HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6762
Issued Date : 1994.11.09
Revised Date : 2002. 01.15
Page No. : 1/3
HD44H11 HSMC Product Specification
HD44H11
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HD44H11 is designed for various specific and general purpose
applicati ons, s uch as:ou tput and dr iv er st ages o f ampli fiers oper ating
at frequencies from DC to greater than 1MHz; series, shunt and
switching regulators; low and high frequency inverters/converters;
and many others.
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Storage Temper ature............................................................................................ -55 ~ +150 °C
Junction Temperature.....................................................................................+150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)..................................................................................... 50 W
Total Power Dissipation (Ta=25°C).................................................................................. 1.67 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage....................................................................................... 80 V
BVCEO Collector to Emitter Voltage.................................................................................... 80 V
BVEBO Emitter to Base Voltage............................................................................................ 5 V
IC Collector Current............................................................................................................. 10 A
IB Base Current..................................................................................................................... 5 A
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 80 - - V IC=100mA, IB=0
BVCEO 80 - - V IC=100mA, IB=0
BVCES 80 - - V IC=1mA, IC= 0
BVEBO 5 - - V IE=1mA
ICES - - 10 uA VCE=80V
IEBO - - 100 uA VEB=5V
*VCE(sat) - - 1 V IC=8A, IB=0.4A
*VBE(sat) - - 1.5 V IC=8A, IB=0.8A
*hFE1 60 - - IC=2A, VCE=1V
*hFE2 40 - - IC=4A, VCE=1V
Cob - 130 - pF VCB=10V
fT - 50 - MHz VCE=1V, IC=500mA, f=100MHz
*Pulse Test: Pulse Width ≤380us, Dut y Cycle≤2%
TO-220
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6762
Issued Date : 1994.11.09
Revised Date : 2002. 01.15
Page No. : 2/3
HD44H11 HSMC Product Specification
Characteristics Curve
Cur ren t Gain & Collect or Curren t
10
100
1000
1 10 100 1000 10000
Coll e c tor Cur rent I
C
(mA)
hFE
25
o
C
75
o
C
125
o
C
hFE @ V
CE
=1V
Satur ation Volta ge & C ollect or Cur rent
10
100
1000
1 10 100 1000 10000
Coll e c tor Cur rent I
C
(mA)
Sat u r ation Volt ag e ( mV)
25
o
C
75
o
C
125
o
C
VC
E(sat)
@ I
C
=20I
B
Satur ation Voltage & C ollect or Curren t
100
1000
10000
1 10 100 1000 10000
Coll e c tor Cur rent I
C
(mA)
Satur a t ion Voltag e ( mV)
25
o
C
75
o
C
125
o
CV
BE(sat)
@ I
C
=10I
B
Capa ci t ance & Rev erse-Bia sed Volta ge
10
100
1000
1 10 100
R ever s e Biased Vol t a ge (V)
Capacitan ce ( Pf)
Cob
Safe Opera ting Ar ea
0.01
0.1
1
10
100
1 10 100 1000
Forward Vol t a ge ( V)
Collect o r Cu rr ent ( A
)
P
T
=1 ms
P
T
=100 ms
P
T
=1s
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6762
Issued Date : 1994.11.09
Revised Date : 2002. 01.15
Page No. : 3/3
HD44H11 HSMC Product Specification
TO-220AB Dimension
*: Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max. DIM Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I - *0.1508 - *3.83
B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40
D 0.0453 0.0547 1.15 1.39 N - *0.1000 - *2.54
E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H - *0.6398 - *16.25
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controll i ng dimensi on: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any questi on with packi ng specifi cation or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Allo y; solder plati ng
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its produc ts without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any cons equence of cust om er product design, infringement of patents, or applicat ion assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O. C.
Tel : 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industri al Pa rk Hsi n-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax: 886-3-5982931
AB
E
G
IK
M
OP
3
2
1
C
N
H
D
4
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-220AB Plastic Pac k age
HSMC Package Code: E
Marking:
Date Code Control Code
H
D44H11
