(All voltages referenced to GND.)
VDD Logic Supply Voltage .......................................-0.3V to +7V
VPP - VNN Supply Voltage ..................................................220V
VPP Positive Supply Voltage ................... -0.3V to (VNN + 220V)
VNN Negative Supply Voltage .............................+0.3V to -220V
Logic Inputs LE, CLR, CLK, DIN ............................. -0.3V to +7V
DOUT ....................................................... -0.3V to (VDD + 0.3V)
RGND (MAX4802A) .............................................-4.5V to +0.3V
COM_, NO_ .............................................................. VNN to VPP
Continuous Power Dissipation (TA = +70°C)
26-Bump CSBGA (derate 11.8mW/°C above +70°C) ....
941mW
28-Pin PLCC (derate 10.5mW/°C above +70°C) ........842mW
48-Pin LQFP (derate 22.7mW/°C above +70°C) ......1818mW
Operating Temperature Range ............................... 0°C to +70°C
Storage Temperature Range ............................ -65°C to +150°C
Junction Temperature ...................................................... +150°C
Lead Temperature (excluding CSBGA, soldering, 10s) .. +300°C
Soldering Temperature (reflow)
28 PLCC ......................................................................+245°C
All other packages ....................................................... +260°C
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package Information
PACKAGE TYPE: 26 CSBGA
Package Code X07265+1
Outline Number 21-0158
Land Pattern Number 90-0184
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA) 85°C/W
Junction to Case (θJC) 23°C/W
PACKAGE TYPE: 28 PLCC
Package Code Q28+13
Outline Number 21-0049
Land Pattern Number 90-0235
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA) 44°C/W
Junction to Case (θJC) 10°C/W
PACKAGE TYPE: 48 LQFP
Package Code C48+6
Outline Number 21-0054
Land Pattern Number 90-0093
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA) 44°C/W
Junction to Case (θJC) 10°C/W
MAX4800A/MAX4802A Low-Charge-Injection, 8-Channel, High-Voltage
Analog Switches with 20MHz Serial Interface
www.maximintegrated.com Maxim Integrated
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