The LM118 and LM218 are
obsolete and are no longer supplied.
SLOS063B – JUNE 1976 – REVISED DECEMBER 2002
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DSmall Signal Bandwidth . . . 15 MHz Typ
DSlew Rate . . . 50 V/µs Min
DBias Current . . . 250 nA Max (LM118,
LM218)
DSupply Voltage Range . . . ±5 V to ±20 V
DInternal Frequency Compensation
DInput and Output Overload Protection
DSame Pin Assignments as
General-Purpose Operational Amplifiers
description/ordering information
The LM118, LM218, and LM318 are precision,
fast operational amplifiers designed for
applications requiring wide bandwidth and high
slew rate. They feature a factor-of-ten increase in
speed over general-purpose devices without
sacrificing dc performance.
These operational amplifiers have internal
unity-gain frequency compensation. This
considerably simplifies their application because
no external components are necessary for
operation. However, unlike most internally
compensated amplifiers, external frequency
compensation may be added for optimum
performance. For inverting applications,
feed-forward compensation boosts the slew rate
to over 150 V/µs and almost double the
bandwidth. Overcompensation can be used with
the amplifier for greater stability when maximum
bandwidth is not needed. Further, a single
capacitor ca n b e added to reduce the settling time
for 0.1% error band to under 1 µs.
The high speed and fast settling time of these operational amplifiers make them useful in A/D converters,
oscillators, active filters, sample-and-hold circuits, and general-purpose amplifiers.
ORDERING INFORMATION
T
V
IO
max
PACKAGE†
ORDERABLE TOP-SIDE
TA
VIOmax
AT 25°CPACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP (P) Tube of 50 LM318P LM318P
0°Cto70°C
10 mV
SOIC (D)
Tube of 75 LM318D
LM318
0°C to 70°C10 mV SOIC (D) Reel of 2500 LM318DR LM318
SOP (PS) Reel of 2000 LM318PSR LM18
†Package drawings, standard packing quantities, thermal data, symboliztion, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2002, Texas Instruments Incorporated
1
2
3
4
8
7
6
5
BAL/COMP1
IN–
IN+
VCC–
COMP2
VCC+
OUT
BAL/COMP3
LM118...JG PACKAGE
LM218 ...D OR P PACKAGE
LM318 . . . D, P, OR PS PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
NC
VCC+
NC
OUT
NC
NC
IN–
NC
IN+
NC
LM118 . . . FK PACKAGE
(TOP VIEW)
NC
BAL/COMP1
NC
NC NC
NC
NC
NC – No internal connection
CC–
V
BAL/COMP3 COMP2
The LM118 and LM218 are
obsolete and are no longer supplied.
SLOS063B – JUNE 1976 – REVISED DECEMBER 2002
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
symbol
+
–
BAL/COMP1
COMP2
BAL/COMP3
IN+
IN–
OUT
1
8
5
3
2
Pin numbers shown are for the D, JG, P, and PS packages.
6
schematic
33 Ω
COMP2
2 kΩ2 kΩ
20 kΩ20 kΩ
20 kΩ
5 kΩ5 kΩ
5 kΩ
150 kΩ
1 kΩ1 kΩ3.5 kΩ
13 Ω
25 Ω
30 Ω
50 Ω
4 kΩ
500 Ω
1.2 kΩ
1.2 kΩ
110 Ω
5.6 kΩ
30 Ω
1.7 kΩ
6 pF
28 pF
100 pF
VCC+
OUT
VCC–
IN–
IN+
Component values shown are nominal.
BAL/COMP1
BAL/COMP3
The LM118 and LM218 are
obsolete and are no longer supplied.
SLOS063B – JUNE 1976 – REVISED DECEMBER 2002
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage: VCC+ (see Note 1) 20 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VCC– (see Note 1) –20 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI (either input, see Notes 1 and 2) ±15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input current, VID (see Note 3) ±10 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short circuit (see Note 4) Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 5 and 6):D package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
P package 85°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
PS package 95°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJC (see Notes 7 and 8):FK package 5.61°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
JG package 14.5°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
Case temperature for 60 seconds: FK package 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: JG package 300°C. . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: D, P, PS, or PW package 260°C. . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , an d
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC–.
2. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
3. The inputs are shunted with two opposite-facing base-emitter diodes for overvoltage protection. Therefore, excessive current flows
if a different input voltage in excess of approximately 1 V is applied between the inputs unless some limiting resistance is used.
4. The output can be shorted to ground or either power supply. For the LM118 and LM218 only , the unlimited duration of the short circuit
applies at (or below) 85°C case temperature or 75°C free-air temperature.
5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperautre is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
6. The package thermal impedance is calculated in accordance with JESD 51-7.
7. Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable
ambient temperautre is PD = (TJ(max) – TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
8. The package thermal impedance is calculated in accordance with MIL-STD-883.
The LM118 and LM218 are
obsolete and are no longer supplied.
SLOS063B – JUNE 1976 – REVISED DECEMBER 2002
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature (see Note 5)
PARAMETER
TEST
T‡
LM118, LM218 LM318
UNIT
PARAMETER
TEST
CONDITIONS†TA
‡
MIN TYP MAX MIN TYP MAX UNIT
V
Inp t offset oltage
V0
25°C 2 4 4 10
mV
VIO Input offset voltage VO = 0 Full range 6 15 mV
I
Inp t offset c rrent
V0
25°C 6 50 30 200
nA
IIO Input offset current VO = 0 Full range 100 300 nA
I
Input bias current
V0
25°C 120 250 150 500
nA
IIB Input bias current VO = 0 Full range 500 750 nA
VICR Common-mode input voltage range VCC± = ±15 V Full range ±11.5 ±11.5 V
VOM Maximum peak output voltage
swing VCC± = ±15 V,
RL = 2 kΩFull range ±12 ±13 ±12 ±13 V
A
Lar
g
e-si
g
nal differential VCC± = ±15 V,
VO±10 V
25°C 50 200 25 200
V/mV
AVD
Large signal
differential
voltage amplification VO = ±10 V,
RL ≥ 2 kΩFull range 25 20 V/mV
B1Unity-gain bandwidth VCC± = ±15 V 25°C 15 15 MHz
riInput resistance 25°C 1*3 0.5 3 MΩ
CMRR Common-mode rejection ratio VIC = VICRmin Full range 80 100 70 100 dB
kSVR Supply-voltage rejection ratio
(∆VCC/∆VIO)Full range 70 80 65 80 dB
ICC Supply current VO = 0, No load 25°C 5 8 5 10 mA
* On products compliant to MIL-STD-883, Class B, this parameter is not production tested.
†All characteristics are measured under open-loop conditions with common-mode input voltage, unless otherwise specified.
‡Full range for LM118 is –55°C to 125°C, full range for LM218 is –25°C to 85°C, and full range for LM318 is 0°C to 70°C.
NOTE 9: Unless otherwise noted, VCC = ±5 V to ±20 V. All typical values are at VCC± = ±15 V and TA = 25°C.
operating characteristics, VCC± = ±15 V, TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SR Slew rate at unity gain ∆VI = 10 V, CL = 100 pF, See Figure 1 50*70 V/µs
* On products compliant to MIL-STD-883, Class B, this parameter is not production tested.
PARAMETER MEASUREMENT INFORMATION
+
–
Input
Input Output
Output
2 kΩ
2 kΩ
1 kΩ100 pF
TEST CIRCUIT VOLTAGE WAVEFORMS
90%
10% ∆VO
10 V
0 V
tt
10 V
0 V
SR +
DVO
tt
Figure 1. Slew Rate
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’sstandard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support thiswarranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarilyperformed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers shouldprovide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, maskwork right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or servicesare used. Information published by TI regarding third-party products or services does not constitute a license from TI to use suchproducts or services or a warranty or endorsement thereof. Use of such information may require a license from a third party underthe patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is anunfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or servicevoids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive businesspractice. TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product wouldreasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreementspecifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramificationsof their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-relatedrequirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding anyapplications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and itsrepresentatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade issolely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements inconnection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI productsare designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use anynon-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDSP dsp.ti.com Broadband www.ti.com/broadbandInterface interface.ti.com Digital Control www.ti.com/digitalcontrolLogic logic.ti.com Military www.ti.com/militaryPower Mgmt power.ti.com Optical Networking www.ti.com/opticalnetworkMicrocontrollers microcontroller.ti.com Security www.ti.com/securityLow Power www.ti.com/lpw Telephony www.ti.com/telephonyWireless
Video & Imaging www.ti.com/videoWireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
JM38510/10107BPA OBSOLETE CDIP JG 8 TBD Call TI Call TI
LM118FKB OBSOLETE LCCC FK 20 TBD Call TI Call TI
LM118JG OBSOLETE CDIP JG 8 TBD Call TI Call TI
LM118JGB OBSOLETE CDIP JG 8 TBD Call TI Call TI
LM318D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM318DE4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM318DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM318DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM318DRE4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM318DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM318P ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
LM318PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
LM318PSR ACTIVE SO PS 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM318PSRE4 ACTIVE SO PS 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM318PSRG4 ACTIVE SO PS 8 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
LM318DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM318PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM318DR SOIC D 8 2500 340.5 338.1 20.6
LM318PSR SO PS 8 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
P (R-PDIP-T8) PLASTIC DUAL-IN-LINE
8
4
0.015 (0,38)
Gage Plane
0.325 (8,26)
0.300 (7,62)
0.010 (0,25) NOM
MAX
0.430 (10,92)
4040082/D 05/98
0.200 (5,08) MAX
0.125 (3,18) MIN
5
0.355 (9,02)
0.020 (0,51) MIN
0.070 (1,78) MAX
0.240 (6,10)
0.260 (6,60)
0.400 (10,60)
1
0.015 (0,38)
0.021 (0,53)
Seating Plane
M
0.010 (0,25)
0.100 (2,54)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
