SFH4641-Z - OSRAM Opto Semiconductors

SFH 4641

SFH 4646

Engwinklige LED im MIDLED-Gehäuse (940 nm)

Narrow beam LED in MIDLED package (940 nm)

Lead (Pb) Free Product - RoHS Compliant

2009-09-08 1

SFH 4641 SFH 4646

Wesentliche Merkmale

• Infrarot LED mit hoher Ausgangsleistung

• Kurze Schaltzeiten

• Enger Abstrahlwinkel (± 15°)

• Geringe Bauhöhe

• Als Toplooker und Sidelooker einsetzbar

•SFH 4641: Gurtung als Toplooker

SFH 4646: Gurtung als Sidelooker

Anwendungen

• Infrarotbeleuchtung für Kamera s

• IR-Datenübertragung

• Sensorik in der Automobiltechnik

• Fernsteuerung

Sicherheitshinweise

Je nach Betriebsart emittieren diese Bauteile

hochkonzentrierte, nicht sichtbare Infrarot-

Strahlung, die gefährlich für das menschliche

Auge sein kann. Produkte, die diese Bauteile

enthalten, müssen gemäß den Sicherheits-

richtlinien der IEC-Normen 60825-1 und 62471

behandelt werden.

Typ

Type Bestellnummer

Ordering Code Strahlstärkegruppierung1) (IF = 70 mA, tp = 20 ms)

Radiant Intensity Grouping1)

Ie (mW/sr)

SFH 4641

SFH 4646 Q65110A8098

Q65110A8099 ≥ 16 (typ. 40)

≥ 16 (typ. 40)

1) gemessen bei einem Raumwin ke l Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr

Features

• High Power Infrared LED

• Short switching ti mes

• Narrow halfangle (± 15°)

• Low profile component

• Usable as top-looking and side-looking device

•SFH 4641: Taping as Toplooker

SFH 4646: Taping as Sidelooker

Applications

• Infrared Illumination for cameras

• IR Data Transmission

• Automotive senso r s

• Remote controls

Safety Advices

Depending on the mode of operation, these

devices emit highly concentrated non visible

infrared light which can be hazardous to the

human eye. Products which incorporate these

devices have to follow the safety precautions

given in IEC 60825-1 and IEC 62471.

2009-09-08 2

SFH 4641, SFH 4646

Grenzwerte (TA = 25 °C)

Maximum Ratings

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Betriebs- und Lagertemperatur

Operating and storage temperature range Top , Tstg – 40 … + 100 °C

Sperrspannung

Reverse voltage VR5 V

Vorwärtsgleichstrom

Forward current IF70 mA

Stoßstrom, tp = 25 μs, D = 0

Surge current IFSM 700 mA

Verlustleistung

Power dissipation Ptot 140 mW

Wärmewiderstand Sperrschicht - Umgebung bei

Montage auf FR4 Platine, Padgröße je 16 mm2

Thermal resistance junction - ambient mounted

on PC-board (FR4), padsize 16 mm2 each

Wärmewiderstand Sperrschicht - Lötstelle bei

Montage auf Metall-Block

Thermal resistance junction - soldering point,

mounted on metal block

RthJA

RthJS

380

220

K/W

Kennwerte (TA = 25 °C)

Characteristics

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Wellenlänge der Strahlung

Wavelength at peak emission

IF = 70 mA

λpeak 950 nm

Centroid-Wellenlänge der Strahlung

Centroid wavelength

IF = 70 mA

λcentroid 940 nm

Spektrale Bandbreite bei 50% von Imax

Spectral bandwidth at 50% of Imax

IF = 70 mA

Δλ 42 nm

Abstrahlwinkel

Half angle ϕ± 15 Grad

deg.

Aktive Chipfläche

Active chip area A0.04 mm2

SFH 4641, SFH 4646

2009-09-08 3

Abmessungen der aktiven Chipfläche

Dimension of the active chip area L × B

L × W0.2 × 0.2 mm²

Schaltzeiten, Ie von 10% auf 90% und von 90%

auf 10%, bei IF = 70 mA, RL = 50 Ω

Switching times, Ιe from 10% to 90% and from

90% to 10%, IF = 70 mA, RL = 50 Ω

tr, tf11 ns

Durchlassspannung

Forward voltage

IF = 70 mA, tp = 20 ms

IF = 500 mA, tp = 100 µs

1.6 (< 2.0)

2.4 (< 3.0)

Sperrstrom

Reverse current IRnot designed for

reverse

operation

μA

Gesamtstrahlungsfluss

Total radiant flux

IF = 70 mA, tp = 20 ms

Φe typ 33 mW

Temperaturkoeffizient von Ie bzw. Φe,

IF = 70 mA

Temperature coefficient of Ie or Φe,

IF = 70 mA

TCI– 0.5 %/K

Temperaturkoeffizient von VF, IF = 70 mA

Temperature coefficient of VF, IF = 70 mA TCV– 3.5 mV/K

Temperaturkoeffizient von λ, IF = 70 mA

Temperature coefficient of λ, IF = 70 mA TCλ+ 0.3 nm/K

Kennwerte (TA = 25 °C)

Characteristics (cont’d)

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

2009-09-08 4

SFH 4641, SFH 4646

Strahlstärke Ie in Achsrichtung1)

gemessen bei einem Raumwinkel Ω = 0.01 sr

Radiant Intensity Ie in Axial Direction

at a solid angle of Ω = 0.01 sr

Bezeichnung

Parameter Symbol Werte

Values Einheit

Unit

-S -T -U -V

Strahlstärke

Radiant intensity

IF = 70 mA, tp = 20 ms

Ie min

Ie max

32 25

50 40

80 63

125 mW/sr

mW/sr

Strahlstärke

Radiant intensity

IF = 500 mA, tp = 25 µs

Ie typ 120 185 295 465 mW/sr

1) Nur eine Gruppe in einer Verp ackungseinheit (Streuung kleiner 2:1) /

Only one bin in one packing unit (variation lower 2:1)

Abstrahlcharakteristik

Radiation Characteristics Irel = f (ϕ)

OHF03823

0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0

100˚

90˚

80˚

70˚

60˚

50˚

0˚10˚20˚30˚40˚

0.2

0.4

0.6

0.8

1.0

SFH 4641, SFH 4646

2009-09-08 5

Relative Spectral Emission

Irel = f (λ)

Forward Current IF = f (VF)

Single pulse, tp = 100 μs

800

0nm

OHF04134

100

rel

850 900 950 1025

OHF03828

-4

0.5 1 1.5 2 2.5 V3

-1

-2

-3

Radiant Intensity

Single pulse, tp = 25 μs

Permissible Pulse Handling

Capability IF = f (τ), TA = 25 °C,

duty cycle D = parameter

Ie 70 mA = f (IF)

OHF03827

-2

1055

-1

(70 mA)

0-5

OHF04058

-4

10 -3

10 -2

10 -1

10 0

10 1

10 2

1010

0.05

0.5

0.1

0.3

0.005

0.01

0.02

0.2

0.1

0.2

0.3

0.4

0.5

0.6

0.7

Max. Permissible Forward Current

IF = f (TA), RthJA = 380 K/W

Permissible Pulse Handling

Capability IF = f (τ), TA = 85 °C,

duty cycl e D = parameter

0˚C

OHF04057

20 40 60 80

100 120

0-5

OHF04059

-4

10 -3

10 -2

10 -1

10 0

10 1

10 2

1010

0.05

0.5

0.1

0.3

0.005

0.01

0.02

0.2

0.1

0.2

0.3

0.4

0.5

0.6

0.7

2009-09-08 6

SFH 4641, SFH 4646

Maßzeichnung

Package Outlines

Maße in mm / Dimensions in mm.

Gehäuse / Package MID mit klarem Silikonverguss / MID casted with clear Silicone

Anschlussbelegung

Pin configuration Pad 1 = Anode / anode

Pad 2 = Kathode / cathode

SFH 4641, SFH 4646

2009-09-08 7

Gurtung / Polarität und Lage Verpackungseinheit 2000/Rolle, ø180 mm

oder 9000/Rolle, ø330 mm

Method of Taping / Polarity and Orientation Packing unit 2000/reel, ø180 mm

or 9000/reel, ø330 mm

Maße in mm (inch) / Dimensions in mm (inch).

OHAY2431

8 (0.315)

1.75 (0.069)

4 (0.157)

2.55 (0.100) ±0.05 (0.002)

0.3 (0.012) ±0.02 (0.001)

±0.05 (0.002)

1.75 (0.069)

3.4 (0.134)

±0.05 (0.002)

2˚

1.5 (0.059) +0.1 (0.004)

3.5 (0.138)

±0.05 (0.002)

2 (0.079) ±0.05 (0.002)

Pad 1 Orientation

SFH 4641

OHAY2430

2.3 (0.091)

8 (0.315)

4 (0.157)

3.3 (0.130)

±0.15 (0.006)

0.3 (0.012)

±0.02 (0.001)

±0.05 (0.002)

2.45 (0.096)

3.25 (0.128)

±0.05 (0.002)

2˚

±0.05 (0.002)

2 (0.079)

1.7 (0.067)

±0.05 (0.002)

3.5 (0.138)

±0.05 (0.002)

1.75 (0.069)

1.5 (0.059)

+0.1 (0.004)

Pad 1 Orientation

Optical axis/viewing direction

SFH 4641

SFH 4646

2009-09-08 8

SFH 4641, SFH 4646

Empfohlenes Lötpaddesign

Recommended Solder Pad Design

Maße in mm / Dimensions in mm.

Verarbeitungshinweis: Das Gehäuse ist mit Silikon vergossen. Mechanischer Stress auf der

Bauteiloberfläche sollte so gering wie möglich gehalten werden.

Handling indication: The package is casted with silicone. Mechanical stress at the surface of

the unit should be as low as possible.

OHF02422

4.0

2.4

1.35

Padgeometrie für

heat dissipation

Lötstopplack

Solder resist

verbesserte Wärmeableitung

Paddesign for improved

Cu-Fläche > 16 mm

Cu-area 2

SFH 4641

4.5

1.7

1.25

verbesserte Wärmeableitung

OHF02421

Solder resist

Cu-Fläche > 16 mm

Paddesign for improved

Lötstopplack

heat dissipation

Padgeometrie für

Cu-area

SFH 4646

SFH 4641, SFH 4646

2009-09-08 9

Lötbedingungen Vorbehandlung nach JEDEC Level 2

Soldering Conditions Preconditioning acc. to JEDEC Level 2

Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)

Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)

Published by

OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg

www.osram-os.com

The information describes the type of component and shall not be considered as as sured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in question please contact our Sales Organization.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components 1 , may only be use d in life-support devices or systems 2 with the express written approval of OSRAM OS.

1 A critical componen t is a component usedin a life-support device or syste m whose failure can reasonably be expected

to cause the failure of that life-support devic e or system, or to a ffect its safety or e ffectiveness of that device or system.

2 Life support devices or syste ms are intended (a) to be implanted in the human body, o r (b) to support and/or maintain

and sustain human life. If they fail, it is reas onable to assume that the health of the user may be endangered.

OHLA0687

˚C

120 s max

100

150

200

250

300

Ramp Up

100 s max

50 100 150 200 250 300

Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C

30 s max

260 ˚C +0 ˚C

-5 ˚C

245 ˚C ±5 ˚C

240 ˚C

255 ˚C

217 ˚C

Maximum Solder Profile

Recommended Solder Profile

235 ˚C -0 ˚C

+5 ˚C

Minimum Solder Profile

10 s min