PbF
Base
common
cathode
A
node Anode
Common
cathode
13
2
2
Base
common
cathode
Anode Anode
Common
cathode
13
2
2
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL CHARACTERISTICS VALUES UNITS
IF(AV) Rectangular waveform (per device) 30 A
IFRM TC = 123 °C (per leg) 30
VRRM 35/45 V
IFSM tp = 5 μs sine 1020 A
VF20 Apk, TJ = 125 °C 0.6 V
TJRange - 65 to 150 °C
VOLTAGE RATINGS
PARAMETER SYMBOL VS-MBRB3035CTPbF
VS-MBR3035CT-1PbF
VS-MBRB3045CTPbF
VS-MBR3045CT-1PbF UNITS
Maximum DC reverse voltage VR35 45 V
Maximum working peak reverse voltage VRWM
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum average
forward current
per leg IF(AV) TC = 123 °C, rated VR
15
A
per device 30
Peak repetitive forward current per leg IFRM Rated VR, square wave, 20 kHz, TC = 123 °C 30
Non-repetitive peak surge current IFSM
5 μs sine or 3 μs
rect. pulse
Following any rated load condition
and with rated VRRM applied 1020
Surge applied at rated load conditions halfwave,
single phase, 60 Hz 200
Non-repetitive avalanche energy per leg EAS TJ = 25 °C, IAS = 2 A, L = 5 mH 10 mJ
Repetitive avalanche current per leg IAR
Current decaying linearly to zero in 1 μs
Frequency limited by TJ maximum VA = 1.5 x VR typical 2A
www.vishay.com For technical questions, contact: diodestech@vishay.com Document Number: 94310
2Revision: 16-Mar-10
VS-MBRB30..CTPbF, VS-MBR30..CT-1PbF Series
Vishay High Power Products Schottky Rectifier, 2 x 15 A
Note
(1) Pulse width < 300 μs, duty cycle < 2 %
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum forward voltage drop VFM (1)
30 A TJ = 25 °C 0.76
V20 A TJ = 125 °C 0.6
30 A 0.72
Maximum instantaneous
reverse current IRM (1) TJ = 25 °C Rated DC voltage 1mA
TJ = 125 °C 100
Threshold voltage VF(TO) TJ = TJ maximum 0.29 V
Forward slope resistance rt13.6 mΩ
Maximum junction capacitance CTVR = 5 VDC (test signal range 100 kHz to 1 MHz), 25 °C 800 pF
Typical series inductance LSMeasured from top of terminal to mounting plane 8.0 nH
Maximum voltage rate of change dV/dt Rated VR10 000 V/μs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction temperature range TJ- 65 to 150 °C
Maximum storage temperature range TStg - 65 to 175
Maximum thermal resistance,
junction to case per leg RthJC DC operation 1.5
°C/W
Typical thermal resistance,
case to heatsink RthCS Mounting surface, smooth and greased 0.50
Maximum thermal resistance,
junction to ambient RthJA DC operation 50
Approximate weight 2g
0.07 oz.
Mounting torque minimum Non-lubricated threads 6 (5) kgf · cm
(lbf · in)
maximum 12 (10)
Marking device Case style D2PAK MBRB3045CT
Case style TO-262 MBR3045CT-1
Document Number: 94310 For technical questions, contact: diodestech@vishay.com www.vishay.com
Revision: 16-Mar-10 3
VS-MBRB30..CTPbF, VS-MBR30..CT-1PbF Series
Schottky Rectifier, 2 x 15 A Vishay High Power Products
Fig. 1 - Maximum Forward Voltage Drop Characteristics (Per Leg) Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage (Per Leg)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage (Per Leg)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics (Per Leg)
1
100
10
IF - Instantaneous
Forward Current (A)
VFM - Forward Voltage Drop (V)
0.3 0.6 0.9 1.2 1.5
0
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
0.001
1
10
100
0.1
0.01
1000
I
R
- Reverse Current (mA)
V
R
- Reverse Voltage (V)
2010 30 40 50
0
TJ = 150 °C
TJ = 125 °C
TJ = 100 °C
TJ = 75 °C
TJ = 50 °C
TJ = 25 °C
100
1000
CT - Junction Capacitance (pF)
VR - Reverse Voltage (V)
2010 30 40 50
0
TJ = 25 °C
0.01
0.1
1
10
0.00001 0.0001 0.001 0.01 0.1 1
t1 - Rectangular Pulse Duration (s)
ZthJC - Thermal Impedance (°C/W)
100 10
Single pulse
(thermal resistance)
D = 0.75
D = 0.50
D = 0.33
D = 0.25
D = 0.20
PDM
t1
t2
Notes:
1. Duty factor D = t1/t2
2. Peak TJ = PDM x ZthJC + TC
www.vishay.com For technical questions, contact: diodestech@vishay.com Document Number: 94310
4Revision: 16-Mar-10
VS-MBRB30..CTPbF, VS-MBR30..CT-1PbF Series
Vishay High Power Products Schottky Rectifier, 2 x 15 A
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current (Per Leg)
Fig. 6 - Forward Power Loss Characteristics (Per Leg)
Fig. 7 - Maximum Non-Repetitive Surge Current (Per Leg)
Note
(1) Formula used: TC = TJ - (Pd + PdREV) x RthJC;
Pd = Forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = Inverse power loss = VR1 x IR (1 - D); IR at VR1 = Rated VR
100
110
120
130
140
150
Allowable Case Temperature (°C)
IF
(
AV
)
- Average Forward Current (A)
10 5 15 20
25
0
DC
See note (1)
Square wave (D = 0.50)
Rated VR applied
0
3
12
9
6
15
Average Power Loss (W)
I
F(AV)
- Average Forward Current (A)
1051520
25
0
DC
RMS limit
D = 0.20
D = 0.25
D = 0.33
D = 0.50
D = 0.75
100
1000
IFSM - Non-Repetitive Surge Current (A)
tp - Square Wave Pulse Duration (µs)
100 1000 10 000
10
At any rated load condition
and with rated VRRM applied
following surge
Document Number: 94310 For technical questions, contact: diodestech@vishay.com www.vishay.com
Revision: 16-Mar-10 5
VS-MBRB30..CTPbF, VS-MBR30..CT-1PbF Series
Schottky Rectifier, 2 x 15 A Vishay High Power Products
ORDERING INFORMATION TABLE
2- Essential part number
3-
4- Current rating (30 = 30 A)
5-
8- None = Tube (50 pieces)
TRL = Tape and reel (left oriented - for D2PAK only)
Voltage ratings
PbF = Lead (Pb)-free (for TO-262 and D2PAK tube)
7-
35 = 35 V
45 = 45 V
None = D2PAK
-1 = TO-262
B = D2PAK
None = TO-262
7
7
None
= -1
6- CT = Essential part number
3 = B
3 None
TRR = Tape and reel (right oriented - for D2PAK only)
9-
P = Lead (Pb)-free (for D2PAK TRR and TRL)
1- HPP product suffix
Device code
51 324
6789
VS- MBR B 30 45 CT -1 TRL PbF
LINKS TO RELATED DOCUMENTS
Dimensions www.vishay.com/doc?95014
Part marking information www.vishay.com/doc?95008
Packaging information www.vishay.com/doc?95032
Document Number: 95014 For technical questions concerning discrete products, contact: diodes-tech@vishay.com www.vishay.com
Revision: 31-Mar-09 For technical questions concerning module products, contact: ind-modules@vishay.com 1
D2PAK, TO-262
Outline Dimensions
Vishay High Power Products
DIMENSIONS FOR D2PAK in millimeters and inches
Notes
(1) Dimensioning and tolerancing per ASME Y14.5 M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall not
exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Datum A and B to be determined at datum plane H
(6) Controlling dimension: inch
(7) Outline conforms to JEDEC outline TO-263AB
SYMBOL MILLIMETERS INCHES NOTES SYMBOL MILLIMETERS INCHES NOTES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
A 4.06 4.83 0.160 0.190 D1 6.86 8.00 0.270 0.315 3
A1 0.00 0.254 0.000 0.010 E 9.65 10.67 0.380 0.420 2, 3
b 0.51 0.99 0.020 0.039 E1 7.90 8.80 0.311 0.346 3
b1 0.51 0.89 0.020 0.035 4 e 2.54 BSC 0.100 BSC
b2 1.14 1.78 0.045 0.070 H 14.61 15.88 0.575 0.625
b3 1.14 1.73 0.045 0.068 4 L 1.78 2.79 0.070 0.110
c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.066 3
c1 0.38 0.58 0.015 0.023 4 L2 1.27 1.78 0.050 0.070
c2 1.14 1.65 0.045 0.065 L3 0.25 BSC 0.010 BSC
D 8.51 9.65 0.335 0.380 2 L4 4.78 5.28 0.188 0.208
c
B
Detail A
c2
AA
A
± 0.004 B
M
A
Lead tip
(3)
(3)
View A - A
(E)
(D1)
E1
B
H
A1
Detail “A”
Rotated 90 °CW
Scale: 8:1
L
Gauge
plane
0° to 8°
L3
L4
Seating
plane
Section B - B and C - C
Scale: None
(4)
(4)
(b, b2)
b1, b3
(c) c1
Base
Metal
Plating
Conforms to JEDEC outline D2PAK (SMD-220)
132
D
C
A
L2
E
(2)(3)
(2)
4
H
BB
2 x b
2 x b2
L1
0.010 AB
MM
(3)
e
2 x
Pad layout
MIN.
11.00
(0.43)
MIN.
9.65
(0.38)
MIN.
3.81
(0.15)
MIN.
2.32
(0.08)
17.90 (0.70)
15.00 (0.625)
2.64 (0.103)
2.41 (0.096)
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
www.vishay.com For technical questions concerning discrete products, contact: diodes-tech@vishay.com Document Number: 95014
2 For technical questions concerning module products, contact: ind-modules@vishay.com Revision: 31-Mar-09
Outline Dimensions
Vishay High Power Products D2PAK, TO-262
DIMENSIONS FOR TO-262 in millimeters and inches
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall not
exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Controlling dimension: inches
(6) Outline conform to JEDEC TO-262 except A1 (maximum), b
(minimum) and D1 (minimum) where dimensions derived the
actual package outline
SYMBOL MILLIMETERS INCHES NOTES
MIN. MAX. MIN. MAX.
A 4.06 4.83 0.160 0.190
A1 2.03 3.02 0.080 0.119
b 0.51 0.99 0.020 0.039
b1 0.51 0.89 0.020 0.035 4
b2 1.14 1.78 0.045 0.070
b3 1.14 1.73 0.045 0.068 4
c 0.38 0.74 0.015 0.029
c1 0.38 0.58 0.015 0.023 4
c2 1.14 1.65 0.045 0.065
D 8.51 9.65 0.335 0.380 2
D1 6.86 8.00 0.270 0.315 3
E 9.65 10.67 0.380 0.420 2, 3
E1 7.90 8.80 0.311 0.346 3
e 2.54 BSC 0.100 BSC
L 13.46 14.10 0.530 0.555
L1 - 1.65 - 0.065 3
L2 3.56 3.71 0.140 0.146
(4)
(4) Base
metal
Plating b1, b3
(b, b2)
c1
c
Section B - B and C - C
Scale: None
Section A - A
(3)
E1
(3)D1
E
B
A
A
A
c2
c
A1
Seating
plane
Lead tip
(3)
(2) (3)
(2)
A
E
(Datum A)
L1
L2
BB
CC
3
2
1
L
D
2 x e
3 x b2
3 x b
0.010 A B
MM
Modified JEDEC outline TO-262
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
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Revision: 02-Oct-12 1Document Number: 91000
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definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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