TM3
www.vishay.com Vishay Sprague
Revision: 07-Feb-2019 1Document Number: 40166
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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Solid Tantalum Surface Mount Chip Capacitors
TANTAMOUNT™, Molded Case, for Medical Instruments
PERFORMANCE / ELECTRICAL
CHARACTERISTICS
www.vishay.com/doc?40209
Operating Temperature: -55 °C to +125 °C
(above 85 °C, voltage derating is required)
Capacitance Range: 1 μF to 220 μF
Capacitance Tolerance: ± 10 %, ± 20 % standard
Voltage Rating: 4 VDC to 20 VDC
Note
• For recommended voltage derating guidelines see “Typical
Performance Characteristics”
FEATURES
•For non-life support medical applications
• High reliability
• Weibull grading options
• DC leakage at 0.005 CV
• 100 % surge current tested (B, C, D, E cases)
• Terminations: 100 % matte tin and tin / lead
• Standard EIA 535BAAC case sizes (A through E)
• Manufacturing location is certified to medical standard
ISO 13485
• Compliant terminations
• Dry pack as per IPC / JEDEC® J-STD-033 standard
• Moisture sensitivity level 1
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
Note
• Dry pack as specified in J-STD-033 for MSL3. Applicable for D and E cases only
Available
Available
Available
ORDERING INFORMATION
TM3 C 226 K 6R3 C B A
TYPE CASE
CODE
CAPACITANCE CAPACITANCE
TOLERANCE
DC VOLTAGE
RATING AT +85 °C
TERMINATION
AND PACKAGING
RELIABILITY
LEVEL
SURGE
CURRENT
See
Ratings
and Case
Codes
table.
This is
expressed
in picofarads.
The first two
digits are
the significant
figures.
The third is the
number of
zeros to follow.
K = ± 10 %
M = ± 20 %
This is expressed
in volts. To
complete the
three-digit block,
zeros precede
the voltage rating.
A decimal point is
indicated by an “R”
(6R3 = 6.3 V).
Matte tin
C = 7" (178 mm) reel
H = 7" (178 mm) ½ reel
V = 7" (178 mm) reel,
dry pack
Tin / lead
E = 7" (178 mm) reel
L = 7" (178 mm) ½ reel
T = 7" (178 mm) reel,
dry pack
B = 0.1 %
Weibull FRL
S = hi-rel std.
(40 h burn-in)
Z = non-
established
reliability
A = 10 cycles at
+25 °C, 1.1 RV
Z = no surge
(for A case only)
TM3
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Revision: 07-Feb-2019 2Document Number: 40166
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Note
• Glue pad (non-conductive, part of molded case) is dedicated for glue attachment (as user option)
DIMENSIONS in inches (millimeters)
CASE CODE EIA SIZE L W H P TWTH (MIN.)
A 3216-18
0.126 ± 0.008
[3.2 ± 0.20] 0.063 ± 0.008
[1.6 ± 0.20] 0.063 ± 0.008
[1.6 ± 0.20] 0.031 ± 0.012
[0.80 ± 0.30] 0.047 ± 0.004
[1.2 ± 0.10] 0.028
[0.70]
B 3528-21
0.138 ± 0.008
[3.5 ± 0.20] 0.110 ± 0.008
[2.8 ± 0.20] 0.075 ± 0.008
[1.9 ± 0.20] 0.031 ± 0.012
[0.80 ± 0.30] 0.087 ± 0.004
[2.2 ± 0.10] 0.028
[0.70]
C 6032-28
0.236 ± 0.012
[6.0 ± 0.30] 0.126 ± 0.012
[3.2 ± 0.30] 0.098 ± 0.012
[2.5 ± 0.30] 0.051 ± 0.012
[1.3 ± 0.30] 0.087 ± 0.004
[2.2 ± 0.10] 0.039
[1.0]
D 7343-31
0.287 ± 0.012
[7.3 ± 0.30] 0.169 ± 0.012
[4.3 ± 0.30] 0.110 ± 0.012
[2.8 ± 0.30] 0.051 ± 0.012
[1.3 ± 0.30] 0.094 ± 0.004
[2.4 ± 0.10] 0.039
[1.0]
E 7343-43
0.287 ± 0.012
[7.3 ± 0.30] 0.169 ± 0.012
[4.3 ± 0.30 0.157 ± 0.012
[4.0 ± 0.30] 0.051 ± 0.012
[1.3 ± 0.30] 0.094 ± 0.004
[2.4 ± 0.10] 0.039
[1.0]
RATINGS AND CASE CODES
μF 4 V 6.3 V 10 V 16 V 20 V
1.0 A
1.5 A A
2.2 A A A / B B
3.3 A A A / B B
4.7 A / B A / B C
6.8 B B B B / C
10 A / B A / B B / C C
15 B / C B / C
22 A / B / C B / C B / C / D C / D
33 B B / C / D D D
47 B / C / D C / D C / D E
68BDDD
100 D D D D / E
150 D D
220 D / E D / E E
MARKING
“A” CASE VOLTAGE CODE
VOLTS CODE
4.0 G
6.3 J
10 A
16 C
20 D
25 E
35 V
50 T
Marking
Capacitor marking includes an anode (+) polarity band, capacitance in microfarads and the voltage rating. “A” case capacitors use a letter
code for the voltage and EIA capacitance code.
The Vishay identification is included if space permits. Capacitors rated at 6.3 V are marked 6 V.
A manufacturing date code is marked on all capacitors, for details see FAQ: www.vishay.com/doc?40110.
Call the factory for further explanation.
H
WTW
P
L
TH
(MIN.)
Glue Pad
Glue Pad
Capacitance code, pF
Indicates TM3 series
Polarity band (+) Voltage code
J225M
A Case
Date code
designation
Date code Vishay marking
Indicates TM3 series
Voltage
Capacitance μF
Polarity
band (+)
22 M10
XX
2
B, C, D, E Cases
TM3
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Revision: 07-Feb-2019 3Document Number: 40166
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STANDARD RATINGS
CAPACITANCE
(μF) CASE CODE PART NUMBER
MAX. DCL
AT +25 °C
(μA)
MAX. DF
AT +25 °C
120 Hz
(%)
MAX. ESR
AT +25 °C
100 kHz
()
MAX. RIPPLE
100 kHz
IRMS
(A)
4 VDC AT +85 °C; 2.7 VDC AT +125 °C
68 B TM3B686(1)004(2)(3)A 1.36 6 1.90 0.21
100 D TM3D107(1)004(4)(3)A 2.00 6 0.70 0.46
150 D TM3D157(1)004(4)(3)A 3.00 8 0.60 0.50
220 D TM3D227(1)004(4)(3)A 4.40 8 0.60 0.50
220 E TM3E227(1)004(4)(3)A 4.40 8 0.50 0.57
6.3 VDC AT +85 °C; 4 VDC AT +125 °C
2.2 A TM3A225(1)6R3(2)(3)Z 0.25 6 7.60 0.10
3.3 A TM3A335(1)6R3(2)(3)Z 0.25 6 6.30 0.11
6.8 B TM3B685(1)6R3(2)(3)A 0.25 6 3.40 0.16
10 A TM3A106(1)6R3(2)(3)Z 0.32 6 3.40 0.15
10 B TM3B106(1)6R3(2)(3)A 0.30 6 2.90 0.17
22 A TM3A226(1)6R3(2)(3)Z 0.66 6 2.90 0.16
22 B TM3B226(1)6R3(2)(3)A 0.69 6 2.00 0.21
22 C TM3C226(1)6R3(2)(3)A 0.66 6 1.80 0.25
33 B TM3B336(1)6R3(2)(3)A 0.99 6 1.90 0.21
47 B TM3B476(1)6R3(2)(3)A 1.41 6 1.90 0.21
47 C TM3C476(1)6R3(2)(3)A 1.41 6 1.40 0.28
47 D TM3D476(1)6R3(4)(3)A 1.41 6 0.80 0.43
68 D TM3D686(1)6R3(4)(3)A 2.04 6 0.70 0.46
100 D TM3D107(1)6R3(4)(3)A 3.00 6 0.14 1.04
150 D TM3D157(1)6R3(4)(3)A 4.50 8 0.60 0.50
220 D TM3D227(1)6R3(4)(3)A 6.60 8 0.60 0.50
220 E TM3E227(1)6R3(4)(3)A 6.60 8 0.50 0.57
10 VDC AT +85 °C; 7 VDC AT +125 °C
1.5 A TM3A155(1)010(2)(3)Z 0.25 6 8.00 0.10
2.2 A TM3A225(1)010(2)(3)Z 0.25 6 6.30 0.11
3.3 A TM3A335(1)010(2)(3)Z 0.25 6 5.50 0.12
4.7 A TM3A475(1)010(2)(3)Z 0.25 6 5.00 0.12
4.7 B TM3B475(1)010(2)(3)A 0.25 6 3.40 0.16
6.8 B TM3B685(1)010(2)(3)A 0.34 6 2.90 0.17
10 A TM3A106(1)010(2)(3)Z 0.50 6 3.40 0.15
10 B TM3B106(1)010(2)(3)A 0.50 6 2.50 0.18
15 B TM3B156(1)010(2)(3)A 0.75 6 2.00 0.21
15 C TM3C156(1)010(2)(3)A 0.75 6 1.80 0.25
22 B TM3B226(1)010(2)(3)A 1.10 6 1.90 0.21
22 C TM3C226(1)010(2)(3)A 1.10 6 0.35 0.56
33 B TM3B336(1)010(2)(3)A 1.65 6 1.90 0.21
33 C TM3C336(1)010(2)(3)A 1.65 6 1.40 0.28
33 D TM3D336(1)010(4)(3)A 1.65 6 0.80 0.43
47 C TM3C476(1)010(2)(3)A 2.35 6 1.10 0.32
47 D TM3D476(1)010(4)(3)A 2.35 6 0.70 0.46
68 D TM3D686(1)010(4)(3)A 3.40 6 0.70 0.46
100 D TM3D107(1)010(4)(3)A 5.00 6 0.60 0.50
220 E TM3E227(1)010(4)(3)A 11.00 8 0.50 0.57
Note
• Part number definitions:
(1) Capacitance tolerance: K, M
(2) Termination and packaging: C, E, H, L
(3) Reliability level: B, S, Z
(4) Termination and packaging: C, E, H, L, V, T
TM3
www.vishay.com Vishay Sprague
Revision: 07-Feb-2019 4Document Number: 40166
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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16 VDC AT +85 °C; 10 VDC AT +125 °C
1.0 A TM3A105(1)016(2)(3)Z 0.25 4 9.30 0.09
1.5 A TM3A155(1)016(2)(3)Z 0.25 6 6.70 0.11
2.2 A TM3A225(1)016(2)(3)Z 0.25 6 4.00 11.00
2.2 B TM3B225(1)016(2)(3)A 0.25 6 4.60 0.14
3.3 A TM3A335(1)016(2)(3)Z 0.26 6 3.50 0.15
3.3 B TM3B335(1)016(2)(3)A 0.26 6 3.50 0.16
4.7 A TM3A475(1)016(2)(3)Z 0.38 6 5.00 0.12
4.7 B TM3B475(1)016(2)(3)A 0.38 6 2.90 0.17
6.8 B TM3B685(1)016(2)(3)A 0.54 6 2.50 0.18
10 B TM3B106(1)016(2)(3)A 0.80 6 2.00 0.21
10 C TM3C106(1)016(2)(3)A 0.80 6 1.80 0.25
15 B TM3B156(1)016(2)(3)A 1.20 6 2.00 0.21
15 C TM3C156(1)016(2)(3)A 1.20 6 0.40 0.52
22 B TM3B226(1)016(2)(3)A 1.76 6 1.90 0.21
22 C TM3C226(1)016(2)(3)A 1.76 6 1.40 0.28
22 D TM3D226(1)016(4)(3)A 1.76 6 0.80 0.43
33 D TM3D336(1)016(4)(3)A 2.64 6 0.70 0.46
47 C TM3C476(1)016(2)(3)A 3.76 6 1.00 0.33
47 D TM3D476(1)016(4)(3)A 3.76 6 0.70 0.46
68 D TM3D686(1)016(4)(3)A 5.44 6 0.60 0.50
100 D TM3D107(1)016(4)(3)A 8.00 8 0.60 0.50
100 E TM3E107(1)016(4)(3)A 8.00 8 0.60 0.52
20 VDC AT +85 °C; 13 VDC AT +125 °C
2.2 B TM3B225(1)020(2)(3)A 0.25 6 3.50 0.16
3.3 B TM3B335(1)020(2)(3)A 0.33 6 3.00 0.17
4.7 C TM3C475(1)020(2)(3)A 0.47 6 2.30 0.22
6.8 B TM3B685(1)020(2)(3)A 0.68 6 2.50 0.18
6.8 C TM3C685(1)020(2)(3)A 0.68 6 1.90 0.24
10 C TM3C106(1)020(2)(3)A 1.00 6 1.70 0.25
22 C TM3C226(1)020(2)(3)A 2.20 6 1.10 0.32
22 D TM3D226(1)020(4)(3)A 2.20 6 0.70 0.46
33 D TM3D336(1)020(4)(3)A 3.30 6 0.70 0.46
47 E TM3E476(1)020(4)(3)A 4.70 6 0.60 0.52
STANDARD RATINGS
CAPACITANCE
(μF) CASE CODE PART NUMBER
MAX. DCL
AT +25 °C
(μA)
MAX. DF
AT +25 °C
120 Hz
(%)
MAX. ESR
AT +25 °C
100 kHz
()
MAX. RIPPLE
100 kHz
IRMS
(A)
Note
• Part number definitions:
(1) Capacitance tolerance: K, M
(2) Termination and packaging: C, E, H, L
(3) Reliability level: B, S, Z
(4) Termination and packaging: C, E, H, L, V, T
TM3
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Revision: 07-Feb-2019 5Document Number: 40166
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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POWER DISSIPATION
CASE CODE MAXIMUM PERMISSIBLE POWER DISSIPATION AT +25 °C (W) IN FREE AIR
A 0.075
B 0.085
C 0.110
D 0.150
E 0.165
STANDARD PACKAGING QUANTITY
CASE CODE UNITS PER REEL
7" FULL REEL 7" HALF REEL
A 2000 1000
B 2000 1000
C 500 250
D 500 250
E 400 200
PRODUCT INFORMATION
Guide for Molded Tantalum Capacitors
www.vishay.com/doc?40074
Pad Dimensions
Packaging Dimensions
Moisture Sensitivity (MSL) www.vishay.com/doc?40135
SELECTOR GUIDES
Solid Tantalum Selector Guide www.vishay.com/doc?49053
Solid Tantalum Chip Capacitors www.vishay.com/doc?40091
FAQ
Frequently Asked Questions www.vishay.com/doc?40110
Molded Guide
www.vishay.com Vishay Sprague
Revision: 13-Dec-2018 1Document Number: 40074
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Guide for Molded Tantalum Capacitors
INTRODUCTION
Tantalum electrolytic capacitors are the preferred choice in
applications where volumetric efficiency, stable electrical
parameters, high reliability, and long service life are primary
considerations. The stability and resistance to elevated
temperatures of the tantalum / tantalum oxide / manganese
dioxide system make solid tantalum capacitors an
appropriate choice for today's surface mount assembly
technology.
Vishay Sprague has been a pioneer and leader in this field,
producing a large variety of tantalum capacitor types for
consumer, industrial, automotive, military, and aerospace
electronic applications.
Tantalum is not found in its pure state. Rather, it is
commonly found in a number of oxide minerals, often in
combination with Columbium ore. This combination is
known as “tantalite” when its contents are more than
one-half tantalum. Important sources of tantalite include
Australia, Brazil, Canada, China, and several African
countries. Synthetic tantalite concentrates produced from
tin slags in Thailand, Malaysia, and Brazil are also a
significant raw material for tantalum production.
Electronic applications, and particularly capacitors,
consume the largest share of world tantalum production.
Other important applications for tantalum include cutting
tools (tantalum carbide), high temperature super alloys,
chemical processing equipment, medical implants, and
military ordnance.
Vishay Sprague is a major user of tantalum materials in the
form of powder and wire for capacitor elements and rod and
sheet for high temperature vacuum processing.
THE BASICS OF TANTALUM CAPACITORS
Most metals form crystalline oxides which are
non-protecting, such as rust on iron or black oxide on
copper. A few metals form dense, stable, tightly adhering,
electrically insulating oxides. These are the so-called
“valve”metals and include titanium, zirconium, niobium,
tantalum, hafnium, and aluminum. Only a few of these
permit the accurate control of oxide thickness by
electrochemical means. Of these, the most valuable for the
electronics industry are aluminum and tantalum.
Capacitors are basic to all kinds of electrical equipment,
from radios and television sets to missile controls and
automobile ignitions. Their function is to store an electrical
charge for later use.
Capacitors consist of two conducting surfaces, usually
metal plates, whose function is to conduct electricity. They
are separated by an insulating material or dielectric. The
dielectric used in all tantalum electrolytic capacitors is
tantalum pentoxide.
Tantalum pentoxide compound possesses high-dielectric
strength and a high-dielectric constant. As capacitors are
being manufactured, a film of tantalum pentoxide is applied
to their electrodes by means of an electrolytic process. The
film is applied in various thicknesses and at various voltages
and although transparent to begin with, it takes on different
colors as light refracts through it. This coloring occurs on the
tantalum electrodes of all types of tantalum capacitors.
Rating for rating, tantalum capacitors tend to have as much
as three times better capacitance / volume efficiency than
aluminum electrolytic capacitors. An approximation of the
capacitance / volume efficiency of other types of capacitors
may be inferred from the following table, which shows the
dielectric constant ranges of the various materials used in
each type. Note that tantalum pentoxide has a dielectric
constant of 26, some three times greater than that of
aluminum oxide. This, in addition to the fact that extremely
thin films can be deposited during the electrolytic process
mentioned earlier, makes the tantalum capacitor extremely
efficient with respect to the number of microfarads available
per unit volume. The capacitance of any capacitor is
determined by the surface area of the two conducting
plates, the distance between the plates, and the dielectric
constant of the insulating material between the plates.
In the tantalum electrolytic capacitor, the distance between
the plates is very small since it is only the thickness of the
tantalum pentoxide film. As the dielectric constant of the
tantalum pentoxide is high, the capacitance of a tantalum
capacitor is high if the area of the plates is large:
where
C = capacitance
e = dielectric constant
A = surface area of the dielectric
t = thickness of the dielectric
Tantalum capacitors contain either liquid or solid
electrolytes. In solid electrolyte capacitors, a dry material
(manganese dioxide) forms the cathode plate. A tantalum
lead is embedded in or welded to the pellet, which is in turn
connected to a termination or lead wire. The drawings show
the construction details of the surface mount types of
tantalum capacitors shown in this catalog.
COMPARISON OF CAPACITOR
DIELECTRIC CONSTANTS
DIELECTRIC e
DIELECTRIC CONSTANT
Air or vacuum 1.0
Paper 2.0 to 6.0
Plastic 2.1 to 6.0
Mineral oil 2.2 to 2.3
Silicone oil 2.7 to 2.8
Quartz 3.8 to 4.4
Glass 4.8 to 8.0
Porcelain 5.1 to 5.9
Mica 5.4 to 8.7
Aluminum oxide 8.4
Tantalum pentoxide 26
Ceramic 12 to 400K
CeA
t
-------
=
Molded Guide
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Revision: 13-Dec-2018 2Document Number: 40074
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SOLID ELECTROLYTE TANTALUM CAPACITORS
Solid electrolyte capacitors contain manganese dioxide,
which is formed on the tantalum pentoxide dielectric layer
by impregnating the pellet with a solution of manganous
nitrate. The pellet is then heated in an oven, and the
manganous nitrate is converted to manganese dioxide.
The pellet is next coated with graphite, followed by a layer
of metallic silver, which provides a conductive surface
between the pellet and the leadframe.
Molded Chip tantalum capacitor encases the element in
plastic resins, such as epoxy materials. After assembly, the
capacitors are tested and inspected to assure long life and
reliability. It offers excellent reliability and high stability for
consumer and commercial electronics with the added
feature of low cost
Surface mount designs of “Solid Tantalum” capacitors use
lead frames or lead frameless designs as shown in the
accompanying drawings.
TANTALUM CAPACITORS FOR ALL DESIGN
CONSIDERATIONS
Solid electrolyte designs are the least expensive for a given
rating and are used in many applications where their very
small size for a given unit of capacitance is of importance.
They will typically withstand up to about 10 % of the rated
DC working voltage in a reverse direction. Also important
are their good low temperature performance characteristics
and freedom from corrosive electrolytes.
Vishay Sprague patented the original solid electrolyte
capacitors and was the first to market them in 1956. Vishay
Sprague has the broadest line of tantalum capacitors and
has continued its position of leadership in this field. Data
sheets covering the various types and styles of Vishay
Sprague capacitors for consumer and entertainment
electronics, industry, and military applications are available
where detailed performance characteristics must be
specified.
MOLDED CHIP CAPACITOR
Leadframe
Epoxy
Encapsulation
Anode
Polarity Bar
Solderable
Cathode
Termination
Silver
Adhesive
MnO2/Carbon/
Silver Coating
Solderable Anode
Termination
Sintered
Tantalum
Molded Guide
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Revision: 13-Dec-2018 3Document Number: 40074
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COMMERCIAL PRODUCTS
SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES 293D 793DX-CTC3-
CTC4 593D TR3 TP3 TL3
PRODUCT IMAGE
TYPE Surface mount TANTAMOUNT™, molded case
FEATURES Standard
industrial grade CECC approved Low ESR Low ESR High performance,
automotive grade Very low DCL
TEMPERATURE
RANGE -55 °C to +125 °C
CAPACITANCE
RANGE 0.1 µF to 1000 µF 0.1 µF to 100 µF 1 µF to 470 µF 0.47 µF to 1000 µF 0.1 µF to 470 µF 0.1 µF to 470 µF
VOLTAGE RANGE 4 V to 75 V 4 V to 50 V 4 V to 50 V 4 V to 75 V 4 V to 50 V 4 V to 50 V
CAPACITANCE
TOLERANCE ± 10 %, ± 20 %
LEAKAGE
CURRENT 0.01 CV or 0.5 A, whichever is greater
0.005 CV or
0.25 A,
whichever is
greater
DISSIPATION
FACTOR 4 % to 30 % 4 % to 6 % 4 % to 15 % 4 % to 30 % 4 % to 15 % 4 % to 15 %
CASE CODES A, B, C, D, E A, B, C, D A, B, C, D, E A, B, C, D, E, W A, B, C, D, E A, B, C, D, E
TERMINATION 100 % matte tin standard, tin / lead available
SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES TH3 TH4 TH5
PRODUCT IMAGE
TYPE Surface mount TANTAMOUNT™, molded case
FEATURES High temperature +150 °C,
automotive grade
High temperature +175 °C,
automotive grade Very high temperature +200 °C
TEMPERATURE
RANGE -55 °C to +150 °C -55 °C to +175 °C -55 °C to +200 °C
CAPACITANCE
RANGE 0.33 µF to 220 µF 10 µF to 100 µF 4.7 µF to 100 µF
VOLTAGE RANGE 6.3 V to 50 V 6.3 V to 35 V 5 V to 24 V
CAPACITANCE
TOLERANCE ± 10 %, ± 20 %
LEAKAGE
CURRENT 0.01 CV or 0.5 A, whichever is greater
DISSIPATION
FACTOR 4 % to 8 % 4.5 % to 8 % 6 % to 10 %
CASE CODES A, B, C, D, E B, C, D, E D, E
TERMINATION
100 % matte tin standard,
tin / lead and gold plated available
100 % matte tin Gold plated
Molded Guide
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HIGH RELIABILITY PRODUCTS
SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES TM3 T83 CWR11 95158
PRODUCT
IMAGE
TYPE TANTAMOUNT™,
molded case, hi-rel.
TANTAMOUNT™,
molded case,
hi-rel. COTS
TANTAMOUNT™, molded case,
DLA approved
FEATURES High reliability,
for medical Instruments
High reliability,
standard and low ESR MIL-PRF-55365/8 qualified Low ESR
TEMPERATURE
RANGE -55 °C to +125 °C
CAPACITANCE
RANGE 1 µF to 220 µF 0.1 µF to 470 µF 0.1 µF to 100 µF 4.7 µF to 220 µF
VOLTAGE RANGE 4 V to 20 V 4 V to 63 V 4 V to 50 V
CAPACITANCE
TOLERANCE ± 10 %, ± 20 % ± 5 %, ± 10 %, ± 20 % ± 10 %, ± 20 %
LEAKAGE
CURRENT
0.005 CV or 0.25 µA,
whichever is greater 0.01 CV or 0.5 A, whichever is greater
DISSIPATION
FACTOR 4 % to 8 % 4 % to 15 % 4 % to 6 % 4 % to 12 %
CASE CODES A, B, C, D, E A, B, C, D, E A, B, C, D C, D, E
TERMINATION 100 % matte tin;
tin / lead
100 % matte tin;
tin / lead;
tin / lead solder fused
Tin / lead;
tin / lead solder fused
Tin / lead solder plated;
gold plated
Molded Guide
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Notes
• Metric dimensions will govern. Dimensions in inches are rounded and for reference only.
(1) A0, B0, K0, are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent
rotation of the component within the cavity of not more than 20°.
(2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide
“R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum.
(3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed
cavities or to the edge of the cavity whichever is less.
(4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier
tape between the embossed cavity or to the edge of the cavity whichever is less.
(5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. Dimensions of
embossement location shall be applied independent of each other.
(6) B1 dimension is a reference dimension tape feeder clearance only.
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
Tape and Reel Specifications: all case sizes are available
on plastic embossed tape per EIA-481. Standard reel
diameter is 7" [178 mm], 13" [330 mm] reels are available and
recommended as the most cost effective packaging method.
The most efficient packaging quantities are full reel
increments on a given reel diameter. The quantities shown
allow for the sealed empty pockets required to be in
conformance with EIA-481. Reel size and packaging
orientation must be specified in the Vishay Sprague part
number.
CASE
CODE
TAPE
SIZE
B1
(MAX.)
D1
(MIN.) FK0
(MAX.) P1W
MOLDED CHIP CAPACITORS; ALL TYPES
A8 mm 0.165
[4.2]
0.039
[1.0]
0.138 ± 0.002
[3.5 ± 0.05]
0.094
[2.4]
0.157 ± 0.004
[4.0 ± 1.0]
0.315 ± 0.012
[8.0 ± 0.30]
B
C
12 mm 0.32
[8.2]
0.059
[1.5]
0.217 ± 0.00
[5.5 ± 0.05]
0.177
[4.5]
0.315 ± 0.004
[8.0 ± 1.0]
0.472 ± 0.012
[12.0 ± 0.30]
D
E
W
0.004 [0.1]
MAX.
K
0
Tape thickness
B
1
MAX.
(Note 6)
0.014
[0.35]
MAX.
± 0.008 [0.200]
Embossment 0.069 ± 0.004
[1.75 ± 0.10]
D
1
MIN. for components
0.079 x 0.047 [2.0 x 1.2] and larger .
(Note 5)
Maximum
cavity size
(Note 1)
USER DIRECTION OF FEED
Center lines
of cavity
A
0
P
1
FW
0.030 [0.75]
MIN. (Note 4)
0.030 [0.75]
MIN. (Note 3)
0.079 ± 0.002
[2.0 ± 0.05]
0.157 ± 0.004
[4.0 ± 0.10]
0.059 + 0.004 - 0.0
[1.5 + 0.10 - 0.0]
B
0
Maxim um
component
rotation
(Side or front sectional view)
20°
For tape feeder
reference only
including draft.
Concentric around B
0
(Note 5)
Deformation
between
embossments
Top
cover
tape
Top
cover
tape
10 pitches cumulative
tolerance on tape
Direction of Feed
Anode (+)
Cathode (-)
20° maximum
component rotation
Typical
component
cavity
center line
Typical
component
center line
A0
B0
(Top view)
0.9843 [250.0]
Tape
3.937 [100.0]
0.039 [1.0]
MAX.
0.039 [1.0]
MAX.
Camber
(top view)
Allowable camber to be 0.039/3.937 [1/100]
non-cumulative over 9.843 [250.0]
Molded Guide
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RECOMMENDED REFLOW PROFILES
Capacitors should withstand reflow profile as per J-STD-020 standard, three cycles.
PROFILE FEATURE SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY
Preheat / soak
Temperature min. (Ts min.) 100 °C 150 °C
Temperature max. (Ts max.) 150 °C 200 °C
Time (ts) from (Ts min. to Ts max.) 60 s to 120 s 60 s to 120 s
Ramp-up
Ramp-up rate (TL to Tp) 3 °C/s max. 3 °C/s max.
Liquidus temperature (TL) 183 °C 217 °C
Time (tL) maintained above TL60 s to 150 s 60 s to 150 s
Peak package body temperature (Tp) Depends on case size - see table below
Time (tp) within 5 °C of the specified
classification temperature (TC)20 s 30 s
Time 25 °C to peak temperature 6 min max. 8 min max.
Ramp-down
Ramp-down rate (Tp to TL) 6 °C/s max. 6 °C/s max.
PEAK PACKAGE BODY TEMPERATURE (Tp)
CASE CODE PEAK PACKAGE BODY TEMPERATURE (Tp)
SnPb EUTECTIC PROCESS LEAD (Pb)-FREE PROCESS
A, B, C 235 °C 260 °C
D, E, W 220 °C 250 °C
PAD DIMENSIONS in inches [millimeters]
CASE CODE A
(MIN.)
B
(NOM.)
C
(NOM.)
D
(NOM.)
MOLDED CHIP CAPACITORS, ALL TYPES
A 0.071 [1.80] 0.067 [1.70] 0.053 [1.35] 0.187 [4.75]
B 0.118 [3.00] 0.071 [1.80] 0.065 [1.65] 0.207 [5.25]
C 0.118 [3.00] 0.094 [2.40] 0.118 [3.00] 0.307 [7.80]
D 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80]
E 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80]
W 0.185 [4.70] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80]
A
BC
D
Molded Guide
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GUIDE TO APPLICATION
1. AC Ripple Current: the maximum allowable ripple
current shall be determined from the formula:
where,
P = power dissipation in W at +25 °C as given in
the tables in the product datasheets (Power
Dissipation).
RESR = the capacitor equivalent series resistance at
the specified frequency
2. AC Ripple Voltage: the maximum allowable ripple
voltage shall be determined from the formula:
or, from the formula:
where,
P = power dissipation in W at +25 °C as given in
the tables in the product datasheets (Power
Dissipation).
RESR = the capacitor equivalent series resistance at
the specified frequency
Z = the capacitor impedance at the specified
frequency
2.1 The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
2.2 The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at
+25 °C.
3. Reverse Voltage: solid tantalum capacitors are not
intended for use with reverse voltage applied.
However, they have been shown to be capable of
withstanding momentary reverse voltage peaks of up
to 10 % of the DC rating at 25 °C and 5 % of the DC
rating at +85 °C.
4. Temperature Derating: if these capacitors are to be
operated at temperatures above +25 °C, the
permissible RMS ripple current shall be calculated
using the derating factors as shown:
Note
(1)Applicable for dedicated high temperature product series
5. Power Dissipation: power dissipation will be
affected by the heat sinking capability of the
mounting surface. Non-sinusoidal ripple current may
produce heating effects which differ from those
shown. It is important that the equivalent IRMS value
be established when calculating permissible
operating levels. (Power dissipation calculated using
+25 °C temperature rise).
6. Printed Circuit Board Materials: molded capacitors
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
7. Attachment:
7.1 Solder Paste: the recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178 mm ± 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat. In
practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
7.2 Soldering: capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering,
and hot plate methods. The soldering profile charts
show recommended time / temperature conditions
for soldering. Preheating is recommended. The
recommended maximum ramp rate is 2 °C per s.
Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
7.2.1 Backward and Forward Compatibility: capacitors
with SnPb or 100 % tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
8. Cleaning (Flux Removal) After Soldering: molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC / ODS products are not used in the production
of these devices and are not recommended.
Solvents containing methylene chloride or other
epoxy solvents should be avoided since these will
attack the epoxy encapsulation material.
8.1 When using ultrasonic cleaning, the board may
resonate if the output power is too high. This
vibration can cause cracking or a decrease in the
adherence of the termination. DO NOT EXCEED 9W/l
at 40 kHz for 2 min.
9. Recommended Mounting Pad Geometries: proper
mounting pad geometries are essential for
successful solder connections. These dimensions
are highly process sensitive and should be designed
to minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and /
or circuit board design.
TEMPERATURE (°C) DERATING FACTOR
+25 1.0
+85 0.9
+125 0.4
+150 (1) 0.3
+175 (1) 0.2
+200 (1) 0.1
IRMS
P
RESR
------------=
VRMS IRMS x Z=
VRMS ZP
RESR
------------=
Typical Performance Characteristics
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COTS Tantalum Capacitors
Notes
• All information presented in this document reflects typical performance characteristics
(1) Capacitance value 15 μF and higher
(2) For temperatures above +85 °C the same voltage derating ratio is recommended, but with respect to category voltage: up to +85 °C:
category voltage = rated voltage; at +125 °C: category voltage = 2/3 of rated voltage, between these temperatures it decreases linearly -
see graph below
ELECTRICAL PERFORMANCE CHARACTERISTICS
ITEM PERFORMANCE CHARACTERISTICS
Category temperature range -55 °C to +85 °C (to +125 °C with voltage derating)
Capacitance tolerance ± 20 %, ± 10 %, tested via bridge method, at 25 °C, 120 Hz
Dissipation factor Limit per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz
ESR Limit per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz
Leakage current After application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 k
resistor in series with the capacitor under test, leakage current at 25 °C is not more than 0.01 CV or
0.5 μA, whichever is greater. Note that the leakage current varies with temperature and applied voltage.
See graph below for the appropriate adjustment factor.
Capacitance change by
temperature
+15 % max. (at +125 °C)
+10 % max. (at +85 °C)
-10 % max. (at -55 °C)
Reverse voltage Capacitors are capable of withstanding peak voltages in the reverse direction equal to:
10 % of the DC rating at +25 °C
5 % of the DC rating at +85 °C
1 % of the DC rating at +125 °C
Vishay does not recommend intentional or repetitive application of reverse voltage.
Ripple current For maximum ripple current values (at 25 °C) refer to relevant datasheet. If capacitors are to be used at
temperatures above +25 °C, the permissible RMS ripple current (or voltage) shall be calculated using the
derating factors:
1.0 at +25 °C
0.9 at +85 °C
0.4 at +125 °C
Maximum operating and surge
voltages vs. temperature
+85 °C +125 °C
RATED VOLTAGE
(V)
SURGE VOLTAGE
(V)
CATEGORY VOLTAGE
(V)
SURGE VOLTAGE
(V)
4.0 5.2 2.7 3.4
6.3 8.0 4.0 5.0
10 13 7.0 8.0
16 20 10 12
20 26 13 16
25 32 17 20
35 46 23 28
40 52 26 31
50 65 33 40
50 (1) 60 33 40
63 75 42 50
75 75 50 50
Recommended voltage
derating guidelines
(below 85 °C) (2)
VOLTAGE RAIL CAPACITOR VOLTAGE RATING
3.3 6.3
510
10 20
12 25
15 35
24 50 or series configuration
Typical Performance Characteristics
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Notes
•At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table.
•At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table.
•At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table
CATEGORY VOLTAGE VS. TEMPERATURE
TYPICAL LEAKAGE CURRENT TEMPERATURE FACTOR
10
100
1000
10000
0
0.2
0.4
0.6
0.8
1.0
1.2
-55 0 25 55 85 105 125
Axis Title
1st line
2nd line
2nd line
Category Voltage (V)
Temperature (°C)
10
100
1000
10000
0.001
0.01
0.1
1
10
100
0 102030405060708090100
Axis Title
1st line
2nd line
2nd line
Leakage Current Factor
Percent of Rated Voltage
-55 °C
0 °C
+25 °C
+85 °C
+55 °C
+125 °C
Typical Performance Characteristics
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ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM CONDITION POST TEST PERFORMANCE
Surge voltage MIL-PRF-55365
1000 successive test cycles at 85 °C of surge
voltage (as specified in the table above), in
series with a 33 resistor at the rate of
30 s ON, 30 s OFF
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified limit
Initial specified limit
Life test at +85 °C MIL-STD-202, method 108
1000 h application of rated voltage at 85 °C
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified limit
Shall not exceed 125 % of initial limit
Life test at +125 °C MIL-STD-202, method 108
1000 h application 2/3 of rated voltage at 125 °C
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified limit
Shall not exceed 125 % of initial limit
Moisture resistance MIL-STD-202, method 106 at rated voltage,
20 cycles
Capacitance change
Dissipation factor
Leakage current
Within ± 15 % of initial value
Shall not exceed 150 % of initial limit
Shall not exceed 200 % of initial limit
Stability at low and
high temperatures
MIL-PRF-55365 Delta cap limit at -55 °C, 85 °C is ± 10 % of initial value
Delta cap limit at 125 °C is ± 15 % of initial value
Delta cap at step 3 and final step 25 °C is ± 10 %
DCL at 85 °C: 10 x initial specified value
DCL at 125 °C: 12 x initial specified value
DCL at 25 °C: initial specified value at RV
Thermal shock MIL-STD-202, method 107
At -55 °C / +125 °C, for 5 cycles,
30 min at each temperature
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified limit
Initial specified limit
MECHANICAL PERFORMANCE CHARACTERISTICS
ITEM CONDITION POST TEST PERFORMANCE
Terminal strength /
Shear force test
Apply a pressure load of 5 N for 10 s ± 1 s
horizontally to the center of capacitor side body
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified limit
Initial specified limit
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Vibration MIL-STD-202, method 204, condition D,
10 Hz to 2000 Hz, 20 g peak, 8 h, at rated voltage
Electrical measurements are not applicable, since the same
parts are used for shock (specified pulse) test.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Shock
(specified pulse)
MIL-STD-202, method 213, condition I,
100 g peak
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified limit
Initial specified limit
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Resistance
to soldering heat
MIL-STD-202, method 210, condition J
(leadbearing capacitors) and K (lead (Pb)-free
capacitors), one heat cycle
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified limit
Initial specified limit
Solderability MIL-STD-202, method 208, ANSI/J-STD-002,
test B (leadbearing) and B1 (lead (Pb)-free).
Preconditioning per category C (category E -
optional).
Does not apply to gold terminations.
Lead (Pb)-free and leadbearing capacitors are
backward and forward compatible
Solder coating of all capacitors shall meet specified
requirements.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Resistance to
solvents
MIL-STD-202, method 215 There shall be no mechanical or visual damage to capacitors
post-conditioning. Body marking shall remain legible.
Flammability Encapsulation materials meet UL 94 V-0 with an
oxygen index of 32 %
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Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
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